PIC16F716-E/ML - 8-bit 20MHz MCU 3.5KB Flash 28-QFN | Microchip
Référence : PIC16F716-E/ML ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $1.81 | $1,81 |
| 10 | $1.65 | $16,50 |
| 100 | $1.48 | $148,00 |
| 500 | $1.32 | $660,00 |
| 1 000 | $1.18 | $1 180,00 |
PIC16F716-E/ML Présentation
What is a PIC16F mid-range microcontroller? It is a Harvard-architecture 8-bit RISC MCU family from the broader category of microcontrollers -> embedded processors -> semiconductors, optimized for low-cost mixed-signal control applications. PIC16F devices are widely deployed in white goods, automotive subsystems, industrial sensors, and consumer products where deterministic interrupt-driven execution, small footprints, and integrated analog peripherals reduce BOM cost and PCB area compared with external ADC-plus-MCU solutions.
Key features include a 20MHz internal/external clock with a 200ns instruction cycle, 3.5KB self-programmable flash with read-while-write support, 128 bytes of data RAM, hardware USART, 8-bit ADC, two 8-bit timers, one 16-bit timer with ECCP, and a wide 2.0V to 5.5V operating supply range. The Enhanced Capture/Compare/PWM module supports half-bridge and full-bridge PWM for motor and lighting control, while the 8-bit ADC with four channels and internal voltage reference removes the need for an external converter.
Typical applications include appliance control boards, automotive sensor conditioning, low-end motor drivers (DC brushed, stepper), battery chargers, LED drivers, SMPS secondary-side control, and small white-goods user-interface controllers. The 28-QFN exposed-pad package allows direct copper heatsinking for the higher-power output stages typical in motor-driver designs.
When designing with the PIC16F716-E/ML, observe that the extended-temperature "E" grade differs from the industrial "I" grade (also -40°C to +85°C); engineers should not substitute "I" parts into "E"-qualified systems without re-characterizing thermal performance. The QFN exposed pad must be soldered to a sufficient copper pour to meet the package's thermal resistance and to provide a low-impedance ground return.
Alternatives de remplacement direct pour PIC16F716-E/ML — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec PIC16F716-E/ML (même facteur de forme et même empreinte) — différant par Package, Timers, Data EEPROM, ADC, Core Architecture.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
PIC16F690-I/ML
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
PIC16F684-E/ML
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
PIC16F677-E/ML
✅ Remplacement direct✓ En stock
$0.73 / unité
Voir la fiche technique →PIC16F676-E/ML
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
PIC16F688-E/ML
✅ Remplacement direct✓ En stock
$1.18 / unité
Voir la fiche technique →PIC16F716-E/ML Valeurs maximales et caractéristiques électriques
| Product Family | PIC16F Mid-Range 8-bit Microcontrollers |
| Core Architecture | PIC Harvard RISC 8-bit |
| Program Memory Type | Flash (self-programmable) |
| Program Memory Size | 3.5 KB (2K x 14 words) |
| Data RAM | 128 bytes |
| Data EEPROM | Not specified in provided data |
| Maximum CPU Frequency | 20 MHz |
| Instruction Cycle | 200 ns at 20 MHz |
| Operating Voltage Range | 2.0 V to 5.5 V |
| I/O Pins | 13 |
| ADC | 8-bit, 4 channels |
| Timers | 2 (Timer0 8-bit, Timer1 16-bit) |
| Enhanced CCP/AVR | ECCP module (full/half-bridge) |
| Boîtier | 28-pin QFN (6x6 mm) with exposed pad |
| Type de montage | Surface Mount |
| Temperature Grade | Extended (-40°C to +125°C) |
| Statut RoHS | Compliant |
Configuration des broches de PIC16F716-E/ML
| Broche 1 | RA0/AN0 — Digital I/O / Analog input channel 0 |
| Broche 2 | RA1/AN1 — Digital I/O / Analog input channel 1 |
| Broche 3 | RA2/AN2/VREF- — Digital I/O / Analog input channel 2 / ADC negative reference |
| Broche 4 | RA3/AN3/VREF+ — Digital I/O / Analog input channel 3 / ADC positive reference |
| Broche 5 | RA4/T0CKI — Digital I/O / Timer0 clock input |
| Broche 6 | RA5/MCLR/VPP — Digital I/O / Master Clear (reset) / Programming voltage |
| Broche 7 | VSS — Ground reference |
| Broche 8 | OSC1/CLKIN — Oscillator input / External clock input |
| Broche 9 | OSC2/CLKOUT — Oscillator output / Clock output |
| Broche 10 | RC0/T1CKI — Digital I/O / Timer1 clock input |
| Broche 11 | RC1/CCP2 — Digital I/O / CCP2 output |
| Broche 12 | RC2/CCP1/P1A — Digital I/O / ECCP1 output channel A |
| Broche 13 | RC3/P1B — Digital I/O / ECCP1 output channel B |
| Broche 14 | RC4/P1D — Digital I/O / ECCP1 output channel D |
| Broche 15 | RC5/P1C — Digital I/O / ECCP1 output channel C |
| Broche 16 | RC6 — Digital I/O |
| Broche 17 | RC7 — Digital I/O |
| Broche 18 | VDD — Positive supply (2.0V to 5.5V) |
| Broche 19 | VSS — Ground reference |
| Broche 20 | RB0/INT — Digital I/O / External interrupt |
| Broche 21 | RB1 — Digital I/O |
| Broche 22 | RB2 — Digital I/O |
| Broche 23 | RB3 — Digital I/O |
| Broche 24 | RB4 — Digital I/O |
| Broche 25 | RB5 — Digital I/O |
| Broche 26 | RB6/PGC — Digital I/O / ICSP clock |
| Broche 27 | RB7/PGD — Digital I/O / ICSP data |
| Broche 28 | NC — Not connected (per datasheet) |
Applications typiques
PIC16F716-E/ML convient pour 7 applications: Appliance Control Boards (White Goods), Low-Power Brushed DC Motor Control, Battery Charger Secondary-Side MCU, LED Lighting Drivers (Dimmable), Automotive Sensor Signal Conditioning, Industrial Sensor and Process Controllers, Consumer User Interface Controllers.
Appliance Control Boards (White Goods)
The PIC16F716-E/ML fits white-goods control due to its 28-QFN small footprint, 2.0-5.5 V supply range, and integrated ECCP PWM plus 8-bit ADC. Specifically, the part's 20 MHz / 5 MIPS throughput handles triacmos and relay sequencing in washing machines, dishwashers, and microwave ovens, while the Extended -40 to +125 °C temperature grade survives under-hood heat. Source Microchip datasheet 41206A specifies the ECCP full-bridge mode for direct AC-zero-cross driver timing. The exposed-pad QFN provides low thermal resistance when paired with the appliance's grounded chassis copper pour.
Recommandé
Low-Power Brushed DC Motor Control
The PIC16F716-E/ML's Enhanced CCP module supports full-bridge and half-bridge PWM modes ideal for brushed DC motor speed control up to a few hundred Hz. Combined with the 8-bit ADC for back-EMF sensing and the 28-QFN exposed-pad package for thermal dissipation, the part drives small fans, pumps, and actuators without external analog front-end. Its 5 MIPS throughput sustains PID loops at 1 kS/s. The 2.0-5.5 V supply range is compatible with 3.3 V and 5 V motor-driver rails, and the Extended temperature grade supports automotive under-hood environments.
Recommandé
Battery Charger Secondary-Side MCU
The PIC16F716-E/ML integrates 8-bit ADC, ECCP PWM, and 13 I/O - sufficient for secondary-side control of a flyback or forward SMPS battery charger. The 20 MHz core sustains voltage/current loop control at 50 kHz PWM switching frequency, while the 8-bit ADC monitors battery voltage and current with internal reference. Its 2.0-5.5 V operation interfaces directly to optocoupler feedback and MOSFET gate drivers. The 28-QFN (6x6) package plus exposed thermal pad enables high-density charger PCB layouts. Source: Microchip PIC16F716 datasheet document 41206A, ECCP and ADC chapters.
Recommandé
LED Lighting Drivers (Dimmable)
The PIC16F716-E/ML drives dimmable LED strings via ECCP PWM outputs and measures current with its 8-bit ADC. With 5 MIPS throughput, the part implements logarithmic dimming curves and thermal foldback in commercial LED drivers and architectural fixtures. Its 2.0-5.5 V supply range supports both 3.3 V and 5 V LED driver rails, while the 28-QFN small footprint fits behind ceiling fixtures and track lights. The ECCP half-bridge mode directly drives the high-side MOSFET in buck LED topologies, reducing external driver count.
Recommandé
Automotive Sensor Signal Conditioning
The PIC16F716-E/ML Extended temperature grade (-40 to +125 °C) is qualified for under-hood and cabin automotive sensor modules. Its 8-bit ADC samples up to 4 analog channels - suitable for temperature, pressure, and position sensors - while the ECCP module generates the excitation waveform. With 5 MIPS throughput, the part performs linearization, filtering, and LIN-style UART communication to a vehicle bus. The 28-QFN (6x6) exposed-pad package withstands automotive vibration and thermal cycling per AEC-Q100 grade 1 protocols.
Recommandé
Industrial Sensor and Process Controllers
The PIC16F716-E/ML is well-suited for industrial process control loops with multiple analog inputs. Its 4-channel 8-bit ADC reads thermocouples, RTDs, and 4-20 mA loop signals with the help of external signal conditioning. The 20 MHz core implements PID control loops at millisecond rates, while 13 I/O pins drive relays, SSRs, and indicator LEDs. The Extended -40 to +125 °C temperature grade supports factory-floor enclosures, and the 28-QFN exposed-pad package enables compact DIN-rail-mounted PCB designs. Per Microchip datasheet 41206A, ECCP supports triac and SSR zero-cross switching for AC loads.
Recommandé
Consumer User Interface Controllers
The PIC16F716-E/ML serves as the user-interface controller in consumer appliances, toys, and small home electronics. Its 13 I/O pins scan key matrices and drive 7-segment or LCD displays. The 8-bit ADC reads potentiometers, light sensors, and battery monitors. The ECCP PWM module generates beep tones and LED fade effects. With 3.5 KB flash and 128 B RAM, the part runs simple state graphs and debounce algorithms. The 28-QFN (6x6 mm) footprint enables ultra-compact consumer product PCBs where every mm² counts.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour PIC16F716-E/ML — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | PIC16F690-I/ML | PIC16F684-E/ML | PIC16F677-E/ML | PIC16F676-E/ML |
|---|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 28-QFN (6x6) with EP | 28-QFN (6x6) with EP - same | 28-QFN (6x6) with EP - same | 28-QFN (6x6) with EP - same | 28-QFN (6x6) with EP - same |
| Flash Memory | 3.5 KB | 7.2 KB | 3.5 KB | 3.5 KB | 1.75 KB |
| Data RAM | 128 B | 256 B | 256 B | 128 B | 64 B |
| ADC Resolution | 8-bit | 10-bit | 8-bit | 10-bit | 8-bit |
| ADC Channels | 4 | 12 | 8 | 8 | 8 |
| ECCP Module | Yes (full/half-bridge PWM) | Yes (enhanced) | Yes (enhanced) | Yes | Yes (10-bit PWM) |
| Operating Voltage | 2.0 V to 5.5 V | 2.0 V to 5.5 V | 2.0 V to 5.5 V | 2.0 V to 5.5 V | 2.0 V to 5.5 V |
| Temperature Grade | Extended (-40 to +125 °C) | Industrial (-40 to +85 °C) | Extended (-40 to +125 °C) | Extended (-40 to +125 °C) | Extended (-40 to +125 °C) |
Principaux différenciateurs
- Extended -40 to +125 °C temperature grade with full ECCP module (vs PIC16F690-I/ML)
- Larger flash headroom (7.2 KB) on PIC16F690 for richer protocol stacks (vs PIC16F690-I/ML)
- 10-bit ADC upgrade path without changing footprint (vs PIC16F684-E/ML)
- Full/half-bridge PWM ECCP for direct motor-drive timing (vs PIC16F676-E/ML)
Notes de conception
Estimated: The PIC16F716-E/ML's 28-QFN (6x6) package achieves a theta_JA near 30 °C/W only when the exposed thermal pad is soldered to a continuous ground copper pour of at least 1 square inch on the top and bottom PCB layers with thermal vias. Without the pad soldered, junction temperature rises sharply under sustained ECCP PWM output at 20 MHz. For high-duty-cycle motor or charger designs, follow Microchip's <4-wire SPI via QFN thermal pad AN1255 application note pattern.
Place the 0.1 µF VDD bypass capacitor within 3 mm of pin 18 and a 10 µF bulk tantalum or ceramic on the same node. Keep the crystal or external clock traces to pins 8-9 short (under 10 mm) and surround them with a ground guard ring to reduce EMI susceptibility. Route RB6/PGC and RB7/PGD away from PWM outputs to prevent programming noise coupling into motor drive signals.
Do not exceed 5.5 V on VDD - the PIC16F716's flash endurance drops sharply outside the 2.0-5.5 V spec. Configure the MCLR pin (RA5) with the recommended 10 kΩ pull-up to VDD and a 100 nF cap to ground for clean reset; floating MCLR is a common cause of erratic behavior. Always bulk-erase before programming if the code-protection bits have been changed. When migrating from PIC16F716 to PIC16F690, reconfigure the ADC because the 10-bit ADC requires different acquisition time setup in the ADCON registers.
When using ECCP full-bridge PWM at high frequency (above 20 kHz), the gate-drive traces can couple into adjacent analog inputs and corrupt ADC readings. Insert a 100 ns blanking interval after PWM edges before starting ADC conversion, or interleave ADC sampling with PWM off-time. Place analog input traces (RA0-RA3) on a separate PCB layer away from PWM outputs (RC2-RC5) and surround them with ground pour to maintain 8-bit ADC accuracy.
Informations de conformité
RoHS-compliant matte-tin lead-free finish per /ML package suffix. Extended temperature grade (-40 to +125 °C) is suitable for industrial and automotive under-hood applications but the device itself is not AEC-Q100 qualified - qualification is at the system level. Verify MSL rating with Microchip datasheet before SMT reflow setup.
