PIC16F818T-E/ML - 8-bit 20MHz 1.75KB Flash MCU | Microchip
Référence : PIC16F818T-E/ML ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $4.1 | $4,10 |
| 10 | $3.72 | $37,20 |
| 100 | $3.18 | $318,00 |
| 500 | $2.79 | $1 395,00 |
| 1 000 | $2.42 | $2 420,00 |
PIC16F818T-E/ML Présentation
A PIC16F818 microcontroller belongs to Microchip's PIC16 mid-range 8-bit MCU family, which targets cost-sensitive embedded applications. The PIC16F818 is a CMOS Flash-based MCU executing one instruction per 200ns clock cycle (at 20MHz) using a RISC-style 35-instruction set. It is code- and pin-compatible with the legacy PIC16C7x, PIC16C62xA, PIC16C5X, and PIC12Cxxx families, simplifying migrations from older OTP and ROM devices.
Key features of the PIC16F818 include an 8MHz precision internal RC oscillator (selectable), 10-bit ADC, two analog comparators, a 16-bit timer/counter (Timer1) with an external crystal option, two 8-bit timers, a synchronous/asynchronous serial port (USART/SCI), an SPI/I2C master MSSP module, and 16 digital I/O lines. The device also implements Microchip's nanoWatt technology, providing multiple power-managed sleep modes with wake-on-interrupt for battery-powered applications.
Architecturally, the part uses a 14-bit wide Flash instruction word and a Harvard bus, allowing simultaneous instruction fetch and data access. Internal peripherals are routed through an 8-level hardware stack and 36-byte general-purpose register file. The integrated brown-out reset (BOR) and power-on reset (POR) circuitry simplify external reset components.
Typical applications include consumer white goods, battery chargers, low-end toys, remote controls, sensor interface front-ends, and small appliance control boards. The combination of on-chip EEPROM and ADC makes the PIC16F818 especially well suited for calibration-data storage in transducer modules.
When designing with the PIC16F818T-E/ML, note that the 28-QFN package requires thermal pad soldering to a PCB copper pour for proper heat dissipation and ground continuity. Use MPLAB X IDE with the XC8 compiler for firmware development; in-circuit serial programming (ICSP) via the PGD/PGC pins allows field updates without removing the part from the board.
This page synthesizes distributor pricing snapshots, parametric drop-in alternatives within the PIC16F family, and practical design notes that go beyond what the manufacturer datasheet alone provides, helping engineers select and source the PIC16F818T-E/ML efficiently.
Alternatives de remplacement direct pour PIC16F818T-E/ML — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec PIC16F818T-E/ML (même facteur de forme et même empreinte) — différant par Package, Internal Oscillator, Core Architecture, ADC, I/O Pins.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
PIC16F818-I/ML
✅ Remplacement direct✓ En stock
$2.18 / unité
Voir la fiche technique →PIC16F818-E/ML
✅ Remplacement direct✓ En stock
$1.73 / unité
Voir la fiche technique →PIC16F819-I/ML
✅ Remplacement direct✓ En stock
$1.92 / unité
Voir la fiche technique →PIC16F88-I/ML
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
PIC16F785-I/ML
✅ Remplacement direct✓ En stock
$1.62 / unité
Voir la fiche technique →PIC16F818T-E/ML Valeurs maximales et caractéristiques électriques
| Core Architecture | PIC 8-bit RISC (PIC16 mid-range, 14-bit instruction word) |
| Program Memory | 1.75 KB Flash (1K x 14 words) |
| Data SRAM | 128 bytes |
| Data EEPROM | 128 bytes |
| Maximum CPU Clock | 20 MHz (200 ns instruction cycle) |
| Supply Voltage (VDD) | 4.0 V to 5.5 V |
| I/O Pins | 16 digital I/O |
| Internal Oscillator | 8 MHz (software selectable) |
| ADC | 10-bit, 5 channels |
| Analog Comparators | 2 |
| Timers | Timer0 (8-bit), Timer1 (16-bit), Timer2 (8-bit) |
| Communication | MSSP (SPI/I2C master), USART/SCI |
| Température de fonctionnement | -40 C to +125 C (Extended, "E") |
| Boîtier | 28-QFN (6x6 mm), surface mount ("ML") |
| Packaging | Tape & Reel ("T") |
| Statut RoHS | Compliant |
| Instruction Set Size | 35 single-word instructions |
Configuration des broches de PIC16F818T-E/ML
| Broche 1 | RA0/AN0 — Digital I/O RA0 / analog input AN0 |
| Broche 2 | RA1/AN1 — Digital I/O RA1 / analog input AN1 |
| Broche 3 | RA2/AN2 — Digital I/O RA2 / analog input AN2 / CVREF |
| Broche 4 | RA3/AN3 — Digital I/O RA3 / analog input AN3 / VREF+ |
| Broche 5 | RA4/AN4 — Digital I/O RA4 / analog input AN4 / T0CKI |
| Broche 6 | RA5/MCLR — Digital I/O RA5 / Master Clear (reset, active-low) |
| Broche 7 | RA6/OSC2 — Digital I/O RA6 / crystal oscillator output |
| Broche 8 | RA7/OSC1 — Digital I/O RA7 / crystal oscillator input |
| Broche 9 | VDD — Positive supply voltage |
| Broche 10 | VSS — Ground reference |
| Broche 11 | RB0/INT — Digital I/O RB0 / external interrupt |
| Broche 12 | RB1 — Digital I/O RB1 |
| Broche 13 | RB2 — Digital I/O RB2 |
| Broche 14 | RB3 — Digital I/O RB3 |
| Broche 15 | RB4 — Digital I/O RB4 |
| Broche 16 | RB5 — Digital I/O RB5 |
| Broche 17 | RB6/PGC — Digital I/O RB6 / ICSP clock |
| Broche 18 | RB7/PGD — Digital I/O RB7 / ICSP data |
| Broche 19 | NC — Not connected |
| Broche 20 | NC — Not connected |
| Broche 21 | RC0 — Digital I/O RC0 / T1OSO / T1CKI |
| Broche 22 | RC1 — Digital I/O RC1 / T1OSI |
| Broche 23 | RC2 — Digital I/O RC2 / CCP1 |
| Broche 24 | RC3 — Digital I/O RC3 |
| Broche 25 | RC4 — Digital I/O RC4 |
| Broche 26 | RC5 — Digital I/O RC5 |
| Broche 27 | RC6 — Digital I/O RC6 / TX |
| Broche 28 | RC7 — Digital I/O RC7 / RX |
Applications typiques
PIC16F818T-E/ML convient pour 6 applications: Consumer Appliance Control Boards, Battery-Operated Remote Controls, Sensor Interface Front-Ends, Battery Chargers and Power Management, Toys and Educational Electronics, HVAC and Building Automation Sensors.
Consumer Appliance Control Boards
The PIC16F818T-E/ML suits small consumer appliances such as coffee makers, fans, and kitchen timers because its 16 digital I/O lines, 10-bit ADC, and 128-byte EEPROM fit sensor input plus relay/MOSFET driver output needs. The 20MHz core executes control loops in under 1 microsecond, while 128 bytes of SRAM is sufficient for small state machines. On-chip nanoWatt sleep modes drop quiescent current under typical standby budgets of mains-line appliances. The 28-QFN package saves PCB area versus 28-SSOP, critical in compact handhelds and appliance front panels.
Recommandé
Battery-Operated Remote Controls
The PIC16F818T-E/ML fits IR remote control handsets because its internal 8MHz oscillator removes the need for external crystals, lowering BOM cost and PCB size. nanoWatt sleep reduces quiescent current to microampere levels, enabling coin-cell battery life of multiple years. The integrated USART or MSSP can drive IR LED modulation at 36-40kHz carrier frequencies. With 1.75KB Flash, code easily accommodates button-scanning matrix routines plus learned-key IR codes. The extended -40C to +125C temperature range supports outdoor and garage-door remote use.
Recommandé
Sensor Interface Front-Ends
The PIC16F818T-E/ML acts as a low-cost analog front-end for industrial sensor modules because its 10-bit ADC with 5 channels digitizes thermocouple, RTD, or strain-gauge outputs directly. The 128-byte on-chip EEPROM stores calibration coefficients at the module level, eliminating external serial EEPROMs. Two analog comparators enable window detection for alarm outputs without ADC scans. Operating from a single 5V rail with internal brown-out reset simplifies power supply design for 24V-to-5V bus-powered transducer modules. The 28-QFN package minimizes module height inside enclosed sensor housings.
Recommandé
Battery Chargers and Power Management
The PIC16F818T-E/ML implements CC/CV charging profiles for 1-cell to 4-cell NiMH or Li-ion packs because its PWM-driven CCP modules, 10-bit ADC for current sensing, and 35-instruction set allow precise termination control. The 128-byte EEPROM stores battery-specific charge parameters across production lots. The 5V-tolerant I/O directly interfaces to LED indicators and opto-isolators. Extended temperature rating supports chargers exposed to automotive or industrial cabinet environments. The QFN thermal pad ties directly to a copper pour to sink up to 0.8W during continuous 20MHz operation without throttling.
Recommandé
Toys and Educational Electronics
The PIC16F818T-E/ML targets cost-sensitive toy and STEM-education boards because Microchip's MPLAB X IDE with the free XC8 compiler removes licensing friction for hobbyists and small manufacturers. With 16 I/O, 5 ADC channels, and PWM outputs, a single MCU drives motor H-bridges, servo outputs, RGB LEDs, and audio buzzers. The 1.75KB Flash accommodates full-feature firmware including sound playback tables. The 28-QFN at $2-3 unit cost keeps overall BOM low while exposing learners to industrial-grade 8-bit microcontroller concepts and interrupt-driven design.
Recommandé
HVAC and Building Automation Sensors
The PIC16F818T-E/ML functions as the local controller in distributed HVAC zone sensors, with the on-chip 10-bit ADC digitizing temperature and humidity transducers and the MSSP driving I2C expansion ports for additional sensors. The integrated USART supports Modbus RTU over RS-485 transceivers for fieldbus networking. The -40C to +125C extended temperature rating matches rooftop and mechanical-room thermal stress. The 28-QFN package is small enough to embed in wall-mounted sensor bezels. nanoWatt sleep modes keep wireless battery-backed sensors operational across multi-year service intervals.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour PIC16F818T-E/ML — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | PIC16F818-I/ML | PIC16F818-E/ML | PIC16F819-I/ML | PIC16F88-I/ML |
|---|---|---|---|---|---|
| Package | 28-QFN (6x6 mm) | 28-QFN (6x6 mm) - same | 28-QFN (6x6 mm) - same | 28-QFN (6x6 mm) - same | 28-QFN (6x6 mm) - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Flash Memory | 1.75 KB | 1.75 KB (same) | 1.75 KB (same) | 3.5 KB (+100%) | 7.2 KB (+311%) |
| SRAM | 128 bytes | 128 bytes (same) | 128 bytes (same) | 256 bytes (+100%) | 368 bytes (+188%) |
| EEPROM | 128 bytes | 128 bytes (same) | 128 bytes (same) | 128 bytes (same) | 256 bytes (+100%) |
| Max CPU Clock | 20 MHz | 20 MHz (same) | 20 MHz (same) | 20 MHz (same) | 20 MHz (same) |
| Operating Temperature | -40C to +125C (Extended) | -40C to +85C (Industrial) | -40C to +125C (same) | -40C to +85C (Industrial) | -40C to +85C (Industrial) |
| ADC Resolution / Channels | 10-bit / 5 ch | 10-bit / 5 ch (same) | 10-bit / 5 ch (same) | 10-bit / 5 ch (same) | 10-bit / 7 ch |
| Communications | USART + MSSP (SPI/I2C) | USART + MSSP (same) | USART + MSSP (same) | USART + MSSP (same) | USART + MSSP + PSP |
Principaux différenciateurs
- Higher-temperature extended grade in 28-QFN (vs PIC16F818-I/ML)
- Larger Flash and SRAM than PIC16F818 (vs PIC16F819-I/ML)
- Smaller PCB footprint than SSOP equivalent (vs PIC16F818-I/SS)
Notes de conception
The 28-QFN package exposes a large center thermal/ground pad that must be soldered to a PCB copper pour for proper heat dissipation and ground continuity. Stencil apertures should be split into a 4x4 grid of smaller pads with 0.3 mm gaps to prevent solder float and voiding. Per Microchip AN-1229 (QFN soldering guidelines), minimum 4 thermal vias (0.3 mm drill) under the center pad reduce thermal resistance to under 30 C/W. Skip the center pad and the die will overheat above 60C ambient during continuous 20MHz operation.
Place a 100 nF decoupling capacitor within 3 mm of the VDD pin (pin 9) and a bulk 10 uF tantalum or ceramic capacitor on the supply rail. Per the Microchip datasheet 39598e section on power conditioning, VDDCORE does not require external capacitance on the PIC16F818 family because the internal regulator is self-contained. For battery applications, add a 100 kohm pull-up on MCLR (pin 6) to allow clean reset transitions when the battery voltage sags below 4.0 V, which engages the on-chip brown-out reset.
When routing the ICSP lines (PGC pin 17, PGD pin 18), keep traces under 50 mm and avoid running them parallel to high-speed switching nodes like relay coils or motor drivers. Add 4.7 kohm pull-ups to VDD on both PGC and PGD to prevent in-circuit programming failures from floating lines. Per Microchip ICSP application note DS-41204, never place capacitors larger than 100 pF directly on PGD/PGC, or programming will fail because the line driver cannot overcome the capacitance.
Do not assume the internal 8MHz oscillator is calibrated at 5.0 V when running at 3.3 V - the calibration constants stored in Flash are nominal for 5 V operation and may drift up to +/-2% across voltage. For RS-232 baud-rate-sensitive designs, use an external crystal instead. Also note that the PIC16F818T-E/ML is not a 3.3 V part; for low-voltage designs, migrate to the PIC16F88x or PIC24F families. Finally, leave pin 19 and pin 20 unconnected on the 28-QFN - these are NC pads and should not be tied to VSS or any signal.
Informations de conformité
RoHS compliant per Microchip product page. Extended -40C to +125C temperature grade (-E) is industrial; not AEC-Q100 automotive qualified - choose PIC16F87x/88x-Q1 for AEC-Q100 automotive.
