PIC16LF1707T-I/ML - 8-bit MCU 3.5KB Flash 32MHz QFN-20
Référence : PIC16LF1707T-I/ML ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $0.92 | $0,92 |
| 10 | $0.85 | $8,50 |
| 100 | $0.75 | $75,00 |
| 500 | $0.68 | $340,00 |
| 1 000 | $0.6 | $600,00 |
PIC16LF1707T-I/ML Présentation
An 8-bit Flash microcontroller is a small, self-contained computer-on-a-chip built around an 8-bit data path, integrating a CPU, non-volatile program memory (Flash), RAM, and a curated set of peripherals (timers, ADC, comparators, communication ports) on a single die. Within the broader semiconductor taxonomy, the PIC16LF1707 sits as: microcontroller -> 8-bit microcontroller -> embedded controller -> integrated circuit. Microcontrollers of this class typically replace discrete logic and analog front-ends in cost-sensitive and space-constrained designs.
The PIC16LF1707 features 256 bytes of SRAM, up to 18 general-purpose I/O pins, an integrated 10-bit ADC with up to 12 channels, two operational amplifiers with rail-to-rail input/output, an 8-bit DAC, two comparators, and peripheral pin select (PPS) for flexible signal routing. XLP technology brings supply current down to a deep-sleep regime suitable for coin-cell applications, while the LF process node (1.8V-3.6V VDD) extends battery life compared to the 5V-capable PIC16F1707 sibling. Peripherals include Master Synchronous Serial Port (MSSP) for SPI/I2C, Enhanced Universal Synchronous Asynchronous Receiver Transmitter (EUSART), and four 10-bit PWM outputs.
Architecturally, the device is built on a 14-bit instruction-word enhanced mid-range core with a hardware stack, single-cycle instruction execution (other than branches), and a configurable oscillator block supporting internal 32 MHz HFINTOSC, 31 kHz LFINTOSC, and external crystal modes. Code is protected by a configurable Flash read protection and a unique 32-bit device ID. The integrated op-amps and DAC allow direct analog signal conditioning on-chip, eliminating many external components in sensor-interface and LED-driving applications.
Typical applications include low-power IoT sensor nodes, wearable fitness and health devices, battery-powered remote controls, LED lighting controllers with analog dimming, small appliance HMI panels, and consumer electronic accessories where a 20-pin footprint and integrated analog reduce BOM cost.
When designing with this device, choose decoupling capacitance per the manufacturer recommended layout (typically 0.1 µF plus 10 µF bulk within 3 mm of the VDD pins), and verify PPS remap constraints before committing to a PCB layout because some peripheral functions must be assigned to specific pins.
This page synthesizes distributor pricing, drop-in same-package alternatives from the same PIC16LF1707 family and across Microchip's wider 8-bit portfolio, and practical design notes not found in the standalone datasheet.
Alternatives de remplacement direct pour PIC16LF1707T-I/ML — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec PIC16LF1707T-I/ML (même facteur de forme et même empreinte) — différant par Program Memory (Flash), ADC, Operating Temperature, Package, DAC.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
PIC16LF1707-I/ML
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
$0.55 / unité
Voir la fiche technique →PIC16F1707T-I/ML
✅ Remplacement direct✓ En stock
$0.71 / unité
Voir la fiche technique →PIC16LF1704-I/ML
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
$0.71 / unité
Voir la fiche technique →PIC16LF15356-I/ML
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
$0.96 / unité
Voir la fiche technique →PIC16LF1559T-I/ML
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
$1.32 / unité
Voir la fiche technique →PIC16LF1707T-I/ML Valeurs maximales et caractéristiques électriques
| Core Architecture | PIC 8-bit enhanced mid-range |
| Program Memory (Flash) | 3.5 KB (2K x 14) |
| Data RAM | 256 bytes |
| Maximum CPU Speed | 32 MHz (32 MIPS) |
| Supply Voltage (VDD) | 1.8 V to 3.6 V |
| I/O Pins | Up to 18 |
| ADC | 10-bit, up to 12 channels |
| DAC | 8-bit |
| Comparators | 2 |
| Operational Amplifiers | 2 (on-chip, rail-to-rail I/O) |
| PWM Outputs | 4 x 10-bit |
| Communication | 1x MSSP (SPI/I2C), 1x EUSART |
| Température de fonctionnement | -40C to +85C (Industrial) |
| Boîtier | 20-pin QFN (4x4 mm) with exposed pad |
| Type de montage | Surface Mount |
| Statut RoHS | Compliant |
| Low-Power Technology | XLP (eXtreme Low Power) |
| Internal Oscillator | 32 MHz HFINTOSC + 31 kHz LFINTOSC |
Configuration des broches de PIC16LF1707T-I/ML
| Broche 1 | RA5 — GPIO / analog input / PWM |
| Broche 2 | RA4 — GPIO / analog input |
| Broche 3 | RA3 — GPIO / MCLR (master clear reset) |
| Broche 4 | RA2 — GPIO / analog input / op-amp output |
| Broche 5 | RA1 — GPIO / analog input / op-amp inverting input |
| Broche 6 | RA0 — GPIO / analog input / op-amp non-inverting input |
| Broche 7 | VSS — Ground reference |
| Broche 8 | RA7 — GPIO / analog input / DAC output |
| Broche 9 | RA6 — GPIO / analog input / comparator output |
| Broche 10 | RC0 — GPIO / PWM / SPI SCK |
| Broche 11 | RC1 — GPIO / PWM / SPI SDI |
| Broche 12 | RC2 — GPIO / PWM / SPI SDO |
| Broche 13 | RC3 — GPIO / PWM / SPI SS |
| Broche 14 | RC4 — GPIO / I2C SDA / EUSART TX |
| Broche 15 | RC5 — GPIO / I2C SCL / EUSART RX |
| Broche 16 | RC6 — GPIO / EUSART TX / PWM |
| Broche 17 | RC7 — GPIO / EUSART RX / PWM |
| Broche 18 | VSS — Ground reference (secondary) |
| Broche 19 | VDD — Positive supply voltage 1.8V-3.6V |
| Broche 20 | VDD — Positive supply voltage (secondary) |
Applications typiques
PIC16LF1707T-I/ML convient pour 6 applications: Battery-Powered IoT Sensor Nodes, Wearable Fitness and Health Devices, Battery-Powered Remote Controls, LED Lighting Controllers with Analog Dimming, Small Appliance HMI Panels, Consumer Electronic Accessories.
Battery-Powered IoT Sensor Nodes
The PIC16LF1707T-I/ML's XLP platform delivers sub-microamp deep-sleep current, making it well suited for IoT sensor nodes that wake periodically to sample and transmit data over BLE or sub-GHz radios. Its 1.8 V to 3.6 V VDD range supports direct connection to coin cells or single-cell Li-ion batteries, while the integrated 10-bit ADC with up to 12 channels handles multi-sensor input without external multiplexers.
Recommandé
Wearable Fitness and Health Devices
Wearable fitness bands require long battery life and direct analog signal conditioning from heart-rate, SpO2, and motion sensors. The PIC16LF1707T-I/ML's two on-chip rail-to-rail op-amps condition photodiode signals directly, while the 8-bit DAC sets bias voltages for optical front-ends. The 32 MHz CPU can run RTOS-free main loops fast enough to keep active current low, with XLP sleep between bursts extending coin-cell runtime to weeks.
Recommandé
Battery-Powered Remote Controls
Universal remote controls, key fobs, and small RF transmitter keypads benefit from the PIC16LF1707T-I/ML's LF supply range and XLP sleep. The EUSART enables infrared modulation or sub-GHz link interfacing, while the MSSP drives SPI peripherals or I2C sensors. The 4x4 mm QFN-20 footprint fits inside compact handheld enclosures, and the exposed pad provides thermal dissipation for higher duty-cycle TX bursts without throttling.
Recommandé
LED Lighting Controllers with Analog Dimming
Smart LED drivers and architectural dimmers need analog current control and PWM generation. The PIC16LF1707T-I/ML's four 10-bit PWM channels drive MOSFET gates or LED strings directly, while the on-chip op-amps close current-sense loops without external amplifiers. The 8-bit DAC sets reference levels for tunable-white or RGB color mixing, and XLP sleep during standby lighting maintains energy-star efficiency targets.
Recommandé
Small Appliance HMI Panels
Coffee machines, air purifiers, and countertop appliances integrate capacitive-touch buttons, status LEDs, and small displays. The PIC16LF1707T-I/ML's 18 I/O pins handle mTouch proximity sensing, LED matrix driving, and segment LCD via the integrated 8-bit DAC. The MSSP SPI/I2C ports connect to OLED displays or wireless modules, and the LF supply range permits direct 3.3 V regulator operation from rectified mains.
Recommandé
Consumer Electronic Accessories
Computer peripherals, USB dongles, and gaming accessories need compact, low-cost MCUs with mixed signal capability. The PIC16LF1707T-I/ML's 4x4 mm QFN-20 footprint fits inside USB Type-A housings and connector shells, while its integrated op-amps interface analog sensors (temperature, current, light) without external ICs. XLP technology keeps standby current below USB suspend limits, ensuring compliance with USB 2.0 power management specifications.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour PIC16LF1707T-I/ML — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | PIC16LF1707-I/ML | PIC16F1707T-I/ML | PIC16LF1704-I/ML | PIC16LF15356-I/ML | PIC16LF1559T-I/ML |
|---|---|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | QFN-20 (4x4 mm) | QFN-20 (4x4 mm) - same | QFN-20 (4x4 mm) - same | QFN-20 (4x4 mm) - same | QFN-20 (4x4 mm) - same | QFN-20 (4x4 mm) - same |
| Process / VDD Range | LF / 1.8V-3.6V | LF / 1.8V-3.6V | F / 1.8V-5.5V | LF / 1.8V-3.6V | LF / 1.8V-3.6V | LF / 1.8V-3.6V |
| Program Flash | 3.5 KB | 3.5 KB | 3.5 KB | 7 KB | 28 KB | 14 KB |
| Data RAM | 256 B | 256 B | 256 B | 512 B | 2048 B | 1024 B |
| On-chip Op-amps | 2 | 2 | 2 | 0 | 0 | 0 |
| ADC Resolution / Channels | 10-bit / 12 ch | 10-bit / 12 ch | 10-bit / 12 ch | 10-bit / 12 ch | 10-bit / 22 ch | 10-bit / 17 ch |
| PWM Channels | 4 x 10-bit | 4 x 10-bit | 4 x 10-bit | 4 x 10-bit | 5 x 10-bit | 4 x 10-bit |
Principaux différenciateurs
- Two on-chip op-amps eliminate external analog front-end ICs (vs PIC16LF1704-I/ML)
- LF process node with 1.8 V lower VDD for battery applications (vs PIC16F1707T-I/ML)
- Tape-and-reel shipping packaging for OEM production (vs PIC16LF1707-I/ML)
Notes de conception
Estimated: Decouple VDD with a 0.1 µF ceramic capacitor placed within 3 mm of pins 19 and 20, plus a 10 µF bulk capacitor on the same net. For XLP deep-sleep operation below 1 µA, route both VDD pins and both VSS pins to solid copper planes and avoid high-impedance analog traces near the VDD bond wires. The exposed thermal pad (pin 21 in some datasheet conventions) must be soldered to a grounded copper island for thermal dissipation and electrical reference.
The QFN-20 (4x4 mm) land pattern requires a center pad of approximately 2.5x2.5 mm with via array stitching to the ground plane for thermal conduction. Stencil aperture should be split into four quadrants (or follow Microchip IPC-7351 compliant QFN recommendations) to prevent solder voiding. Recommended PCB land footprint and via pattern are documented in Microchip application note AN279 and the PIC16LF1707 datasheet's PCB layout section.
When migrating firmware between PIC16LF1707T-I/ML and the F-process PIC16F1707T-I/ML, verify VDD upper limit (3.6 V vs 5.5 V) and analog voltage reference scaling. The MSSP module's I2C fast-mode (400 kHz) and high-speed mode (3.4 MHz) require specific SDA/SCL slew-rate configuration via the SSP1STAT and SSP1CON registers. Avoid leaving unused pins floating - configure them as outputs low or enable the weak pull-ups via WPUA/WPUC registers to minimize sleep current leakage.
Informations de conformité
RoHS and REACH compliance per Microchip product page. Industrial temperature grade -40C to +85C only; not AEC-Q100 qualified for automotive. Halogen-free per Microchip green packaging standards.
