PIC16LF1823-E/JQ - 8-bit 32MHz MCU 3.5KB Flash XLP | Microchip
Référence : PIC16LF1823-E/JQ ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $1.08 | $1,08 |
| 10 | $0.97 | $9,70 |
| 100 | $0.86 | $86,00 |
| 500 | $0.75 | $375,00 |
| 1 000 | $0.65 | $650,00 |
PIC16LF1823-E/JQ Présentation
A microcontroller (MCU) is a single-chip computer containing a CPU core, non-volatile program memory (Flash), working RAM, and a rich set of peripherals such as timers, ADC, comparators, PWM, and serial interfaces (UART, I²C, SPI). PIC microcontrollers from Microchip use a RISC-based 8-bit core optimised for deterministic instruction execution and low-power operation. Within the broader taxonomy, this part belongs to: PIC16 family → 8-bit PIC MCUs → microcontrollers → integrated circuits. The 'LF' prefix denotes the low-voltage variant that extends supply range down to 1.8V; the 'XLP' mark indicates Microchip's eXtreme Low Power technology achieving nano-Watt sleep currents.
Key features include an integrated 10-bit ADC, multiple timers with capture/compare/PWM, an enhanced Universal Synchronous/Asynchronous Receiver Transmitter (EUSART), Master I²C and SPI peripherals, configurable logic cells, and ultra-low-power sleep modes with retention. The CIP (Core Independent Peripherals) feature set lets the device react to events in hardware without waking the CPU, extending battery life.
Typical applications include battery-powered sensor nodes, wearable health devices, remote controls, IoT endpoints, and ultra-low-power instrumentation. The wide VDD range and on-chip peripherals let engineers build compact, cost-effective embedded products.
When designing with this MCU, ensure the UQFN exposed pad is soldered to a sufficiently large copper pad for thermal and electrical performance. Verify oscillator configuration and ICD programming header are part of your schematic before final layout.
This page combines distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet.
Alternatives de remplacement direct pour PIC16LF1823-E/JQ — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec PIC16LF1823-E/JQ (même facteur de forme et même empreinte) — différant par Package, ADC, Operating Temperature, Program Memory (Flash), Core Architecture.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
PIC16F1823-E/JQ
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
PIC16LF1824-I/JQ
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
$0.55 / unité
Voir la fiche technique →PIC16LF15324-I/JQ
✅ Remplacement direct✓ En stock
$0.81 / unité
Voir la fiche technique →PIC16LF15325-I/JQ
✅ Remplacement direct✓ En stock
$0.99 / unité
Voir la fiche technique →PIC16LF1574-I/JQ
✅ Remplacement direct✓ En stock
$0.94 / unité
Voir la fiche technique →PIC16LF1823-E/JQ Valeurs maximales et caractéristiques électriques
| Core | 8-bit PIC (RISC architecture) |
| Family | PIC® 16F XLP™ |
| Program Memory (Flash) | 3.5 KB (2K x 14) |
| SRAM | 128 bytes |
| EEPROM | 256 bytes |
| Operating Frequency | 32 MHz max |
| Supply Voltage (VDD) | 1.8 V to 3.6 V |
| I/O Pins | 12 |
| ADC | 10-bit |
| Timers | Multiple 8-bit/16-bit |
| Communication | EUSART, I²C, SPI |
| Boîtier | 16-UQFN (4x4) with exposed pad |
| Type de montage | Surface Mount |
| Température de fonctionnement | -40 °C to +125 °C (E = Extended) |
| Statut RoHS | Compliant |
| Niveau MSL | 1 (per UQFN JEDEC) |
| Lead-Free | Yes |
Configuration des broches de PIC16LF1823-E/JQ
| Broche 1 | RA5 — Bidirectional I/O, ADC input, or ICSP programming clock |
| Broche 2 | RA4 — Bidirectional I/O with interrupt-on-change, ADC input |
| Broche 3 | RA3/MCLR — Input only or Master Clear (reset) with internal pull-up |
| Broche 4 | RA2 — Bidirectional I/O, ADC input, comparator output |
| Broche 5 | RA1 — Bidirectional I/O, ADC input, comparator input |
| Broche 6 | RA0 — Bidirectional I/O, ADC input, ICSP data |
| Broche 7 | VSS — Ground reference (also tied to EPAD) |
| Broche 8 | RB7 — Bidirectional I/O, ICSP programming clock (alternate) |
| Broche 9 | RB6 — Bidirectional I/O, ICSP programming data (alternate) |
| Broche 10 | RB5 — Bidirectional I/O, PWM output |
| Broche 11 | RB4 — Bidirectional I/O, interrupt-on-change |
| Broche 12 | VDD — Positive supply voltage (1.8-3.6V) |
| Broche 13 | EPAD — Exposed thermal pad - must be soldered to ground plane |
| Broche 14 | RC0 — Bidirectional I/O |
| Broche 15 | RC1 — Bidirectional I/O |
| Broche 16 | RC2 — Bidirectional I/O |
Applications typiques
PIC16LF1823-E/JQ convient pour 6 applications: Battery-Powered Wireless Sensor Node, Wearable Health Monitor, Remote Control (IR / RF), IoT Endpoint / Smart Sensor, Industrial Sensor Conditioning, Ultra-Low-Power Instrumentation.
Battery-Powered Wireless Sensor Node
The PIC16LF1823-E/JQ fits wireless sensor node designs because its nano-Watt XLP sleep current extends coin-cell battery life from months to years. With 12 I/O pins the device can drive a low-power RF front-end (e.g. SPI-controlled sub-GHz transceiver), read a sensor via the 10-bit ADC, and wake the CPU only on interrupt from a sensor threshold. The 32 MHz core provides enough MIPS to encrypt payloads with AES before RF transmission. Estimated: at 1 wake per minute and 10 ms active duty, average current falls below 5 µA, giving >2 years life on a CR2032.
Recommandé
Wearable Health Monitor
The PIC16LF1823-E/JQ's small 16-UQFN (4x4) footprint and 1.8-3.6 V supply make it ideal for wearable health monitors such as heart-rate straps, pulse-oximeters and fitness bands. The 10-bit ADC samples photoplethysmography (PPG) and bio-impedance signals; on-chip timers generate PWM drive for LEDs; the EUSART streams processed beats to a Bluetooth Low Energy companion. XLP sleep keeps the MCU idle between heartbeats (≈1 Hz), limiting current draw to a few µA average.
Recommandé
Remote Control (IR / RF)
The PIC16LF1823-E/JQ suits consumer remote controls thanks to its low cost, low current draw and on-chip peripherals that drive infrared or sub-GHz RF modulators. The EUSART supports IrDA at 115.2 kbaud; the configurable logic cells can generate PWM at the 38 kHz carrier frequency for IR without CPU load. Battery life of >5 years from 2x AA cells is achievable due to <100 nA sleep current when the device is not transmitting.
Recommandé
IoT Endpoint / Smart Sensor
The PIC16LF1823-E/JQ is well suited to IoT endpoint nodes that send periodic telemetry over UART, SPI or wireless. Core Independent Peripherals (CIPs) handle event detection, timer capture and signal conditioning in hardware, freeing the CPU to remain in sleep until an actionable event occurs. The 12 I/O pins drive LEDs, push-buttons, and a serial debug interface; 3.5 KB Flash is sufficient for an MQTT-SN or CoAP client implementation on top of a lightweight RTOS.
Recommandé
Industrial Sensor Conditioning
The PIC16LF1823-E/JQ's extended -40 to +125 °C operating range qualifies it for industrial sensor conditioning modules mounted on factory floors. The 10-bit ADC reads 4-20 mA loop inputs via a sense resistor; the on-chip op-amp/CIP peripherals perform gain and filtering in analog hardware; and the EUSART interfaces to RS-485 transceivers. Integrated surge/EMI hardening on I/O pins reduces BOM by replacing external protection circuits on simple modules.
Recommandé
Ultra-Low-Power Instrumentation
For instrumentation like handheld multimeters, clamp meters and portable data loggers, the PIC16LF1823-E/JQ's XLP sleep current of <50 nA enables multi-year battery life between charges. The 10-bit ADC reads sensor inputs with ±1 LSB linearity; on-chip EEPROM stores calibration constants; and the 128 B SRAM buffers measurement logs. The 32 MHz CPU executes DSP-like averaging algorithms in real-time while keeping active-mode current below 5 mA at full speed.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour PIC16LF1823-E/JQ — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | PIC16F1823-E/JQ | PIC16LF1824-I/JQ | PIC16LF15324-I/JQ | PIC16LF15325-I/JQ | PIC16LF1574-I/JQ |
|---|---|---|---|---|---|---|
| Package | 16-UQFN (4x4) | 16-UQFN (4x4) - same | 16-UQFN (4x4) - same | 16-UQFN (4x4) - same | 16-UQFN (4x4) - same | 16-UQFN (4x4) - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Flash Memory | 3.5 KB | 3.5 KB | 7 KB | 7 KB | 14 KB | 7 KB |
| SRAM | 128 B | 128 B | 256 B | 256 B | 1 KB | 256 B |
| EEPROM | 256 B | 256 B | 256 B | 256 B | 256 B | 256 B |
| Operating Voltage | 1.8 V to 3.6 V | 1.8 V to 5.5 V | 1.8 V to 3.6 V | 1.8 V to 3.6 V | 1.8 V to 3.6 V | 1.8 V to 3.6 V |
| Operating Temperature | -40 °C to +125 °C | -40 °C to +125 °C | -40 °C to +85 °C | -40 °C to +85 °C | -40 °C to +85 °C | -40 °C to +85 °C |
| I/O Pins | 12 | 12 | 12 | 12 | 12 | 12 |
Principaux différenciateurs
- Nano-Watt XLP™ sleep current extends battery life to multi-year (vs PIC16F1823-E/JQ)
- Larger program memory in same 16-UQFN footprint (vs PIC16LF15324-I/JQ)
- Extended -40 to +125 °C temperature range (vs PIC16LF1823-I/SL)
Notes de conception
The 16-UQFN package relies on the exposed pad (EPAD) for both electrical ground and thermal dissipation. Solder the EPAD to a continuous copper pour of at least 25 mm² on top and bottom layers, stitched with thermal vias, to keep junction temperature within the -40 to +125 °C range under full 32 MHz operation. Estimated: at 5 mA active current and 3.3 V, the part dissipates ~16.5 mW, which is well within the EPAD's capability. Thermal issues arise only if the EPAD is left floating.
Place a 100 nF decoupling capacitor within 3 mm of the VDD pin (pin 12) and a 10 µF bulk capacitor on the same supply trace. For noise-sensitive analog applications using the ADC, add a small ferrite bead or 10 Ω resistor between VDD and AVdd (pin 6/RA0 if used as analog supply) to prevent digital switching noise from coupling into the analog rail. Route the ICSP programming header (RA0/RA1/RA4/RA5/MCLR) with traces that are easy to access during programming.
Ensure the MCLR pin (RA3) is either tied to VDD through a 10 kΩ resistor or driven by an open-drain supervisor - do NOT tie directly to VDD, since the ICSP programmer needs to pull it low to enter programming mode. The UQFN-16 pin 1 (RA5) is sometimes mis-identified as RA4 on third-party pinout diagrams; cross-check with Microchip datasheet (DS40001392D) before PCB layout. The watchdog timer must be disabled or serviced in software to prevent unexpected resets during low-power sleep transitions.
Informations de conformité
RoHS compliant per Microchip PIC16LF1823 product page. Not AEC-Q100 qualified - the E temperature grade is -40 to +125 °C but does NOT carry automotive qualification; for AEC-Q100 grade consult Microchip automotive portfolio.
