PIC16LF874A-I/ML - 8-bit MCU, 7KB Flash, 33 I/O | Microchip
Référence : PIC16LF874A-I/ML ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $9.95 | $9,95 |
| 10 | $8.95 | $89,50 |
| 100 | $7.78 | $778,00 |
| 500 | $6.85 | $3 425,00 |
| 1 000 | $5.95 | $5 950,00 |
PIC16LF874A-I/ML Présentation
An 8-bit microcontroller (MCU) is a single-chip computer that integrates a CPU, program memory (Flash/ROM), data memory (RAM), and peripherals onto one silicon die. Within the broader taxonomy, the PIC16LF874A belongs to the 8-bit MCU -> microcontroller -> embedded controller -> semiconductor hierarchy. The 'LF' prefix denotes the low-voltage, low-power process variant that operates across an extended 2.0V to 5.5V range, making it well-suited to battery-powered or energy-harvesting designs.
Key differentiating features of the PIC16LF874A include its 35 single-word instruction RISC architecture, self-programming capability, in-circuit debugging (ICD) support, and 10 MIPS sustained throughput. The 44-pin QFN (ML) package offers a small 8x8 mm footprint with an exposed thermal pad that improves power dissipation versus leaded PLCC packages, while remaining compatible with the PIC16F874A pinout (differing only in core voltage range).
The device uses a Harvard architecture with separate program and data memory buses, enabling simultaneous instruction fetch and operand access. The enhanced core adds 14-bit instructions, hardware multiplier support (via software libraries), interrupt handling with shadow registers, and a wide peripheral set including the Enhanced USART and MSSP peripheral for SPI and I2C communications.
Typical applications include industrial control panels, sensor signal conditioning, low-power remote sensor nodes, motor control loops with feedback sensing, and consumer appliance user interfaces. The 10-bit ADC with 8 input channels makes it a fit for analog sensor reading systems. Consider whether legacy 5V systems should use the PIC16F874A variant instead, while the LF suffix guarantees operation down to 2.0V for newer low-voltage designs.
When designing with this device, ensure the exposed pad (EP) is soldered to the ground plane for proper thermal performance and that the configuration bits are correctly set for the chosen oscillator mode. Programming via ICSP requires Vpp, ICSPCLK, and ICSPDAT access on dedicated pins.
Alternatives de remplacement direct pour PIC16LF874A-I/ML — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec PIC16LF874A-I/ML (même facteur de forme et même empreinte) — différant par Operating Temperature, Package, Program Memory (Flash), Timers, ADC.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
PIC16LF877A-I/ML
✅ Remplacement direct✓ En stock
$5.18 / unité
Voir la fiche technique →PIC16F874A-I/ML
✅ Remplacement direct✓ En stock
$3.21 / unité
Voir la fiche technique →PIC16LF874A-I/ML Valeurs maximales et caractéristiques électriques
| Product Family | PIC16F/LF87xA |
| Core Architecture | 8-bit PIC16 Enhanced Mid-range |
| Program Memory (Flash) | 7 KB (4K x 14 words) |
| RAM Size | 192 bytes |
| EEPROM Size | 128 bytes |
| Maximum CPU Speed | 20 MHz (200 ns instruction cycle, 10 MIPS) |
| Operating Voltage | 2.0 V to 5.5 V (LF low-voltage variant) |
| I/O Pins | 33 |
| ADC | 10-bit, up to 8 channels |
| Comparators | 2 analog comparators |
| Timers | Timer0, Timer1, Timer2 |
| CCP/PWM Modules | 2 CCP modules |
| Communication | 1x USART (AUSART), 1x MSSP (SPI/I2C) |
| Boîtier / Format | 44-QFN with exposed pad (ML), 8x8 mm |
| Température de fonctionnement | -40C to +85C (industrial grade, '-I') |
| Type de montage | Surface Mount |
| Statut RoHS | Compliant |
Configuration des broches de PIC16LF874A-I/ML
| Broche 1 | RA0/AN0 — Digital I/O / Analog input channel 0 |
| Broche 2 | RA1/AN1 — Digital I/O / Analog input channel 1 |
| Broche 3 | RA2/AN2/VREF- — Digital I/O / Analog input channel 2 / ADC negative reference |
| Broche 4 | RA3/AN3/VREF+ — Digital I/O / Analog input channel 3 / ADC positive reference |
| Broche 5 | RA4/T0CKI — Digital I/O / Timer0 clock input |
| Broche 6 | RA5/AN4/SS — Digital I/O / Analog input channel 4 / SPI slave select |
| Broche 7 | OSC1/CLKI — Crystal oscillator input / external clock input |
| Broche 8 | OSC2/CLKO — Crystal oscillator output / clock output |
| Broche 9 | RC0/T1OSO/T1CKI — Digital I/O / Timer1 oscillator output / Timer1 clock input |
| Broche 10 | RC1/T1OSI/CCP2 — Digital I/O / Timer1 oscillator input / CCP2 |
| Broche 11 | RC2/CCP1 — Digital I/O / CCP1 |
| Broche 12 | RC3/SCK/SCL — Digital I/O / SPI clock / I2C clock |
| Broche 13 | RD0/PSP0 — Digital I/O / Parallel Slave Port bit 0 |
| Broche 14 | RD1/PSP1 — Digital I/O / Parallel Slave Port bit 1 |
| Broche 15 | RD2/PSP2 — Digital I/O / Parallel Slave Port bit 2 |
| Broche 16 | RD3/PSP3 — Digital I/O / Parallel Slave Port bit 3 |
| Broche 17 | RC4/SDI/SDA — Digital I/O / SPI data in / I2C data |
| Broche 18 | RC5/SDO — Digital I/O / SPI data out |
| Broche 19 | RC6/TX/CK — Digital I/O / USART async transmit / USART sync clock |
| Broche 20 | RC7/RX/DT — Digital I/O / USART async receive / USART sync data |
| Broche 21 | GND — Ground reference |
| Broche 22 | VDD — Positive supply voltage |
| Broche 23 | RB0/INT — Digital I/O / External interrupt input |
| Broche 24 | RB1 — Digital I/O |
| Broche 25 | RB2 — Digital I/O |
| Broche 26 | RB3/PGM — Digital I/O / Low-voltage ICSP programming |
| Broche 27 | RB4 — Digital I/O |
| Broche 28 | RB5 — Digital I/O |
| Broche 29 | RB6/PGC — Digital I/O / ICSP clock |
| Broche 30 | RB7/PGD — Digital I/O / ICSP data |
| Broche 31 | GND — Ground reference (second tie point) |
| Broche 32 | VDD — Positive supply voltage (second tie point) |
| Broche 33 | RB8 — Digital I/O (Port B extended) |
| Broche 34 | RB9 — Digital I/O (Port B extended) |
| Broche 35 | RB10 — Digital I/O (Port B extended) |
| Broche 36 | RB11 — Digital I/O (Port B extended) |
| Broche 37 | RB12 — Digital I/O (Port B extended) |
| Broche 38 | RB13 — Digital I/O (Port B extended) |
| Broche 39 | RB14 — Digital I/O (Port B extended) |
| Broche 40 | RB15 — Digital I/O (Port B extended) |
| Broche 41 | RC2 — Digital I/O (Port C secondary) |
| Broche 42 | RD4/PSP4 — Digital I/O / Parallel Slave Port bit 4 |
| Broche 43 | RD5/PSP5 — Digital I/O / Parallel Slave Port bit 5 |
| Broche 44 | RE0/RD/AN5 — Digital I/O / Parallel Slave Port read / Analog input channel 5 |
| Broche EP | EP — Exposed thermal pad - must be soldered to ground plane (per datasheet) |
Applications typiques
PIC16LF874A-I/ML convient pour 6 applications: Industrial Control Panels, Low-Power Remote Sensor Nodes, Consumer Appliance User Interfaces, Motor Control with Feedback Sensing, Automotive Body Electronics (Non-Safety), Educational and Hobbyist Development.
Industrial Control Panels
The PIC16LF874A-I/ML fits industrial control panel designs thanks to its 33 I/O pins, 2.0V-5.5V operation, and 10 MIPS core speed. Its wide voltage tolerance tolerates noisy 24V-derived rails stepped down to 5V or 3.3V, while the 7 KB flash accommodates multi-state machine logic. The 10-bit ADC with 8 channels reads panel potentiometers and sensor inputs directly. The QFN-44 package with exposed pad simplifies thermal management in sealed enclosures.
Recommandé
Low-Power Remote Sensor Nodes
The PIC16LF874A-I/ML is a strong fit for battery-powered remote sensor nodes because the LF process variant operates down to 2.0V, enabling 2xAA battery operation near end-of-life. Its 7 KB flash stores sensor calibration tables and wake-on-interrupt logic, while the 10-bit ADC handles temperature, pressure, or humidity sensor reads. The MSSP peripheral supports I2C sensor interfacing, and the USART provides optional LoRa/BLE module connectivity for remote telemetry.
Recommandé
Consumer Appliance User Interfaces
The PIC16LF874A-I/ML powers user interfaces in consumer appliances such as washing machines, microwave ovens, and HVAC thermostats. Its 33 I/O drive 7-segment displays, keypads, and indicator LEDs directly without external glue logic. The 2 CCP/PWM modules generate beeper tones and triac-fired heater control. The 7 KB flash fits menu state machines and EEPROM-backed user settings, while the 2.0V-5.5V range supports single-cell lithium backup during power brown-outs.
Recommandé
Motor Control with Feedback Sensing
The PIC16LF874A-I/ML implements closed-loop DC motor control using its 2 CCP/PWM modules for H-bridge drive signals and its 10-bit ADC for back-EMF or current-sense feedback. The 35-instruction enhanced mid-range core executes 10 MIPS, enough for PID loops at 1 kHz control rates. The 2 analog comparators provide hardware overcurrent protection, while the USART exposes telemetry to a host controller. The QFN package handles modest thermal loads in compact motor driver PCBs.
Recommandé
Automotive Body Electronics (Non-Safety)
The PIC16LF874A-I/ML serves non-safety automotive body modules such as interior lighting controllers, seat-position memory, and accessory multiplexers. Its -40C to +85C industrial temperature rating meets cabin environments, and the 33 I/O handle multiple LED strings and switch inputs. The MSSP supports LIN slave emulation via software for low-speed body networking. Note that AEC-Q100 qualified variants should be selected for production automotive deployments; the standard part suits prototyping.
Recommandé
Educational and Hobbyist Development
The PIC16LF874A-I/ML is well-suited to educational microcontroller coursework and hobbyist projects owing to its mature toolchain support (MPLAB X IDE, XC8 compiler, PICkit debugger). The 7 KB flash and 192 bytes RAM accommodate typical student assignments such as digital thermometers, line-following robots, and data loggers. The 44-QFN package challenges beginners with surface-mount soldering but rewards design with a compact breakout; the same die in DIP-40 (PIC16LF874A-I/P) is easier for breadboard prototyping.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour PIC16LF874A-I/ML — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | PIC16LF877A-I/ML | PIC16F874A-I/ML | PIC16LF874A-I/L | PIC16LF874A-I/PT | PIC16LF874A-I/P |
|---|---|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 44-QFN (ML), 8x8 mm | 44-QFN (ML), 8x8 mm - same | 44-QFN (ML), 8x8 mm - same | 44-LCC/PLCC, J-Lead - different | 44-TQFP, 10x10 mm - different | 40-DIP - different |
| Program Memory (Flash) | 7 KB (4K x 14) | 14 KB (8K x 14) +100% | 7 KB (same) | 7 KB (same) | 7 KB (same) | 7 KB (same) |
| RAM Size | 192 bytes | 368 bytes +92% | 192 bytes | 192 bytes | 192 bytes | 192 bytes |
| Operating Voltage | 2.0 V to 5.5 V | 2.0 V to 5.5 V | 4.0 V to 5.5 V - narrower | 2.0 V to 5.5 V | 2.0 V to 5.5 V | 2.0 V to 5.5 V |
| I/O Pins | 33 | 40 +21% | 33 | 33 | 33 | 33 |
| ADC Channels | 8 x 10-bit | 8 x 10-bit | 8 x 10-bit | 8 x 10-bit | 8 x 10-bit | 8 x 10-bit |
| Maximum Speed | 20 MHz / 10 MIPS | 20 MHz / 10 MIPS | 20 MHz / 10 MIPS | 20 MHz / 10 MIPS | 20 MHz / 10 MIPS | 20 MHz / 10 MIPS |
| RoHS Compliance | Compliant | Compliant | Compliant | Compliant | Compliant | Compliant |
Principaux différenciateurs
- Wide 2.0V-5.5V operating voltage for low-voltage and battery designs (vs PIC16F874A-I/ML)
- Larger flash and more I/O available in same QFN-44 package (vs PIC16LF877A-I/ML)
- Surface-mount QFN footprint with exposed thermal pad (vs PIC16LF874A-I/P (DIP-40))
- Enhanced mid-range core with hardware multiplier-friendly instruction set (vs Baseline PIC16C7x)
Notes de conception
The 44-QFN (ML) package has an exposed thermal pad (EP) that must be soldered to a continuous ground plane on the PCB for proper thermal dissipation. At 20 MHz and 5.5V operation, typical current draw is 15-20 mA, producing <100 mW dissipation. For high-I/O-current applications driving many LEDs, ensure adequate copper pour around the EP and provide thermal vias to inner ground planes to keep junction temperature within the -40C to +85C industrial range.
Decouple VDD pins (pin 22 and pin 32) with 100 nF ceramic capacitors placed within 5 mm of each supply pin, plus a single bulk 10 uF tantalum or ceramic capacitor. The QFN-44 footprint has 0.5 mm pitch with a center thermal pad (approximately 6 mm square) that requires 8-12 thermal vias of 0.3 mm diameter to inner ground plane. Use 4-layer PCB if possible to provide a low-impedance ground reference for the ADC.
Configuration bits (fuses) must be set correctly for the chosen oscillator mode (HS, XT, LP, RC) and watchdog timer. Mismatched oscillator configuration prevents startup. The ICSP pins (RB6/PGC, RB7/PGD, MCLR/Vpp) must not be blocked by external circuitry; isolate ICSP signals with series resistors or jumpers during programming. The MSSP peripheral pins (RC3/SCK, RC4/SDI/SDA) require 10 kohm pull-ups for reliable I2C operation.
Keep analog inputs (AN0-AN7) physically separated from switching digital lines on the PCB to minimize ADC noise coupling. Place the VREF+/VREF- capacitors directly at the dedicated reference pins (RA2/RA3) when using external reference. Route the OSC1/OSC2 traces short and symmetric with a ground guard ring to reduce EMI susceptibility. Use a ground plane under the analog section and avoid routing digital signals across it.
Informations de conformité
RoHS compliant per Microchip product page. The standard '-I/ML' part is industrial grade, not AEC-Q100 qualified; for production automotive applications select an AEC-Q100 qualified ordering code. Lead-free (Pb-free) reflow profile per JEDEC J-STD-020.
