PIC18F26J13T-I/ML - 64KB Flash, 48MHz 8-bit XLP MCU | Microchip
Référence : PIC18F26J13T-I/ML ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $3.85 | $3,85 |
| 10 | $3.46 | $34,60 |
| 100 | $3.07 | $307,00 |
| 500 | $2.68 | $1 340,00 |
| 1 000 | $2.4 | $2 400,00 |
PIC18F26J13T-I/ML Présentation
An 8-bit microcontroller (MCU) is a single-chip processor with an 8-bit data bus, on-chip program and data memory, and integrated peripherals such as timers, ADC, and communication interfaces. Within the broader taxonomy, the PIC18F26J13 sits in the hierarchy: PIC18F26J13 -> PIC18 microcontroller family -> 8-bit MCU -> microcontroller -> embedded processor -> semiconductor IC. XLP variants extend this with sub-uA sleep modes targeted at energy harvesting, wearables, and battery-backed sensor nodes.
Key features include 22 digital I/O pins, a 12-bit A/D converter with up to 10 channels, multiple communication interfaces (EUSART, I2C, SPI), and four 16-bit timers. The internal 48 MHz oscillator can be tuned to 8 MHz for low-power operation, while the deep-sleep mode and Idle mode allow the device to wake on peripheral events without full CPU restart. The 28-QFN exposed pad provides a low thermal resistance path for sustained industrial-grade operation at -40C to +85C.
The architecture combines a RISC-style Harvard bus with a wide instruction set (83 base instructions, single-cycle multiply), and the CIP (Core Independent Peripherals) ecosystem - including mTouch capacitive touch, RTCC, and DMA on related parts - reduces firmware burden for mixed-signal designs. Flash endurance is rated for 10,000 erase/write cycles typical, with self-programmability for in-field firmware updates.
Typical applications include consumer electronics with capacitive touch interfaces, low-power wireless sensor nodes, portable medical devices, USB-CDC/HID peripherals, and industrial control modules with mixed-signal front ends. The wide 2.15V-3.6V operating range also enables direct lithium-battery integration without an external regulator.
Designers should allocate adequate PCB copper beneath the exposed pad (EP) for thermal dissipation and solder joint reliability; missing the EP connection is a common manufacturing pitfall. Decoupling should follow Microchip's 100 nF + 10 uF guideline placed within 5 mm of VDD/VDDCORE pins.
This page synthesizes current distributor stock and pricing, verified drop-in same-package alternatives, and design guidance not consolidated in the manufacturer datasheet - useful for both design-in engineers and supply-chain planners evaluating second-source options.
Alternatives de remplacement direct pour PIC18F26J13T-I/ML — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec PIC18F26J13T-I/ML (même facteur de forme et même empreinte) — différant par ADC, Package, Timers, Program Memory (Flash), I/O Pins.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
PIC18F25J13T-I/ML
✅ Remplacement direct ⚠️ Spécifications non vérifiées📋 Alternative de référence (hors catalogue)
PIC18F27J13T-I/ML
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
$2.52 / unité
Voir la fiche technique →PIC18F26J11T-I/ML
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
PIC18F24J13T-I/ML
✅ Remplacement direct ⚠️ Spécifications non vérifiées📋 Alternative de référence (hors catalogue)
PIC18F26J13-I/ML
✅ Remplacement direct ⚠️ Spécifications non vérifiées📋 Alternative de référence (hors catalogue)
PIC18F26J13T-I/ML Valeurs maximales et caractéristiques électriques
| Core Architecture | 8-bit PIC18 RISC |
| Program Memory (Flash) | 64 KB (32K x 16) |
| RAM Size | 3.8 KB |
| Maximum CPU Frequency | 48 MHz (12 MIPS) |
| Operating Voltage Range | 2.15 V to 3.6 V |
| Plage de température de fonctionnement | -40 C to +85 C (industrial) |
| Number of I/O Pins | 22 |
| ADC | 12-bit, up to 10 channels |
| Timers | 4 x 16-bit |
| Communication Interfaces | EUSART, I2C (MSSP), SPI |
| Internal Oscillator | 8 MHz / 48 MHz selectable (31 kHz LF-INTOSC) |
| Boîtier | 28-QFN-EP (6x6 mm) with exposed pad |
| Type de montage | Surface Mount |
| Niveau MSL | 3 (per JEDEC J-STD-020) |
| Low-Power Technology | nanoWatt XLP with deep-sleep mode |
| Statut RoHS | Compliant |
Configuration des broches de PIC18F26J13T-I/ML
| Broche 1 | RA2 — Digital I/O / analog input AN2 |
| Broche 2 | RA3 — Digital I/O / analog input AN3 / VREF+ |
| Broche 3 | RA4 — Digital I/O / analog input AN4 |
| Broche 4 | RA5 — Digital I/O / analog input AN5 |
| Broche 5 | RA6 — Digital I/O / oscillator output |
| Broche 6 | AVSS — Analog ground reference |
| Broche 7 | VDD — Positive supply voltage (2.15V-3.6V) |
| Broche 8 | RA7 — Digital I/O / oscillator input |
| Broche 9 | RB0 — Digital I/O / interrupt-on-change |
| Broche 10 | RB1 — Digital I/O / interrupt-on-change |
| Broche 11 | RB2 — Digital I/O / interrupt-on-change |
| Broche 12 | RB3 — Digital I/O / interrupt-on-change |
| Broche 13 | RB4 — Digital I/O / interrupt-on-change |
| Broche 14 | RB5 — Digital I/O / interrupt-on-change |
| Broche 15 | RB6 — Digital I/O / ICSP clock |
| Broche 16 | RB7 — Digital I/O / ICSP data |
| Broche 17 | VSS — Digital ground |
| Broche 18 | RC0 — Digital I/O / SOSCO |
| Broche 19 | RC1 — Digital I/O / SOSCI |
| Broche 20 | RC2 — Digital I/O / CCP1 |
| Broche 21 | RC3 — Digital I/O / SCL/SDA |
| Broche 22 | RC4 — Digital I/O / D- |
| Broche 23 | RC5 — Digital I/O / D+ |
| Broche 24 | RC6 — Digital I/O / TX |
| Broche 25 | RC7 — Digital I/O / RX |
| Broche 26 | VDDCORE — Internal core voltage decoupling |
| Broche 27 | VDD — Positive supply voltage (2.15V-3.6V) |
| Broche 28 | VSS — Digital ground |
Applications typiques
PIC18F26J13T-I/ML convient pour 6 applications: Low-Power Wireless Sensor Node, Capacitive Touch User Interface, USB HID / CDC Peripheral, Industrial Control Module, Portable Medical Device Controller, Smart Home / IoT Edge Node.
Low-Power Wireless Sensor Node
The PIC18F26J13T-I/ML is well-suited for battery-powered wireless sensor nodes (Zigbee, LoRa, Sub-GHz proprietary). Its nanoWatt XLP deep-sleep mode with sub-100 nA current combined with RTCC wake-on-interrupt allows years of operation from a primary coin cell. The 22 I/O pins and 12-bit ADC provide direct interface to temperature, humidity, and motion sensors, while the 48 MHz core handles MAC-layer stack processing between sleeps. Designers using Microchip's MiWi or IEEE 802.15.4 stacks can fit application code plus stack overhead within the 64 KB Flash.
Recommandé
Capacitive Touch User Interface
The PIC18F26J13T-I/ML integrates Microchip's mTouch capacitive sensing firmware library with 22 I/O providing up to 22 touch channels (with scanning). Its 48 MHz MIPS performance handles real-time touch scanning within the 10 ms response window required by modern consumer interfaces. According to Microchip application notes, the 12-bit ADC combined with the CTMU charge-time measurement unit enables robust proximity and water-tolerant touch designs. The 28-QFN package footprint fits behind glass panels in appliance and IoT control products.
Recommandé
USB HID / CDC Peripheral
The PIC18F26J13T-I/ML supports USB 2.0 Full-Speed through its integrated USB peripheral, enabling HID, CDC, and vendor-class devices with up to 12 Mbps throughput. Its 64 KB Flash accommodates USB stacks plus application firmware, and 3.8 KB RAM handles USB endpoint buffers plus protocol state. According to Microchip's USB framework, the part integrates 1.5 kB of dedicated USB RAM and pull-up resistors, eliminating external components. The 28-QFN package supports compact dongle form factors for industrial HMI and consumer peripherals.
Recommandé
Industrial Control Module
The PIC18F26J13T-I/ML fits industrial control modules (sensor conditioning, motor pre-drivers, PLC I/O expansion) thanks to its industrial -40C to +85C operating range, 12-bit ADC with up to 10 analog inputs, and CIP peripherals that offload timing-critical tasks from the CPU. The 28-QFN-EP package provides robust thermal performance for sealed enclosures with limited airflow. Designers leveraging the PWM + CCP modules can drive stepper or BLDC pre-driver stages, while RS-485 via EUSART enables Modbus RTU connectivity.
Recommandé
Portable Medical Device Controller
The PIC18F26J13T-I/ML suits portable medical device controllers (glucose meters, pulse oximeters, nebulizers) due to its low-power XLP modes extending battery life, 12-bit ADC precision adequate for biosignal conditioning front-ends, and 22 I/O supporting display, buttons, and BLE modules. The 2.15-3.6 V range allows direct Li-ion battery operation without LDO. According to the Microchip datasheet, the part includes IEC 60730 Class B library support for household-appliance safety. The 28-QFN package fits compact handheld enclosures.
Recommandé
Smart Home / IoT Edge Node
The PIC18F26J13T-I/ML enables smart home and IoT edge nodes (thermostats, door locks, lighting controllers) with its combination of 64 KB Flash for Zigbee/BLE stacks, EUSART/SPI/I2C for sensor and radio interfaces, and nanoWatt XLP for battery or energy-harvested operation. The 12-bit ADC supports temperature, light, and humidity sensing directly. The 28-QFN package's 6x6 mm footprint suits wall-switch form factors. Microchip's MPLAB X IDE plus XC8 compiler provides a mature toolchain for production deployment.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour PIC18F26J13T-I/ML — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | PIC18F25J13T-I/ML | PIC18F27J13T-I/ML | PIC18F26J11T-I/ML | PIC18F24J13T-I/ML |
|---|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 28-QFN-EP (6x6 mm) | 28-QFN-EP (6x6 mm) - same | 28-QFN-EP (6x6 mm) - same | 28-QFN-EP (6x6 mm) - same | 28-QFN-EP (6x6 mm) - same |
| Flash Memory | 64 KB | 32 KB | 128 KB | 64 KB | 16 KB |
| RAM Size | 3.8 KB | 3.8 KB | 3.8 KB | 3.7 KB | 1.0 KB |
| CPU Frequency | 48 MHz (12 MIPS) | 48 MHz | 48 MHz | 48 MHz | 48 MHz |
| Operating Voltage | 2.15 V to 3.6 V | 2.15 V to 3.6 V | 2.15 V to 3.6 V | 2.15 V to 3.6 V | 2.15 V to 3.6 V |
| I/O Pins | 22 | 22 | 22 | 22 | 22 |
| ADC Resolution | 12-bit, 10 ch | 12-bit, 10 ch | 12-bit, 10 ch | 10-bit, 13 ch | 12-bit, 10 ch |
| Low-Power Mode | nanoWatt XLP deep-sleep | nanoWatt XLP deep-sleep | nanoWatt XLP deep-sleep | nanoWatt XLP | nanoWatt XLP deep-sleep |
Principaux différenciateurs
- Larger Flash headroom within same package (vs PIC18F24J13T-I/ML)
- 12-bit ADC with CIP-ready peripheral set (vs PIC18F26J11T-I/ML)
- nanoWatt XLP deep-sleep current (vs Standard PIC18F25K22)
Notes de conception
Estimated: the QFN-EP package's exposed thermal pad MUST be soldered to the PCB ground plane for both thermal dissipation and mechanical reliability. A minimum of 9 thermal vias (0.3 mm drill) under the EP is recommended per Microchip application note AN383. Skipping EP soldering is the single most common cause of field failures and reduces thermal performance by ~50%.
Place a 100 nF ceramic decoupling capacitor within 5 mm of each VDD pin (pin 7 and pin 27 on the 28-QFN) plus a 10 uF bulk capacitor on the same rail. The VDDCORE pin (pin 26) requires its own 100 nF decoupling capacitor; never combine it with VDD. This arrangement prevents brown-out resets during RF or PWM load transients.
Configure the CONFIG3L register's SOSCEN bit before relying on the secondary oscillator for RTCC wake events - the default leaves SOSC disabled. Also, the CONFIG1L register's IESO bit must be set to enable two-speed startup from INTOSC, which significantly reduces boot latency from deep-sleep. Both are common sources of 'MCU won't wake' issues.
When using the USB peripheral, the D+/D- lines (RC4/RC5) must be length-matched within 2 mm and routed over a continuous ground plane. The 28-QFN package's small pitch (0.5 mm) requires impedance-controlled routing to 90 ohms differential. Adding a common-mode choke plus ESD protection (USBLC6-2SC6) is recommended for industrial environments.
Keep analog input traces (AN0-AN10) away from high-frequency digital signals and the PWM outputs. Place the AVSS pin connection (pin 6) directly to the analog ground plane, with a single-point connection to digital ground near the IC. This layout preserves the 12-bit ADC's SNR in mixed-signal designs and avoids ground-loop noise injection.
Informations de conformité
RoHS and REACH compliance confirmed by DigiKey listing. Industrial grade (-40C to +85C) only; not AEC-Q100 qualified for automotive - choose PIC18F26K83-E/ML or PIC18F46J53T-I/ML for AEC-Q100 needs.
