PIC18F26K83-E/SSVAO - 64KB Flash, CAN, AEC-Q100 8-bit MCU | Microchip
Référence : PIC18F26K83-E/SSVAO ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $4.2 | $4,20 |
| 10 | $3.85 | $38,50 |
| 100 | $3.42 | $342,00 |
| 500 | $3.05 | $1 525,00 |
| 1 000 | $2.74 | $2 740,00 |
PIC18F26K83-E/SSVAO Présentation
This device belongs to the PIC18 (L)F25/26K83 family of low-power, high-performance microcontrollers. An 8-bit microcontroller (MCU) is a single-chip computer that integrates a CPU, non-volatile program memory (Flash), working RAM, EEPROM, and a rich set of peripherals such as timers, ADC, communication controllers, and I/O into one package. The K83 sub-family adds CAN, ADC2 with Capacitive Voltage Divider (CVD) for touch sensing, vector interrupts, DMA, and comparators, placing it in the mid-range of Microchip's enhanced PIC18 portfolio, suitable for industrial and automotive designs requiring deterministic real-time response.
Key features include 64 KB self-programmable Flash, 4 KB SRAM, 1 KB EEPROM, a 12-bit ADC2 with up to 24 channels, three op-amps configurable as comparators, multiple communication peripherals including CAN FD, SPI, I2C, UART with LIN, and DMA for offloading core data movement. The core executes most instructions in one cycle at 64 MHz, delivering up to 16 MIPS, while the integrated nanoWatt XLP power management minimizes active and sleep currents for battery-aware designs.
Architecturally, the device couples a Harvard RISC core with a wide peripheral set and Direct Memory Access (DMA), allowing deterministic data flow between ADC, communication modules, and memory without CPU intervention. ADC2 adds hardware averaging, oversampling, filtering, and threshold comparisons, enabling capacitive touch and precision sensor measurements while freeing the CPU for application logic.
Typical applications include automotive body and comfort modules (lighting, seat, HVAC, mirror control), industrial CAN nodes (sensor hubs, motor control companions, isolated gateways), touch-sensing user interfaces using CVD, and home appliances requiring AEC-Q100 grade reliability and a CAN bus interface.
When designing with this part, ensure the SSOP-28 land pattern is used and that unused pins are tied to defined logic levels per Microchip guidance. Verify CAN bus termination (typically 120 ohm at each end of the trunk) and place decoupling capacitors close to VDD/VSS pairs to support the ADC2 and CAN transceiver cleanly.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet.
Alternatives de remplacement direct pour PIC18F26K83-E/SSVAO — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec PIC18F26K83-E/SSVAO (même facteur de forme et même empreinte) — différant par ADC, Package, Program Memory (Flash), Core Architecture, Instruction Throughput.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
PIC18F26K83-I/SSVAO
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
PIC18F25K83-E/SS
✅ Remplacement direct✓ En stock
$2.28 / unité
Voir la fiche technique →PIC18F26K83-E/SSVAO Valeurs maximales et caractéristiques électriques
| Core Architecture | PIC18 (8-bit RISC, Harvard) |
| Program Memory (Flash) | 64 KB |
| Data Memory (SRAM) | 4 KB |
| EEPROM | 1 KB |
| Maximum CPU Frequency | 64 MHz |
| Instruction Throughput | Up to 16 MIPS |
| ADC | 12-bit ADC2 with Computation (CVD, averaging, oversampling) |
| CAN | Yes (CAN FD) |
| DMA | Yes |
| Comparators | 3 (configurable with op-amp outputs) |
| Température de fonctionnement | -40C to +125C (extended) |
| Operating Voltage | 2.3 V to 5.5 V |
| Boîtier | SSOP-28 (5.30 mm width) |
| Type de montage | Surface Mount |
| AEC-Q100 | Qualified |
| Statut RoHS | Compliant |
Configuration des broches de PIC18F26K83-E/SSVAO
| Broche 1 | RA0 — Analog/Digital I/O |
| Broche 2 | RA1 — Analog/Digital I/O |
| Broche 3 | RA2 — Analog/Digital I/O |
| Broche 4 | RA3 — Analog/Digital I/O |
| Broche 5 | RA4 — Analog/Digital I/O |
| Broche 6 | RA5 — Analog/Digital I/O |
| Broche 7 | RA6 — Analog/Digital I/O / OSC2 |
| Broche 8 | RA7 — Analog/Digital I/O / OSC1 |
| Broche 9 | VSS — Ground |
| Broche 10 | VDD — Positive supply voltage |
| Broche 11 | RB0 — Digital I/O / INT0 |
| Broche 12 | RB1 — Digital I/O / INT1 |
| Broche 13 | RB2 — Digital I/O / INT2 |
| Broche 14 | RB3 — Digital I/O |
| Broche 15 | RB4 — Digital I/O |
| Broche 16 | RB5 — Digital I/O |
| Broche 17 | RB6 — Digital I/O / PGC (ICSP clock) |
| Broche 18 | RB7 — Digital I/O / PGD (ICSP data) |
| Broche 19 | RC0 — Digital I/O |
| Broche 20 | RC1 — Digital I/O |
| Broche 21 | RC2 — Digital I/O |
| Broche 22 | RC3 — Digital I/O / SCL |
| Broche 23 | RC4 — Digital I/O / SDA |
| Broche 24 | RC5 — Digital I/O |
| Broche 25 | RC6 — Digital I/O / TX |
| Broche 26 | RC7 — Digital I/O / RX |
| Broche 27 | RE3 — Digital I/O / MCLR |
| Broche 28 | AVDD — Analog positive supply |
Applications typiques
PIC18F26K83-E/SSVAO convient pour 6 applications: Automotive Body Control Module, Industrial CAN Sensor Hub, Capacitive Touch User Interface, HVAC Climate Control Module, Battery-Powered IoT Sensor Node, Automotive Lighting Controller.
Automotive Body Control Module
The PIC18F26K83-E/SSVAO fits automotive BCM designs thanks to its AEC-Q100 qualification, CAN FD interface, and 64 KB Flash for protocol stacks plus application logic. Its 12-bit ADC2 supports up to 24 channels for body sensors, and the DMA engine offloads repetitive peripheral transactions, freeing the 16 MIPS core for lighting, mirror, and seat control algorithms. The SSOP-28 footprint suits space-constrained PCB modules behind the dash, while the extended -40C to +125C temperature range handles under-hood adjacent environments. Engineer's tip: place the SSOP-28 device near the CAN transceiver with a 120 ohm split termination, and use a ferrite bead on the VDD rail feeding the ADC2 to suppress switching noise that would otherwise degrade touch-sensing measurements.
Recommandé
Industrial CAN Sensor Hub
For industrial CAN sensor hubs, the PIC18F26K83-E/SSVAO delivers 64 KB Flash for CANopen or J1939 stacks, 4 KB SRAM for buffering telemetry, and 1 KB EEPROM for non-volatile node configuration. The DMA + ADC2 combination captures analog sensor data at high sample rates without CPU intervention, ideal for multi-channel pressure, flow, or temperature aggregation. With AEC-Q100 and an extended -40C to +125C temperature grade, the part withstands factory-floor thermal stress and meets automotive-grade reliability expectations. Use a 5V regulator, isolated CAN transceiver, and proper TVS protection to harden the design against ESD and surge transients common in industrial cabinets.
Recommandé
Capacitive Touch User Interface
The PIC18F26K83-E/SSVAO's ADC2 with Capacitive Voltage Divider (CVD) hardware automates touch-button and slider measurements, including averaging, oversampling, and threshold detection. This allows a single MCU to replace an external touch IC, reducing BOM cost and PCB area for HMI panels, appliances, and automotive interior switches. The 12-bit resolution and dedicated CVD sequence engine deliver robust performance against moisture and noise. Pair the device with a low-leakage PCB layout (guard rings around touch electrodes) and use the DMA engine to stream ADC results into RAM without CPU overhead, ensuring consistent response times across the touch surface.
Recommandé
HVAC Climate Control Module
Automotive HVAC modules benefit from the PIC18F26K83-E/SSVAO's CAN FD bus interface for body-network communication and ADC2's multi-channel analog inputs for NTC temperature sensors and blower feedback. The 64 KB Flash accommodates PID control loops, blower speed curves, and diagnostic routines, while the 4 KB SRAM buffers sensor data for the 16 MIPS core to process in real time. The AEC-Q100 qualification and extended temperature range ensure reliable operation across cold-start and summer cabin heat conditions. Reference design pattern: use PWM outputs for blower motor drive with MOSFET gate drivers, and use the built-in comparators for over-current protection.
Recommandé
Battery-Powered IoT Sensor Node
For battery-powered IoT sensor nodes, the PIC18F26K83-E/SSVAO leverages Microchip's nanoWatt XLP technology for low sleep current, plus DMA to wake, sample, transmit, and return to sleep efficiently. With 64 KB Flash, the device supports over-the-air firmware update stubs or protocol stacks like LoRaWAN MAC. ADC2 enables high-precision sensor measurements from a 3.6 V lithium primary cell across the 2.3 V to 5.5 V operating range. Use the integrated op-amp to amplify low-level sensor signals before digitization, reducing external analog components and extending battery life. Best practice: enable deep sleep, gate unused peripherals with PMD bits, and use the RTCC for scheduled wake events.
Recommandé
Automotive Lighting Controller
The PIC18F26K83-E/SSVAO controls LED matrix headlamps, tail lamps, and interior ambient lighting through its multiple PWM outputs, timers, and DMA-driven sequencing. AEC-Q100 qualification ensures compliance with automotive EMC and reliability requirements, while 64 KB Flash holds animation profiles, diagnostic routines, and LIN/CAN stack. The 12-bit ADC reads photodiode feedback for adaptive lighting and detects open/short LED faults via current-sense resistors. Reference design: drive high-side LEDs via MOSFET switches, use gate driver ICs when current exceeds MCU pin drive capability, and isolate the CAN FD bus with a transformer or capacitive isolator for high-voltage LED driver stages.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour PIC18F26K83-E/SSVAO — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | PIC18F26K83-I/SSVAO | PIC18F25K83-E/SS | PIC18F25K83T-I/MX |
|---|---|---|---|---|
| Package | SSOP-28 (5.30 mm) | SSOP-28 - same | SSOP-28 - same | UQFN-28 - different |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Program Memory (Flash) | 64 KB | 64 KB | 32 KB | 32 KB |
| SRAM | 4 KB | 4 KB | 2 KB | 2 KB |
| EEPROM | 1 KB | 1 KB | 1 KB | 1 KB |
| Max CPU Frequency | 64 MHz | 64 MHz | 64 MHz | 64 MHz |
| CAN | CAN FD | CAN FD | CAN FD | CAN FD |
| AEC-Q100 | Yes | No (industrial grade) | Yes | No (industrial grade) |
| Operating Temperature | -40C to +125C | -40C to +85C | -40C to +125C | -40C to +85C |
Principaux différenciateurs
- Highest-density Flash in the K83 SSOP-28 family (vs PIC18F25K83-E/SS)
- Automotive AEC-Q100 qualification (vs PIC18F26K83-I/SSVAO)
- SSOP-28 with standard 5.30 mm body width (vs PIC18F25K83T-I/MX)
Notes de conception
Place a 100 nF ceramic decoupling capacitor as close as possible to each VDD/AVDD pin and a bulk 10 uF tantalum or ceramic capacitor near the MCU to handle transient current spikes from CAN transmissions and ADC conversions. For noise-sensitive ADC2 measurements, use a ferrite bead between digital VDD and analog AVDD, plus a 10 uF + 100 nF cap stack on AVDD. Estimated: a CAN FD frame at 5 Mbps with a fully loaded bus can draw source instantaneous over 100 mA, so bulk capacitor sizing should account for this.
The SSOP-28 package has a theta_JA around 70 C/W on a standard 4-layer JEDEC test PCB. At maximum ambient (125C) and full peripheral activity (CAN + ADC + DMA), the die may approach its 150C junction limit. For under-hood automotive designs, keep ambient temperature budget below 110C or add thermal copper relief under the exposed pad routing area. Estimated: with 60 mA active current at 5V, self-heating contributes approximately 20C temperature rise on the standard JEDEC board.
Route the CANH and CANL traces as a differential pair with 120 ohm differential impedance, keep them short, and avoid crossing them with switching signals. Place the CAN termination resistor (typically 120 ohm) at each end of the bus segment. Keep analog sensor traces away from digital and CAN traces; use a ground guard ring around ADC input pins to minimize leakage into ADC2 measurements. Ensure the ICSP pins (RB6/RA6/MCLR) have accessible test pads for in-circuit programming and debugging.
Do not leave MCLR floating - tie it to VDD through a 10 kohm pull-up resistor to ensure proper reset behavior, optionally with a manual reset push-button to ground. When using the internal oscillator, configure the OSCCON and OSCTUNE registers carefully to meet CAN timing accuracy requirements; CAN FD typically requires a higher-precision clock source. For ADC2 touch-sensing applications, ensure the CVD sequence timing matches the datasheet reference values for stable measurements across temperature. Avoid configuring analog pins as outputs inadvertently, which can cause unexpected current draw and latch-up.
Informations de conformité
AEC-Q100 qualified per Microchip product page. RoHS compliant. Halogen-free per Microchip environmental compliance data.
