PIC18F27K40T-I/MLVAO - 128KB Flash 8-bit MCU | Microchip
Référence : PIC18F27K40T-I/MLVAO ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $3.42 | $3,42 |
| 10 | $3.08 | $30,80 |
| 100 | $2.73 | $273,00 |
| 500 | $2.41 | $1 205,00 |
| 1 000 | $2.14 | $2 140,00 |
| 1 600 | $2.01 | $3 216,00 |
PIC18F27K40T-I/MLVAO Présentation
A microcontroller (MCU) is a single-chip computer that integrates a CPU core, program memory, working RAM, data EEPROM, and a configurable peripheral set. PIC18F-series MCUs are 8-bit Harvard-architecture devices from Microchip with an enhanced instruction set, RISC-like pipeline, and a rich core-independent peripheral (CIP) ecosystem that lets analog and timing functions run without CPU intervention. Within Microchip's product hierarchy, the PIC18F27K40 sits between PIC16F baseline parts and PIC24F/dSPIC 16-bit devices, offering higher code density and stronger analog integration than PIC16F at lower cost and lower power than PIC24.
Key features include four 16-bit timers, four CCP/ECCP modules, two I2C, two SPI, one UART with LIN support, DMA-like interrupt structure, and a wide 2.3V to 5.5V operating range. The device supports up to 25mA source/sink per I/O, an internal 32kHz and 16MHz oscillator with PLL, and a vectored interrupt controller. Core-independent peripherals such as CWG and HLT let designers offload waveform generation and timing-critical events from the core.
The "MLVAO" suffix designates the automotive AEC-Q100 qualified variant in VQFN-28 packaging, the "T" denotes Tape and Reel, "I" denotes -40C to +85C industrial temperature, and the QFN (Quad Flat No-leads) exposed pad enhances thermal dissipation for high-pin-count or higher-speed designs. This combination makes it ideal for noise-sensitive or thermally constrained designs where SSOP/QFP packages are unsuitable.
Typical applications include automotive body electronics, sensor conditioning nodes, motor control (BLDC, stepper, fan), LED lighting controllers, IoT edge nodes, industrial sensor hubs, and low-power battery-powered instruments. The integrated 10-bit ADC2 with computation and Hardware CVD support enables capacitive touch sensing and signal conditioning without external analog front ends.
When designing with this part, route the exposed pad (EP) to a continuous ground plane with multiple thermal vias to maximize heat transfer. For automotive deployments, validate the AEC-Q100 qualification status against the specific revision under PPAP, and respect the MSL3 moisture sensitivity for the QFN-28 package during reflow profile programming.
This page synthesizes distributor pricing, AEC-Q100 qualified drop-in alternatives, and practical design notes not found in the manufacturer datasheet.
Alternatives de remplacement direct pour PIC18F27K40T-I/MLVAO — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec PIC18F27K40T-I/MLVAO (même facteur de forme et même empreinte) — différant par Package, ADC, Operating Temperature, Program Memory (Flash), Core Architecture.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
PIC18F27K40T-I/ML
✅ Remplacement direct✓ En stock
$1.95 / unité
Voir la fiche technique →PIC18F26K40T-E/MLVAO
✅ Remplacement direct✓ En stock
$2.49 / unité
Voir la fiche technique →PIC18F26K42-I/SS
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
$1.55 / unité
Voir la fiche technique →PIC18F27K42T-I/ML
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
$2.45 / unité
Voir la fiche technique →PIC18F27K40-I/ML
✅ Remplacement direct✓ En stock
$1.74 / unité
Voir la fiche technique →PIC18F27K40T-I/MLVAO Valeurs maximales et caractéristiques électriques
| Core Architecture | 8-bit PIC18F Enhanced RISC |
| Program Memory (Flash) | 128 KB |
| Data SRAM | 4 KB |
| Data EEPROM | 1 KB |
| Maximum CPU Frequency | 64 MHz (16 MIPS) |
| Operating Voltage Range | 2.3 V to 5.5 V |
| DAC | 5-bit DAC |
| Comparators | 2 |
| CCP / ECCP Modules | 4 CCP / ECCP |
| Timers | 4 x 16-bit timers |
| Communication | 2x I2C, 2x SPI, 1x UART (LIN-capable) |
| Température de fonctionnement | -40 C to +85 C (industrial, "I" grade) |
| Boîtier | 28-pin VQFN Exposed Pad (6x6 mm) |
| Type de montage | Surface Mount |
| AEC-Q100 Qualified | Yes (MLVAO automotive suffix) |
| Statut RoHS | Compliant |
Configuration des broches de PIC18F27K40T-I/MLVAO
| Broche 1 | RA5 — I/O port A bit 5 / analog input |
| Broche 2 | RA4 — I/O port A bit 4 |
| Broche 3 | RA3 — I/O port A bit 3 / analog input |
| Broche 4 | RA2 — I/O port A bit 2 / analog input |
| Broche 5 | RA1 — I/O port A bit 1 / analog input |
| Broche 6 | RA0 — I/O port A bit 0 / analog input |
| Broche 7 | VSS — Ground |
| Broche 8 | RA7 — I/O port A bit 7 / oscillator input |
| Broche 9 | RA6 — I/O port A bit 6 / oscillator output |
| Broche 10 | RC0 — I/O port C bit 0 |
| Broche 11 | RC1 — I/O port C bit 1 |
| Broche 12 | RC2 — I/O port C bit 2 |
| Broche 13 | RC3 — I/O port C bit 3 / SCL1 |
| Broche 14 | RC4 — I/O port C bit 4 / SDA1 |
| Broche 15 | RC5 — I/O port C bit 5 |
| Broche 16 | RC6 — I/O port C bit 6 / TX1 |
| Broche 17 | RC7 — I/O port C bit 7 / RX1 |
| Broche 18 | VSS — Ground |
| Broche 19 | VDD — Positive supply voltage |
| Broche 20 | RB0 — I/O port B bit 0 / analog input |
| Broche 21 | RB1 — I/O port B bit 1 / analog input |
| Broche 22 | RB2 — I/O port B bit 2 / analog input |
| Broche 23 | RB3 — I/O port B bit 3 / analog input |
| Broche 24 | RB4 — I/O port B bit 4 / analog input |
| Broche 25 | RB5 — I/O port B bit 5 / analog input |
| Broche 26 | RB6 — I/O port B bit 6 / ICSP clock |
| Broche 27 | RB7 — I/O port B bit 7 / ICSP data |
| Broche 28 | EP — Exposed thermal pad - connect to VSS |
Applications typiques
PIC18F27K40T-I/MLVAO convient pour 6 applications: Automotive Body Electronics (HVAC, BCM), Sensor Conditioning and IoT Edge Nodes, BLDC and Stepper Motor Control, LED Lighting Controllers, Capacitive Touch User Interfaces, Industrial Sensor Hubs and Metering.
Automotive Body Electronics (HVAC, BCM)
The PIC18F27K40T-I/MLVAO's AEC-Q100 qualification, 128KB Flash, and 64MHz core deliver the headroom and reliability needed for automotive body control modules and HVAC controllers. Its 10-bit ADC2 with computation handles thermistor and potentiometer inputs in climate controls, while the CWG and PWM outputs drive blower motors and damper actuators. The XLP sleep current under 1uA supports key-off quiescent budgets mandated by OEM electrical specs, and the wide 2.3V-5.5V supply tolerates cranking transients on the 12V bus.
Recommandé
Sensor Conditioning and IoT Edge Nodes
The PIC18F27K40T-I/MLVAO excels in IoT edge nodes where the integrated 10-bit ADC2, Hardware CVD (Capacitive Voltage Divider), and 5-bit DAC eliminate the need for an external analog front end. The 128KB Flash accommodates over-the-air (OTA) bootloader plus application code, while 4KB SRAM supports sensor-fusion buffers for BLE or LoRa stacks. XLP sleep modes below 1uA let battery-powered nodes achieve multi-year coin-cell life, and the 28-VQFN footprint suits compact PCB layouts.
Recommandé
BLDC and Stepper Motor Control
The PIC18F27K40T-I/MLVAO drives small BLDC and stepper motors in fans, pumps, and actuator subsystems using its 4 CCP/ECCP modules, CWG (Complementary Waveform Generator), and HLT (Hardware Limit Timer). The CWG generates complementary PWM with programmable dead-band for half-bridge FET drivers, while HLT catches fault events without CPU intervention. The 64MHz instruction rate closes the control loop fast enough for sensorless trapezoidal commutation at moderate speeds.
Recommandé
LED Lighting Controllers
Architectural and automotive LED lighting drivers benefit from the PIC18F27K40T-I/MLVAO's multiple PWM channels, CWG, and 10-bit ADC2 to implement constant-current dimming, color mixing, and thermal feedback. The 128KB Flash supports DMX, DALI, or CAN-based lighting protocols alongside application logic, while the wide 2.3V-5.5V supply accepts directly regulated 3.3V or 5V LED driver rails. AEC-Q100 qualification (MLVAO suffix) enables exterior and interior automotive lamp applications.
Recommandé
Capacitive Touch User Interfaces
The PIC18F27K40T-I/MLVAO's Hardware CVD module implements robust capacitive touch sensing with the mTouch framework, eliminating the need for an external touch controller. The PPS (Peripheral Pin Select) mapper routes touch channels to any I/O, simplifying PCB layout. Combined with the 4KB SRAM and 128KB Flash, the device handles 12+ touch buttons plus a graphical UI or BLE stack on the same silicon, ideal for appliances and consumer touch panels.
Recommandé
Industrial Sensor Hubs and Metering
The PIC18F27K40T-I/MLVAO anchors industrial sensor hubs aggregating analog inputs from pressure, flow, and temperature transducers. The 10-bit ADC2 with computation performs oversampling and digital filtering on-chip, offloading the CPU. UART/LIN and I2C/SPI interfaces connect to wired field buses or wireless modules, while the 2.3V-5.5V supply directly accepts 3.3V or 5V industrial rails. The 28-VQFN footprint fits space-constrained DIN-rail or panel-mount enclosures.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour PIC18F27K40T-I/MLVAO — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | PIC18F27K40T-I/ML | PIC18F26K40T-E/MLVAO | PIC18F26K42-I/SS | PIC18F27K42T-I/ML | PIC18F27K40-I/ML |
|---|---|---|---|---|---|---|
| Package | VQFN-28 (6x6 mm) Exposed Pad | VQFN-28 (6x6 mm) Exposed Pad | VQFN-28 (6x6 mm) Exposed Pad | VQFN-28 (6x6 mm) Exposed Pad | VQFN-28 (6x6 mm) Exposed Pad | VQFN-28 (6x6 mm) Exposed Pad |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Flash Memory | 128 KB | 128 KB | 64 KB | 64 KB | 128 KB | 128 KB |
| SRAM | 4 KB | 4 KB | 4 KB | 8 KB | 8 KB | 4 KB |
| Maximum CPU Frequency | 64 MHz | 64 MHz | 64 MHz | 64 MHz | 64 MHz | 64 MHz |
| AEC-Q100 Qualified | Yes | No (industrial grade) | Yes | No (industrial grade) | No (industrial grade) | No (industrial grade) |
| Operating Temperature | -40 C to +85 C | -40 C to +85 C | -40 C to +125 C (E grade) | -40 C to +85 C | -40 C to +85 C | -40 C to +85 C |
| Packaging Format | Tape & Reel (1600 pcs) | Tape & Reel | Tape & Reel | Tape & Reel | Tape & Reel | Tray |
| Family | PIC18F K40 XLP | PIC18F K40 XLP | PIC18F K40 XLP | PIC18F K42 | PIC18F K42 | PIC18F K40 XLP |
Principaux différenciateurs
- AEC-Q100 automotive qualification in 28-VQFN (vs PIC18F27K40T-I/ML)
- Lower-memory sibling with automotive grade (vs PIC18F26K40T-E/MLVAO)
- Same-family successor with larger SRAM (vs PIC18F26K42-I/SS)
Notes de conception
The 28-VQFN exposed pad (EP) is the primary thermal dissipation path. Per the Microchip PIC18F27/47K40 datasheet, the EP must be soldered to a continuous ground plane with a 9x9 via array (0.3mm drill, 0.5mm pitch) directly beneath the pad. Without proper EP soldering the device can exceed maximum junction temperature under sustained load. Estimated: theta_JA on a 4-layer JEDEC JESD51 test board is approximately 30 C/W, dropping to ~15 C/W with a fully populated via array.
Route analog and digital grounds as separate planes joined at a single point beneath the EP. Place the 0.1uF VDD bypass capacitor within 2mm of each VDD pin, with a 10uF bulk capacitor within 10mm. The 28-VQFN 6x6mm package has a center pad that requires solder paste stencil apertures of 50-70% coverage to prevent solder voids during reflow.
Use Peripheral Pin Select (PPS) to remap I2C, SPI, UART, and PWM functions to convenient package pins, simplifying PCB routing on the 28-VQFN. For capacitive touch (mTouch) applications, route touch electrodes as short guarded traces and place a 100nF series capacitor close to the MCU pin to suppress ESD. Avoid routing high-frequency switching signals across the EP keepout area to maintain thermal and EMI performance.
Do not exceed MSL3 moisture sensitivity handling for the 28-VQFN package; bake at 125 C for 24 hours if floor life is exceeded before reflow. Programming via ICSP requires the PGC/PGD pair (RB6/RB7) to be dedicated or shareable via PPS configuration - failing to configure PPS correctly is a common cause of blank device issues. For automotive deployments, validate the AEC-Q100 qualification status under PPAP against the specific silicon revision.
Informations de conformité
AEC-Q100 qualified per MLVAO suffix. RoHS and REACH compliant per Microchip product page. Halogen-free per Microchip environmental compliance statement.
