PIC18F47K40-E/PT - 8-bit 64MHz 128KB Flash MCU 44-TQFP | Microchip
Référence : PIC18F47K40-E/PT ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $4.04 | $4,04 |
| 10 | $3.74 | $37,40 |
| 100 | $3.04 | $304,00 |
| 500 | $2.45 | $1 225,00 |
| 1 000 | $2.1 | $2 100,00 |
PIC18F47K40-E/PT Présentation
An 8-bit PIC microcontroller (MCU) is a microcontroller built around an 8-bit data path Harvard architecture, integrating CPU core, Flash program memory, RAM, EEPROM, peripherals and I/O on a single chip. The PIC18F family extends the baseline PIC16 architecture with 16-bit instructions, enhanced peripherals, and higher code density. PIC microcontrollers belong to the broader category of embedded microcontrollers, which sit under the integrated-circuit (IC) hierarchy alongside DSPs, FPGAs, and microprocessors, and are used wherever deterministic control, low power, and small code footprint matter.
Key features of the PIC18F47K40 include the eXtreme Low Power (XLP) technology with < 100 nA sleep current, a 10-bit ADC with Computation (ADCC) supporting hardware Capacitive Voltage Divider (CVD) for touch sensing, Core Independent Peripherals (CIPs) such as Complementary Waveform Generator (CWG), Windowed Watchdog Timer (WWDT), and CRC/Memory Scan, plus Zero-Cross Detect and Peripheral Pin Select. It also integrates two I²C, two SPI, two UART, and up to 36 I/O pins.
Architecturally, the PIC18F47K40 uses a 16-bit modified Harvard core with an 8-level hardware stack and hardware Multiply/Divide accelerator, achieving 16 MIPS at 64 MHz. The ADCC peripheral pairs a 10-bit ADC with post-processing arithmetic to compute averaging, oversampling, accumulation, and low-pass filtering without CPU intervention, enabling high-throughput sensor sampling with deterministic latency.
Typical applications include capacitive touch user interfaces, automotive body and HVAC modules, industrial sensor hubs, battery-powered IoT nodes, USB-CDC/HID peripherals, and general-purpose embedded control. The combination of 5V tolerance, 128 KB Flash, and XLP current profile allows the same part to serve line-powered industrial nodes and energy-harvesting sensor tiles.
Designers should bias the input supply with a 100 nF decoupling capacitor close to VDD plus a bulk capacitor of at least 1 µF, route the 64 MHz system clock away from analog traces, and leave the exposed thermal pad (if present on the chosen package) soldered to the ground plane for mechanical and thermal integrity. The ICSP/ICD pins must remain accessible for in-circuit programming and debug.
This page synthesizes distributor pricing, drop-in same-package alternatives, and practical design notes that are not found on the manufacturer product page or generic distributor listings, giving engineers and buyers a single reference for selection, sourcing, and implementation.
Alternatives de remplacement direct pour PIC18F47K40-E/PT — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec PIC18F47K40-E/PT (même facteur de forme et même empreinte) — différant par Package, ADC, Comparators, DAC, Core Architecture.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
PIC18F47K40-I/PT
✅ Remplacement direct✓ En stock
$1.4 / unité
Voir la fiche technique →PIC18F47K40T-I/PT
✅ Remplacement direct✓ En stock
$2.1 / unité
Voir la fiche technique →PIC18F47K42-I/PT
✅ Remplacement direct✓ En stock
$2.04 / unité
Voir la fiche technique →PIC18F46K40-I/PT
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
PIC18F47K40-E/PT Valeurs maximales et caractéristiques électriques
| Core Architecture | PIC 8-bit RISC modified Harvard |
| Family | PIC® XLP™ 18K |
| CPU Speed | 64 MHz (16 MIPS) |
| Program Memory (Flash) | 128 KB |
| RAM | 8 KB |
| EEPROM | 1 KB |
| Operating Voltage | 2.3 V to 5.5 V |
| Température de fonctionnement | -40 °C to +125 °C (Extended, E) |
| I/O Pins | 36 |
| ADC | 10-bit with Computation (ADCC), 35 channels |
| Comparators | 2 |
| DAC | 1 x 5-bit |
| Timers | 8-/16-bit, multiple CCP/ECCP |
| Communication | 2x I²C, 2x SPI, 2x UART (with LIN) |
| XLP Sleep Current | < 100 nA typical |
| Boîtier | 44-pin TQFP (10x10 mm) |
| Type de montage | Surface Mount |
| Niveau MSL | 3 |
| Statut RoHS | Compliant |
| AEC-Q100 Qualification | Qualified |
Configuration des broches de PIC18F47K40-E/PT
| Broche 1 | RA0 — Bidirectional I/O, analog input AN0 |
| Broche 2 | RA1 — Bidirectional I/O, analog input AN1 |
| Broche 3 | RA2 — Bidirectional I/O, analog input AN2 |
| Broche 4 | RA3 — Bidirectional I/O, analog input AN3 |
| Broche 5 | RA4 — Bidirectional I/O, analog input AN4 |
| Broche 6 | RA5 — Bidirectional I/O, analog input AN5 |
| Broche 7 | RA6 — Bidirectional I/O, analog input AN6 |
| Broche 8 | RA7 — Bidirectional I/O, analog input AN7 |
| Broche 9 | VSS — Ground reference |
| Broche 10 | VDD — Positive supply, 2.3 V to 5.5 V |
| Broche 11 | RB0 — Bidirectional I/O, INT0, AN8 |
| Broche 12 | RB1 — Bidirectional I/O, AN9 |
| Broche 13 | RB2 — Bidirectional I/O, AN10 |
| Broche 14 | RB3 — Bidirectional I/O, AN11 |
| Broche 15 | RB4 — Bidirectional I/O, AN12 |
| Broche 16 | RB5 — Bidirectional I/O, AN13 |
| Broche 17 | RB6 — Bidirectional I/O, ICD PGC, AN14 |
| Broche 18 | RB7 — Bidirectional I/O, ICD PGD, AN15 |
| Broche 19 | RC0 — Bidirectional I/O, analog input AN16 |
| Broche 20 | RC1 — Bidirectional I/O, analog input AN17 |
| Broche 21 | RC2 — Bidirectional I/O, AN18 |
| Broche 22 | RC3 — Bidirectional I/O, AN19 |
| Broche 23 | RC4 — Bidirectional I/O, AN20 |
| Broche 24 | RC5 — Bidirectional I/O, AN21 |
| Broche 25 | RC6 — Bidirectional I/O, AN22 |
| Broche 26 | RC7 — Bidirectional I/O, AN23 |
| Broche 27 | VSS — Ground reference |
| Broche 28 | VDD — Positive supply, 2.3 V to 5.5 V |
| Broche 29 | RD0 — Bidirectional I/O, AN24 |
| Broche 30 | RD1 — Bidirectional I/O, AN25 |
| Broche 31 | RD2 — Bidirectional I/O, AN26 |
| Broche 32 | RD3 — Bidirectional I/O, AN27 |
| Broche 33 | RD4 — Bidirectional I/O, AN28 |
| Broche 34 | RD5 — Bidirectional I/O, AN29 |
| Broche 35 | RD6 — Bidirectional I/O, AN30 |
| Broche 36 | RD7 — Bidirectional I/O, AN31 |
| Broche 37 | RE0 — Bidirectional I/O, AN5 (alt) |
| Broche 38 | RE1 — Bidirectional I/O, AN6 (alt) |
| Broche 39 | RE2 — Bidirectional I/O, AN7 (alt) |
| Broche 40 | RE3 — Bidirectional I/O, MCLR/Reset |
| Broche 41 | VSS — Ground reference |
| Broche 42 | VDD — Positive supply, 2.3 V to 5.5 V |
| Broche 43 | OSC1 — Crystal/clock input |
| Broche 44 | OSC2 — Crystal/clock output |
Applications typiques
PIC18F47K40-E/PT convient pour 6 applications: Capacitive Touch User Interface, Automotive Body and HVAC Modules, Industrial Sensor Hubs, Battery-Powered IoT Sensor Nodes, USB-CDC/HID Peripherals, General-Purpose Embedded Control.
Capacitive Touch User Interface
The PIC18F47K40-E/PT is ideal for capacitive touch keypads, sliders, and proximity sensors because the integrated 10-bit ADC with Computation (ADCC) and hardware Capacitive Voltage Divider (CVD) automates touch measurement and noise rejection on each scan. The 64 MHz CPU and hardware averaging further reduce CPU load to a few percent, leaving MIPS for UI logic, LEDs, and comms. XLP < 100 nA sleep current extends battery life on wake-on-touch designs. Place CWG and zero-cross detect peripherals at the user's discretion to drive haptics or backlight PWMs.
Recommandé
Automotive Body and HVAC Modules
With AEC-Q100 qualification, -40 °C to +125 °C operation, and 5 V tolerant I/O, the PIC18F47K40-E/PT is well-suited for body-control modules, HVAC blend-door control, seat and mirror actuators, and LIN-bus sensor clusters. The two LIN-capable UARTs and 36 I/O pins handle multiple loads and sensors in a single MCU, while the 128 KB Flash reserves room for LIN stack, fault handling, and bootloaders. The extended temperature grade protects against under-hood thermal stress.
Recommandé
Industrial Sensor Hubs
The PIC18F47K40-E/PT serves as an industrial 4-20 mA loop, RTD, or process-signal aggregator, leveraging the 10-bit ADCC with up to 35 analog inputs, plus the comparators for fast over-range detection. The CWG can produce isolated excitation PWMs, and the ECCP can drive high-resolution analog front-ends. 128 KB Flash accommodates Modbus, IO-Link, or custom protocols; 8 KB RAM buffers large sample arrays before forwarding via UART/SPI/I²C.
Recommandé
Battery-Powered IoT Sensor Nodes
The PIC18F47K40-E/PT's XLP technology delivers < 100 nA sleep current, so a 3.6 V LiSOCl2 cell can power a wake-on-event sensor node for years. The WWDT and CRC peripherals give deterministic watchdog supervision and memory-integrity checks critical for unattended deployments. 36 I/O pins allow direct connection to multiple sensors (temperature, humidity, PIR) without external muxing, and 128 KB Flash reserves space for OTA-capable firmware.
Recommandé
USB-CDC/HID Peripherals
The PIC18F47K40-E/PT can implement USB-CDC virtual COM ports and HID-class devices with bit-banging on the 16-bit I/O bank, paired with the MSSP peripherals for high-speed UART/SPI bridging. 128 KB Flash and 8 KB RAM are sufficient for USB stacks, vendor class firmware, and application logic. The wide 2.3-5.5 V range simplifies bus-powered designs that draw from a 5 V USB rail.
Recommandé
General-Purpose Embedded Control
The PIC18F47K40-E/PT acts as a drop-in main controller for appliance controllers, smart lighting, motor drivers, and display panels where 36 I/O pins, 128 KB Flash, and 5 V tolerance cover the majority of the BOM. The CWG peripheral produces complementary PWMs for half-bridge motor drivers, and the ADCC handles analog feedback in the same scan loop. Industrial temperature range suits white-goods and outdoor enclosures.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour PIC18F47K40-E/PT — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | PIC18F47K40-I/PT | PIC18F47K40T-I/PT | PIC18F47K42-I/PT | PIC18F46K40-I/PT |
|---|---|---|---|---|---|
| Package | 44-TQFP (10x10 mm) | 44-TQFP (10x10 mm) - same | 44-TQFP (10x10 mm) - same | 44-TQFP (10x10 mm) - same | 44-TQFP (10x10 mm) - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Flash Memory | 128 KB | 128 KB | 128 KB | 128 KB | 64 KB (-50%) |
| RAM | 8 KB | 8 KB | 8 KB | 8 KB | 3.6 KB (-55%) |
| Operating Temperature | -40 °C to +125 °C (E) | -40 °C to +85 °C (I) | -40 °C to +85 °C (I) | -40 °C to +85 °C (I) | -40 °C to +85 °C (I) |
| CPU Speed | 64 MHz / 16 MIPS | 64 MHz / 16 MIPS | 64 MHz / 16 MIPS | 64 MHz / 16 MIPS | 64 MHz / 16 MIPS |
| AEC-Q100 Qualified | Yes (E grade) | No (I grade) | No (I grade) | No (I grade) | No (I grade) |
| Unit Price (1 pc) | $4.04 | $3.90 approx | $4.04 approx | $4.30 approx | $3.70 approx |
Principaux différenciateurs
- AEC-Q100 qualified with extended +125 °C operating temperature (vs PIC18F47K40-I/PT)
- Next-generation ADCC with hardware CVD for capacitive touch (vs PIC18F46K22-I/PT)
- 128 KB Flash and 8 KB RAM in 44-TQFP (vs PIC18F46K40-I/PT)
Notes de conception
Place a 100 nF ceramic decoupling capacitor within 3 mm of each VDD pin (pins 10, 28, 42 on this 44-TQFP) and a shared bulk capacitor of at least 1 µF (X7R, 10 V) close to the MCU supply. The ADCC and high-speed system clock draw brief peak currents during ADC sampling, and inadequate decoupling will appear as ADC self-noise or SPI glitches. Estimated: with 64 MHz clock and 35 ADCC channels active, instantaneous supply current can spike 10-20 mA; the bulk cap absorbs that without rail droop.
Route the 64 MHz system clock (X1/X2 or OSC pins) and high-speed digital signals (SPI, PWM, CWG) away from analog traces feeding the ADC. Add a guard ring around the analog pins connected to VSS, and keep the ADCC reference voltage pin (VREF+/VREF-) star-routed back to the analog ground. Keep digital and analog grounds connected only at the MCU's VSS pins to avoid ground-loop noise pickup into the ADC measurement.
Do not float the MCLR/RE3 pin (pin 40); either tie it to VDD through a 10 kΩ pull-up or drive it with a supervisor / reset controller. If left floating, the MCU may randomly enter reset, causing boot loops in production. Also avoid tying I/O pins to outputs that back-power the MCU through ESD diodes when VDD is off - this can cause latch-up or ghost power scenarios. Use the Peripheral Pin Select (PPS) carefully; once locked, the PPS assignment persists across resets until the IOLOCK bit is cleared.
At 64 MHz and 5.5 V supply, the PIC18F47K40-E/PT draws roughly 15 mA active, giving < 100 mW dissipation - well below the 44-TQFP's thermal budget (theta_JA ≈ 60 °C/W). For XLP sleep modes, the XLP oscillator plus RTC module keeps sleep current under 100 nA, suitable for years-long battery life. Estimated: at 25 °C ambient with no copper thermal pad, junction temperature rises by ~6 °C; with a 1 sq-in copper pour on top layer, it falls to ~3 °C rise.
Informations de conformité
AEC-Q100 qualified per Microchip product page; RoHS and REACH compliant per distributor listings.