PIC18F47K40-E/PT - 8-bit 64MHz 128KB Flash MCU 44-TQFP | Microchip
MPN： PIC18F47K40-E/PT ✓ 啟用中PIC18F47K40-E/PT 概覽
An 8-bit PIC microcontroller (MCU) is a microcontroller built around an 8-bit data path Harvard architecture, integrating CPU core, Flash program memory, RAM, EEPROM, peripherals and I/O on a single chip. The PIC18F family extends the baseline PIC16 architecture with 16-bit instructions, enhanced peripherals, and higher code density. PIC microcontrollers belong to the broader category of embedded microcontrollers, which sit under the integrated-circuit (IC) hierarchy alongside DSPs, FPGAs, and microprocessors, and are used wherever deterministic control, low power, and small code footprint matter.
Key features of the PIC18F47K40 include the eXtreme Low Power (XLP) technology with < 100 nA sleep current, a 10-bit ADC with Computation (ADCC) supporting hardware Capacitive Voltage Divider (CVD) for touch sensing, Core Independent Peripherals (CIPs) such as Complementary Waveform Generator (CWG), Windowed Watchdog Timer (WWDT), and CRC/Memory Scan, plus Zero-Cross Detect and Peripheral Pin Select. It also integrates two I²C, two SPI, two UART, and up to 36 I/O pins.
Architecturally, the PIC18F47K40 uses a 16-bit modified Harvard core with an 8-level hardware stack and hardware Multiply/Divide accelerator, achieving 16 MIPS at 64 MHz. The ADCC peripheral pairs a 10-bit ADC with post-processing arithmetic to compute averaging, oversampling, accumulation, and low-pass filtering without CPU intervention, enabling high-throughput sensor sampling with deterministic latency.
Typical applications include capacitive touch user interfaces, automotive body and HVAC modules, industrial sensor hubs, battery-powered IoT nodes, USB-CDC/HID peripherals, and general-purpose embedded control. The combination of 5V tolerance, 128 KB Flash, and XLP current profile allows the same part to serve line-powered industrial nodes and energy-harvesting sensor tiles.
Designers should bias the input supply with a 100 nF decoupling capacitor close to VDD plus a bulk capacitor of at least 1 µF, route the 64 MHz system clock away from analog traces, and leave the exposed thermal pad (if present on the chosen package) soldered to the ground plane for mechanical and thermal integrity. The ICSP/ICD pins must remain accessible for in-circuit programming and debug.
This page synthesizes distributor pricing, drop-in same-package alternatives, and practical design notes that are not found on the manufacturer product page or generic distributor listings, giving engineers and buyers a single reference for selection, sourcing, and implementation.
直接替換替代品，適用於 PIC18F47K40-E/PT — 相同封裝，腳位對腳位相容。需重新設計 PCB 的不同封裝零件不列入。
此系列的變體
與下列產品可直接替換的同系列型號： PIC18F47K40-E/PT （相同外形與佔位） — 差異在於 Package, ADC, Comparators, DAC, Core Architecture.
PIC18F47K40-I/PT
✅ 直接替換聯絡詢價
查看資料表 →PIC18F47K40T-I/PT
✅ 直接替換聯絡詢價
查看資料表 →PIC18F47K42-I/PT
✅ 直接替換聯絡詢價
查看資料表 →PIC18F46K40-I/PT
✅ 直接替換📋 參考替代品（不在目錄中）
PIC18F47K40-E/PT 最大額定值與電氣特性
| Core Architecture | PIC 8-bit RISC modified Harvard |
| Family | PIC® XLP™ 18K |
| CPU Speed | 64 MHz (16 MIPS) |
| Program Memory (Flash) | 128 KB |
| RAM | 8 KB |
| EEPROM | 1 KB |
| Operating Voltage | 2.3 V to 5.5 V |
| 工作溫度 | -40 °C to +125 °C (Extended, E) |
| I/O Pins | 36 |
| ADC | 10-bit with Computation (ADCC), 35 channels |
| Comparators | 2 |
| DAC | 1 x 5-bit |
| Timers | 8-/16-bit, multiple CCP/ECCP |
| Communication | 2x I²C, 2x SPI, 2x UART (with LIN) |
| XLP Sleep Current | < 100 nA typical |
| 封裝 | 44-pin TQFP (10x10 mm) |
| 安裝類型 | Surface Mount |
| MSL 等級 | 3 |
| RoHS 狀態 | Compliant |
| AEC-Q100 Qualification | Qualified |
PIC18F47K40-E/PT 腳位配置
| 腳位 1 | RA0 — Bidirectional I/O, analog input AN0 |
| 腳位 2 | RA1 — Bidirectional I/O, analog input AN1 |
| 腳位 3 | RA2 — Bidirectional I/O, analog input AN2 |
| 腳位 4 | RA3 — Bidirectional I/O, analog input AN3 |
| 腳位 5 | RA4 — Bidirectional I/O, analog input AN4 |
| 腳位 6 | RA5 — Bidirectional I/O, analog input AN5 |
| 腳位 7 | RA6 — Bidirectional I/O, analog input AN6 |
| 腳位 8 | RA7 — Bidirectional I/O, analog input AN7 |
| 腳位 9 | VSS — Ground reference |
| 腳位 10 | VDD — Positive supply, 2.3 V to 5.5 V |
| 腳位 11 | RB0 — Bidirectional I/O, INT0, AN8 |
| 腳位 12 | RB1 — Bidirectional I/O, AN9 |
| 腳位 13 | RB2 — Bidirectional I/O, AN10 |
| 腳位 14 | RB3 — Bidirectional I/O, AN11 |
| 腳位 15 | RB4 — Bidirectional I/O, AN12 |
| 腳位 16 | RB5 — Bidirectional I/O, AN13 |
| 腳位 17 | RB6 — Bidirectional I/O, ICD PGC, AN14 |
| 腳位 18 | RB7 — Bidirectional I/O, ICD PGD, AN15 |
| 腳位 19 | RC0 — Bidirectional I/O, analog input AN16 |
| 腳位 20 | RC1 — Bidirectional I/O, analog input AN17 |
| 腳位 21 | RC2 — Bidirectional I/O, AN18 |
| 腳位 22 | RC3 — Bidirectional I/O, AN19 |
| 腳位 23 | RC4 — Bidirectional I/O, AN20 |
| 腳位 24 | RC5 — Bidirectional I/O, AN21 |
| 腳位 25 | RC6 — Bidirectional I/O, AN22 |
| 腳位 26 | RC7 — Bidirectional I/O, AN23 |
| 腳位 27 | VSS — Ground reference |
| 腳位 28 | VDD — Positive supply, 2.3 V to 5.5 V |
| 腳位 29 | RD0 — Bidirectional I/O, AN24 |
| 腳位 30 | RD1 — Bidirectional I/O, AN25 |
| 腳位 31 | RD2 — Bidirectional I/O, AN26 |
| 腳位 32 | RD3 — Bidirectional I/O, AN27 |
| 腳位 33 | RD4 — Bidirectional I/O, AN28 |
| 腳位 34 | RD5 — Bidirectional I/O, AN29 |
| 腳位 35 | RD6 — Bidirectional I/O, AN30 |
| 腳位 36 | RD7 — Bidirectional I/O, AN31 |
| 腳位 37 | RE0 — Bidirectional I/O, AN5 (alt) |
| 腳位 38 | RE1 — Bidirectional I/O, AN6 (alt) |
| 腳位 39 | RE2 — Bidirectional I/O, AN7 (alt) |
| 腳位 40 | RE3 — Bidirectional I/O, MCLR/Reset |
| 腳位 41 | VSS — Ground reference |
| 腳位 42 | VDD — Positive supply, 2.3 V to 5.5 V |
| 腳位 43 | OSC1 — Crystal/clock input |
| 腳位 44 | OSC2 — Crystal/clock output |
典型應用
PIC18F47K40-E/PT 適用於 6 應用s: Capacitive Touch User Interface, Automotive Body and HVAC Modules, Industrial Sensor Hubs, Battery-Powered IoT Sensor Nodes, USB-CDC/HID Peripherals, General-Purpose Embedded Control.
Capacitive Touch User Interface
The PIC18F47K40-E/PT is ideal for capacitive touch keypads, sliders, and proximity sensors because the integrated 10-bit ADC with Computation (ADCC) and hardware Capacitive Voltage Divider (CVD) automates touch measurement and noise rejection on each scan. The 64 MHz CPU and hardware averaging further reduce CPU load to a few percent, leaving MIPS for UI logic, LEDs, and comms. XLP < 100 nA sleep current extends battery life on wake-on-touch designs. Place CWG and zero-cross detect peripherals at the user's discretion to drive haptics or backlight PWMs.
推薦
Automotive Body and HVAC Modules
With AEC-Q100 qualification, -40 °C to +125 °C operation, and 5 V tolerant I/O, the PIC18F47K40-E/PT is well-suited for body-control modules, HVAC blend-door control, seat and mirror actuators, and LIN-bus sensor clusters. The two LIN-capable UARTs and 36 I/O pins handle multiple loads and sensors in a single MCU, while the 128 KB Flash reserves room for LIN stack, fault handling, and bootloaders. The extended temperature grade protects against under-hood thermal stress.
推薦
Industrial Sensor Hubs
The PIC18F47K40-E/PT serves as an industrial 4-20 mA loop, RTD, or process-signal aggregator, leveraging the 10-bit ADCC with up to 35 analog inputs, plus the comparators for fast over-range detection. The CWG can produce isolated excitation PWMs, and the ECCP can drive high-resolution analog front-ends. 128 KB Flash accommodates Modbus, IO-Link, or custom protocols; 8 KB RAM buffers large sample arrays before forwarding via UART/SPI/I²C.
推薦
Battery-Powered IoT Sensor Nodes
The PIC18F47K40-E/PT's XLP technology delivers < 100 nA sleep current, so a 3.6 V LiSOCl2 cell can power a wake-on-event sensor node for years. The WWDT and CRC peripherals give deterministic watchdog supervision and memory-integrity checks critical for unattended deployments. 36 I/O pins allow direct connection to multiple sensors (temperature, humidity, PIR) without external muxing, and 128 KB Flash reserves space for OTA-capable firmware.
推薦
USB-CDC/HID Peripherals
The PIC18F47K40-E/PT can implement USB-CDC virtual COM ports and HID-class devices with bit-banging on the 16-bit I/O bank, paired with the MSSP peripherals for high-speed UART/SPI bridging. 128 KB Flash and 8 KB RAM are sufficient for USB stacks, vendor class firmware, and application logic. The wide 2.3-5.5 V range simplifies bus-powered designs that draw from a 5 V USB rail.
推薦
General-Purpose Embedded Control
The PIC18F47K40-E/PT acts as a drop-in main controller for appliance controllers, smart lighting, motor drivers, and display panels where 36 I/O pins, 128 KB Flash, and 5 V tolerance cover the majority of the BOM. The CWG peripheral produces complementary PWMs for half-bridge motor drivers, and the ADCC handles analog feedback in the same scan loop. Industrial temperature range suits white-goods and outdoor enclosures.
推薦
推薦產品摘要
工程參考資料，適用於 PIC18F47K40-E/PT — 比較、設計指引及合規資訊。
選型指南
與替代品比較
| 參數 | 本產品 | PIC18F47K40-I/PT | PIC18F47K40T-I/PT | PIC18F47K42-I/PT | PIC18F46K40-I/PT |
|---|---|---|---|---|---|
| Package | 44-TQFP (10x10 mm) | 44-TQFP (10x10 mm) - same | 44-TQFP (10x10 mm) - same | 44-TQFP (10x10 mm) - same | 44-TQFP (10x10 mm) - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Flash Memory | 128 KB | 128 KB | 128 KB | 128 KB | 64 KB (-50%) |
| RAM | 8 KB | 8 KB | 8 KB | 8 KB | 3.6 KB (-55%) |
| Operating Temperature | -40 °C to +125 °C (E) | -40 °C to +85 °C (I) | -40 °C to +85 °C (I) | -40 °C to +85 °C (I) | -40 °C to +85 °C (I) |
| CPU Speed | 64 MHz / 16 MIPS | 64 MHz / 16 MIPS | 64 MHz / 16 MIPS | 64 MHz / 16 MIPS | 64 MHz / 16 MIPS |
| AEC-Q100 Qualified | Yes (E grade) | No (I grade) | No (I grade) | No (I grade) | No (I grade) |
| Unit Price (1 pc) | $4.04 | $3.90 approx | $4.04 approx | $4.30 approx | $3.70 approx |
主要差異化特點
- AEC-Q100 qualified with extended +125 °C operating temperature (對比PIC18F47K40-I/PT)
- Next-generation ADCC with hardware CVD for capacitive touch (對比PIC18F46K22-I/PT)
- 128 KB Flash and 8 KB RAM in 44-TQFP (對比PIC18F46K40-I/PT)
設計說明
Place a 100 nF ceramic decoupling capacitor within 3 mm of each VDD pin (pins 10, 28, 42 on this 44-TQFP) and a shared bulk capacitor of at least 1 µF (X7R, 10 V) close to the MCU supply. The ADCC and high-speed system clock draw brief peak currents during ADC sampling, and inadequate decoupling will appear as ADC self-noise or SPI glitches. Estimated: with 64 MHz clock and 35 ADCC channels active, instantaneous supply current can spike 10-20 mA; the bulk cap absorbs that without rail droop.
Route the 64 MHz system clock (X1/X2 or OSC pins) and high-speed digital signals (SPI, PWM, CWG) away from analog traces feeding the ADC. Add a guard ring around the analog pins connected to VSS, and keep the ADCC reference voltage pin (VREF+/VREF-) star-routed back to the analog ground. Keep digital and analog grounds connected only at the MCU's VSS pins to avoid ground-loop noise pickup into the ADC measurement.
Do not float the MCLR/RE3 pin (pin 40); either tie it to VDD through a 10 kΩ pull-up or drive it with a supervisor / reset controller. If left floating, the MCU may randomly enter reset, causing boot loops in production. Also avoid tying I/O pins to outputs that back-power the MCU through ESD diodes when VDD is off - this can cause latch-up or ghost power scenarios. Use the Peripheral Pin Select (PPS) carefully; once locked, the PPS assignment persists across resets until the IOLOCK bit is cleared.
At 64 MHz and 5.5 V supply, the PIC18F47K40-E/PT draws roughly 15 mA active, giving < 100 mW dissipation - well below the 44-TQFP's thermal budget (theta_JA ≈ 60 °C/W). For XLP sleep modes, the XLP oscillator plus RTC module keeps sleep current under 100 nA, suitable for years-long battery life. Estimated: at 25 °C ambient with no copper thermal pad, junction temperature rises by ~6 °C; with a 1 sq-in copper pour on top layer, it falls to ~3 °C rise.
合規資訊
AEC-Q100 qualified per Microchip product page; RoHS and REACH compliant per distributor listings.