PIC18LF24K22T-I/MV - 16KB Flash 8-bit MCU, 28-UQFN | Microchip
Référence : PIC18LF24K22T-I/MV ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $3.45 | $3,45 |
| 10 | $3.18 | $31,80 |
| 100 | $2.74 | $274,00 |
| 500 | $2.41 | $1 205,00 |
| 1 000 | $2.1 | $2 100,00 |
| 3 300 | $1.92 | $6 336,00 |
PIC18LF24K22T-I/MV Présentation
What is a PIC18 LF microcontroller? It is a member of Microchip's 8-bit PIC18 family targeting low-voltage (1.8V-3.6V) operation with the proprietary nanoWatt XLP technology, which provides sleep currents as low as tens of nanoamperates and multiple power-saving modes. Within the broader taxonomy, PIC18 belongs to the 8-bit microcontroller category -> MCU -> embedded microcontroller -> semiconductor IC, sitting alongside PIC16 (mid-range) and PIC24/dsPIC (16-bit) families in Microchip's portfolio.
Key features of the PIC18LF24K22T-I/MV include 16 KB self-programmable Flash with 10K erase/write cycles endurance, 768 bytes of RAM, 256 bytes of EEPROM, an integrated 12-bit ADC with up to 17 channels, multiple capture/compare/PWM modules, two Enhanced USART modules, two MSSP (SPI/I2C) peripherals, and a 32 kHz internal oscillator. The device supports CTMU (Charge Time Measurement Unit) for capacitive touch sensing, mTouch capability, and up to 25 mA source/sink current on I/O pins.
From an architectural standpoint, the PIC18F K-series uses a 16-bit instruction word and a Harvard bus architecture with separate program and data paths, enabling deterministic single-cycle execution. The "LF" variant specifies an operating voltage range of 1.8V-3.6V, distinguishing it from the standard "F" variant which supports up to 5.5V. The 28-UQFN package with an exposed die pad provides a 4x4 mm footprint suited for space-constrained hand-held modules.
Typical applications for the PIC18LF24K22T-I/MV include low-power remote sensor nodes, wearable fitness/health monitors, IoT edge nodes, industrial sensor interface modules, USB/serial bridge firmware using the Enhanced USART, consumer handheld devices, and small appliances requiring capacitive touch controls. Designers select this part when an 8-bit MCU is sufficient for the workload and minimal sleep current is the dominant requirement.
Design consideration: ensure the ICSP/ICD pins (PGC/PGD) are reserved for in-circuit serial programming and debugging access; an isolation resistor or jumper is recommended on PGC/PGD lines if the application shares those pins with user circuitry. The exposed thermal pad on the UQFN-28 must be soldered to the board ground plane for mechanical integrity and thermal performance.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet, giving engineers and procurement teams a single, actionable reference.
Alternatives de remplacement direct pour PIC18LF24K22T-I/MV — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec PIC18LF24K22T-I/MV (même facteur de forme et même empreinte) — différant par Package, Operating Temperature, Program Memory (Flash), Core Architecture, ADC.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
PIC18LF24K22-I/MV
✅ Remplacement direct✓ En stock
$1.9 / unité
Voir la fiche technique →PIC18LF24K22T-I/ML
✅ Remplacement direct✓ En stock
$2.55 / unité
Voir la fiche technique →PIC18LF23K22T-I/MV
✅ Remplacement direct✓ En stock
$1.65 / unité
Voir la fiche technique →PIC18LF23K22-I/MV
✅ Remplacement direct✓ En stock
$1.42 / unité
Voir la fiche technique →PIC18F24K22T-I/MV
✅ Remplacement direct✓ En stock
$1.95 / unité
Voir la fiche technique →PIC18LF23K22T-I/ML
✅ Remplacement direct✓ En stock
$1.92 / unité
Voir la fiche technique →PIC18LF24K22T-I/MV Valeurs maximales et caractéristiques électriques
| Core Architecture | PIC18 (8-bit RISC, Harvard) |
| Core Size | 8-bit |
| Maximum CPU Speed | 64 MHz |
| Program Memory (Flash) | 16 KB (8K x 16) |
| Data RAM | 768 bytes |
| Data EEPROM | 256 bytes |
| Operating Voltage Range | 1.8 V to 3.6 V |
| ADC | 12-bit, up to 17 channels |
| Comparators | 2 (peripheral) |
| EUSART | 2 |
| MSSP (SPI/I2C) | 2 |
| Internal Oscillator | 32 kHz + 16 MHz HF (per datasheet family) |
| nanoWatt XLP Technology | Yes |
| CTMU / mTouch | Yes |
| Boîtier | 28-UQFN (4x4 mm) with exposed pad |
| Type de montage | Surface Mount |
| Température de fonctionnement | -40C to +85C (Industrial, "I") |
| Lead-Free / RoHS | Compliant (lead-free per Microchip product page) |
| Programming/Debug | ICSP, ICD via PGC/PGD |
Configuration des broches de PIC18LF24K22T-I/MV
| Broche 1 | RA7/OSC1/CLKI — I/O port / external clock input |
| Broche 2 | RA6/OSC2/CLKO — I/O port / oscillator output |
| Broche 3 | RA5/AN4/C2IN+/HLVDIN — I/O / ADC channel / comparator input |
| Broche 4 | RA4/AN3/C2OUT — I/O / ADC channel / comparator output |
| Broche 5 | RA3/AN2/VREF+/C1IN+ — I/O / ADC channel / voltage reference |
| Broche 6 | RA2/AN1/C2IN- — I/O / ADC channel / comparator input |
| Broche 7 | RA1/AN1/C1IN-/AN8 — I/O / ADC channel |
| Broche 8 | RA0/AN0/C1IN+/AN10 — I/O / ADC channel |
| Broche 9 | VSS — Ground reference |
| Broche 10 | VDD — Positive supply (1.8V-3.6V) |
| Broche 11 | RB7/KBI3/PGD — I/O / ICD data |
| Broche 12 | RB6/KBI2/PGC — I/O / ICD clock |
| Broche 13 | RB5/AN13/KBI1 — I/O / ADC channel |
| Broche 14 | RB4/AN11/KBI0 — I/O / ADC channel |
| Broche 15 | RB3/CCP2/AN8 — I/O / capture/compare / ADC |
| Broche 16 | RB2/CCP1/AN9 — I/O / capture/compare / ADC |
| Broche 17 | RB1/AN10/INT1 — I/O / ADC / external interrupt |
| Broche 18 | RB0/AN12/INT0 — I/O / ADC / external interrupt |
| Broche 19 | VDD — Positive supply (1.8V-3.6V) |
| Broche 20 | VSS — Ground reference |
| Broche 21 | RC7/RX/DT — I/O / EUSART RX |
| Broche 22 | RC6/TX/CK — I/O / EUSART TX |
| Broche 23 | RC5/SDO — I/O / SPI data out |
| Broche 24 | RC4/SDA/SDI — I/O / I2C data / SPI data in |
| Broche 25 | RC3/SCL/SCK — I/O / I2C clock / SPI clock |
| Broche 26 | RC2/CCP1 — I/O / capture/compare |
| Broche 27 | RC1/CCP2 — I/O / capture/compare |
| Broche 28 | RC0 — I/O |
Applications typiques
PIC18LF24K22T-I/MV convient pour 6 applications: Battery-Powered Wireless Sensor Node, Wearable Fitness/Health Monitor, Industrial Sensor Interface Module, Capacitive Touch User Interface, USB-to-Serial Bridge Firmware, Low-Power IoT Edge Node.
Battery-Powered Wireless Sensor Node
The PIC18LF24K22T-I/MV fits battery-powered wireless sensor nodes thanks to its nanoWatt XLP technology, achieving sleep currents below 100 nA. The 1.8V-3.6V supply aligns directly with single-cell Li-coin or 2xAA battery chemistries, eliminating the need for a boost regulator. The 64 MHz CPU (16 MIPS) handles on-sensor DSP for temperature, humidity, or vibration pre-processing, while the 12-bit ADC provides calibrated readings across 17 channels. Engineers pair this MCU with sub-GHz transceivers via SPI/EUSART to achieve 5-10 year battery life on standard coin cells.
Recommandé
Wearable Fitness/Health Monitor
Wearable health monitors demand a tiny footprint and minimal sleep current - both delivered by the PIC18LF24K22T-I/MV in its 4x4 mm UQFN-28 package. The CTMU peripheral enables capacitive touch button or slider input on the watch band without dedicated touch ICs, while the 12-bit ADC captures heart-rate or SpO2 signals. Combined with EUSART + MSSP peripherals, the MCU drives a BLE module (e.g., RN4871) for phone connectivity. The low-voltage LF design draws <500 nA in deep sleep, preserving battery life between user interactions.
Recommandé
Industrial Sensor Interface Module
In industrial 4-20 mA sensor modules and RTU front-ends, the PIC18LF24K22T-I/MV acts as the local MCU converting analog inputs into digital Modbus RTU frames. Its 12-bit ADC with 17 channels multiplexes multiple sensor inputs, while the two EUSARTs handle RS-485 and debug console independently. The industrial -40C to +85C temperature rating allows deployment in factory automation cabinets. The 28-UQFN package lets the design fit on a 25 mm x 30 mm PCB, typical for DIN-rail-mounted analog modules.
Recommandé
Capacitive Touch User Interface
Capacitive touch human-machine interfaces (HMIs) - including white-good front panels, smart thermostats, and POS keypads - benefit from the PIC18LF24K22T-I/MV's integrated CTMU and mTouch firmware library. The CTMU measures sub-picofarad capacitance changes without external timing components, supporting 8-12 touch channels across the 28-UQFN GPIO. Combined with the PWM/ECCP modules for backlight dimming and EUSART for host communication, this MCU provides a complete touch UI solution in a single chip, eliminating dedicated touch controllers and reducing BOM cost.
Recommandé
USB-to-Serial Bridge Firmware
The PIC18LF24K22T-I/MV implements a USB-to-UART bridge by pairing with Microchip's MCP2200 or by directly using the 28-UQFN's USB-capable variant logic. Two EUSARTs support simultaneous debug-console and application-data serial links. The 16 KB Flash hosts Microchip's USB stack and CDC-class firmware, while 768-byte RAM handles USB endpoint buffers. This configuration is widely used in industrial programming tools, firmware-updater dongles, and POS peripherals requiring both USB host connectivity and field-bus serial.
Recommandé
Low-Power IoT Edge Node
IoT edge nodes deployed in field installations run the PIC18LF24K22T-I/MV as a sensor aggregator and protocol translator. The 64 MHz CPU executes MQTT-SN or CoAP publish routines, while nanoWatt XLP drops standby current to nanoampere levels between transmissions. The MSSP peripherals drive LoRa or sub-GHz transceivers, and the 12-bit ADC reads analog field sensors. The 28-UQFN (4x4 mm) footprint allows the design to fit within IP67-rated enclosures for outdoor deployment.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour PIC18LF24K22T-I/MV — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | PIC18LF24K22-I/MV | PIC18LF24K22T-I/ML | PIC18LF23K22T-I/MV | PIC18LF23K22-I/MV | PIC18F24K22T-I/MV | PIC18LF23K22T-I/ML |
|---|---|---|---|---|---|---|---|
| Package | 28-UQFN (4x4) | 28-UQFN (4x4) - same | 28-UQFN (4x4) - same | 28-UQFN (4x4) - same | 28-UQFN (4x4) - same | 28-UQFN (4x4) - same | 28-UQFN (4x4) - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Operating Voltage | 1.8V - 3.6V (LF) | 1.8V - 3.6V (LF) | 1.8V - 3.6V (LF) | 1.8V - 3.6V (LF) | 1.8V - 3.6V (LF) | 1.8V - 5.5V (F) | 1.8V - 3.6V (LF) |
| Flash Program Memory | 16 KB | 16 KB | 16 KB | 16 KB | 16 KB | 16 KB | 16 KB |
| Data RAM | 768 bytes | 768 bytes | 768 bytes | 512 bytes | 512 bytes | 768 bytes | 512 bytes |
| Maximum CPU Clock | 64 MHz / 16 MIPS | 64 MHz / 16 MIPS | 64 MHz / 16 MIPS | 64 MHz / 16 MIPS | 64 MHz / 16 MIPS | 64 MHz / 16 MIPS | 64 MHz / 16 MIPS |
| Packaging Suffix | Tape & Reel (T) | Tray (no T) | Tape & Reel (T) | Tape & Reel (T) | Tray | Tape & Reel (T) | Tape & Reel (T) |
Principaux différenciateurs
- Low-voltage LF variant with nanoWatt XLP (vs PIC18F24K22T-I/MV)
- Full 28-pin complement on 28-UQFN footprint (vs PIC18LF23K22T-I/MV)
- Industrial -40C to +85C operating temperature (vs consumer-grade PIC18LF parts)
Notes de conception
Do not apply more than 3.6V to VDD on the PIC18LF24K22T-I/MV. The "LF" variant is the low-voltage version; the PIC18F24K22T-I/MV (5V-tolerant) is pin-compatible but is NOT recommended for drop-in if you have nearby 5V transients. For mixed-voltage designs, use the "F" part instead. Always confirm the full system maximum rail before PCB layout.
Estimated: at 3.3V VDD with CPU active at 64 MHz, the core draws roughly 8-10 mA per the K22 family datasheet. Decouple VDD with a 100 nF X7R ceramic placed within 3 mm of pins 10 and 19, plus a bulk 1-10 uF tantalum. For low-noise analog (ADC, VREF+), place a separate filtered AVSS/AVDD pair if used, or use the dedicated VREF+ pin with its own 1 uF bypass.
The 28-UQFN exposed thermal pad (pin 29, sometimes shown as pad below pin 28) MUST be soldered to the PCB ground plane for mechanical robustness and thermal dissipation. Use an array of thermal vias connecting the pad to a continuous ground pour on the opposite PCB layer. Failure to solder the pad can cause intermittent JTAG connection and high junction temperatures under load.
Reserve PGC (RB6) and PGD (RB7) for ICSP/ICD programming access. If the application requires these pins as GPIOs, add 4.7 kohm isolation resistors or solder-jumpers to permit in-circuit programming without affecting user circuitry. MCLR must be pulled up to VDD through a 10 kohm resistor, with a 100 nF capacitor to ground for ICSP entry.
Informations de conformité
Lead-free and RoHS-compliant per Microchip product page. Industrial temperature grade (-40C to +85C) marked by "I" suffix. Not AEC-Q100 qualified - choose AEC-Q100-grade parts (e.g., PIC18FxxKxx with /VAO suffix) for automotive applications.
