PIC18LF26K80-I/MM - 8-bit XLP MCU 64KB Flash ECAN 28-QFN | Microchip
Référence : PIC18LF26K80-I/MM ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $5.4 | $5,40 |
| 10 | $4.86 | $48,60 |
| 100 | $4.32 | $432,00 |
| 500 | $3.84 | $1 920,00 |
| 1 000 | $3.42 | $3 420,00 |
PIC18LF26K80-I/MM Présentation
A microcontroller (MCU) is a single-chip computer that integrates a CPU core, program memory, data RAM, and a rich set of peripherals such as ADCs, timers, communication interfaces, and I/O. PIC microcontrollers use a Harvard RISC architecture with separate program and data buses, which allows instruction fetch and data access in the same instruction cycle. The PIC18 family is positioned in Microchip's mid-range 8-bit portfolio, balancing code density, peripheral richness, and low power consumption for embedded control applications spanning consumer, industrial, and automotive segments.
Key features of the PIC18LF26K80 include 24 I/O pins, hardware ECAN™ (CAN 2.0B) for industrial and automotive networking, a 12-bit ADC with up to 8 channels, CTMU for capacitive touch sensing, an integrated LCD driver not present on this variant, and nanoWatt XLP™ sleep currents down to the nanoamp range. The combination of ECAN and 12-bit ADC at this price point is unusual in the 28-pin 8-bit category, making the part attractive for sensor nodes and bridge controllers.
The architecture uses a modified Harvard design with a 16-bit instruction word and an 8-bit data path, plus a hardware multiplier and 32-level stack. ECAN supports CAN 2.0B active, with acceptance filters, time-stamping, and flexible wake-up - features that reduce the external CAN controller bill of materials compared to discrete transceivers.
Typical applications include industrial CAN node controllers, automotive body and comfort ECUs, sensor signal conditioning with capacitive touch, low-power remote sensor nodes, and USB-to-CAN bridges using the ECAN peripheral with an external MCU. The wide 1.8 V-5.5 V supply range supports both battery-powered and 5 V industrial buses.
When using this part, ensure the ECAN bit timing is configured against the chosen baud rate (50 kbps to 1 Mbps) and that the CTMU current source is calibrated against the load capacitance for accurate touch sensing. ICSP™ programming via PGC/PGD allows in-circuit firmware updates without removing the device from the board.
This page synthesizes distributor pricing tiers, same-family and cross-brand drop-in alternatives, and practical design notes not always visible on the manufacturer product page.
Alternatives de remplacement direct pour PIC18LF26K80-I/MM — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec PIC18LF26K80-I/MM (même facteur de forme et même empreinte) — différant par Package, ADC, CTMU, Operating Temperature Range, Timers.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
PIC18LF26K80T-I/MM
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
PIC18F26K80-I/MM
✅ Remplacement direct✓ En stock
$2.86 / unité
Voir la fiche technique →PIC18F26K80T-I/MM
✅ Remplacement direct✓ En stock
$2.38 / unité
Voir la fiche technique →PIC18LF25K80-I/MM
✅ Remplacement direct✓ En stock
$4.05 / unité
Voir la fiche technique →PIC18LF26K80-I/MM Valeurs maximales et caractéristiques électriques
| Core Architecture | PIC18 (8-bit RISC, Harvard) |
| Family | PIC® XLP™ 18K with ECAN™ and nanoWatt XLP |
| Maximum CPU Frequency | 64 MHz |
| CPU Performance | 16 MIPS |
| Flash Program Memory | 64 KB (32K x 16) |
| Data SRAM | 4 KB (3.56 KB usable per datasheet) |
| Number of I/O Pins | 24 |
| ADC | 12-bit, up to 8 channels |
| CTMU | Charge Time Measurement Unit for capacitive touch |
| CAN | ECAN™ (CAN 2.0B active) |
| Operating Voltage Range | 1.8 V to 5.5 V |
| Plage de température de fonctionnement | -40 °C to +85 °C (Industrial) |
| Boîtier | QFN-S-28 (6x6 mm) with exposed pad |
| Type de montage | Surface Mount |
| Statut RoHS | Compliant |
| Lead-Free | Yes |
Configuration des broches de PIC18LF26K80-I/MM
| Broche 1 | VDD — Positive supply voltage |
| Broche 2 | RA5 — Digital I/O / AN4 |
| Broche 3 | RA4 — Digital I/O |
| Broche 4 | RA3 — Digital I/O / AN3 / VREF+ |
| Broche 5 | RC5 — Digital I/O |
| Broche 6 | RC4 — Digital I/O |
| Broche 7 | RC3 — Digital I/O / SCL |
| Broche 8 | RC6 — Digital I/O / TX |
| Broche 9 | RC7 — Digital I/O / RX |
| Broche 10 | RB7 — Digital I/O |
| Broche 11 | RB6 — Digital I/O / PGC (ICSP clock) |
| Broche 12 | RB5 — Digital I/O / PGD (ICSP data) |
| Broche 13 | RB4 — Digital I/O |
| Broche 14 | VSS — Ground reference |
| Broche 15 | RC0 — Digital I/O |
| Broche 16 | RC1 — Digital I/O |
| Broche 17 | RC2 — Digital I/O / AN6 |
| Broche 18 | RA2 — Digital I/O / AN2 / VREF- |
| Broche 19 | RA1 — Digital I/O / AN1 |
| Broche 20 | RA0 — Digital I/O / AN0 |
| Broche 21 | OSC1 — Crystal oscillator input |
| Broche 22 | OSC2 — Crystal oscillator output |
| Broche 23 | RB0 — Digital I/O / INT0 |
| Broche 24 | RB1 — Digital I/O / INT1 |
| Broche 25 | RB2 — Digital I/O / INT2 |
| Broche 26 | RB3 — Digital I/O / INT3 |
| Broche 27 | CANRX — ECAN receive input |
| Broche 28 | CANTX — ECAN transmit output |
Applications typiques
PIC18LF26K80-I/MM convient pour 6 applications: Industrial CAN Sensor Node, Automotive Body and Comfort ECU, Capacitive Touch HMI Controller, Battery-Powered Remote Sensor / IoT Edge, USB-to-CAN Bridge / Gateway, Motor Control Signal Conditioning.
Industrial CAN Sensor Node
The PIC18LF26K80-I/MM is well suited for industrial CAN sensor nodes because its integrated ECAN™ (CAN 2.0B active) controller eliminates the need for an external CAN IC, reducing BOM cost and PCB area. Its 12-bit ADC with up to 8 channels and the integrated CTMU (Charge Time Measurement Unit) enable direct connection to analog sensors and capacitive touch interfaces without a dedicated analogue front-end. The 1.8 V to 3.6 V supply range supports 3.3 V industrial bus rails, while nanoWatt XLP™ sleep modes below 100 nA let battery-backed nodes last on a single primary cell for years. Place the MCU between an MCP2562 isolated CAN transceiver and the sensor array; use ICSP™ (PGC/PGD) for in-circuit firmware updates so the node can be reprogrammed on the line.
Recommandé
Automotive Body and Comfort ECU
In automotive body and comfort modules such as window lifters, mirror controllers, and seat adjusters, the PIC18LF26K80-I/MM delivers integrated ECAN connectivity with a 28-QFN-S footprint that fits space-constrained PCBAs. Its 12-bit ADC and 24 I/O pins are sufficient for end-of-line position sensing and H-bridge control signals, while the 64 KB Flash supports AUTOSAR-free custom firmware stacks. The -40 °C to +85 °C industrial temperature range covers most cabin and door-module environments; for under-hood use choose the AEC-Q100 qualified PIC18F26K80-E/MM or PIC18LF26K80-E/MQ instead. Pair the MCU with a TLE7259-3 CAN transceiver and use the CTMU peripheral for moisture-detection grids in convertible top modules.
Recommandé
Capacitive Touch HMI Controller
The PIC18LF26K80-I/MM is an excellent host for low-channel capacitive touch Human-Machine Interfaces because the on-chip CTMU measures capacitance with sub-picofarad resolution, eliminating the need for a dedicated touch controller IC. With up to 8 ADC channels and the CTMU driving a current source through the touch electrodes, the MCU supports sliders, buttons, and proximity sensing in a single chip. The 16 MIPS throughput at 64 MHz is fast enough to scan 12+ electrodes while still servicing ECAN messages in the same loop. The 64 KB Flash provides ample room for touch firmware libraries, gesture recognition, and bootloader. Pair the device with an MCP1700 LDO and an MCP2551 CAN transceiver for networked touch panels.
Recommandé
Battery-Powered Remote Sensor / IoT Edge
The PIC18LF26K80-I/MM fits battery-powered remote sensor nodes thanks to its nanoWatt XLP™ technology, which delivers sleep currents in the nanoamp range and a 1.8 V minimum supply that lets designers extract the last few percent of energy from Li-coin and 2xAA cells. The 64 MHz/16 MIPS performance can wake, take a 12-bit ADC reading, transmit on ECAN, and return to sleep within milliseconds. Its 24 I/O pins and 4 KB SRAM are sufficient for most edge sensor stacks, while the ECAN peripheral enables low-overhead fieldbus integration where LoRa or Wi-Fi would be too power-hungry. Use the PIC18LF26K80T-I/MM Tape & Reel variant for high-volume SMT production, and a TPL5110 nano-power timer for duty-cycling the rail.
Recommandé
USB-to-CAN Bridge / Gateway
The PIC18LF26K80-I/MM is well matched to compact USB-to-CAN gateways and protocol bridges used in automotive diagnostics, factory automation, and lab instrumentation. Its integrated ECAN™ controller manages CAN 2.0B frames, while the 64 KB Flash and 16 MIPS CPU throughput handle USB-CDC and CANOpen, J1939, or DeviceNet protocol stacks. The 12-bit ADC enables bus voltage and temperature monitoring on the gateway PCB. Operating from 1.8 V to 3.6 V, it pairs with a 3.3 V USB Full-Speed PHY like the MCP2221A; use an MCP2562 CAN transceiver to the bus side. The 28-QFN-S (6x6 mm) footprint is small enough for dongle-format enclosures.
Recommandé
Motor Control Signal Conditioning
The PIC18LF26K80-I/MM provides a compact signal-conditioning and supervisory front-end for brushed DC and stepper motor drives in industrial equipment. Its 12-bit ADC with up to 8 channels reads motor current shunts, back-EMF, and position feedback, while 24 I/O pins drive enable lines, fault inputs, and PWM hand-off to a dedicated gate driver. The ECAN peripheral reports motor health to the plant-wide bus without an external CAN IC. The 1.8 V to 3.6 V supply is suitable for 3.3 V logic-level FET drivers such as the MCP1416; for 5 V gate drivers choose the F-variant. The 64 KB Flash supports field-oriented control firmware and on-board diagnostics. Add the MCP1700 LDO and MCP2562 CAN transceiver for a complete node.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour PIC18LF26K80-I/MM — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | PIC18LF26K80T-I/MM | PIC18F26K80-I/MM | PIC18F26K80T-I/MM | PIC18LF26K80-I/SP | PIC18LF26K80-I/SO | PIC18LF25K80-I/MM |
|---|---|---|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | QFN-S-28 (6x6 mm) | QFN-S-28 (6x6 mm) - same | QFN-S-28 (6x6 mm) - same | QFN-S-28 (6x6 mm) - same | SPDIP-28 - different | SOIC-28 - different | QFN-S-28 (6x6 mm) - same |
| Flash Memory | 64 KB | 64 KB | 64 KB | 64 KB | 64 KB | 64 KB | 32 KB (-50%) |
| Operating Voltage | 1.8 V to 3.6 V | 1.8 V to 3.6 V | 1.8 V to 5.5 V | 1.8 V to 5.5 V | 1.8 V to 3.6 V | 1.8 V to 3.6 V | 1.8 V to 3.6 V |
| ECAN | Yes (CAN 2.0B) | Yes (CAN 2.0B) | Yes (CAN 2.0B) | Yes (CAN 2.0B) | Yes (CAN 2.0B) | Yes (CAN 2.0B) | Yes (CAN 2.0B) |
| ADC | 12-bit, 8 channels | 12-bit, 8 channels | 12-bit, 8 channels | 12-bit, 8 channels | 12-bit, 8 channels | 12-bit, 8 channels | 12-bit, 8 channels |
| Maximum Frequency | 64 MHz (16 MIPS) | 64 MHz (16 MIPS) | 64 MHz (16 MIPS) | 64 MHz (16 MIPS) | 64 MHz (16 MIPS) | 64 MHz (16 MIPS) | 64 MHz (16 MIPS) |
| Temperature Range | -40 °C to +85 °C (Industrial) | -40 °C to +85 °C | -40 °C to +85 °C | -40 °C to +85 °C | -40 °C to +85 °C | -40 °C to +85 °C | -40 °C to +85 °C |
Principaux différenciateurs
- Integrated ECAN™ at 28 pins and 1.8 V (vs PIC18LF25K80-I/MM)
- Low-voltage nanoWatt XLP™ operation (vs PIC18F26K80-I/MM)
- CTMU integrated for capacitive touch (vs PIC18LF2680-I/SP (legacy 28-pin MCU))
Notes de conception
Decouple VDD with a 100 nF ceramic capacitor placed within 5 mm of pin 1, and bulk-decouple with a 10 µF tantalum or polymer cap near the package exposed pad (VSS). For battery-powered designs add a bulk reservoir of 10-100 µF on VDD to handle the 64 MHz CPU current transients, and tie the exposed thermal pad to a low-impedance VSS plane. Brown-out reset (BOR) should be enabled with the highest threshold that still covers your supply tolerance to prevent Flash corruption at end-of-battery.
ECAN bit timing requires the oscillator tolerance to be within 1.58% for reliable 1 Mbps operation; an external crystal or ceramic resonator is strongly preferred over the internal HFINTOSC. Ensure the CANTX and CANRX pins are not repurposed for any analog or digital output, and keep the CAN bus traces matched and short. The CTMU requires calibration against a known load capacitance; without it the touch readings will drift with temperature and supply voltage.
The 28-QFN-S exposed thermal pad must be soldered to the PCB with an array of thermal vias connecting to the ground plane; this is both electrical ground and the primary thermal dissipation path. Keep the ICSP (PGC/PGD) header accessible on production PCBs to allow field firmware updates. Route the CAN differential pair (CANTX/CANRX plus the external MCP2562 traces) as a 120 Ω-impedance matched differential pair, with no splits in the reference plane, to meet CAN bus signal-integrity requirements.
Informations de conformité
RoHS and lead-free per Microchip product page. Standard -I/MM is industrial grade; for AEC-Q100 automotive grade use PIC18LF26K80-E/MQ or PIC18F26K80-E/MQ (extended temperature).
