PIC24EP128GP202-H/MM - 16-bit 70 MIPS MCU, 128KB Flash | Microchip
Référence : PIC24EP128GP202-H/MM ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $7.5 | $7,50 |
| 10 | $6.75 | $67,50 |
| 100 | $6.05 | $605,00 |
| 500 | $5.42 | $2 710,00 |
| 1 000 | $4.85 | $4 850,00 |
PIC24EP128GP202-H/MM Présentation
What is a 16-bit MCU? A 16-bit microcontroller is an embedded computing device built around a 16-bit data path and register file, sitting in the hierarchy between 8-bit microcontrollers (e.g., PIC16, PIC18, ATmega) and 32-bit microcontrollers (e.g., ARM Cortex-M). 16-bit MCUs like the PIC24E family deliver deterministic real-time control, on-chip DSP capability, and richer peripherals than 8-bit parts while remaining simpler and lower-power than 32-bit Cortex-M devices. They are widely deployed in motor control, power conversion, industrial sensing, and audio processing where the combination of DSP throughput and deterministic interrupt latency is essential.
Key features of the PIC24EP128GP202 include a 70 MIPS CPU core, dual operational amplifiers on-chip, a high-speed 10/12-bit ADC with up to 1.1 Msps sampling, Charge Time Measurement Unit (CTMU) for capacitive touch and precise time measurement, and the Peripheral Trigger Generator (PTG) for hardware-driven peripheral sequencing. The device also integrates high-speed PWM, multiple UART/SPI/I2C interfaces, and a configurable oscillator block. Together, these peripherals enable single-chip implementations of advanced motor-control, lighting, and analog-signal-conditioning designs.
Architecturally, the PIC24E core uses a modified Harvard structure with separate program and data buses, a 16 x 16-bit working register array, and a hardware DSP engine for single-cycle MAC operations. The on-chip op-amps and 1 Msps ADC allow direct conditioning and digitization of analog signals without external analog front-end ICs, reducing BOM cost and PCB area. The 70 MIPS throughput gives 14.3 ns instruction-cycle time, supporting fast closed-loop control loops at PWM frequencies above 100 kHz.
Typical applications include industrial motor control (BLDC, PMSM, and stepper drives), digital power conversion (AC-DC, DC-DC, and PFC stages), automotive sensor interfaces, LED lighting controllers, solar inverters, and battery management systems. The extended -40C to +150C operating range of the -H/MM grade makes it particularly suited for under-hood automotive electronics, outdoor industrial equipment, and any application where the ambient temperature exceeds standard commercial or industrial limits.
When designing with this MCU, allocate sufficient decoupling capacitance near the VDD/VSS pairs (typically 100 nF plus bulk) and ensure the PCB layout keeps analog and digital ground returns separated before joining at a single point near the device. For high-temperature operation, derate output drive strength and verify oscillator startup behavior at the cold-side extreme.
This page synthesizes distributor pricing, application-specific design notes, and cross-references against the wider PIC24E family - information not found in the manufacturer datasheet alone.
Alternatives de remplacement direct pour PIC24EP128GP202-H/MM — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec PIC24EP128GP202-H/MM (même facteur de forme et même empreinte) — différant par Package, ADC, Operating Temperature, Program Memory (Flash), Core Architecture.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
PIC24EP128GP202-I/MM
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
PIC24EP128GP202-E/MM
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
PIC24EP128GP202T-I/MM
✅ Remplacement direct✓ En stock
$2.05 / unité
Voir la fiche technique →PIC24EP128GP202-E/SS
✅ Remplacement direct✓ En stock
$2.71 / unité
Voir la fiche technique →PIC24EP128MC202-I/MM
✅ Remplacement direct✓ En stock
$3.85 / unité
Voir la fiche technique →PIC24EP128GP202-H/MM Valeurs maximales et caractéristiques électriques
| Family | PIC24E 16-bit MCU / DSC |
| Core | PIC24E modified Harvard, 16-bit |
| CPU Performance | 70 MIPS (70 MHz instruction rate) |
| Program Flash Memory | 128 KB |
| SRAM | 16 KB |
| Operating Voltage (VDD) | 3.0 V to 3.6 V |
| Boîtier | 28-pin QFN (MM) |
| Type de montage | Surface Mount |
| Température de fonctionnement | -40C to +150C (H grade, extended) |
| On-Chip Op-Amps | Yes (dual internal op-amps) |
| CTMU | Yes (Charge Time Measurement Unit) |
| Peripheral Trigger Generator (PTG) | Yes |
| High-Speed PWM | Yes |
Configuration des broches de PIC24EP128GP202-H/MM
| Broche 1 | RA0 — Analog/digital I/O |
| Broche 2 | RA1 — Analog/digital I/O |
| Broche 3 | RA2 — Analog/digital I/O |
| Broche 4 | RA3 — Analog/digital I/O |
| Broche 5 | VDD — Supply voltage |
| Broche 6 | VSS — Ground reference |
| Broche 7 | OSC1 — Crystal oscillator input |
| Broche 8 | OSC2 — Crystal oscillator output |
| Broche 9 | RB0 — Digital I/O |
| Broche 10 | RB1 — Digital I/O |
| Broche 11 | RB2 — Digital I/O |
| Broche 12 | RB3 — Digital I/O |
| Broche 13 | RB4 — Digital I/O |
| Broche 14 | RB5 — Digital I/O |
| Broche 15 | RB6 — Digital I/O |
| Broche 16 | RB7 — Digital I/O |
| Broche 17 | RC0 — Digital I/O |
| Broche 18 | RC1 — Digital I/O |
| Broche 19 | RC2 — Digital I/O |
| Broche 20 | RC3 — Digital I/O |
| Broche 21 | RC4 — Digital I/O |
| Broche 22 | RC5 — Digital I/O |
| Broche 23 | RC6 — Digital I/O |
| Broche 24 | RC7 — Digital I/O |
| Broche 25 | MCLR — Master clear reset |
| Broche 26 | PGED1 — ICSP data line 1 |
| Broche 27 | PGEC1 — ICSP clock line 1 |
| Broche 28 | VDD — Supply voltage (secondary) |
Applications typiques
PIC24EP128GP202-H/MM convient pour 7 applications: BLDC / PMSM Motor Control, Digital Power Conversion (AC-DC, DC-DC, PFC), Automotive Under-Hood Sensor Interface, Industrial LED Lighting Controllers, Solar Inverter Control, Battery Management Systems (BMS), Industrial Servo and Stepper Drives.
BLDC / PMSM Motor Control
The PIC24EP128GP202-H/MM is well-suited for brushless DC and permanent-magnet synchronous motor drives because its 70 MIPS core, on-chip op-amps for current sensing, and 1 Msps ADC support field-oriented control (FOC) loops at PWM frequencies above 20 kHz. The H-grade -40C to +150C temperature range lets it sit close to the inverter power stage where ambient temperatures exceed 100C in sealed IPM modules. Compared with PIC24EP128GP202-I/MM, this part adds 65C of thermal headroom for under-hood automotive and industrial-motor applications.
Recommandé
Digital Power Conversion (AC-DC, DC-DC, PFC)
In digital power supplies the PIC24EP128GP202-H/MM's 70 MIPS DSP throughput executes digital PFC, average-current-mode control, and adaptive dead-time compensation in real time. The on-chip op-amps close the current-sense loop directly without an external analog front end, reducing BOM cost and PCB area. The -40C to +150C H-grade temperature window allows the MCU to be co-located with the power MOSFET bridge, simplifying thermal management in sealed industrial PSU designs above 1 kW.
Recommandé
Automotive Under-Hood Sensor Interface
Automotive under-hood sensors such as exhaust pressure, coolant temperature, and oil-quality transducers demand extended temperature operation and reliable ADC performance. The PIC24EP128GP202-H/MM's -40C to +150C thermal grade, 1 Msps ADC, and CTMU for capacitive sensing make it a strong fit for harsh-environment analog front ends. The 128 KB Flash provides ample code space for LIN/CAN stacks and self-diagnostics, while the 16 KB SRAM accommodates calibration tables and digital-filter state without external memory.
Recommandé
Industrial LED Lighting Controllers
High-power LED drivers for stage lighting, streetlights, and architectural luminaires need precise current regulation and ambient-temperature operation above 100C near the LED heatsink. The PIC24EP128GP202-H/MM executes digital PI current control loops and DMX/RDM protocol stacks at 70 MIPS while its H-grade thermal rating tolerates co-location with the LED heat sink. The integrated op-amps close the current-sense loop directly, eliminating an external analog IC and reducing system cost.
Recommandé
Solar Inverter Control
Solar micro-inverters and string inverters need MPPT algorithms running every few milliseconds while operating at ambient temperatures above 70C in rooftop enclosures. The PIC24EP128GP202-H/MM's 70 MIPS DSP throughput executes perturb-and-observe or incremental-conductance MPPT, anti-islanding detection, and grid-synchronization PLLs in real time. The H-grade temperature rating lets the MCU sit near the IGBT bridge without thermal derating, simplifying enclosure design.
Recommandé
Battery Management Systems (BMS)
Lithium-ion battery management systems require accurate cell voltage and temperature monitoring with redundant safety checks. The PIC24EP128GP202-H/MM's 1 Msps ADC samples multiple cell voltages and thermistor inputs simultaneously, while its on-chip op-amps buffer the high-impedance cell-sense nodes. The -40C to +150C H-grade rating accommodates battery-pack enclosures that exceed 100C during fast-charge cycles in e-mobility and grid-storage applications.
Recommandé
Industrial Servo and Stepper Drives
Stepper and servo drives for CNC machines, robotics, and factory automation require precise closed-loop current and position control. The PIC24EP128GP202-H/MM's Peripheral Trigger Generator (PTG) sequences ADC samples, PWM updates, and interrupt responses with deterministic timing, achieving sub-microsecond control-loop jitter. The H-grade thermal envelope and 28-pin QFN package make it a compact, robust solution for sealed industrial-drive enclosures.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour PIC24EP128GP202-H/MM — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | PIC24EP128GP202-I/MM | PIC24EP128GP202-E/MM | PIC24EP128GP202T-I/MM | PIC24EP128GP202-E/SS | PIC24EP128MC202-I/MM |
|---|---|---|---|---|---|---|
| Package | QFN-28 (MM) | QFN-28 (MM) - same | QFN-28 (MM) - same | QFN-28 (MM) - same | SSOP-28 (SS) - different footprint, NOT pin-compatible | QFN-28 (MM) - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Operating Temperature | -40C to +150C (H) | -40C to +85C (I) | -40C to +125C (E) | -40C to +85C (I) | -40C to +125C (E) | -40C to +85C (I) |
| Program Flash | 128 KB | 128 KB | 128 KB | 128 KB | 128 KB | 128 KB |
| SRAM | 16 KB | 16 KB | 16 KB | 16 KB | 16 KB | 16 KB |
| CPU Performance | 70 MIPS | 70 MIPS | 70 MIPS | 70 MIPS | 70 MIPS | 70 MIPS |
| Variant Type | General Purpose (GP) | General Purpose (GP) | General Purpose (GP) | General Purpose (GP), T&R packaging | General Purpose (GP), SSOP package | Motor Control (MC) |
| Drop-In for H/MM? | Reference | Yes, if ambient <85C | Yes, if ambient <125C | Yes, if ambient <85C and T&R accepted | No - SSOP-28 requires PCB rework | Partial - same package/temp, but MC peripherals differ from GP |
Principaux différenciateurs
- Extended -40C to +150C H-grade temperature window (vs PIC24EP128GP202-I/MM)
- On-chip dual op-amps and CTMU (vs PIC24EP128GP202-E/MM)
- Same die/package across I, E, and H temperature grades (vs PIC24EP128GP202-E/SS)
Notes de conception
The 28-pin QFN package's exposed thermal pad MUST be soldered to a sufficient copper pour on the PCB to keep junction temperature below 150C at the H-grade maximum. Estimated: at 70 MIPS full-load CPU activity (~30 mA IDD from datasheet typicals) plus peripheral current, total die dissipation is roughly 100-150 mW; with the QFN-28 theta_JA around 40-50 C/W on a 1-square-inch copper pour, junction rise above ambient stays below 8C, leaving comfortable thermal headroom up to 150C ambient. Add thermal vias under the exposed pad for high-temperature applications.
Place 100 nF ceramic decoupling capacitors as close as possible to each VDD/VSS pin pair, plus a single 10 uF bulk capacitor near the package. Separate analog and digital ground returns on the PCB and join them at a single point near the MCU's VSS pin to minimize ADC noise coupling. The 28-pin QFN's center thermal pad also serves as the primary ground connection, so stitch it to the ground plane with multiple vias.
Route the ADC analog signals (AN0-AN15) away from PWM outputs and clock traces to avoid switching noise injection into measurements. If using the on-chip op-amps for current sensing, keep the op-amp output traces short and guard them with ground pours. For high-temperature operation above 125C, prefer NP0/C0G ceramic capacitors over X7R for ADC reference and supply-bypass stability because X7R loses 30-50% of nominal capacitance at 150C.
Do not assume the H-grade part is identical to the I/E grades electrically - while the silicon die is the same, the H grade is tested and guaranteed across -40C to +150C, including oscillator startup and ADC accuracy at temperature extremes. Always download the latest PIC24E datasheet from Microchip's website rather than rely on third-party datasheet mirrors, which may be several revisions out of date for the latest silicon errata. Also remember that VDD must remain within 3.0V to 3.6V - applying 5V to any I/O pin will damage the part.
Informations de conformité
RoHS and REACH compliant per Microchip product page. H-grade (-40C to +150C) is an extended temperature grade, but not formally AEC-Q100 qualified - check the PIC24EP128GP202-H/MM automotive part number with a Microchip factory rep if AEC-Q100 is required.
