PIC24EP128GP204T-E/ML - 16-bit 60MIPS MCU 128KB Flash | Microchip
Référence : PIC24EP128GP204T-E/ML ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $7.42 | $7,42 |
| 10 | $6.78 | $67,80 |
| 100 | $5.95 | $595,00 |
| 500 | $5.21 | $2 605,00 |
| 1 000 | $4.65 | $4 650,00 |
PIC24EP128GP204T-E/ML Présentation
A PIC24E 16-bit microcontroller is a member of Microchip's enhanced PIC24 family, which sits above the PIC16 and PIC18 8-bit lines and below the dsPIC33/PIC32 MIPS-class devices in the broader Microchip MCU hierarchy (8-bit MCU -> 16-bit MCU -> 32-bit MCU). The 'EP' suffix designates the high-speed 70 MIPS-capable core variant with DSP instructions, advanced peripherals, and extended memory addressing, while the 'T-E/ML' suffix indicates tape-and-reel packaging, the extended (-40C to +125C) automotive temperature grade, and the 44-pin QFN package.
Key features of the PIC24EP128GP204T-E/ML include up to 60 MIPS core throughput, 128 KB self-programmable Flash with ECC, 8 KB SRAM, 4 KB EEPROM (family-typical), multiple communication peripherals (I2C, SPI, UART with IrDA/LINbus support), and a high-resolution PWM module. The CTMU enables capacitive touch sensing and precise time measurement, while the integrated op-amps simplify analog front-end designs and reduce BOM count.
Architecturally, the device uses a Harvard bus with separate program and data paths, a hardware multiply/divide engine, and tightly-coupled peripheral trigger logic (PTG) that allows peripherals to chain events without CPU intervention, freeing the core for application-level processing. This combination is well suited to closed-loop control, motor drive, and high-end general-purpose embedded designs.
Typical applications include automotive body electronics, industrial motor control, digital power conversion, capacitive touch HMIs, sensor signal conditioning, and high-performance sensor hubs. The AEC-Q100 qualification makes it attractive for under-hood and body-control ECUs.
A primary design consideration when using this device is the 3.3 V-only supply range, which requires level shifting when interfacing to 5 V peripherals. Additionally, the 44-QFN exposed-pad must be soldered to a sufficient copper pour on the PCB for thermal dissipation and electrical grounding.
This page synthesizes distributor pricing, drop-in alternative listings and practical design notes drawn from Microchip documentation and authorized distributor data, offering engineers a single-source reference not available in the bare datasheet.
Alternatives de remplacement direct pour PIC24EP128GP204T-E/ML — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec PIC24EP128GP204T-E/ML (même facteur de forme et même empreinte) — différant par CTMU, Package, ADC, Communication, Core.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
PIC24EP128GP204-I/ML
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
PIC24EP128GP204T-I/ML
✅ Remplacement direct✓ En stock
$4.31 / unité
Voir la fiche technique →PIC24EP128GP204-H/ML
✅ Remplacement direct✓ En stock
$4.18 / unité
Voir la fiche technique →PIC24EP128GP204T-E/ML Valeurs maximales et caractéristiques électriques
| Core | PIC Harvard 16-bit |
| Series | PIC® 24EP |
| Maximum Core Speed | 60 MIPS (70 MIPS capable) |
| Program Memory | 128 KB Flash (43K x 24) |
| RAM | 8 KB |
| Operating Voltage | 3.0 V to 3.6 V |
| Boîtier | 44-pin QFN EP (8x8 mm) |
| Type de montage | Surface Mount |
| Température de fonctionnement | -40C to +125C (Automotive E temp grade) |
| Communication Interfaces | I2C, SPI, UART (IrDA/LINbus) |
| On-chip Op-Amps | Yes |
| CTMU | Yes (Charge Time Measurement Unit) |
| Peripheral Trigger Generator (PTG) | Yes |
| AEC-Q100 Qualification | Yes |
| Statut RoHS | Compliant |
| Packaging | Tape & Reel |
Configuration des broches de PIC24EP128GP204T-E/ML
| Broche 1 | VDD — Core supply voltage (3.3 V) |
| Broche 2 | OSCI — Oscillator input / external clock |
| Broche 3 | OSCO — Oscillator output |
| Broche 4 | SOSCI — Secondary oscillator input (32.768 kHz) |
| Broche 5 | SOSCO — Secondary oscillator output |
| Broche 6 | MCLR — Master clear / reset (active low) |
| Broche 7 | PGED1 — ICSP programming data pin |
| Broche 8 | PGEC1 — ICSP programming clock pin |
| Broche 9 | RB0 — I/O port B bit 0 |
| Broche 10 | RB1 — I/O port B bit 1 |
| Broche 11 | RB2 — I/O port B bit 2 |
| Broche 12 | RB3 — I/O port B bit 3 |
| Broche 13 | RA0 — I/O port A bit 0 / analog input |
| Broche 14 | RA1 — I/O port A bit 1 / analog input |
| Broche 15 | RA2 — I/O port A bit 2 / analog input |
| Broche 16 | RA3 — I/O port A bit 3 / analog input |
| Broche 17 | RA4 — I/O port A bit 4 |
| Broche 18 | AVDD — Analog supply voltage |
| Broche 19 | AVSS — Analog ground |
| Broche 20 | RB4 — I/O port B bit 4 |
| Broche 21 | RB5 — I/O port B bit 5 |
| Broche 22 | RB6 — I/O port B bit 6 / ICSP PGEC2 |
| Broche 23 | RB7 — I/O port B bit 7 / ICSP PGED2 |
| Broche 24 | RC0 — I/O port C bit 0 |
| Broche 25 | RC1 — I/O port C bit 1 |
| Broche 26 | RC2 — I/O port C bit 2 |
| Broche 27 | VSS — Digital ground |
| Broche 28 | RC3 — I/O port C bit 3 |
| Broche 29 | RC4 — I/O port C bit 4 |
| Broche 30 | RC5 — I/O port C bit 5 |
| Broche 31 | RC6 — I/O port C bit 6 / UART TX |
| Broche 32 | RC7 — I/O port C bit 7 / UART RX |
| Broche 33 | RD0 — I/O port D bit 0 |
| Broche 34 | RD1 — I/O port D bit 1 |
| Broche 35 | RD2 — I/O port D bit 2 |
| Broche 36 | RD3 — I/O port D bit 3 |
| Broche 37 | RD4 — I/O port D bit 4 |
| Broche 38 | RD5 — I/O port D bit 5 |
| Broche 39 | RD6 — I/O port D bit 6 |
| Broche 40 | RD7 — I/O port D bit 7 |
| Broche 41 | RE0 — I/O port E bit 0 |
| Broche 42 | RE1 — I/O port E bit 1 |
| Broche 43 | RE2 — I/O port E bit 2 |
| Broche 44 | EP — Exposed pad (thermal/ground - must be soldered) |
Applications typiques
PIC24EP128GP204T-E/ML convient pour 6 applications: Automotive Body Control Module, Industrial Motor Control / FOC Drive, Capacitive Touch Human-Machine Interface (HMI), Digital Power Conversion (SMPS) Control, Sensor Signal Conditioning Hub, Automotive LINbus Slave ECU.
Automotive Body Control Module
The PIC24EP128GP204T-E/ML is a strong fit for automotive body control modules (BCMs) where AEC-Q100 qualification, -40C to +125C operation and reliable LINbus communication are required. Its 60 MIPS 16-bit core runs BCM state machines and LIN stacks with low latency, while the 128 KB Flash (43K x 24) holds the full body-application firmware including diagnostic UDS handlers. The CTMU and on-chip op-amps interface directly with body-control sensors (rain, light, humidity) without external analog chains. Placed on a BCM PCB with a 3.3 V LDO and LIN transceiver, the device simplifies BOM and supports both body ECU and central gateway use cases with low part count.
Recommandé
Industrial Motor Control / FOC Drive
The PIC24EP128GP204T-E/ML suits low-power industrial motor control loops, including 1-2 axis brushed and small BLDC drives, where field-oriented control (FOC) or trapezoidal commutation is required. The 60 MIPS core executes FOC math in single-digit microseconds, while the high-resolution PWM module drives MOSFET half-bridges at switching frequencies from 20 kHz to 100 kHz. Integrated op-amps condition current-sense shunt signals, eliminating external amplifiers. The 128 KB Flash stores FOC parameter tables, ramp profiles and fault handlers, and the 8 KB SRAM handles per-cycle current and torque calculations.
Recommandé
Capacitive Touch Human-Machine Interface (HMI)
The PIC24EP128GP204T-E/ML is well matched to capacitive-touch HMIs thanks to its integrated Charge Time Measurement Unit (CTMU), which measures capacitance changes with sub-ns resolution to detect finger touches. The 60 MIPS core drives a touch UI, RGB LED animations, and I2C communication to a host MCU or LED driver simultaneously. The 128 KB Flash supports full touch firmware plus UI state machines, while 8 KB SRAM handles active touch scanning buffers. Combined with the on-chip op-amps for analog touch sensing, this device enables a small BOM, automotive-grade touch panel design with high noise immunity.
Recommandé
Digital Power Conversion (SMPS) Control
The PIC24EP128GP204T-E/ML can serve as a primary controller for low-to-mid power digital switch-mode power supplies (SMPS) where DSP-class compute is needed for digital compensation. The 60 MIPS core runs digital PID loops at PWM switching rates, while the high-resolution PWM module (typical 7.5 ns resolution for the PIC24EP family) generates precise switching waveforms. The ADC (10/12-bit on family) samples output voltage and current at high bandwidth, and the integrated op-amps amplify feedback signals before ADC sampling. The 128 KB Flash fits full compensation firmware plus telemetry, while AEC-Q100 qualification opens automotive converter designs.
Recommandé
Sensor Signal Conditioning Hub
The PIC24EP128GP204T-E/ML is a good fit as a multi-sensor signal-conditioning hub for industrial and IoT-edge gateways, where multiple analog sensors (temperature, pressure, strain, flow) must be amplified, filtered and digitized. The integrated op-amps implement instrumentation-amp-style front-ends without external analog ICs, while the CTMU supports temperature and time-domain sensing. The 60 MIPS core runs sensor-fusion algorithms at high sample rates, and the 128 KB Flash holds calibration tables, linearization coefficients and JSON-over-UART protocol stacks. AEC-Q100 plus extended temperature make it deployable in outdoor and in-cabin sensing nodes.
Recommandé
Automotive LINbus Slave ECU
The PIC24EP128GP204T-E/ML works as a LINbus slave ECU controller in distributed automotive networks (window lifters, seat controllers, mirror adjusters). The integrated UART with LIN support handles LIN 2.0/2.1/2.2A protocol handling directly, the 60 MIPS core processes LIN frames and actuator commands, and the integrated op-amps drive H-bridge current sense or position feedback. The AEC-Q100 grade plus extended -40C to +125C operation lets the part live inside the door module next to motors. 128 KB Flash holds the full LIN slave stack, diagnostics and actuator control firmware, while the 44-QFN EP footprint fits inside space-constrained modules.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour PIC24EP128GP204T-E/ML — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | PIC24EP128GP204-I/ML | PIC24EP128GP204T-I/ML | PIC24EP128GP204-H/ML |
|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 44-QFN EP (8x8 mm) | 44-QFN EP (8x8 mm) - same | 44-QFN EP (8x8 mm) - same | 44-QFN EP (8x8 mm) - same |
| Flash | 128 KB | 128 KB | 128 KB | 128 KB |
| RAM | 8 KB | 8 KB | 8 KB | 8 KB |
| Core Speed | 60 MIPS | 60 MIPS | 60 MIPS | 60 MIPS |
| Operating Voltage | 3.0 V to 3.6 V | 3.0 V to 3.6 V | 3.0 V to 3.6 V | 3.0 V to 3.6 V |
| Temperature Grade | -40C to +125C (E, automotive) | -40C to +85C (I, industrial) | -40C to +85C (I, industrial) | H grade variant |
| AEC-Q100 | Yes | No | No | No |
Principaux différenciateurs
- AEC-Q100 automotive qualified at 60 MIPS (vs PIC24FJ128GA204-I/ML)
- Same 128 KB Flash in a smaller 44-QFN package (vs PIC24EP256GP204-I/PT)
- Integrated CTMU + op-amps reduces BOM (vs PIC24EP128GP204-I/ML)
Notes de conception
Estimated: at fcore = 60 MIPS, VDD = 3.3 V, and Icore ~ 30 mA typ (PIC24EP family), core power dissipation is approximately 99 mW. Add ~10-20 mA I/O contribution for typical 16 mA drive ports. Use a low-noise 3.3 V LDO with <50 mV dropout, and place 100 nF + 10 uF ceramic decoupling on AVDD and VDD within 5 mm of the pins. Star-ground AGND/AVSS to the QFN exposed pad and tie EP to the ground pour with at least 4 vias for thermal relief.
The 44-QFN EP package is the primary heat-dissipation path. The exposed pad must be soldered to a continuous copper pour (recommended minimum 1 square inch of 2 oz copper on the top layer) and stitched to the inner ground plane with at least 4 thermal vias (0.3 mm hole, 0.6 mm pad). For automotive under-hood designs at full 60 MIPS, this keeps theta_JA in the 25-30 C/W range and prevents thermal shutdown above the +125C ambient target.
Keep the MCLR pin trace <25 mm, and place the MCLR pull-up (10 kohm to VDD) and decoupling capacitor (100 nF to GND) within 5 mm of the pin. Route the ICSP lines (PGED1/PGEC1, PGED2/PGEC2) away from analog sensor traces and high-current switching lines to minimize noise coupling during in-circuit programming. Use a 4-layer PCB with a dedicated ground plane for the 44-QFN to control EMI and provide a stable reference for the ADC and op-amp sections.
Do not connect 5 V signals directly to the PIC24EP128GP204T-E/ML's GPIO - the absolute maximum Vih on any I/O pin is VDD + 0.3 V. Use a 74LVC245 or equivalent level shifter when interfacing to 5 V peripherals. The internal op-amp inputs share the analog I/O pins and cannot be used as digital GPIO simultaneously - plan pin assignments early so the CTMU, op-amp and standard GPIO functions do not conflict. Always configure unused I/O as outputs driven low to minimize power consumption.
Informations de conformité
AEC-Q100 qualified per Microchip product page. RoHS and REACH compliant per distributor listings. Conflict-minerals statement available from Microchip.
