PIC16F15375-E/ML - 14KB Flash 8-bit MCU, 44-pin QFN | Microchip
Référence : PIC16F15375-E/ML ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $2.12 | $2,12 |
| 10 | $1.93 | $19,30 |
| 100 | $1.71 | $171,00 |
| 500 | $1.48 | $740,00 |
| 1 000 | $1.28 | $1 280,00 |
PIC16F15375-E/ML Présentation
A microcontroller (MCU) is a single-chip computer that integrates a CPU, memory, and programmable I/O peripherals on one die. The 8-bit PIC architecture uses a modified Harvard RISC core that executes most instructions in one cycle, and PIC microcontrollers belong to the broader category of microcontrollers -> embedded processors -> semiconductors. The '153xx generation adds CIPs such as CLC, CWG, NCO, and DSM that can operate without CPU intervention, reducing active-mode current and enabling deterministic timing.
Key specifications include 14KB Flash, 1KB SRAM, 256B EEPROM, four 10-bit PWMs with complementary outputs, a 5-bit DAC, a 10-bit ADC with computation, two comparators, four Configurable Logic Cells (CLC), a Complementary Waveform Generator (CWG), two EUSART (with LIN), one SPI/I2C, and eXtreme Low-Power features such as IDLE/DOZE modes and nanoWatt XLP sleep currents in the order of nanoamps. Supply voltage runs from 2.3V to 5.5V (F suffix = 3V-5.5V Vdd range typical for this family).
The 44-pin QFN EP package provides excellent thermal dissipation through the exposed pad, which must be soldered to a ground pad to meet electrical and thermal specifications. The QFN-44 footprint is compact (8x8 mm typical) and supports high-pin-count I/O on a small board area, ideal for hand-held and space-constrained designs.
Typical applications include low-power IoT sensor nodes, LED lighting and signage controllers, USB-CDC/HID human-interface devices, battery-powered measurement instruments, and motor/solenoid control with the CWG. The combination of XLP, CIPs, and EUSART makes the part well suited to mains-powered or battery-powered nodes that need deterministic peripheral behaviour without waking the CPU.
When designing with this part, always solder the exposed pad to a ground plane of at least 8 thermal vias for thermal and electrical performance. Use Microchip's MPLAB X IDE with the XC8 compiler; the device is supported by the MPLAB Code Configurator (MCC) for graphical peripheral setup, which dramatically reduces firmware development time.
This page synthesizes distributor stock, drop-in same-package alternatives, application notes and practical design considerations not found in the bare datasheet, optimized for engineers who already know the PIC16 architecture and need a quick decision matrix.
Alternatives de remplacement direct pour PIC16F15375-E/ML — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec PIC16F15375-E/ML (même facteur de forme et même empreinte) — différant par Package, ADC, PWM Channels, Program Memory (Flash), SPI / I2C.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
PIC16F15376-E/ML
✅ Remplacement direct✓ En stock
$1.45 / unité
Voir la fiche technique →PIC16F15356-E/ML
✅ Remplacement direct✓ En stock
$1.05 / unité
Voir la fiche technique →PIC16F15385-E/ML
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
PIC16F15376-I/ML
✅ Remplacement direct✓ En stock
$1.45 / unité
Voir la fiche technique →PIC16F15356T-I/ML
✅ Remplacement direct✓ En stock
$1.15 / unité
Voir la fiche technique →PIC16F15375-E/ML Valeurs maximales et caractéristiques électriques
| Architecture | 8-bit PIC RISC (modified Harvard) |
| Family | PIC16(L)F153xx |
| Program Memory (Flash) | 14 KB |
| Data Memory (SRAM) | 1 KB |
| EEPROM | 256 B |
| Maximum CPU Speed | 32 MHz |
| Operating Voltage (Vdd) | 2.3 V to 5.5 V |
| Boîtier | 44-pin QFN EP (8x8 mm) |
| Comparators | 2 |
| PWM Channels | 4 (10-bit) |
| CLC Cells | 4 |
| CWG | 1 (Complementary Waveform Generator) |
| EUSART | 2 |
| SPI / I2C | 1 SPI, 1 I2C |
| Température de fonctionnement | -40 C to +125 C (extended, -E suffix) |
| Statut RoHS | Compliant |
| Type de montage | Surface Mount |
Configuration des broches de PIC16F15375-E/ML
| Broche 1 | RA5 — I/O port A bit 5 / ADC reference |
| Broche 2 | RA4 — I/O port A bit 4 |
| Broche 3 | RA3 — I/O port A bit 3 |
| Broche 4 | RA2 — I/O port A bit 2 |
| Broche 5 | RA1 — I/O port A bit 1 |
| Broche 6 | RA0 — I/O port A bit 0 |
| Broche 7 | Vdd — Positive supply voltage |
| Broche 8 | Vss — Ground reference |
| Broche 9 | RB7 — I/O port B bit 7 / ICSP CLK |
| Broche 10 | RB6 — I/O port B bit 6 / ICSP DAT |
| Broche 11 | RB5 — I/O port B bit 5 |
| Broche 12 | RB4 — I/O port B bit 4 |
| Broche 13 | RB3 — I/O port B bit 3 |
| Broche 14 | RB2 — I/O port B bit 2 |
| Broche 15 | RB1 — I/O port B bit 1 |
| Broche 16 | RB0 — I/O port B bit 0 |
| Broche 17 | RC7 — I/O port C bit 7 |
| Broche 18 | RC6 — I/O port C bit 6 |
| Broche 19 | RC5 — I/O port C bit 5 |
| Broche 20 | RC4 — I/O port C bit 4 |
| Broche 21 | RC3 — I/O port C bit 3 |
| Broche 22 | RC2 — I/O port C bit 2 |
| Broche 23 | RC1 — I/O port C bit 1 |
| Broche 24 | RC0 — I/O port C bit 0 |
| Broche 25 | RD7 — I/O port D bit 7 |
| Broche 26 | RD6 — I/O port D bit 6 |
| Broche 27 | RD5 — I/O port D bit 5 |
| Broche 28 | RD4 — I/O port D bit 4 |
| Broche 29 | RD3 — I/O port D bit 3 |
| Broche 30 | RD2 — I/O port D bit 2 |
| Broche 31 | RD1 — I/O port D bit 1 |
| Broche 32 | RD0 — I/O port D bit 0 |
| Broche 33 | RE7 — I/O port E bit 7 |
| Broche 34 | RE6 — I/O port E bit 6 |
| Broche 35 | RE5 — I/O port E bit 5 |
| Broche 36 | RE4 — I/O port E bit 4 |
| Broche 37 | RE3 — I/O port E bit 3 |
| Broche 38 | RE2 — I/O port E bit 2 |
| Broche 39 | RE1 — I/O port E bit 1 |
| Broche 40 | RE0 — I/O port E bit 0 |
| Broche 41 | OSC2 — Crystal oscillator output |
| Broche 42 | OSC1 — Crystal oscillator input |
| Broche 43 | Vdd — Positive supply voltage (second pin) |
| Broche 44 | Vss — Ground reference (second pin) |
| Broche 45 | EP — Exposed pad - thermal/ground, must be soldered to PCB ground plane |
Applications typiques
PIC16F15375-E/ML convient pour 6 applications: Low-Power IoT Sensor Node, LED Lighting and Signage Controller, USB HID / CDC Human Interface Device, Battery-Powered Measurement Instrument, Motor and Solenoid Control, Home Appliance User Interface.
Low-Power IoT Sensor Node
The PIC16F15375-E/ML suits battery-powered IoT sensor nodes because of its nanoWatt XLP sleep currents in the nA range, 4 Configurable Logic Cells (CLC) that can wake the part on analog events without the CPU, and 14 KB of Flash that comfortably fits BLE/Zigbee sub-GHz stack glue logic. The 2.3-5.5 V Vdd range supports direct Li-ion battery connection through a simple LDO. Two EUSART peripherals allow simultaneous sensor-bus and uplink-radio connectivity, while the 10-bit ADC with computation handles temperature, light and motion sensing on-chip. Place the QFN EP over a ground copper pour with thermal vias to maintain junction temperature during periodic radio TX bursts.
Recommandé
LED Lighting and Signage Controller
The PIC16F15375-E/ML drives LED lighting and signage with its 4 PWM channels (10-bit) for dimming, 1 Complementary Waveform Generator (CWG) for half-bridge MOSFET timing, and 4 CLC cells for fault protection logic implemented entirely in hardware. The 5-bit DAC and 2 comparators enable constant-current LED driver regulation without CPU intervention, allowing the core to sleep most of the time and only wake for color/pattern updates via SPI. Its 44-pin QFN EP footprint fits inside compact downlight form factors while supporting high-channel-count LED strings.
Recommandé
USB HID / CDC Human Interface Device
The PIC16F15375-E/ML forms the core of USB-HID and USB-CDC peripherals when paired with an external USB transceiver; its two EUSART ports enable CDC-ACM bridging, while 14 KB Flash supports HID report descriptors, bootloader and command parser. The 10-bit ADC with computation handles analog joystick or button-matrix scanning, and the CLC cells debounce mechanical inputs in hardware so the CPU can remain in IDLE mode. The 44-pin QFN EP package minimizes PCB footprint, and the 2.3-5.5 V range allows direct USB 5V or 3.3V regulated rail operation.
Recommandé
Battery-Powered Measurement Instrument
The PIC16F15375-E/ML powers portable measurement instruments (multimeters, dataloggers, field testers) thanks to its 14 KB Flash for calibration tables and UI state machines, 1 KB SRAM for measurement buffers, and the 10-bit ADC with computation that performs oversampling and averaging in hardware. The 5-bit DAC and 2 comparators generate and detect precise threshold crossings for battery-test or sensor-stimulation waveforms. nanoWatt XLP allows a year-long shelf life on coin cells when the unit is dormant, and the -40C to +125C operating range supports outdoor and industrial field use.
Recommandé
Motor and Solenoid Control
The PIC16F15375-E/ML drives small DC motors, steppers and solenoids using its Complementary Waveform Generator (CWG) for dead-band-correct half-bridge timing, 4 PWM channels (10-bit) for speed/duty control, and 4 CLC cells that implement cycle-by-cycle current limiting in hardware. Two EUSART ports allow communication with a host PLC or HMI while motor control loops run autonomously via CIPs. The 44-pin QFN EP footprint fits inside BLDC driver modules, and the extended -40C to +125C operating temperature handles under-hood automotive and industrial cabinet environments.
Recommandé
Home Appliance User Interface
The PIC16F15375-E/ML builds touchscreen-less home appliance UI boards (washers, ovens, microwaves) using its 14 KB Flash for state machines and LCD segment drivers, plus 4 PWM channels for buzzer and indicator LED brightness control. The CLC cells implement capacitive touch or matrix-keypad scan autonomously, letting the core enter IDLE between button events. Two EUSARTs connect to the main appliance controller board and a service/diagnostic port, and the -40C to +125C extended temperature range handles behind-panel thermal rise. The QFN EP footprint fits behind 7-segment LCD modules.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour PIC16F15375-E/ML — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | PIC16F15376-E/ML | PIC16F15356-E/ML | PIC16F15385-E/ML | PIC16F15376-I/ML | PIC16F15356T-I/ML |
|---|---|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 44-pin QFN EP (ML) | 44-pin QFN EP (ML) - same | 44-pin QFN EP (ML) - same | 44-pin QFN EP (ML) - same | 44-pin QFN EP (ML) - same | 44-pin QFN EP (ML) - same |
| Program Memory (Flash) | 14 KB | 16 KB | 7 KB | 28 KB | 16 KB | 7 KB |
| Data Memory (SRAM) | 1 KB | 1 KB | 1 KB | 2 KB | 1 KB | 1 KB |
| Operating Voltage | 2.3 V to 5.5 V | 2.3 V to 5.5 V | 2.3 V to 5.5 V | 2.3 V to 5.5 V | 2.3 V to 5.5 V | 2.3 V to 5.5 V |
| Operating Temperature | -40 C to +125 C (E suffix) | -40 C to +125 C | -40 C to +125 C | -40 C to +125 C | -40 C to +85 C (I suffix) | -40 C to +85 C (I suffix) |
| Core Independent Peripherals (CLC) | 4 CLC + 1 CWG | 4 CLC + 1 CWG | 4 CLC + 1 CWG | 4 CLC + 1 CWG | 4 CLC + 1 CWG | 4 CLC + 1 CWG |
| EUSART / I2C / SPI | 2 EUSART / 1 I2C / 1 SPI | 2 EUSART / 1 I2C / 1 SPI | 2 EUSART / 1 I2C / 1 SPI | 2 EUSART / 1 I2C / 1 SPI | 2 EUSART / 1 I2C / 1 SPI | 2 EUSART / 1 I2C / 1 SPI |
| Packaging | Tube | Tube | Tube | Tube | Tube | Tape-and-Reel |
Principaux différenciateurs
- Balanced Flash-to-pin ratio for the 44-pin QFN EP package (vs PIC16F15356-E/ML)
- Industrial / commercial -40C to +125C operating range (vs PIC16F15376-I/ML)
- 1 KB SRAM matches peripheral count more efficiently than 15385 (vs PIC16F15385-E/ML)
Notes de conception
The 44-pin QFN EP package dissipates heat through the exposed pad (pin 45). Solder the EP to a PCB ground pad of at least 25 mm^2 connected by 8-12 thermal vias (0.3 mm drill, 0.5 mm pitch) to the inner ground plane. Without proper EP soldering the junction temperature can rise 20-30 C above the datasheet figure, causing derated performance or thermal shutdown. Estimated: at 32 MHz CPU and full peripheral activity, power dissipation is around 15-20 mW; the EP keeps theta_JA below ~30 C/W on a standard 4-layer 1 oz copper JEDEC test board.
Place a 0.1 uF decoupling capacitor within 3 mm of each Vdd pin (pins 7 and 43) and a bulk 1-10 uF tantalum or ceramic on the supply rail close to the MCU. The QFN EP ground pad doubles as the second Vss return; route high-speed signals (OSC, EUSART) over a continuous ground plane to avoid ground bounce. Keep the ICSP CLK/DAT lines (RB6/RB7) short and protected with series resistors to ease in-circuit programming.
Do not leave the MCLR pin floating - always tie it to Vdd through a 10 kohm pull-up and add a 100 nF cap to ground for noise immunity, or use the internal MCLR via CONFIG. The OSC1/OSC2 pins must be left open or configured as digital I/O if you select the internal HFINTOSC; a floating unused crystal pin can pick up noise and cause spurious clock anomalies. Avoid routing analog ADC inputs near PWM outputs to prevent switching noise coupling into measurements; use the ADC's computation mode with oversampling for clean readings.
Informations de conformité
RoHS compliant per Microchip product page. -E suffix denotes extended -40C to +125C temperature grade, not AEC-Q100 automotive qualification; for AEC-Q100 qualified PIC16F15375 variants, contact Microchip for -VAO or -AUT part numbers.
