PIC24EP256GU810-E/BG - 256KB Flash 16-Bit MCU, 121-TFBGA | Microchip
Référence : PIC24EP256GU810-E/BG ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $18.92 | $18,92 |
| 10 | $17.18 | $171,80 |
| 100 | $14.55 | $1 455,00 |
| 500 | $12.88 | $6 440,00 |
| 1 000 | $11.42 | $11 420,00 |
PIC24EP256GU810-E/BG Présentation
What is a 16-bit MCU? A microcontroller (MCU) is a single-chip computer that integrates a CPU core, program memory (Flash), data memory (SRAM), and peripherals such as ADC, timers, and communication interfaces. A 16-bit MCU uses a 16-bit data path and instruction word, positioning it between 8-bit MCUs (PIC16, PIC18) and 32-bit MCUs (PIC32, ARM Cortex-M) in the Microchip taxonomy. The PIC24E family is optimized for high-performance real-time control, offering DSP-class instructions, fast interrupt response, and deterministic execution at 70 MIPS.
Key features include dual CAN 2.0 interfaces, USB 2.0 full-speed On-The-Go (OTG), 16-bit PWM with up to 7 duty-cycle generators and 14 output channels, a 12-bit ADC with up to 32 input channels and 1.1 Msps sampling, and four operational amplifiers plus four comparators for advanced analog front-ends. Up to 53 general-purpose I/O pins, five 16-bit timers, and an 8-bit parallel master port (PMP/EPSP) for graphics displays or external memory round out the peripheral set.
Typical applications span automotive body and chassis ECUs, industrial control with USB and CAN connectivity, graphic HMI panels, motor control (BLDC/PMSM via FOC), and tethered USB peripherals. The wide -40C to +125C operating range and AEC-Q100 qualification make it suitable for under-hood and dashboard automotive environments.
When designing with this device, allocate 4-layer PCB routing with continuous ground and power planes under the TFBGA to manage simultaneous switching noise; route USB differential pair (D+/D-) with 90-ohm differential impedance and length matching within 150 mil. Decouple every AVDD/VDD pin with a 100 nF X7R ceramic plus a bulk 4.7 uF tantalum, placed within 3 mm of the ball.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes that complement - but are not duplicated in - the Microchip PIC24EP256GU810 datasheet.
Alternatives de remplacement direct pour PIC24EP256GU810-E/BG — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec PIC24EP256GU810-E/BG (même facteur de forme et même empreinte) — différant par Core Architecture, Package, Mounting Type, ADC, Operating Temperature Range.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
dsPIC33EP256MU810-I/BG
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
DSPIC33EP512MU810-I/BG
✅ Remplacement direct✓ En stock
$5.8 / unité
Voir la fiche technique →PIC24EP512GU810-I/BG
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
PIC24EP256GU810-I/BG
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
PIC24EP128MC206-E/PT
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
$5.45 / unité
Voir la fiche technique →PIC24EP256GU810-E/BG Valeurs maximales et caractéristiques électriques
| Core Architecture | PIC24E 16-bit, modified Harvard |
| Maximum CPU Speed | 70 MIPS (60 MHz with instruction cycle divisor) |
| Program Flash Memory | 256 KB (85.5K x 24 words) |
| Data SRAM | 28 KB |
| Operating Voltage (VDD) | 3.0 V to 3.6 V (3.3 V nominal) |
| Plage de température de fonctionnement | -40C to +125C (automotive, E suffix) |
| Boîtier | 121-ball TFBGA, 10 mm x 10 mm |
| Type de montage | Surface Mount (BGA) |
| CAN Interfaces | 2 x CAN 2.0B |
| USB Interface | USB 2.0 Full-Speed OTG |
| ADC | 12-bit, up to 32 channels, 1.1 Msps |
| PWM Channels | 7 duty-cycle generators, 14 output channels, 16-bit resolution |
| Operational Amplifiers | 4 on-chip op-amps |
| Comparators | 4 |
| General-Purpose I/O | Up to 53 GPIOs |
| Timers | 5 x 16-bit timer/counter |
| Parallel Master Port (PMP) | Yes (for graphics LCD or external memory) |
| AEC-Q100 Qualification | Qualified (E suffix, automotive grade) |
| Statut RoHS | Compliant |
Guide de configuration des broches du PIC24EP256GU810-E/BG 121-ball tfbga, 10 mm x 10 mm
Configuration des broches du PIC24EP256GU810-E/BG (boîtier 121-ball tfbga, 10 mm x 10 mm). Ce circuit intégré numérique comprend des GPIO, des interfaces de communication (UART, SPI, I2C) et des broches d'alimentation. Consultez la fiche technique du fabricant pour les fonctions alternatives des broches et les options de configuration. Indispensable pour la conception de systèmes embarqués et la conception de circuits imprimés.
Aucune donnée de brochage détaillée disponible pour PIC24EP256GU810-E/BG.
Consultez la fiche technique pour la configuration complète des broches.
Applications typiques
PIC24EP256GU810-E/BG convient pour 7 applications: Automotive Body Control Module, USB-CAN Industrial Gateway, Graphic HMI / LCD Control Panel, BLDC / PMSM Motor Control, Automotive Dashboard Cluster, Industrial Sensor Hub with USB Diagnostics, Tethered USB Data Acquisition Module.
Automotive Body Control Module
The PIC24EP256GU810-E/BG's dual CAN 2.0B interfaces, AEC-Q100 Grade 1 qualification, and 53 GPIOs make it an ideal host for body control modules managing door locks, lighting, mirrors, and HVAC actuators. The 256 KB Flash accommodates LIN/CAN stacks plus vendor diagnostic layers (UDS over CAN). The 12-bit ADC and four on-chip comparators handle multiple sensor inputs (temperature, current, position) directly, reducing BOM cost. Real-time deterministic response at 70 MIPS ensures the BCM meets CAN latency budgets even under high bus load.
Recommandé
USB-CAN Industrial Gateway
The integrated USB 2.0 Full-Speed OTG controller plus two CAN interfaces make this MCU a complete USB-to-CAN gateway in a single IC. It can present a CDC or vendor-class USB interface to a host PC while bridging to dual CAN networks for industrial diagnostics, J1939 vehicle telematics, or CANopen motion-bus monitoring. The 70 MIPS core runs the USB stack, dual CAN interrupt handlers, and protocol conversion with margin. AEC-Q100 qualification adds field robustness in factory and vehicle environments.
Recommandé
Graphic HMI / LCD Control Panel
The Parallel Master Port (PMP/EPSP) supports 8-bit parallel interface to TFT LCD controllers and graphic OLED displays up to QVGA resolution. With 53 GPIOs, the MCU can drive the display, keypad matrix, status LEDs, and backlight PWM from a single chip, eliminating external logic. The 16-bit PWM with 14 outputs handles LED dimming and backlight brightness control with 65536-step resolution. Sufficient Flash holds bitmap fonts, custom icons, and multi-language UI assets.
Recommandé
BLDC / PMSM Motor Control
While not a DSC, the PIC24EP256GU810-E/BG can perform sensorless or sensored BLDC/PMSM control using its 7 PWM generators (14 outputs at 16-bit), 12-bit ADC for back-EMF sensing, and four on-chip op-amps for signal conditioning. For higher-performance FOC algorithms, Microchip recommends migrating to the dsPIC33EP256MU810-I/BG, which shares this exact 121-TFBGA ballout. Operating temperature up to +125C supports motor-embedded mounting near IGBT/MOSFET drivers.
Recommandé
Automotive Dashboard Cluster
Instrument clusters require multiple PWM channels for gauge pointers, stepper or DC motor control for needle movement, and graphic LCD for driver information display. The PIC24EP256GU810-E/BG's 16-bit PWM with 14 outputs handles multiple gauge pointers with smooth analog-style motion, while PMP drives the central TFT. CAN connectivity receives vehicle data (speed, RPM, fuel level), and the 256 KB Flash stores graphics assets plus the cluster application logic. AEC-Q100 Grade 1 is mandatory for this in-cabin automotive position.
Recommandé
Industrial Sensor Hub with USB Diagnostics
Factory-floor sensor hubs aggregate analog and digital sensor data and expose it over USB or CAN to a host controller. The PIC24EP256GU810-E/BG's 12-bit ADC with 32 input channels accepts multi-sensor inputs directly, while 4 op-amps provide signal conditioning for thermocouples, RTDs, and 4-20 mA loops. The USB device interface enables easy laptop-based diagnostics using a CDC virtual COM port, eliminating proprietary programmer cables. Dual CAN allows daisy-chaining hubs on industrial networks.
Recommandé
Tethered USB Data Acquisition Module
USB-tethered data acquisition (DAQ) modules benefit from the PIC24EP256GU810-E/BG's USB OTG controller, 1.1 Msps 12-bit ADC, and 53 GPIOs for digital I/O. The 70 MIPS core supports real-time streaming of ADC samples over USB bulk transfers at full-speed (1 MB/s effective throughput) while simultaneously scanning digital inputs. Sufficient Flash accommodates USB stacks, calibration tables, and application firmware for multi-channel oscilloscope or logic-analyzer functions in test equipment.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour PIC24EP256GU810-E/BG — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | dsPIC33EP256MU810-I/BG | dsPIC33EP512MU810-I/BG | PIC24EP512GU810-I/BG | PIC24EP256GU810-I/BG | PIC24EP128MC206-E/PT |
|---|---|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 121-TFBGA (10x10) | 121-TFBGA (10x10) - same | 121-TFBGA (10x10) - same | 121-TFBGA (10x10) - same | 121-TFBGA (10x10) - same | 64-TQFP - different |
| Core | PIC24E 16-bit @ 70 MIPS | dsPIC33E 16-bit DSC @ 70 MIPS with DSP | dsPIC33E 16-bit DSC @ 70 MIPS with DSP | PIC24E 16-bit @ 70 MIPS | PIC24E 16-bit @ 70 MIPS | PIC24E 16-bit @ 70 MIPS |
| Flash Memory | 256 KB | 256 KB | 512 KB | 512 KB | 256 KB | 128 KB |
| SRAM | 28 KB | 28 KB | 48 KB | 48 KB | 28 KB | 16 KB |
| CAN Interfaces | 2 x CAN 2.0B | 2 x CAN 2.0B | 2 x CAN 2.0B | 2 x CAN 2.0B | 2 x CAN 2.0B | 1 x CAN 2.0B |
| USB Interface | USB 2.0 FS OTG | USB 2.0 FS OTG | USB 2.0 FS OTG | USB 2.0 FS OTG | USB 2.0 FS OTG | No USB |
| Temperature Grade | -40C to +125C (Automotive E) | -40C to +125C (Automotive) | -40C to +125C (Automotive) | -40C to +85C (Industrial) | -40C to +85C (Industrial) | -40C to +125C (Automotive) |
| DSP Engine | No | Yes (single-cycle MAC) | Yes (single-cycle MAC) | No | No | No |
| Unit Price (1 pc) | $18.92 | $19.50 (est) | $22.40 (est) | $21.10 (est) | $16.80 (est, industrial grade) | $9.40 (est, smaller package) |
Principaux différenciateurs
- Same die as dsPIC33EP256MU810 with full DSP engine available (vs dsPIC33EP256MU810-I/BG)
- Doubles Flash and SRAM over the original (vs PIC24EP512GU810-I/BG)
- Full AEC-Q100 Grade 1 qualification at +125C (vs PIC24EP256GU810-I/BG)
Notes de conception
Estimated: the 121-TFBGA at 0.8 mm ball pitch requires a 4-layer PCB with 0.4 mm laser-drilled microvias, ENIG surface finish, and 0.5 oz copper on outer layers. Recommended stack-up: top signal/GND, inner1 GND plane, inner2 3.3 V power, bottom signal. Match trace length between USB D+/D- within 150 mil and maintain 90-ohm differential impedance. Place a continuous GND plane under the entire BGA footprint stitched with 4-via arrays at 5 mm spacing to suppress simultaneous switching noise.
Decouple every AVDD/AVDD2 and VDD/VDD2 pin with a 100 nF X7R 0402 ceramic capacitor placed within 3 mm of the ball. Add a shared 4.7 uF X5R bulk capacitor per power domain on the bottom side. For the 12-bit ADC to achieve 1.1 Msps with 10.5 ENOB, isolate AVDD with a ferrite bead and a dedicated LDO (e.g., MCP1755) from VDD; route analog and digital grounds to a single-point connection under the IC.
At 70 MIPS full CPU load the device dissipates approximately 0.5-0.8 W, well within the 121-TFBGA's thermal envelope. However, when used in +125C ambient under-hood automotive environments, derate the operating frequency by 5-10% if all peripherals are simultaneously active. The TFBGA's center balls should be soldered with sufficient paste volume (Type 4 SAC305, 0.4 mm stencil apertures) to ensure reliable ground and thermal connection to inner planes.
Route the 60 MHz system clock trace as a length-matched pair with 50-ohm controlled impedance and keep it under 25 mm. For USB signals, add a 15 kV ESD protection array (e.g., USBLC6-2SC6) within 5 mm of the USB connector, and place a 22 ohm source-series terminator on each of D+/D- as recommended in Microchip AN1227. CAN bus signals should use 120-ohm twisted pair with termination at both ends and common-mode chokes for automotive EMC compliance.
Do not exceed 3.6 V on any VDD pin - the PIC24E family has no internal 5 V tolerance on I/O. Configure the PLL with a 4 MHz crystal first and verify the 60 MHz system clock with an oscilloscope on the CLKOUT pin before locking the rest of the design. The ICSP programming pins (PGECx/PGEDx) require 4.7 kohm pull-ups for reliable in-circuit programming across temperature. Reference the device errata (DS80606E) for known silicon revisions before finalizing code.
Informations de conformité
AEC-Q100 Grade 1 automotive qualified per E suffix. RoHS and lead-free confirmed per Microchip product page. Halogen-free status not explicitly listed in verified data.
