PIC24EP32GP204-H/TL - 32KB Flash 16-bit MCU 44-Pin | Microchip
Référence : PIC24EP32GP204-H/TL ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $3.92 | $3,92 |
| 10 | $3.53 | $35,30 |
| 100 | $3.14 | $314,00 |
| 500 | $2.81 | $1 405,00 |
| 1 000 | $2.5 | $2 500,00 |
PIC24EP32GP204-H/TL Présentation
A microcontroller (MCU) is a single-chip computer that integrates a CPU core, memory (Flash/RAM), and programmable I/O peripherals. The PIC24EP family belongs to Microchip's 16-bit dsPIC/PIC24E architecture hierarchy: microcontroller -> 16-bit MCU -> PIC24E family -> PIC24EP sub-family -> general purpose tier. This taxonomy places the PIC24EP between the older PIC24F and the higher-end dsPIC33E families in both performance and on-chip analog integration.
Key differentiating features include enhanced ADC performance with up to 12-bit resolution and 1.1 Msps conversion rate, on-chip op-amps, Charge Time Measurement Unit (CTMU) for capacitive touch and accurate time measurement, Peripheral Trigger Generator (PTG) for hardware event sequencing, and high-speed PWM with independent time bases. These blocks are uncommon in competing 16-bit MCUs at this price/performance tier and reduce external component count for motor control and power conversion designs.
The PIC24E core uses a 16-bit modified Harvard architecture with a 24-bit instruction word, allowing most instructions to execute in a single cycle and supporting DSP-oriented operations. The 70 MIPS performance, combined with 32 KB self-programmable Flash and 4 KB SRAM, supports real-time control loops up to several kHz while leaving headroom for communication stacks (UART, SPI, I2C) and user interfaces.
Typical applications include automotive body electronics and sensor conditioning, BLDC/PMSM motor control (fans, pumps, small appliances), digital power supplies, LED lighting controllers, industrial sensor hubs, and consumer appliances requiring extended-temperature operation. The integrated op-amps and CTMU allow direct interfacing with current-shunt resistors and capacitive sensors without external analog ICs.
When designing with this device, allocate decoupling per Microchip's recommended layout: 100 nF ceramic on each VDD/AVDD pair within 5 mm of the pin, plus a bulk 10 uF near the supply entry. The exposed thermal pad (EP) must be soldered to a continuous ground plane for both thermal dissipation and electrical reference per the package guidelines.
Alternatives de remplacement direct pour PIC24EP32GP204-H/TL — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec PIC24EP32GP204-H/TL (même facteur de forme et même empreinte) — différant par Package, ADC, RoHS Status, Core Architecture, Operating Voltage.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
PIC24EP32GP204-I/TL
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
$1.85 / unité
Voir la fiche technique →PIC24EP32GP203-H/TL
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
$2.62 / unité
Voir la fiche technique →PIC24EP32GP204-H/ML
✅ Remplacement direct ⚠️ Spécifications non vérifiées📋 Alternative de référence (hors catalogue)
PIC24EP32GP204T-H/TL
✅ Remplacement direct ⚠️ Spécifications non vérifiées📋 Alternative de référence (hors catalogue)
dsPIC33EP32GP204-H/TL
✅ Remplacement direct ⚠️ Spécifications non vérifiées📋 Alternative de référence (hors catalogue)
PIC24EP32MC204-H/TL
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
$3.15 / unité
Voir la fiche technique →PIC24EP32GP204-H/TL Valeurs maximales et caractéristiques électriques
| Core Architecture | PIC24E (16-bit modified Harvard) |
| Program Memory (Flash) | 32 KB |
| Data Memory (RAM) | 4 KB |
| Maximum CPU Speed | 60 MHz / 70 MIPS |
| Plage de température de fonctionnement | -40C to +150C (H grade) |
| Boîtier | 44-pin VTLA Exposed Pad (TL) |
| Type de montage | Surface Mount |
| ADC | 12-bit, up to 1.1 Msps (per family datasheet) |
| On-chip Op-Amps | Yes |
| CTMU | Yes (Charge Time Measurement Unit) |
| Peripheral Trigger Generator (PTG) | Yes |
| High-Speed PWM | Yes |
| Automotive Qualification | AEC-Q100 (H grade) |
| Statut RoHS | Compliant (per distributor listings) |
| Lead-Free | Yes |
Guide de configuration des broches du PIC24EP32GP204-H/TL 44-pin vtla exposed pad (tl)
Configuration des broches du PIC24EP32GP204-H/TL (boîtier 44-pin vtla exposed pad (tl)). Ce circuit intégré numérique comprend des GPIO, des interfaces de communication (UART, SPI, I2C) et des broches d'alimentation. Consultez la fiche technique du fabricant pour les fonctions alternatives des broches et les options de configuration. Indispensable pour la conception de systèmes embarqués et la conception de circuits imprimés.
Aucune donnée de brochage détaillée disponible pour PIC24EP32GP204-H/TL.
Consultez la fiche technique pour la configuration complète des broches.
Applications typiques
PIC24EP32GP204-H/TL convient pour 6 applications: Automotive Body Electronics, BLDC/PMSM Motor Control, Industrial Sensor Hubs, Digital Power Supply (SMPS) Control, LED Lighting Controllers, Capacitive Touch HMI.
Automotive Body Electronics
The PIC24EP32GP204-H/TL's AEC-Q100 qualification and -40C to +150C operating envelope make it well-suited for body controllers, lighting modules, and seat/HVAC actuators. Its 32 KB Flash accommodates CAN/LIN stack plus application logic, while on-chip op-amps condition sensor inputs directly. Compared to general-purpose I-grade MCUs, the H-grade screening ensures reliable operation behind the dashboard and in door modules where temperatures routinely exceed 100C in summer.
Recommandé
BLDC/PMSM Motor Control
The PIC24EP32GP204-H/TL's high-speed PWM, integrated op-amps for current sensing, and 12-bit 1.1 Msps ADC deliver a complete sensorless or Hall-sensor FOC platform for small fans, pumps, and appliance motors. The 70 MIPS core sustains 20 kHz FOC loops with margin for speed PI and state-machine overhead. The 32 KB Flash holds motor parameter tables and field-weakening algorithms without external memory, while H-grade qualification extends deployment to automotive cooling fans.
Recommandé
Industrial Sensor Hubs
With its CTMU for capacitive and timing measurements, 12-bit ADC, and multiple op-amps, the PIC24EP32GP204-H/TL consolidates analog front-end and MCU functions for industrial sensor hubs and process transmitters. The 70 MIPS performance handles Modbus RTU, IO-Link, and proprietary protocols alongside background sensor sampling. The H-grade envelope supports deployment near motors or in outdoor enclosures where ambient temperature swings are significant.
Recommandé
Digital Power Supply (SMPS) Control
The PIC24EP32GP204-H/TL's high-speed PWM with configurable triggers, 1.1 Msps ADC, and PTG hardware event sequencer enable digital control of DC-DC converters, PFC stages, and LLC resonant converters. The op-amps condition current-mode feedback directly, eliminating external amplifiers. AEC-Q100 qualification supports onboard EV chargers and telecom 48V bus converters where thermal headroom and reliability are critical design constraints.
Recommandé
LED Lighting Controllers
The PIC24EP32GP204-H/TL drives multi-channel LED strings with independent PWM dimming, color-mixing firmware, and analog current sensing via the integrated op-amps. The 32 KB Flash holds DMX, DALI, or proprietary lighting protocols while leaving room for thermal-compensation lookup tables. Automotive headlamp controllers and architectural RGBW luminaires benefit from the -40C to +150C operating range, eliminating derating near hot LED arrays.
Recommandé
Capacitive Touch HMI
The PIC24EP32GP204-H/TL's CTMU combined with the 12-bit ADC implements robust capacitive touch keypads, sliders, and proximity sensors without dedicated touch ICs. Hardware-event sequencing via the PTG reduces CPU overhead, freeing MIPS for HMI graphics or communication. The H-grade rating permits touch panels near heat-generating components such as motor drivers or power-conversion stages in industrial and automotive HMIs.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour PIC24EP32GP204-H/TL — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | PIC24EP32GP204-I/TL | PIC24EP32GP203-H/TL | PIC24EP32GP204-H/ML | PIC24EP32GP204T-H/TL | dsPIC33EP32GP204-H/TL | PIC24EP32MC204-H/TL |
|---|---|---|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 44-pin VTLA Exposed Pad | 44-pin VTLA Exposed Pad - same | 44-pin VTLA Exposed Pad - same | 44-pin QFN (ML) - same pin count | 44-pin VTLA Exposed Pad - same | 44-pin VTLA Exposed Pad - same | 44-pin VTLA Exposed Pad - same |
| Operating Temperature | -40C to +150C (H grade) | -40C to +85C (I grade) | -40C to +150C (H grade) | -40C to +150C (H grade) | -40C to +150C (H grade) | -40C to +150C (H grade) | -40C to +150C (H grade) |
| Flash Memory | 32 KB | 32 KB | 32 KB | 32 KB | 32 KB | 32 KB | 32 KB |
| RAM | 4 KB | 4 KB | 4 KB | 4 KB | 4 KB | 4 KB | 4 KB |
| Maximum CPU Speed | 60 MHz / 70 MIPS | 60 MHz / 70 MIPS | 60 MHz / 70 MIPS | 60 MHz / 70 MIPS | 60 MHz / 70 MIPS | 60 MHz / 70 MIPS | 60 MHz / 70 MIPS |
| DSP Engine | No (PIC24E core) | No | No | No | No | Yes (dsPIC33E core) | No |
| AEC-Q100 Qualified | Yes (H grade) | No (I grade) | Yes (H grade) | Yes (H grade) | Yes (H grade) | Yes (H grade) | Yes (H grade) |
Principaux différenciateurs
- AEC-Q100 H-grade qualification with -40C to +150C range (vs PIC24EP32GP204-I/TL)
- 44-pin VTLA Exposed Pad package option (vs PIC24EP32GP204-H/ML (QFN variant))
- PIC24E core without DSP engine vs dsPIC33E upgrade path (vs dsPIC33EP32GP204-H/TL)
- Integrated op-amps + CTMU + PTG (vs PIC24EP32GP203-H/TL)
Notes de conception
Place a 100 nF decoupling ceramic capacitor on each VDD/AVDD pin pair within 5 mm of the package pin, and add a single 10 uF bulk capacitor near the supply entry point per Microchip PIC24E layout guidelines. The on-chip op-amps draw transient currents during switching; insufficient decoupling can couple noise into the ADC reference and degrade SNR. For H-grade designs operating above +125C, use X7R or X8R dielectrics rated to +150C.
The 44-pin VTLA Exposed Pad package requires the EP to be soldered to a continuous ground plane with thermal vias to inner planes. Estimated: at 70 MIPS full-load CPU activity with all peripherals active, internal dissipation stays well below 0.5 W, but at +150C ambient the junction-to-ambient thermal rise must remain within the package theta_JA to avoid thermal shutdown. Always refer to the package thermal model in the family datasheet for the specific board conditions.
Route analog input traces (ADC, op-amp) away from PWM switching traces and clock lines; use a ground guard trace or ground fill between analog and digital sections to minimize crosstalk. Keep the ADC reference decoupling capacitor within 3 mm of the AVSS/VREF+ pins. Follow Microchip's analog design checklist in the family datasheet for noise-floor optimization on the 12-bit ADC.
Do not assume the I-grade PIC24EP32GP204-I/TL is a drop-in for the H-grade when the application exceeds +85C; the I-grade part is not AEC-Q100 qualified and may fail early-life reliability testing. Also avoid driving the op-amp outputs beyond the AVDD rail - the on-chip op-amps are not rail-to-rail on the high side and clipping will distort sensor feedback in motor-control loops.
Informations de conformité
AEC-Q100 qualified per the H-grade designation. RoHS and lead-free per distributor listings (besenchips.com, valleyelc.com). Halogen-free status not explicitly stated in the verified web data.
