PIC24F08KL302T-I/MQ - 8KB Flash 16-bit MCU 28-QFN | Microchip
Référence : PIC24F08KL302T-I/MQ ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $1.2 | $1,20 |
| 10 | $1.08 | $10,80 |
| 100 | $0.92 | $92,00 |
| 500 | $0.78 | $390,00 |
| 1 000 | $0.6371 | $637,10 |
PIC24F08KL302T-I/MQ Présentation
Key features include run-mode currents under 350 uA/MHz at 1.8V, multiple low-power sleep modes (Doze, Idle, Sleep), and a wide industrial temperature range of -40C to +85C. The 28-QFN package is footprint-compatible across the PIC24F08KL/KA families, which enables PCB reuse between pin-compatible variants and code-compatible derivatives.
Architecturally, the PIC24F08KL302 uses the PIC24 16-bit modified Harvard core with a 16-element 16-bit working register file and a 32 kHz to 32 MHz internal oscillator, eliminating the need for an external crystal in many designs. The MSSP peripheral supports both SPI and I2C master/slave, while the 5 CCP/ECCP channels handle PWM and capture/compare functions. Integrated 10-bit ADC, comparators, and a hardware RTCC reduce BOM cost and PCB area.
Typical applications include consumer white goods, low-cost sensor nodes, battery-powered IoT peripherals, e-metering front ends, and small appliances. The XLP feature set also makes it suitable for always-on wearable accessories and remote-control keyfobs. Because the KL/KA series shares its peripheral set with PIC18, designs that start with PIC18 can migrate upward to PIC24 without rewriting drivers.
When designing with this part, note that the QFN package requires thermal vias under the exposed pad for proper heat dissipation. Decoupling capacitance of at least 100 nF placed within 3 mm of each power pin, plus a 10 uF bulk cap, is recommended for stable XLP sleep behavior.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet alone.
Alternatives de remplacement direct pour PIC24F08KL302T-I/MQ — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec PIC24F08KL302T-I/MQ (même facteur de forme et même empreinte) — différant par Operating Temperature, ADC, Package, Timers, Communication.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
PIC24F08KL302-I/MQ
✅ Remplacement direct✓ En stock
$1.38 / unité
Voir la fiche technique →PIC24F08KL302-I/ML
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
$1.45 / unité
Voir la fiche technique →PIC24F08KL201T-I/MQ
✅ Remplacement direct✓ En stock
$1.78 / unité
Voir la fiche technique →PIC24F08KL200T-I/ST
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
$1.05 / unité
Voir la fiche technique →PIC24F08KA102T-I/MQ
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
PIC24F08KL302T-I/MQ Valeurs maximales et caractéristiques électriques
| Core | PIC24F 16-bit modified Harvard |
| Flash Program Memory | 8 KB (2.75K x 24) |
| SRAM | 1 KB |
| EEPROM / Data Flash | 256 B |
| Maximum CPU Speed | 32 MHz (16 MIPS) |
| Operating Voltage | 1.8 V to 3.6 V |
| Run Mode Current | < 350 uA/MHz at 1.8 V |
| Température de fonctionnement | -40 C to +85 C |
| Boîtier | 28-pin QFN (MQ) 5x5 mm |
| ADC | 10-bit SAR |
| MSSP | I2C/SPI master and slave |
| CCP/ECCP | Yes |
| Comparators | Yes |
| RTCC | Yes |
| Type de montage | Surface Mount |
| Statut RoHS | Compliant |
Configuration des broches de PIC24F08KL302T-I/MQ
| Broche 1 | RA0 — Port A bit 0 / analog input |
| Broche 2 | RA1 — Port A bit 1 / analog input |
| Broche 3 | RA2 — Port A bit 2 / analog input |
| Broche 4 | RA3 — Port A bit 3 / analog input |
| Broche 5 | VDD — Positive supply voltage |
| Broche 6 | VSS — Ground reference |
| Broche 7 | RA4 — Port A bit 4 |
| Broche 8 | RA5 — Port A bit 5 |
| Broche 9 | RA6 — Port A bit 6 |
| Broche 10 | RA7 — Port A bit 7 |
| Broche 11 | RB0 — Port B bit 0 |
| Broche 12 | RB1 — Port B bit 1 |
| Broche 13 | RB2 — Port B bit 2 |
| Broche 14 | RB3 — Port B bit 3 |
| Broche 15 | RB4 — Port B bit 4 |
| Broche 16 | RB5 — Port B bit 5 / PWM |
| Broche 17 | RB6 — Port B bit 6 / PWM |
| Broche 18 | RB7 — Port B bit 7 / PWM |
| Broche 19 | VSS — Ground reference |
| Broche 20 | VDD — Positive supply voltage |
| Broche 21 | RC0 — Port C bit 0 |
| Broche 22 | RC1 — Port C bit 1 |
| Broche 23 | RC2 — Port C bit 2 |
| Broche 24 | RC3 — Port C bit 3 |
| Broche 25 | RC4 — Port C bit 4 |
| Broche 26 | RC5 — Port C bit 5 |
| Broche 27 | RC6 — Port C bit 6 |
| Broche 28 | RC7 — Port C bit 7 |
Applications typiques
PIC24F08KL302T-I/MQ convient pour 6 applications: Battery-Powered IoT Sensor Nodes, Consumer Appliance Control, Wearable Health Monitoring, Smart Home Lighting Control, Electronic Metering Front End, Remote Control Keyfobs.
Battery-Powered IoT Sensor Nodes
The PIC24F08KL302T-I/MQ is well-suited for battery-powered IoT sensor nodes thanks to its nanoWalt XLP low-power modes with run currents under 350 uA/MHz at 1.8V and a 1.8V-3.6V operating range. The 10-bit ADC samples temperature, humidity, or other analog sensors with minimal CPU intervention, while Sleep + RTCC modes keep quiescent current in the microamp range. The MSSP peripheral runs I2C or SPI sensor buses directly, and 8 KB Flash accommodates BLE/HoneyBee/LoRa command stacks.
Recommandé
Consumer Appliance Control
The PIC24F08KL302T-I/MQ targets cost-sensitive consumer appliances such as rice cookers, washing machines, and induction cooktops. The CCP/ECCP peripheral generates precise PWM outputs for motor control, heater regulation, and triac-fired loads, while the 16-bit PIC24 core runs closed-loop control loops without sacrificing MIPS headroom. Industrial -40C to +85C operation covers kitchen environments, and 8 KB Flash supports graphical user interfaces and fault logging.
Recommandé
Wearable Health Monitoring
Wearable health devices benefit from the PIC24F08KL302T-I/MQ's combination of nanoWalt XLP, small 28-QFN footprint, and PIC24 16-bit processing throughput. Sleep currents in the microamp range extend battery life for heart-rate, SpO2, and step-counter wearables, while the 32 MHz CPU processes sensor-fusion routines without external DSP. The MSSP I2C/SPI bus interfaces with biometric sensors and low-energy wireless companions, and 1 KB SRAM is sufficient for short BLE command buffers.
Recommandé
Smart Home Lighting Control
The PIC24F08KL302T-I/MQ drives smart home lighting nodes including LED dimmers, color controllers, and DMX-compatible fixtures. The CCP/ECCP channels generate high-resolution PWM for dimming and color mixing, while the MSSP peripheral handles I2C or SPI control from external wireless modules such as BLE or Zigbee. Industrial temperature range and 1.8V-3.6V operation let it share a 3.3V regulator with downstream radios. XLP modes enable battery-powered remotes and wall switches that run for years on a coin cell.
Recommandé
Electronic Metering Front End
Single-phase electronic meters and submetering front ends rely on the PIC24F08KL302T-I/MQ's 16-bit ADC sampling and compute performance. The CCP/ECCP channels drive metrology calibration signals and zero-cross detection for power-line cycle measurements, and 8 KB Flash holds calibration tables and metrology libraries. Low-power Sleep plus RTCC provides timekeeping for time-of-use billing while quiescent current stays minimal. The industrial temperature range supports outdoor meter enclosures.
Recommandé
Remote Control Keyfobs
Remote control keyfobs for automotive, garage doors, and security systems use the PIC24F08KL302T-I/MQ to minimize idle current while remaining responsive to button events. XLP Sleep currents in the single-digit microamp range let coin-cell batteries last multiple years, and the wake-up time from Sleep is fast enough for instant button response. The MSSP peripheral drives sub-GHz transceivers over SPI, and the 16-bit PIC24 core runs rolling-code security algorithms efficiently.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour PIC24F08KL302T-I/MQ — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | PIC24F08KL302-I/MQ | PIC24F08KL201T-I/MQ | PIC24F08KA102T-I/MQ |
|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 28-QFN (MQ) 5x5 mm | 28-QFN (MQ) 5x5 mm - same | 28-QFN (MQ) 5x5 mm - same | 28-QFN (MQ) 5x5 mm - same |
| Flash Memory | 8 KB | 8 KB | 4 KB (-50%) | 8 KB |
| SRAM | 1 KB | 1 KB | 1 KB | 1 KB |
| Maximum CPU Speed | 32 MHz (16 MIPS) | 32 MHz (16 MIPS) | 32 MHz (16 MIPS) | 32 MHz (16 MIPS) |
| Operating Voltage | 1.8 V to 3.6 V | 1.8 V to 3.6 V | 1.8 V to 3.6 V | 1.8 V to 3.6 V |
| Run Current at 1.8V | < 350 uA/MHz | < 350 uA/MHz | < 350 uA/MHz | < 350 uA/MHz |
| ADC | 10-bit SAR | 10-bit SAR | 10-bit SAR | 10-bit SAR |
| Operating Temperature | -40 C to +85 C | -40 C to +85 C | -40 C to +85 C | -40 C to +85 C |
Principaux différenciateurs
- Highest Flash density in the KL series at 28-QFN (vs PIC24F08KL201T-I/MQ)
- Industrial temperature range matched with XLP low power (vs PIC24F08KA102T-I/MQ)
- Pin-to-pin compatible with the broader KL/KA family (vs PIC24EP32GP202-I/MM)
Notes de conception
The 28-QFN (MQ) package exposes a thermal pad on the underside that should be soldered to a copper pour on the PCB. Use an array of thermal vias (typically 0.3 mm drill, 0.6 mm pitch, 9-12 vias) connecting the pad to inner ground planes to spread heat. At 32 MHz and 1.8V the device dissipates only a few milliwatts, so thermal concerns are minor unless the part is used in a sealed enclosure above 70 C ambient.
Place a 100 nF decoupling capacitor within 3 mm of each VDD pin (pin 5 and pin 20) and add a single 10 uF bulk capacitor near the device. For XLP Sleep-mode operation, keep the bulk capacitor's leakage below 1 uA to avoid dominating the MCU's quiescent current. If the application uses a switched-mode supply, add a small ferrite bead on VDD to suppress switching noise from coupling into the analog inputs.
Do not skip the exposed-pad soldering step on the QFN package - an unsoldered thermal pad increases thermal resistance and reduces long-term solder-joint reliability. Confirm that your programmer/debugger supports the 28-QFN MQ pinout (pin 1 is at the dot marker on the upper left when reading the top marking). When migrating firmware from PIC24F08KL301, watch the configuration-word changes for the 8 KB Flash region and the additional CCP/ECCP channels.
Route the analog signals (RA0-RA3) away from the PWM outputs (RB5-RB7) and from the high-current traces of any nearby switching regulators. Keep the MSSP I2C/SPI traces short and matched, with a 4.7 kohm pull-up on each I2C line. Place the 32.768 kHz crystal (if used for RTCC) close to the SOSCO/SOSCI pins with a guarded ground pour to minimize coupling from digital signals.
Informations de conformité
RoHS and lead-free per Microchip product page. AEC-Q100 not applicable (industrial grade, not automotive qualified). Halogen-free status not confirmed in available data.
