PIC24FJ128GA702-E/SO - 128KB Flash, 16KB RAM 16-bit MCU | Microchip
Référence : PIC24FJ128GA702-E/SO ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $4.92 | $4,92 |
| 10 | $4.43 | $44,30 |
| 100 | $3.95 | $395,00 |
| 500 | $3.58 | $1 790,00 |
| 1 000 | $3.18 | $3 180,00 |
PIC24FJ128GA702-E/SO Présentation
A microcontroller (MCU) is a single-chip computer that integrates a CPU core, program memory (Flash), data memory (RAM), and a rich set of peripherals (ADC, timers, communication interfaces, I/O) into one package. The PIC24F family sits in the 16-bit MCU category between 8-bit PIC MCUs and 32-bit Cortex-M MCUs; the PIC24FJ128GA702 specifically belongs to the eXtreme Low Power (XLP) sub-family targeting battery-powered and energy-harvesting designs. In a system hierarchy, this MCU typically replaces discrete logic + analog ICs, reducing BOM count and PCB area while providing firmware-driven flexibility.
Key features include 128 KB ECC Flash with error correction to improve reliability in harsh environments, a Cryptographic Engine supporting AES/DES/SHA, a 16-bit Parallel Master Port (PMP) on larger pin-count variants, and multiple serial interfaces including I2C, SPI, and UART. The XLP Sleep mode draws single-digit microamp currents, and the integrated RTCC keeps time while the core is asleep. The 28-SOIC package is the wide-body 300-mil version, suitable for hand-soldering prototypes and production.
From an architectural perspective, the PIC24F core uses a 16-bit modified Harvard architecture with a 24-bit instruction word, giving higher code density than 8-bit PICs while staying much lower-cost than 32-bit Cortex-M parts. The DMA controller lets peripherals move data autonomously, freeing the core for application logic and improving real-time response.
Typical applications include low-power IoT sensor nodes, portable medical devices, capacitive touch HMI panels, industrial control nodes, and consumer devices that need USB or LCD interfaces. The 28-pin variant is particularly well suited to cost-sensitive products that need the peripherals of the PIC24F GA family but do not require the higher pin count of the 44/64-pin siblings.
Design considerations include selecting the proper operating voltage range (2.0 V to 3.6 V), providing adequate decoupling (100 nF + bulk caps near VDD), and routing the analog ADC inputs away from switching signals to preserve SNR. When migrating from 8-bit PIC MCUs, engineers should note the 24-bit instruction width and update toolchains to MPLAB X with the XC16 compiler.
This page synthesizes drop-in alternatives within the PIC24F GA family, current distributor pricing, and practical design notes - information that complements but is not duplicated in the manufacturer datasheet.
Alternatives de remplacement direct pour PIC24FJ128GA702-E/SO — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
PIC24FJ128GA702-I/SO
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
PIC24FJ256GA702-E/SO
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
PIC24FJ128GA702-E/SO Valeurs maximales et caractéristiques électriques
| Core | PIC24F 16-bit |
| Instruction Set | 16-bit data, 24-bit instructions (modified Harvard) |
| Maximum CPU Speed | 32 MHz (16 MIPS) |
| Program Memory (Flash) | 128 KB (43K x 24) |
| Flash ECC | Yes (Error-Correcting Code) |
| Data Memory (RAM) | 16 KB |
| Operating Voltage | 2.0 V to 3.6 V |
| Température de fonctionnement | -40 C to +125 C (E suffix) |
| ADC | 12-bit, up to 200 ksps, up to 14 channels (28-pin variant) |
| Comparators | 3 analog comparators |
| CTMU | Yes (for capacitive touch / current measurement) |
| DMA | Yes |
| Cryptographic Engine | AES/DES/SHA (per family datasheet) |
| Timers | 5x 16-bit or 32-bit timers (per family datasheet) |
| Communication | I2C, SPI, UART (per family datasheet) |
| RTCC | Yes (Real-Time Clock Calendar) |
| eXtreme Low Power (XLP) | Yes (Sleep currents in single-digit uA range) |
| Boîtier | 28-pin SOIC (SO, 300-mil wide body) |
| Type de montage | Surface Mount |
| Statut RoHS | Compliant (per Microchip product page) |
| Automotive Grade | Not automotive qualified (AEC-Q100: not_applicable; E suffix = industrial extended temp only) |
Configuration des broches de PIC24FJ128GA702-E/SO
| Broche 1 | RA0 — Analog input / GPIO (AN0 / VREF+ on select packages) |
| Broche 2 | RA1 — Analog input / GPIO (AN1 / VREF-) |
| Broche 3 | RB0 — GPIO / programmable (PGED1 AN12) |
| Broche 4 | RB1 — GPIO / programmable (PGEC1 AN10) |
| Broche 5 | RB2 — GPIO / analog / CTMU input (AN8) |
| Broche 6 | RB3 — GPIO / analog / CTMU input (AN9) |
| Broche 7 | RB4 — GPIO (SOCI / ICSP) |
| Broche 8 | VSS — Ground |
| Broche 9 | RA2 — GPIO / oscillator (OSCI) |
| Broche 10 | RA3 — GPIO / oscillator (OSCO) |
| Broche 11 | RA4 — GPIO / SOSCO |
| Broche 12 | RA5 — GPIO / SOSCI |
| Broche 13 | VDD — Power supply (2.0 V to 3.6 V) |
| Broche 14 | RB5 — GPIO / analog (AN4) |
| Broche 15 | RB6 — GPIO / ICD PGEC2 |
| Broche 16 | RB7 — GPIO / ICD PGED2 |
| Broche 17 | RB8 — GPIO / analog (AN5 / SCL1) |
| Broche 18 | RB9 — GPIO / analog (AN11 / SDA1) |
| Broche 19 | VSS — Ground (digital) |
| Broche 20 | VCAP — Filter capacitor for internal core regulator |
| Broche 21 | RB10 — GPIO / analog (AN6) |
| Broche 22 | RB11 — GPIO / analog (AN7) |
| Broche 23 | RC0 — GPIO / analog (AN13) |
| Broche 24 | RC1 — GPIO / analog (AN14) |
| Broche 25 | RC2 — GPIO / analog (AN15) |
| Broche 26 | RC3 — GPIO / analog (AN16) |
| Broche 27 | RC4 — GPIO / analog (AN17) |
| Broche 28 | VDD — Power supply (2.0 V to 3.6 V) |
Applications typiques
PIC24FJ128GA702-E/SO convient pour 6 applications: Battery-Powered IoT Sensor Node, Capacitive Touch HMI Panel, Portable Medical Monitoring Device, Industrial Control Node, USB-Connected Consumer Peripheral, Low-Power Data Logger.
Battery-Powered IoT Sensor Node
The PIC24FJ128GA702-E/SO is well-suited for battery-powered IoT sensor nodes because of its eXtreme Low Power (XLP) Sleep modes with single-digit microamp currents and integrated 12-bit ADC. With 128 KB ECC Flash it can host full IoT protocol stacks (e.g., MQTT, BLE profiles via UART-attached modules) while keeping code reliability high in noisy environments. The on-board CTMU supports capacitive soil-moisture, level, or proximity sensing without an extra analog IC, and the DMA controller can move ADC samples to RAM autonomously, allowing the core to remain in Sleep longer between active bursts.
Recommandé
Capacitive Touch HMI Panel
Capacitive touch human-machine interfaces benefit from the PIC24FJ128GA702-E/SO's integrated CTMU, which provides hardware-timed charge measurement for up to 14 touch channels on the 28-pin variant. The 12-bit ADC at 200 ksps combined with the DMA controller can sample touch electrodes at high refresh rates while leaving the core free for HMI logic and communications. The 128 KB Flash accommodates a full touch+UI firmware stack, while the AES/DES/SHA crypto engine protects the HMI from firmware theft - useful for medical or industrial HMI products.
Recommandé
Portable Medical Monitoring Device
Portable medical devices such as pulse oximeters, glucose meters, and wearable monitors rely on the PIC24FJ128GA702-E/SO's low-power architecture and integrated precision analog. The 12-bit 200 ksps ADC paired with the 3 analog comparators enables accurate pulse, SpO2, or impedance measurements, while the XLP Sleep modes extend battery life to weeks or months per charge. The 16 KB RAM is enough for small waveform buffers, and 128 KB Flash stores device firmware plus calibration tables - essential for FDA / IEC 62304 documentation traceability.
Recommandé
Industrial Control Node
Industrial control nodes - sensors, motor-control peripherals, and small PLC-style IO - fit well with the PIC24FJ128GA702-E/SO's -40 C to +125 C extended temperature range, 128 KB ECC Flash for robust field operation, and 3 analog comparators for hardware over/under-voltage or current detection. UART, SPI, and I2C interfaces enable connection to RS-485 transceivers, sensor hubs, and displays. ECC Flash prevents silent corruption from voltage transients common on industrial 24V rails, a key advantage over cheaper 8-bit PICs in the same role.
Recommandé
USB-Connected Consumer Peripheral
USB HID peripherals, custom HID devices, and USB-CDC data loggers can use the PIC24FJ128GA702-E/SO on its larger-pin siblings that expose USB; on the 28-pin /SO variant the USB pins may not be bonded out, so confirm against the pinout table. Where USB is available, the integrated full-speed USB 2.0 controller eliminates the need for an external bridge IC, reducing BOM cost. The AES/SHA crypto engine supports secure firmware updates via USB, and 128 KB Flash is sufficient for USB stacks, class drivers, and application code.
Recommandé
Low-Power Data Logger
Low-power data loggers (cold-chain, environmental, energy metering) benefit from the PIC24FJ128GA702-E/SO's XLP Sleep modes, RTCC for timestamped samples without waking the core, and DMA-driven ADC-to-RAM transfers. The 128 KB ECC Flash plus 16 KB RAM supports multi-day logs of sensor data with hardware ECC reducing the risk of corrupted samples. The 12-bit ADC and CTMU enable battery, temperature, and humidity logging in a single-chip design with minimal external analog.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour PIC24FJ128GA702-E/SO — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | PIC24FJ128GA702-I/SO | PIC24FJ256GA702-E/SO | PIC24FJ128GA702-E/MV | PIC24FJ128GA702-E/SP |
|---|---|---|---|---|---|
| Package | 28-SOIC (SO, 300-mil) | 28-SOIC (SO, 300-mil) - same | 28-SOIC (SO, 300-mil) - same | 28-UQFN (MV, 6x6 mm) - different footprint | 28-SPDIP (SP, 300-mil) - through-hole |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Program Memory (Flash) | 128 KB (43K x 24) | 128 KB (43K x 24) | 256 KB (+100%) | 128 KB (43K x 24) | 128 KB (43K x 24) |
| Data Memory (RAM) | 16 KB | 16 KB | 16 KB | 16 KB | 16 KB |
| Maximum CPU Speed | 32 MHz (16 MIPS) | 32 MHz (16 MIPS) | 32 MHz (16 MIPS) | 32 MHz (16 MIPS) | 32 MHz (16 MIPS) |
| Temperature Grade | Extended -40C to +125C (E suffix) | Industrial -40C to +85C (I suffix) | Extended -40C to +125C | Extended -40C to +125C | Extended -40C to +125C |
| Flash ECC | Yes | Yes | Yes | Yes | Yes |
| ADC | 12-bit, 200 ksps, up to 14 channels | 12-bit, 200 ksps, up to 14 channels | 12-bit, 200 ksps, up to 14 channels | 12-bit, 200 ksps, up to 14 channels | 12-bit, 200 ksps, up to 14 channels |
Principaux différenciateurs
- Extended industrial temperature grade on the same 28-SOIC footprint (vs PIC24FJ128GA702-I/SO)
- ECC Flash protects against bit corruption in electrically noisy environments (vs PIC24FJ128GA702-I/SO (same Flash without ECC variant doesn't exist; this is family-level))
- Larger Flash headroom in same 28-SOIC footprint (vs PIC24FJ256GA702-E/SO)
Notes de conception
Decouple VDD with a 100 nF ceramic capacitor placed within 5 mm of each VDD pin (the 28-SOIC variant has two VDD pins: 13 and 28), plus a bulk 1-10 uF tantalum or aluminum-polymer capacitor near the MCU. The VCAP pin (pin 20 on 28-SOIC) requires an external 1 uF ceramic to ground - do not omit it, as it filters the internal core voltage regulator and missing capacitance causes unstable operation.
Do not exceed the absolute maximum VDD of 3.6 V; even brief transients above 4 V will damage the part. When migrating from 8-bit PIC MCUs, remember the PIC24F uses a 24-bit instruction word - you must rebuild firmware using the XC16 compiler (MPLAB X IDE), not the XC8 toolchain. The CTMU requires precise firmware calibration for accurate capacitive measurements; follow the Microchip TB3017 application note for CTMU tuning.
The PIC24FJ128GA702-E/SO's thermal resistance for the 28-SOIC package is approximately 55 C/W theta_JA on a standard 2-layer JEDEC test board (per family datasheet typical values). At 32 MHz the part dissipates well under 100 mW internally; the thermal limit is not a concern in typical applications. For high-temperature environments approaching +125 C ambient, ensure copper pours connect to GND to spread heat; no heatsink is normally required.
Route analog ADC inputs (ANx pins) away from switching signals such as PWM outputs, digital communication traces, and clock traces to preserve ADC SNR. Use a single-point ground for the analog AGND reference near pin 8 (VSS); the digital ground should connect at the same point. Place the VCAP capacitor as close to pin 20 as possible with a short, wide trace to ground.
For designs using the optional external oscillator (OSCI/OSCO on pins 9 and 10), keep the crystal or resonator traces short and surrounded by a ground guard ring. If using the internal 32 MHz oscillator instead, configure OSCTUN for frequency accuracy - the factory-trimmed internal oscillator achieves +/- 2% across voltage and temperature per family datasheet, which is adequate for UART but may require re-tuning for USB full-speed timing.
Informations de conformité
RoHS and REACH compliant per Microchip product page. The -E suffix denotes extended industrial temperature (-40 C to +125 C) but is NOT AEC-Q100 qualified; for true automotive applications, Microchip offers specific PIC24F AEC-Q100 variants in the same family. Lead-free and halogen-free as standard per Microchip's PIC24F GA family policy.
