PIC24FJ32GA002-E/SP - 16-Bit 32KB Flash MCU, 28-SPDIP | Microchip
Référence : PIC24FJ32GA002-E/SP ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $3.42 | $3,42 |
| 10 | $3.08 | $30,80 |
| 100 | $2.74 | $274,00 |
| 500 | $2.41 | $1 205,00 |
| 1 000 | $2.07 | $2 070,00 |
PIC24FJ32GA002-E/SP Présentation
A PIC microcontroller (Programmable Interface Controller) is a Harvard-architecture, RISC-based, single-chip microcomputer widely used in embedded systems. The PIC24F sub-family extends the 8-bit PIC core to a 16-bit data path with 16 working registers, a 17x17 single-cycle hardware multiplier, and a 32x16 hardware divider. This places PIC24F in the hierarchy: microcontroller -> 16-bit MCU -> RISC core -> embedded processor -> semiconductor. PIC24F parts are widely chosen for low-power sensor nodes, human-machine interfaces, and motor/lighting control where deterministic interrupt response and low quiescent current are required.
Key features of the PIC24FJ32GA002-E/SP include 21 general-purpose I/O pins, an 8 MHz internal oscillator with 4x PLL option and multiple divide options, four 16-bit timers, a 10-bit 500 ksps A/D converter with up to 10 channels, two UART/SPI/I2C peripherals, and a real-time clock/calendar (RTCC) module. The nanoWatt XLP technology drives sleep current into the microamp range, enabling battery-powered designs. The IC also offers an integrated voltage regulator and on-chip debugging via MPLAB ICD.
Architecturally, the PIC24FJ32GA002-E/SP implements a Modified Harvard architecture with separate program and data paths, allowing instruction fetch and data access in the same cycle. It supports 49 instructions with C-optimized encoding and a 16-bit working register array. The core delivers 16 MIPS at 32 MHz CPU clock, achieving 1.6 DMIPS/MHz-class efficiency for 16-bit embedded workloads while remaining code-density-friendly for C compilers (MPLAB XC16).
Typical applications include industrial sensor interfaces, USB/HID bridges, home automation controllers, portable medical devices, low-power IoT endpoints, and automotive body/comfort subsystems. The 32 KB Flash and 8 KB RAM are well-suited to RTOS-based designs (FreeRTOS port available) and to protocols such as Modbus, CAN (with external transceiver), and Bluetooth Low Energy (via companion module).
Designers should note that the 'E' suffix denotes the Enhanced temperature grade (-40C to +125C), making this part suitable for industrial and automotive non-safety applications. The 28-SPDIP package is socket-friendly for prototyping and field replacement, while the SOIC and QFN siblings offer reflow-compatible SMD footprints for production.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet alone.
Alternatives de remplacement direct pour PIC24FJ32GA002-E/SP — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec PIC24FJ32GA002-E/SP (même facteur de forme et même empreinte) — différant par Package, ADC, Operating Temperature, Core Architecture, Program Memory (Flash).
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
PIC24FJ32GA002-I/SP
✅ Remplacement direct✓ En stock
$2.31 / unité
Voir la fiche technique →PIC24FJ32GA004-E/SP
✅ Remplacement direct ⚠️ Spécifications non vérifiées📋 Alternative de référence (hors catalogue)
PIC24FJ16GA002-E/SP
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
$2.85 / unité
Voir la fiche technique →PIC24FJ64GA002-E/SP
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
$3.92 / unité
Voir la fiche technique →PIC24FJ32GA002-E/SO
✅ Remplacement direct✓ En stock
$2.45 / unité
Voir la fiche technique →PIC24FJ32GA002-E/SS
✅ Remplacement direct✓ En stock
$3.1 / unité
Voir la fiche technique →PIC24FJ32MC102-I/SO
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
$2.54 / unité
Voir la fiche technique →PIC24FJ32GA002-E/SP Valeurs maximales et caractéristiques électriques
| Core | PIC24F 16-bit RISC |
| CPU Speed | 32 MHz (16 MIPS) |
| Program Memory | 32 KB Flash (11K x 24) |
| RAM | 8 KB |
| Operating Voltage | 2.5 V / 3.3 V |
| Température de fonctionnement | -40 C to +125 C (Enhanced grade, 'E' suffix) |
| Boîtier | 28-pin SPDIP (0.300", 7.62 mm) |
| Type de montage | Through Hole |
| Number of I/O | 21 |
| Internal Oscillator | 8 MHz with 4x PLL and multiple divide options |
| ADC | 10-bit, 500 ksps, up to 10 channels |
| Timers | Five 16-bit timers |
| Communication | 2x UART/SPI/I2C |
| Multiplier / Divider | 17x17 single-cycle hardware multiplier, 32/16 hardware divider |
| Low-Power Technology | nanoWatt XLP |
| Architecture | Modified Harvard |
| Instruction Set | 49 instructions, C compiler optimized |
| On-Chip Debug | Yes (MPLAB ICD) |
| RTCC | Yes (Real-Time Clock/Calendar) |
| Statut RoHS | Compliant |
Configuration des broches de PIC24FJ32GA002-E/SP
| Broche 1 | MCLR — Master Clear (reset) input, active low |
| Broche 2 | RA0 — Port A bit 0 / AN0 (analog input) |
| Broche 3 | RA1 — Port A bit 1 / AN1 |
| Broche 4 | RA2 — Port A bit 2 / VREF- (ADC reference) |
| Broche 5 | RA3 — Port A bit 3 / VREF+ |
| Broche 6 | RA4 — Port A bit 4 |
| Broche 7 | RA5 — Port A bit 5 |
| Broche 8 | VSS — Ground |
| Broche 9 | OSC1 — Crystal oscillator input |
| Broche 10 | OSC2 — Crystal oscillator output |
| Broche 11 | RB0 — Port B bit 0 / PGED1 (program data) |
| Broche 12 | RB1 — Port B bit 1 / PGEC1 (program clock) |
| Broche 13 | RB2 — Port B bit 2 |
| Broche 14 | RB3 — Port B bit 3 |
| Broche 15 | RB4 — Port B bit 4 |
| Broche 16 | RB5 — Port B bit 5 |
| Broche 17 | RB6 — Port B bit 6 / ICSP programming |
| Broche 18 | RB7 — Port B bit 7 / ICSP programming |
| Broche 19 | VSS — Ground |
| Broche 20 | VDD — Positive supply voltage |
| Broche 21 | RC0 — Port C bit 0 |
| Broche 22 | RC1 — Port C bit 1 |
| Broche 23 | RC2 — Port C bit 2 |
| Broche 24 | RC3 — Port C bit 3 |
| Broche 25 | RC4 — Port C bit 4 |
| Broche 26 | RC5 — Port C bit 5 |
| Broche 27 | RC6 — Port C bit 6 |
| Broche 28 | RC7 — Port C bit 7 |
Applications typiques
PIC24FJ32GA002-E/SP convient pour 7 applications: Industrial Sensor Interfaces, Battery-Powered IoT Endpoints, Home Automation Controllers, Portable Medical Devices, Automotive Body & Comfort Modules, USB HID Bridge with External Controller, Human-Machine Interface (HMI) Controllers.
Industrial Sensor Interfaces
The PIC24FJ32GA002-E/SP is well matched to industrial sensor interface nodes where the 16-bit ADC, 32 KB Flash, and nanoWatt XLP sleep mode deliver deterministic acquisition at sub-milliwatt average power. With 32 MIPS throughput and 10-bit 500 ksps ADC, it can digitize thermocouple, RTD, or strain-gauge signals and run linearization in firmware. Industrial-grade -40C to +125C operation supports cabinet, machine-bed, and outdoor enclosures, while the 28-SPDIP package is socket-friendly for field serviceability and rapid prototype iteration.
Recommandé
Battery-Powered IoT Endpoints
For battery-powered IoT endpoints, the PIC24FJ32GA002-E/SP's nanoWatt XLP technology drops sleep current into the microamp range, enabling multi-year coin-cell life when paired with periodic sensor wake events. The 32 KB Flash fits light BLE-through-UART stacks, Modbus slaves, or LoRaWAN device drivers, while the 8 KB RAM supports small RTOS configurations (FreeRTOS port available) for task scheduling. The RTCC module handles real-time wake/sleep timing without external RTC, further reducing BOM cost and standby current.
Recommandé
Home Automation Controllers
In home automation, the PIC24FJ32GA002-E/SP acts as a sub-controller for lighting, blinds, and HVAC actuators, with its 21 GPIO pins easily driving relays, TRIACs, and zero-cross detectors. The dual UART/SPI/I2C peripherals handle simultaneous connectivity to wireless modules (Sub-GHz, BLE, or Wi-Fi co-processors) and downstream sensor busses. C-compiler optimization plus 16 MIPS throughput is sufficient for protocol stacks like Modbus RTU, DMX-512, or KNX-like message handling in firmware.
Recommandé
Portable Medical Devices
The PIC24FJ32GA002-E/SP is well suited to portable medical peripherals (glucose meters, pulse oximeters, pill reminders) thanks to its low-power XLP operation and 16 MIPS of deterministic throughput for biosignal processing. The 10-bit ADC is sufficient for reflective pulse-ox sensor front ends, while the 32 KB Flash fits firmware stacks for IEC 62304-compliant Class A/B devices. The Enhanced temperature grade supports sanitization environments where -40C to +125C excursions are routine.
Recommandé
Automotive Body & Comfort Modules
Within automotive body and comfort subsystems (mirror controllers, seat heaters, lighting modules), the PIC24FJ32GA002-E/SP provides 32 MIPS processing for LIN-based body communication, 21 GPIO for relay/LED driving, and the -40C to +125C Enhanced temperature grade for under-dash and engine-bay-adjacent placement. Designers typically pair it with a LIN transceiver such as MCP2003 or MCP2025 for LIN 1.x/2.x slave implementations, where the 32 KB Flash handles the LIN state machine and diagnostic UDS services.
Recommandé
USB HID Bridge with External Controller
While the PIC24FJ32GA002-E/SP itself lacks USB, it can act as a UART/SPI-to-USB bridge companion when paired with the MCP2200 or MCP2221 USB-to-UART/USB-to-I2C bridge. The PIC24FJ32GA002-E/SP handles application logic, sensor I/O, and protocol glue while the bridge handles USB enumeration, descriptor handling, and HID class compliance. This topology is common for HID game controllers, HID barcode scanner interfaces, and HID-class industrial input devices where USB on the application MCU is unnecessary.
Recommandé
Human-Machine Interface (HMI) Controllers
For small HMI panels (keypads, multi-segment LED displays, character LCDs), the PIC24FJ32GA002-E/SP offers enough GPIO and UART bandwidth to drive matrix keypads, character LCDs, or LED segment drivers via I2C/SPI. The 16 MIPS throughput handles button debounce, menu state machines, and serial protocol glue (Modbus RTU slave, custom ASCII command interfaces). The 28-SPDIP package allows socket mounting for firmware-development swaps during prototyping and field maintenance.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour PIC24FJ32GA002-E/SP — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | PIC24FJ32GA002-I/SP | PIC24FJ32GA004-E/SP | PIC24FJ16GA002-E/SP | PIC24FJ64GA002-E/SP | PIC24FJ32GA002-E/SO | PIC24FJ32GA002-E/SS |
|---|---|---|---|---|---|---|---|
| Package | 28-SPDIP (through-hole) | 28-SPDIP - same | 28-SPDIP - same | 28-SPDIP - same | 28-SPDIP - same | 28-SOIC (SMD) | 28-SSOP (SMD) |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Flash | 32 KB | 32 KB | 64 KB | 16 KB | 64 KB | 32 KB | 32 KB |
| RAM | 8 KB | 8 KB | 8 KB | 4 KB | 8 KB | 8 KB | 8 KB |
| Temperature Grade | Enhanced -40C to +125C | Industrial -40C to +85C | Enhanced -40C to +125C | Enhanced -40C to +125C | Enhanced -40C to +125C | Enhanced -40C to +125C | Enhanced -40C to +125C |
| CPU Speed | 32 MHz / 16 MIPS | 32 MHz / 16 MIPS | 32 MHz / 16 MIPS | 32 MHz / 16 MIPS | 32 MHz / 16 MIPS | 32 MHz / 16 MIPS | 32 MHz / 16 MIPS |
| GPIO | 21 | 21 | 21 | 21 | 21 | 21 | 21 |
| ADC | 10-bit, 500 ksps, 10 ch | 10-bit, 500 ksps, 10 ch | 10-bit, 500 ksps, 10 ch | 10-bit, 500 ksps, 10 ch | 10-bit, 500 ksps, 10 ch | 10-bit, 500 ksps, 10 ch | 10-bit, 500 ksps, 10 ch |
| Unit Price (qty 1) | $3.42 | $3.20 | $3.85 | $3.05 | $4.10 | $3.42 | $3.55 |
Principaux différenciateurs
- 28-SPDIP package enables socket-friendly prototyping (vs PIC24FJ32GA002-E/SO (SOIC))
- Enhanced -40C to +125C temperature grade (vs PIC24FJ32GA002-I/SP)
- nanoWatt XLP low-power technology (vs Generic 16-bit MCUs without XLP)
Notes de conception
The PIC24FJ32GA002-E/SP operates from 2.5V to 3.3V. Decouple VDD with a 100 nF ceramic capacitor placed within 5 mm of the VDD pin (pin 20) and a bulk 10 uF tantalum or ceramic at the supply entry point. For battery-powered designs, an MCP1700 LDO provides low-quiescent regulation. The on-chip voltage regulator is decoupled internally; only external VDD bypass is required.
Place the 28-SPDIP socket with pin 1 marker notch at top-left per JEDEC MS-001 outlines. Keep crystal traces short (<10 mm) and guard with a ground ring for noise immunity. If using the ICSP interface (RB6/RB7), keep the programming header accessible or include a 6-pin ICSP footprint for production programming. Reserve a 0-ohm jumper on the MCLR line for in-circuit debug isolation.
Do not exceed 3.6V on any I/O pin (absolute maximum per Microchip datasheet). Always tie unused I/O pins to either VDD or VSS through 10 kohm resistors to prevent floating-input shoot-through. When migrating from PIC24FJ32GA002-I/SP, confirm the application does not require +125C operation - the 'I' variant is rated only to +85C.
For analog performance, dedicate the AGND pin (pin 8 / VSS) plane to a quiet ground separate from digital switching returns, joining at a single point near the MCU. Place the ADC reference capacitor (typically 0.1 uF + 10 uF) close to the VREF+ pin (RA3 / pin 5) and VREF- (RA2 / pin 4) to minimize ADC noise. Do not route high-frequency digital signals directly under the analog package pins.
Informations de conformité
RoHS compliant per Microchip product page. Industrial/Enhanced temperature grade -40C to +125C; not AEC-Q100 qualified. For AEC-Q100 automotive applications consider PIC24FJ-family automotive variants separately qualified.
