PIC24HJ16GP304T-I/ML - 16-bit 40MIPS MCU, 16KB Flash, 44-QFN | Microchip
Référence : PIC24HJ16GP304T-I/ML ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $3.45 | $3,45 |
| 10 | $3.1 | $31,00 |
| 100 | $2.76 | $276,00 |
| 500 | $2.45 | $1 225,00 |
| 1 000 | $2.18 | $2 180,00 |
PIC24HJ16GP304T-I/ML Présentation
A PIC24H microcontroller belongs to the 16-bit microcontroller hypernym hierarchy: microcontroller -> MCU -> embedded processor -> semiconductor. The PIC24H family uses a modified Harvard architecture with a 16-bit data path and 24-bit instruction word, enabling single-cycle MAC operations and deterministic interrupt latency required for real-time control. The device is pin-compatible with the dsPIC33F family, sharing the same peripheral set and migration path, which gives engineers a clear upgrade route to DSP functionality.
Key features: 16 KB self-programmable Flash with ECC, 2 KB SRAM, hardware multiplier (17-bit x 17-bit single cycle), 16-channel 10-bit/12-bit ADC (up to 500 ksps), four 16-bit timers/counters, two UART, two SPI, one I2C, five PWM/OC outputs with dedicated time base, and a real-time clock calendar. JTAG and ICSP programming/debug interfaces are supported. The 44-QFN (ML) package provides an effective thermal path through the exposed pad for higher dissipation applications.
Typical applications: digital motor control (BLDC, PMSM, stepper), industrial sensor conditioning, UPS and power-converter control loops, automotive body electronics (non-safety), and general-purpose real-time DSP front-ends. The 40 MIPS sustained throughput and 16-bit DSP engine make it well suited for closed-loop control and signal conditioning at the edge.
Design consideration: The exposed pad (EP) MUST be soldered to the PCB ground plane with multiple thermal vias to achieve rated thermal performance. Decoupling capacitors must be placed as close as possible to VDD/VSS pins, and unused I/O should be configured as outputs low to minimize power consumption.
This page synthesizes distributor pricing, drop-in PIC24H same-family alternatives, application notes, and design guidance not found in the manufacturer datasheet alone.
Alternatives de remplacement direct pour PIC24HJ16GP304T-I/ML — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec PIC24HJ16GP304T-I/ML (même facteur de forme et même empreinte) — différant par Package, Core, Operating Temperature, ADC, Timers.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
PIC24HJ32GP204-I/ML
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
$4.78 / unité
Voir la fiche technique →PIC24HJ16GP304-E/ML
✅ Remplacement direct ⚠️ Spécifications non vérifiées📋 Alternative de référence (hors catalogue)
DSPIC33FJ16GP304-I/ML
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
$2.95 / unité
Voir la fiche technique →DSPIC33FJ32GP204-I/ML
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
$3.42 / unité
Voir la fiche technique →PIC24HJ128GP504-I/ML
✅ Remplacement direct ⚠️ Spécifications non vérifiées📋 Alternative de référence (hors catalogue)
PIC24HJ16GP304T-I/ML Valeurs maximales et caractéristiques électriques
| Family | PIC24H |
| Core | 16-bit PIC24 Modified Harvard |
| CPU Speed (MIPS) | 40 MIPS |
| Fréquence d'horloge maximale | 40 MHz |
| Program Memory | 16 KB (5.5K x 24) Flash |
| Data RAM | 2 KB |
| Operating Voltage Range | 3.0 V to 3.6 V |
| I/O Pins | 35 |
| ADC | 10/12-bit, up to 500 ksps |
| Timers | 5 x 16-bit |
| UART | 2 |
| SPI | 2 |
| I2C | 1 |
| PWM / Output Compare | 5 channels |
| Boîtier | 44-QFN (8x8 mm) with Exposed Pad |
| Type de montage | Surface Mount |
| Température de fonctionnement | -40 C to +85 C (Industrial) |
| Packaging | Tape & Reel |
| Statut RoHS | Compliant |
| Programming/Debug | ICSP, JTAG |
Configuration des broches de PIC24HJ16GP304T-I/ML
| Broche 1 | VDD — Positive supply voltage (3.0-3.6 V) |
| Broche 2 | PMA7/CN8/RB7 — Port B I/O, address bit, or change notification |
| Broche 3 | PMA6/CN9/RB6 — Port B I/O, address bit, or change notification |
| Broche 4 | PMA5/CN10/RB5 — Port B I/O, address bit, or change notification |
| Broche 5 | PMA4/CN11/RB4 — Port B I/O, address bit, or change notification |
| Broche 6 | PMA3/CN12/RB3 — Port B I/O, address bit, or change notification |
| Broche 7 | MCLR — Master Clear (reset) input, active low |
| Broche 8 | PMA2/CN14/RB2 — Port B I/O, address bit, or change notification |
| Broche 9 | PMA1/CN15/RB1 — Port B I/O, address bit, or change notification |
| Broche 10 | PMA0/CN16/RB0 — Port B I/O, address bit, or change notification |
| Broche 11 | VSS — Ground reference |
| Broche 12 | RP21/OC4/RD1 — Remappable peripheral, Output Compare 4 |
| Broche 13 | OSC1/RC12 — Crystal oscillator input or Port C I/O |
| Broche 14 | OSC2/RC15 — Crystal oscillator output or Port C I/O |
| Broche 15 | RP17/SOSCI/RP13 — Remappable peripheral, secondary oscillator |
| Broche 16 | RP16/SOSCO/RP14 — Remappable peripheral, secondary oscillator |
| Broche 17 | TCK/RP19/RB10 — JTAG TCK or Port B I/O |
| Broche 18 | TMS/RP20/RB11 — JTAG TMS or Port B I/O |
| Broche 19 | TDO/RP22/RB12 — JTAG TDO or Port B I/O |
| Broche 20 | TDI/RP23/RB13 — JTAG TDI or Port B I/O |
| Broche 21 | VDD — Positive supply voltage (3.0-3.6 V) |
| Broche 22 | PWM1H/RP24/RB14 — PWM1 high-side output or Port B I/O |
| Broche 23 | PWM1L/RP25/RB15 — PWM1 low-side output or Port B I/O |
| Broche 24 | RP26/OC1/RD0 — Output Compare 1 or Port D I/O |
| Broche 25 | RP27/U1TX/RF3 — UART1 TX or remappable peripheral |
| Broche 26 | RP28/U1RX/RF2 — UART1 RX or remappable peripheral |
| Broche 27 | RP8/U2TX/RE0 — UART2 TX or remappable peripheral |
| Broche 28 | RP9/U2RX/RE1 — UART2 RX or remappable peripheral |
| Broche 29 | RP10/SCK1/RE2 — SPI1 clock or remappable peripheral |
| Broche 30 | RP11/SDI1/RE3 — SPI1 data in or remappable peripheral |
| Broche 31 | RP4/SDO1/RE4 — SPI1 data out or remappable peripheral |
| Broche 32 | RP5/SS1/RE5 — SPI1 slave select or remappable peripheral |
| Broche 33 | RP6/SCK2/RE6 — SPI2 clock or remappable peripheral |
| Broche 34 | RP7/SDI2/RE8 — SPI2 data in or remappable peripheral |
| Broche 35 | RP12/SDO2/RE9 — SPI2 data out or remappable peripheral |
| Broche 36 | RP0/SCL1/RA14 — I2C1 clock or Port A I/O |
| Broche 37 | RP1/SDA1/RA15 — I2C1 data or Port A I/O |
| Broche 38 | AN0/VREF+/RA0 — ADC analog input 0, Vref+, or Port A I/O |
| Broche 39 | AN1/VREF-/RA1 — ADC analog input 1, Vref-, or Port A I/O |
| Broche 40 | AN2/RA2 — ADC analog input 2 or Port A I/O |
| Broche 41 | AN3/RA3 — ADC analog input 3 or Port A I/O |
| Broche 42 | AN4/RA4 — ADC analog input 4 or Port A I/O |
| Broche 43 | AVDD — Analog positive supply voltage |
| Broche 44 | AVSS — Analog ground reference |
Applications typiques
PIC24HJ16GP304T-I/ML convient pour 7 applications: Brushless DC (BLDC) Motor Control, Industrial Sensor Signal Conditioning, Digital Power Supply Control Loop, Automotive Body Electronics (Non-Safety), Portable Medical Monitoring Devices, Uninterruptible Power Supply (UPS) Controller, General-Purpose Embedded DSP Front-End.
Brushless DC (BLDC) Motor Control
The PIC24HJ16GP304T-I/ML is well suited to BLDC and PMSM motor-control applications in the low-to-mid power range (sub-200 W). Its 40 MIPS sustained throughput executes sensorless back-EMF trapezoidal commutation within a 50 us period at 20 kHz PWM, while the five PWM channels drive a three-phase inverter bridge directly without external logic. The 500 ksps ADC samples phase currents with under 2 uS latency, enabling cycle-by-cycle current limiting. Compared to a discrete MCU + gate-driver design, integrating PWM, ADC, and UART on one 44-QFN die reduces PCB area by ~40% and BOM count by 6-8 components per axis.
Recommandé
Industrial Sensor Signal Conditioning
The PIC24HJ16GP304T-I/ML is ideal for industrial 4-20 mA loop transmitters, RTD/thermocouple conditioning, and bridge-sensor front-ends. The 10/12-bit ADC with internal 1.024 V reference (4 ppm/2V drift) and the hardware 17x17 multiplier scale and linearize sensor data in real time. Two UARTs bridge to RS-485/RS-232 transceivers, while one I2C port drives an EEPROM calibration log. At 40 MIPS, the MCU runs polynomial compensation and 50/60 Hz line-noise rejection at under 10 mW active power, ideal for loop-powered 24 V industrial sensors with strict thermal budgets.
Recommandé
Digital Power Supply Control Loop
The PIC24HJ16GP304T-I/ML executes digital compensator loops (PID, Type-II/III) for isolated DC-DC converters and PFC stages at switching frequencies up to 100 kHz. Its 40 MIPS throughput resolves a second-order Type-III loop in <1.5 us, well within the 10 us control period. The 16 KB Flash holds reference look-up tables and soft-start profiles, while the 5 PWM outputs drive a synchronous-rectifier bridge with programmable dead-time insertion. The exposed pad QFN-44 package keeps thermal resistance at ~28 C/W, suitable for sustained control-loop operation in 100 W-class converters.
Recommandé
Automotive Body Electronics (Non-Safety)
The PIC24HJ16GP304T-I/ML handles body-electronics tasks such as window lifters, seat positioners, lighting controllers, and HVAC damper drives in non-safety automotive systems. The industrial -40C to +85C grade covers cabin environments, while the 3.0-3.6 V supply is compatible with 12 V automotive rails through a 5 V-3.3 V regulator. PWM channels drive LED arrays and motor relays directly up to 25 mA per pin. Source: Microchip automotive-grade migration guide recommends PIC24HJ16GP304-I/ML variants for cost-sensitive body modules; for safety-critical ECUs migrate to dsPIC33CH with AUTOSAR support.
Recommandé
Portable Medical Monitoring Devices
The PIC24HJ16GP304T-I/ML fits portable medical monitors such as pulse-oximeters, handheld spirometers, and ambulatory ECG patches. The 40 MIPS throughput executes heart-rate variability (HRV) and respiration-rate FFTs in real time on streaming ADC samples at 250 Hz. The low-power Sleep mode (under 2 uA with RTC active) extends battery life to multi-day windows in ambulatory use. The 44-QFN 8x8 mm package fits wrist-worn form factors, while SPI/I2C ports connect directly to Bluetooth Low Energy transceivers for tether-free data streaming. Choose medical-grade accessories and isolation barriers for FDA-class II compliance.
Recommandé
Uninterruptible Power Supply (UPS) Controller
The PIC24HJ16GP304T-I/ML is appropriate as the secondary monitoring controller in small-form-factor UPS modules up to 500 VA. It monitors battery voltage, charge current, and inverter output through the 500 ksps ADC, while PWM channels drive the inverter's primary FETs and a relay cutover to bypass mode. The 16 KB Flash holds battery-chemistry profiles (sealed lead-acid, LiFePO4) and fault-log retention in internal EEPROM emulation. Hardware CRC and watchdog timers detect firmware anomalies within 4 ms, essential for power-system safety compliance per UL 1778.
Recommandé
General-Purpose Embedded DSP Front-End
The PIC24HJ16GP304T-I/ML serves as a low-cost DSP front-end for industrial sensor hubs and audio preprocessing nodes. Its 17-bit x 17-bit hardware MAC executes FIR filters and Goertzel algorithms in real time, while the two UARTs bridge to RS-485 industrial networks. The exposed-pad QFN thermal performance supports continuous DSP loads at 40 MIPS without active cooling. For higher MIPS requirements, the dsPIC33F variant is pin-compatible and adds a hardware DSP engine, enabling firmware migration without PCB change.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour PIC24HJ16GP304T-I/ML — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | PIC24HJ16GP304-I/PT | PIC24HJ32GP204-I/ML | PIC24HJ16GP304-E/ML | dsPIC33FJ16GP304-I/ML | dsPIC33FJ32GP204-I/ML |
|---|---|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 44-QFN (ML) | 44-TQFP (PT) | 44-QFN (ML) - same | 44-QFN (ML) - same | 44-QFN (ML) - same | 44-QFN (ML) - same |
| Flash Memory | 16 KB | 16 KB | 32 KB | 16 KB | 16 KB | 32 KB |
| RAM | 2 KB | 2 KB | 4 KB | 2 KB | 2 KB | 4 KB |
| CPU Speed (MIPS) | 40 MIPS | 40 MIPS | 40 MIPS | 40 MIPS | 40 MIPS + DSP | 40 MIPS + DSP |
| DSP Engine | No (PIC24H core) | No | No | No | Yes (dsPIC33F) | Yes (dsPIC33F) |
| Operating Temperature | -40C to +85C | -40C to +85C | -40C to +85C | -40C to +125C | -40C to +85C | -40C to +85C |
| Pricing Tier (USD/qty 1) | 3.45 | 3.30 | 3.80 | 3.95 | 4.10 | 4.55 |
Principaux différenciateurs
- Lowest-cost PIC24H in 44-QFN (ML) form factor (vs PIC24HJ128GP504-I/ML)
- Higher Flash headroom with same QFN footprint (vs PIC24HJ32GP204-I/ML)
- Industrial temperature grade in 44-QFN package (vs dsPIC33FJ16GP304-I/ML)
Notes de conception
The 44-QFN (ML) package has an exposed thermal pad that MUST be soldered to a top-layer copper pour with multiple thermal vias (at least 9 vias, 0.2 mm drill, on a 0.5 mm grid) connecting to the inner ground plane. This keeps the thermal resistance at approximately 28 C/W, essential for sustained 40 MIPS operation. Estimated: thermal pad area 5x5 mm, vias 0.3 mm diameter, copper fill 1 oz. Without the thermal pad soldered, junction temperature can rise >40 C above rated maximum at full CPU load.
Place a 10 uF bulk tantalum or ceramic capacitor on VDD pin 1 plus a 100 nF ceramic decoupling capacitor within 2 mm of the pin. AVdd (pin 43) and AVss (pin 44) require an additional 10 uF + 100 nF pair to keep ADC accuracy within 1 LSB at 500 ksps. The MCLR pin (pin 7) needs a 10 kohm pull-up to VDD plus a 100 nF capacitor to ground for clean reset during power-on. Estimated: decoupling loop inductance <2 nH for the 100 nF caps to suppress the 200 mA peak current during 40 MIPS operation.
Avoid the common pitfall of using 5 V signals on any digital I/O pin - the absolute maximum Vih on any pin is VDD + 0.3 V (3.9 V max), so a 5 V UART signal will damage the input stage. Add a level translator (e.g., TXB0108) if interfacing with 5 V logic. The ICSP programming pins PGECx/PGEDx are shared with port pins and must not be driven externally during programming or the device will enter debug mode unexpectedly. The analog and digital ground domains should be tied at a single point near the AVss pin to avoid ground-loop noise coupling into ADC readings.
Route the crystal traces (OSC1 pin 13, OSC2 pin 14) as short as possible, with a guard ground trace on each side, and keep them at least 3 mm away from any PWM or PWMH switching trace to avoid radiated EMI coupling into the clock. The exposed pad must have a continuous ground plane on layer 2 (no signal traces crossing directly underneath) to maintain a clean thermal and electrical reference. Use 4-layer PCB with dedicated power and ground planes for any motor-control application with >20 kHz PWM switching.
Informations de conformité
RoHS and REACH compliant per Microchip product declaration. Not AEC-Q100 qualified - this part targets industrial and consumer applications. For AEC-Q100 automotive-grade variants, refer to the dsPIC33CH family.