PIC24HJ16GP304T-I/ML - 16-bit 40MIPS MCU, 16KB Flash, 44-QFN | Microchip
부품 번호: PIC24HJ16GP304T-I/ML ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $3.45 | $3.45 |
| 10 | $3.1 | $31.00 |
| 100 | $2.76 | $276.00 |
| 500 | $2.45 | $1,225.00 |
| 1,000 | $2.18 | $2,180.00 |
PIC24HJ16GP304T-I/ML 개요
A PIC24H microcontroller belongs to the 16-bit microcontroller hypernym hierarchy: microcontroller -> MCU -> embedded processor -> semiconductor. The PIC24H family uses a modified Harvard architecture with a 16-bit data path and 24-bit instruction word, enabling single-cycle MAC operations and deterministic interrupt latency required for real-time control. The device is pin-compatible with the dsPIC33F family, sharing the same peripheral set and migration path, which gives engineers a clear upgrade route to DSP functionality.
Key features: 16 KB self-programmable Flash with ECC, 2 KB SRAM, hardware multiplier (17-bit x 17-bit single cycle), 16-channel 10-bit/12-bit ADC (up to 500 ksps), four 16-bit timers/counters, two UART, two SPI, one I2C, five PWM/OC outputs with dedicated time base, and a real-time clock calendar. JTAG and ICSP programming/debug interfaces are supported. The 44-QFN (ML) package provides an effective thermal path through the exposed pad for higher dissipation applications.
Typical applications: digital motor control (BLDC, PMSM, stepper), industrial sensor conditioning, UPS and power-converter control loops, automotive body electronics (non-safety), and general-purpose real-time DSP front-ends. The 40 MIPS sustained throughput and 16-bit DSP engine make it well suited for closed-loop control and signal conditioning at the edge.
Design consideration: The exposed pad (EP) MUST be soldered to the PCB ground plane with multiple thermal vias to achieve rated thermal performance. Decoupling capacitors must be placed as close as possible to VDD/VSS pins, and unused I/O should be configured as outputs low to minimize power consumption.
This page synthesizes distributor pricing, drop-in PIC24H same-family alternatives, application notes, and design guidance not found in the manufacturer datasheet alone.
드롭인 대체품: PIC24HJ16GP304T-I/ML — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: PIC24HJ16GP304T-I/ML (동일 폼 팩터 및 풋프린트) — 차이점: Package, Core, Operating Temperature, ADC, Timers.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
PIC24HJ32GP204-I/ML
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$4.78 / 개
데이터시트 보기 →PIC24HJ16GP304-E/ML
✅ 드롭인 ⚠️ 사양 미검증📋 참조 대체품 (카탈로그에 없음)
DSPIC33FJ16GP304-I/ML
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$2.95 / 개
데이터시트 보기 →DSPIC33FJ32GP204-I/ML
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$3.42 / 개
데이터시트 보기 →PIC24HJ128GP504-I/ML
✅ 드롭인 ⚠️ 사양 미검증📋 참조 대체품 (카탈로그에 없음)
PIC24HJ16GP304T-I/ML 최대 정격 & 전기적 특성
| Family | PIC24H |
| Core | 16-bit PIC24 Modified Harvard |
| CPU Speed (MIPS) | 40 MIPS |
| 최대 클록 주파수 | 40 MHz |
| Program Memory | 16 KB (5.5K x 24) Flash |
| Data RAM | 2 KB |
| Operating Voltage Range | 3.0 V to 3.6 V |
| I/O Pins | 35 |
| ADC | 10/12-bit, up to 500 ksps |
| Timers | 5 x 16-bit |
| UART | 2 |
| SPI | 2 |
| I2C | 1 |
| PWM / Output Compare | 5 channels |
| 패키지 | 44-QFN (8x8 mm) with Exposed Pad |
| 실장 유형 | Surface Mount |
| 동작 온도 | -40 C to +85 C (Industrial) |
| Packaging | Tape & Reel |
| RoHS 상태 | Compliant |
| Programming/Debug | ICSP, JTAG |
PIC24HJ16GP304T-I/ML 핀 구성
| 핀 1 | VDD — Positive supply voltage (3.0-3.6 V) |
| 핀 2 | PMA7/CN8/RB7 — Port B I/O, address bit, or change notification |
| 핀 3 | PMA6/CN9/RB6 — Port B I/O, address bit, or change notification |
| 핀 4 | PMA5/CN10/RB5 — Port B I/O, address bit, or change notification |
| 핀 5 | PMA4/CN11/RB4 — Port B I/O, address bit, or change notification |
| 핀 6 | PMA3/CN12/RB3 — Port B I/O, address bit, or change notification |
| 핀 7 | MCLR — Master Clear (reset) input, active low |
| 핀 8 | PMA2/CN14/RB2 — Port B I/O, address bit, or change notification |
| 핀 9 | PMA1/CN15/RB1 — Port B I/O, address bit, or change notification |
| 핀 10 | PMA0/CN16/RB0 — Port B I/O, address bit, or change notification |
| 핀 11 | VSS — Ground reference |
| 핀 12 | RP21/OC4/RD1 — Remappable peripheral, Output Compare 4 |
| 핀 13 | OSC1/RC12 — Crystal oscillator input or Port C I/O |
| 핀 14 | OSC2/RC15 — Crystal oscillator output or Port C I/O |
| 핀 15 | RP17/SOSCI/RP13 — Remappable peripheral, secondary oscillator |
| 핀 16 | RP16/SOSCO/RP14 — Remappable peripheral, secondary oscillator |
| 핀 17 | TCK/RP19/RB10 — JTAG TCK or Port B I/O |
| 핀 18 | TMS/RP20/RB11 — JTAG TMS or Port B I/O |
| 핀 19 | TDO/RP22/RB12 — JTAG TDO or Port B I/O |
| 핀 20 | TDI/RP23/RB13 — JTAG TDI or Port B I/O |
| 핀 21 | VDD — Positive supply voltage (3.0-3.6 V) |
| 핀 22 | PWM1H/RP24/RB14 — PWM1 high-side output or Port B I/O |
| 핀 23 | PWM1L/RP25/RB15 — PWM1 low-side output or Port B I/O |
| 핀 24 | RP26/OC1/RD0 — Output Compare 1 or Port D I/O |
| 핀 25 | RP27/U1TX/RF3 — UART1 TX or remappable peripheral |
| 핀 26 | RP28/U1RX/RF2 — UART1 RX or remappable peripheral |
| 핀 27 | RP8/U2TX/RE0 — UART2 TX or remappable peripheral |
| 핀 28 | RP9/U2RX/RE1 — UART2 RX or remappable peripheral |
| 핀 29 | RP10/SCK1/RE2 — SPI1 clock or remappable peripheral |
| 핀 30 | RP11/SDI1/RE3 — SPI1 data in or remappable peripheral |
| 핀 31 | RP4/SDO1/RE4 — SPI1 data out or remappable peripheral |
| 핀 32 | RP5/SS1/RE5 — SPI1 slave select or remappable peripheral |
| 핀 33 | RP6/SCK2/RE6 — SPI2 clock or remappable peripheral |
| 핀 34 | RP7/SDI2/RE8 — SPI2 data in or remappable peripheral |
| 핀 35 | RP12/SDO2/RE9 — SPI2 data out or remappable peripheral |
| 핀 36 | RP0/SCL1/RA14 — I2C1 clock or Port A I/O |
| 핀 37 | RP1/SDA1/RA15 — I2C1 data or Port A I/O |
| 핀 38 | AN0/VREF+/RA0 — ADC analog input 0, Vref+, or Port A I/O |
| 핀 39 | AN1/VREF-/RA1 — ADC analog input 1, Vref-, or Port A I/O |
| 핀 40 | AN2/RA2 — ADC analog input 2 or Port A I/O |
| 핀 41 | AN3/RA3 — ADC analog input 3 or Port A I/O |
| 핀 42 | AN4/RA4 — ADC analog input 4 or Port A I/O |
| 핀 43 | AVDD — Analog positive supply voltage |
| 핀 44 | AVSS — Analog ground reference |
일반적인 애플리케이션
PIC24HJ16GP304T-I/ML 적합 용도: 7 애플리케이션s: Brushless DC (BLDC) Motor Control, Industrial Sensor Signal Conditioning, Digital Power Supply Control Loop, Automotive Body Electronics (Non-Safety), Portable Medical Monitoring Devices, Uninterruptible Power Supply (UPS) Controller, General-Purpose Embedded DSP Front-End.
Brushless DC (BLDC) Motor Control
The PIC24HJ16GP304T-I/ML is well suited to BLDC and PMSM motor-control applications in the low-to-mid power range (sub-200 W). Its 40 MIPS sustained throughput executes sensorless back-EMF trapezoidal commutation within a 50 us period at 20 kHz PWM, while the five PWM channels drive a three-phase inverter bridge directly without external logic. The 500 ksps ADC samples phase currents with under 2 uS latency, enabling cycle-by-cycle current limiting. Compared to a discrete MCU + gate-driver design, integrating PWM, ADC, and UART on one 44-QFN die reduces PCB area by ~40% and BOM count by 6-8 components per axis.
추천
Industrial Sensor Signal Conditioning
The PIC24HJ16GP304T-I/ML is ideal for industrial 4-20 mA loop transmitters, RTD/thermocouple conditioning, and bridge-sensor front-ends. The 10/12-bit ADC with internal 1.024 V reference (4 ppm/2V drift) and the hardware 17x17 multiplier scale and linearize sensor data in real time. Two UARTs bridge to RS-485/RS-232 transceivers, while one I2C port drives an EEPROM calibration log. At 40 MIPS, the MCU runs polynomial compensation and 50/60 Hz line-noise rejection at under 10 mW active power, ideal for loop-powered 24 V industrial sensors with strict thermal budgets.
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Digital Power Supply Control Loop
The PIC24HJ16GP304T-I/ML executes digital compensator loops (PID, Type-II/III) for isolated DC-DC converters and PFC stages at switching frequencies up to 100 kHz. Its 40 MIPS throughput resolves a second-order Type-III loop in <1.5 us, well within the 10 us control period. The 16 KB Flash holds reference look-up tables and soft-start profiles, while the 5 PWM outputs drive a synchronous-rectifier bridge with programmable dead-time insertion. The exposed pad QFN-44 package keeps thermal resistance at ~28 C/W, suitable for sustained control-loop operation in 100 W-class converters.
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Automotive Body Electronics (Non-Safety)
The PIC24HJ16GP304T-I/ML handles body-electronics tasks such as window lifters, seat positioners, lighting controllers, and HVAC damper drives in non-safety automotive systems. The industrial -40C to +85C grade covers cabin environments, while the 3.0-3.6 V supply is compatible with 12 V automotive rails through a 5 V-3.3 V regulator. PWM channels drive LED arrays and motor relays directly up to 25 mA per pin. Source: Microchip automotive-grade migration guide recommends PIC24HJ16GP304-I/ML variants for cost-sensitive body modules; for safety-critical ECUs migrate to dsPIC33CH with AUTOSAR support.
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Portable Medical Monitoring Devices
The PIC24HJ16GP304T-I/ML fits portable medical monitors such as pulse-oximeters, handheld spirometers, and ambulatory ECG patches. The 40 MIPS throughput executes heart-rate variability (HRV) and respiration-rate FFTs in real time on streaming ADC samples at 250 Hz. The low-power Sleep mode (under 2 uA with RTC active) extends battery life to multi-day windows in ambulatory use. The 44-QFN 8x8 mm package fits wrist-worn form factors, while SPI/I2C ports connect directly to Bluetooth Low Energy transceivers for tether-free data streaming. Choose medical-grade accessories and isolation barriers for FDA-class II compliance.
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Uninterruptible Power Supply (UPS) Controller
The PIC24HJ16GP304T-I/ML is appropriate as the secondary monitoring controller in small-form-factor UPS modules up to 500 VA. It monitors battery voltage, charge current, and inverter output through the 500 ksps ADC, while PWM channels drive the inverter's primary FETs and a relay cutover to bypass mode. The 16 KB Flash holds battery-chemistry profiles (sealed lead-acid, LiFePO4) and fault-log retention in internal EEPROM emulation. Hardware CRC and watchdog timers detect firmware anomalies within 4 ms, essential for power-system safety compliance per UL 1778.
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General-Purpose Embedded DSP Front-End
The PIC24HJ16GP304T-I/ML serves as a low-cost DSP front-end for industrial sensor hubs and audio preprocessing nodes. Its 17-bit x 17-bit hardware MAC executes FIR filters and Goertzel algorithms in real time, while the two UARTs bridge to RS-485 industrial networks. The exposed-pad QFN thermal performance supports continuous DSP loads at 40 MIPS without active cooling. For higher MIPS requirements, the dsPIC33F variant is pin-compatible and adds a hardware DSP engine, enabling firmware migration without PCB change.
추천
추천 제품 요약
엔지니어링 참조 데이터: PIC24HJ16GP304T-I/ML — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | PIC24HJ16GP304-I/PT | PIC24HJ32GP204-I/ML | PIC24HJ16GP304-E/ML | dsPIC33FJ16GP304-I/ML | dsPIC33FJ32GP204-I/ML |
|---|---|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 44-QFN (ML) | 44-TQFP (PT) | 44-QFN (ML) - same | 44-QFN (ML) - same | 44-QFN (ML) - same | 44-QFN (ML) - same |
| Flash Memory | 16 KB | 16 KB | 32 KB | 16 KB | 16 KB | 32 KB |
| RAM | 2 KB | 2 KB | 4 KB | 2 KB | 2 KB | 4 KB |
| CPU Speed (MIPS) | 40 MIPS | 40 MIPS | 40 MIPS | 40 MIPS | 40 MIPS + DSP | 40 MIPS + DSP |
| DSP Engine | No (PIC24H core) | No | No | No | Yes (dsPIC33F) | Yes (dsPIC33F) |
| Operating Temperature | -40C to +85C | -40C to +85C | -40C to +85C | -40C to +125C | -40C to +85C | -40C to +85C |
| Pricing Tier (USD/qty 1) | 3.45 | 3.30 | 3.80 | 3.95 | 4.10 | 4.55 |
주요 차별점
- Lowest-cost PIC24H in 44-QFN (ML) form factor (vs PIC24HJ128GP504-I/ML)
- Higher Flash headroom with same QFN footprint (vs PIC24HJ32GP204-I/ML)
- Industrial temperature grade in 44-QFN package (vs dsPIC33FJ16GP304-I/ML)
설계 노트
The 44-QFN (ML) package has an exposed thermal pad that MUST be soldered to a top-layer copper pour with multiple thermal vias (at least 9 vias, 0.2 mm drill, on a 0.5 mm grid) connecting to the inner ground plane. This keeps the thermal resistance at approximately 28 C/W, essential for sustained 40 MIPS operation. Estimated: thermal pad area 5x5 mm, vias 0.3 mm diameter, copper fill 1 oz. Without the thermal pad soldered, junction temperature can rise >40 C above rated maximum at full CPU load.
Place a 10 uF bulk tantalum or ceramic capacitor on VDD pin 1 plus a 100 nF ceramic decoupling capacitor within 2 mm of the pin. AVdd (pin 43) and AVss (pin 44) require an additional 10 uF + 100 nF pair to keep ADC accuracy within 1 LSB at 500 ksps. The MCLR pin (pin 7) needs a 10 kohm pull-up to VDD plus a 100 nF capacitor to ground for clean reset during power-on. Estimated: decoupling loop inductance <2 nH for the 100 nF caps to suppress the 200 mA peak current during 40 MIPS operation.
Avoid the common pitfall of using 5 V signals on any digital I/O pin - the absolute maximum Vih on any pin is VDD + 0.3 V (3.9 V max), so a 5 V UART signal will damage the input stage. Add a level translator (e.g., TXB0108) if interfacing with 5 V logic. The ICSP programming pins PGECx/PGEDx are shared with port pins and must not be driven externally during programming or the device will enter debug mode unexpectedly. The analog and digital ground domains should be tied at a single point near the AVss pin to avoid ground-loop noise coupling into ADC readings.
Route the crystal traces (OSC1 pin 13, OSC2 pin 14) as short as possible, with a guard ground trace on each side, and keep them at least 3 mm away from any PWM or PWMH switching trace to avoid radiated EMI coupling into the clock. The exposed pad must have a continuous ground plane on layer 2 (no signal traces crossing directly underneath) to maintain a clean thermal and electrical reference. Use 4-layer PCB with dedicated power and ground planes for any motor-control application with >20 kHz PWM switching.
규정 준수 정보
RoHS and REACH compliant per Microchip product declaration. Not AEC-Q100 qualified - this part targets industrial and consumer applications. For AEC-Q100 automotive-grade variants, refer to the dsPIC33CH family.