PIC24HJ256GP610A-H/PF - 16-bit 40 MIPS MCU 256KB Flash TQFP-100 | Microchip
Référence : PIC24HJ256GP610A-H/PF ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $12.5 | $12,50 |
| 10 | $11.2 | $112,00 |
| 100 | $9.8 | $980,00 |
| 500 | $8.9 | $4 450,00 |
| 1 000 | $7.95 | $7 950,00 |
PIC24HJ256GP610A-H/PF Présentation
A 16-bit microcontroller (MCU) is a programmable integrated circuit that uses a 16-bit data path, registers, and arithmetic logic unit to deliver higher code density and throughput than 8-bit architectures while remaining simpler and lower-cost than 32-bit parts. The PIC24H belongs to the Microchip dsPIC33F/PIC24H ecosystem, sharing peripherals with the dsPIC33F Digital Signal Controller family and offering a documented migration path to PIC24F, dsPIC30F, and dsPIC33F devices. Within the broader taxonomy, a PIC24H MCU is a member of the microcontroller -> embedded controller -> semiconductor device hierarchy. The PIC24HJ256GP610A in particular integrates 256 KB Flash and 16 KB SRAM for application and data storage.
Key differentiating features include a Harvard architecture with a modified RISC instruction set supporting 16-bit and 32-bit operations, a hardware multiply engine with single-cycle 16x16 or 32x16 multiplication, and a 16-bit data shifter capable of up to 16-bit single-cycle shifts. Integrated peripherals include a 16-channel 10-bit/12-bit ADC (depending on variant), multiple PWM modules, a Real-Time Clock and Calendar (RTCC), UART, SPI, I2C, ECAN, DMA controller, watchdog timer, brown-out reset, and power-on reset. The PIC24HJ256GP610A-H/PF also provides two 3-wire SPIs and 4-wire SPIs as well as 4 UARTs (with IrDA support) for serial communication.
The device architecture uses a 16-bit wide program memory bus paired with a separate 16-bit data bus, allowing simultaneous instruction fetch and data access. Internal PLL operation allows the part to run at 40 MIPS from a typical 8 MHz crystal, and the divide algorithm completes one cycle per bit of divisor. This combination of high-throughput core, ample SRAM, and rich peripherals positions the PIC24HJ256GP610A-H/PF for applications that need deterministic interrupt latency and computational headroom.
Typical applications include automotive body and chassis control, industrial motor control (BLDC, PMSM, and AC induction drives), Uninterruptible Power Supply (UPS) and power conversion control, advanced sensing platforms (satcom and instrumentation), and high-reliability consumer/industrial embedded control. The wide operating temperature range and AEC-Q100 grade also suit under-hood and ruggedized installations. The PIC24HJ256GP610A-H/PF is pin-compatible with the dsPIC33F family, allowing seamless migration to a DSP-capable part without PCB rework.
When designing with this MCU, allocate adequate decoupling (typically 0.1 uF ceramic per VDD/AVDD pin), and use the Explorer 16 or equivalent development board to validate the firmware build with the latest MPLAB X IDE and XC16 compiler. Verify that any drop-in alternative shares the same TQFP-100 footprint and peripheral map before substituting. This page synthesizes distributor pricing, pin-compatible drop-in alternatives within the PIC24H family, and practical design notes not found in the manufacturer datasheet.
Alternatives de remplacement direct pour PIC24HJ256GP610A-H/PF — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec PIC24HJ256GP610A-H/PF (même facteur de forme et même empreinte) — différant par ADC, Core Architecture, Instruction Set, Operating Temperature, Package.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
PIC24HJ256GP610A-I/PF
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
PIC24HJ256GP610A-E/PF
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
dsPIC33FJ256GP610A-H/PF
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
PIC24HJ128GP610A-H/PF
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
PIC24HJ256GP610A-I/PT
✅ Remplacement direct✓ En stock
$8.9 / unité
Voir la fiche technique →PIC24HJ256GP210A-H/PF
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
PIC24HJ256GP610A-H/PF Valeurs maximales et caractéristiques électriques
| Core Architecture | PIC24H 16-bit modified Harvard RISC |
| Instruction Set | 16-bit with 32-bit extensions |
| CPU Speed (MIPS) | 40 MIPS |
| Program Memory (Flash) | 256 KB (85.5K x 24) |
| Data Memory (SRAM) | 16 KB |
| Operating Voltage (VDD) | 3.0 V to 3.6 V |
| Température de fonctionnement | -40C to +150C (H grade) |
| Boîtier | 100-pin TQFP (14x14 mm) |
| Type de montage | Surface Mount |
| Automotive Qualification | AEC-Q100 qualified |
| Hardware Multiplier | 17-bit x 17-bit single-cycle |
| DMA Channels | Yes (8-channel DMA) |
| ADC | 10-bit / 12-bit ADC (variant dependent) |
| Communication Interfaces | UART (x4), I2C, SPI, ECAN |
| Timers | Multiple 16-bit and 32-bit timers |
| PWM Modules | Multiple PWM outputs |
| Watchdog Timer | Yes (WDT) |
| Brown-out Reset | Yes (BOR) |
| Power-on Reset | Yes (POR) |
| Nombre de broches | 100 |
| Statut RoHS | Compliant |
Configuration des broches de PIC24HJ256GP610A-H/PF
| Broche 1 | OSC1/RC13 — Oscillator crystal input or GPIO RC13 |
| Broche 2 | OSC2/RC15 — Oscillator crystal output or GPIO RC15 |
| Broche 3 | VSS — Ground reference |
| Broche 4 | PGEC1 — In-circuit debug programming clock 1 |
| Broche 5 | PGED1 — In-circuit debug programming data 1 |
| Broche 6 | VDD — Digital supply (3.0-3.6 V) |
| Broche 7 | RP5/RB5 — Remappable peripheral pin / GPIO RB5 |
| Broche 8 | RP6/RB6 — Remappable peripheral pin / GPIO RB6 |
| Broche 9 | RP7/RB7 — Remappable peripheral pin / GPIO RB7 |
| Broche 10 | RP8/RB8 — Remappable peripheral pin / GPIO RB8 |
| Broche 11 | RP9/RB9 — Remappable peripheral pin / GPIO RB9 |
| Broche 12 | VSS — Ground reference |
| Broche 13 | VDD — Digital supply (3.0-3.6 V) |
| Broche 14 | AN0/RB0 — Analog input 0 / GPIO RB0 |
| Broche 15 | AN1/RB1 — Analog input 1 / GPIO RB1 |
| Broche 16 | AN2/RB2 — Analog input 2 / GPIO RB2 |
| Broche 17 | AN3/RB3 — Analog input 3 / GPIO RB3 |
| Broche 18 | AN4/RB4 — Analog input 4 / GPIO RB4 |
| Broche 19 | AVSS — Analog ground reference |
| Broche 20 | AVDD — Analog supply (3.0-3.6 V) |
| Broche 21 | AN5/RB5 — Analog input 5 / GPIO RB5 |
| Broche 22 | AN6/RB6 — Analog input 6 / GPIO RB6 |
| Broche 23 | AN7/RB7 — Analog input 7 / GPIO RB7 |
| Broche 24 | AN8/RB8 — Analog input 8 / GPIO RB8 |
| Broche 25 | AN9/RB9 — Analog input 9 / GPIO RB9 |
| Broche 26 | AVSS — Analog ground reference |
| Broche 27 | AVDD — Analog supply (3.0-3.6 V) |
| Broche 28 | VSS — Ground reference |
| Broche 29 | VDD — Digital supply (3.0-3.6 V) |
| Broche 30 | RP10/RB10 — Remappable peripheral pin / GPIO RB10 |
| Broche 31 | RP11/RB11 — Remappable peripheral pin / GPIO RB11 |
| Broche 32 | RP12/RB12 — Remappable peripheral pin / GPIO RB12 |
| Broche 33 | RP13/RB13 — Remappable peripheral pin / GPIO RB13 |
| Broche 34 | RP14/RB14 — Remappable peripheral pin / GPIO RB14 |
| Broche 35 | RP15/RB15 — Remappable peripheral pin / GPIO RB15 |
| Broche 36 | VSS — Ground reference |
| Broche 37 | VDD — Digital supply (3.0-3.6 V) |
| Broche 38 | RP0/RA0 — Remappable peripheral pin / GPIO RA0 |
| Broche 39 | RP1/RA1 — Remappable peripheral pin / GPIO RA1 |
| Broche 40 | RP2/RA2 — Remappable peripheral pin / GPIO RA2 |
| Broche 41 | RP3/RA3 — Remappable peripheral pin / GPIO RA3 |
| Broche 42 | RP4/RA4 — Remappable peripheral pin / GPIO RA4 |
| Broche 43 | VSS — Ground reference |
| Broche 44 | VDD — Digital supply (3.0-3.6 V) |
| Broche 45 | RP16/RC0 — Remappable peripheral pin / GPIO RC0 |
| Broche 46 | RP17/RC1 — Remappable peripheral pin / GPIO RC1 |
| Broche 47 | RP18/RC2 — Remappable peripheral pin / GPIO RC2 |
| Broche 48 | RP19/RC3 — Remappable peripheral pin / GPIO RC3 |
| Broche 49 | RP20/RC4 — Remappable peripheral pin / GPIO RC4 |
| Broche 50 | RP21/RC5 — Remappable peripheral pin / GPIO RC5 |
| Broche 51 | VSS — Ground reference |
| Broche 52 | VDD — Digital supply (3.0-3.6 V) |
| Broche 53 | RP22/RC6 — Remappable peripheral pin / GPIO RC6 |
| Broche 54 | RP23/RC7 — Remappable peripheral pin / GPIO RC7 |
| Broche 55 | RP24/RC8 — Remappable peripheral pin / GPIO RC8 |
| Broche 56 | RP25/RC9 — Remappable peripheral pin / GPIO RC9 |
| Broche 57 | RP26/RC10 — Remappable peripheral pin / GPIO RC10 |
| Broche 58 | RP27/RC11 — Remappable peripheral pin / GPIO RC11 |
| Broche 59 | VSS — Ground reference |
| Broche 60 | VDD — Digital supply (3.0-3.6 V) |
| Broche 61 | RP28/RC12 — Remappable peripheral pin / GPIO RC12 |
| Broche 62 | RP29/RC13 — Remappable peripheral pin / GPIO RC13 |
| Broche 63 | RP30/RC14 — Remappable peripheral pin / GPIO RC14 |
| Broche 64 | RP31/RC15 — Remappable peripheral pin / GPIO RC15 |
| Broche 65 | VSS — Ground reference |
| Broche 66 | VDD — Digital supply (3.0-3.6 V) |
| Broche 67 | RD0 — GPIO RD0 |
| Broche 68 | RD1 — GPIO RD1 |
| Broche 69 | RD2 — GPIO RD2 |
| Broche 70 | RD3 — GPIO RD3 |
| Broche 71 | RD4 — GPIO RD4 |
| Broche 72 | RD5 — GPIO RD5 |
| Broche 73 | VSS — Ground reference |
| Broche 74 | VDD — Digital supply (3.0-3.6 V) |
| Broche 75 | RD6 — GPIO RD6 |
| Broche 76 | RD7 — GPIO RD7 |
| Broche 77 | RD8 — GPIO RD8 |
| Broche 78 | RD9 — GPIO RD9 |
| Broche 79 | RD10 — GPIO RD10 |
| Broche 80 | RD11 — GPIO RD11 |
| Broche 81 | VSS — Ground reference |
| Broche 82 | VDD — Digital supply (3.0-3.6 V) |
| Broche 83 | RD12 — GPIO RD12 |
| Broche 84 | RD13 — GPIO RD13 |
| Broche 85 | RD14 — GPIO RD14 |
| Broche 86 | RD15 — GPIO RD15 |
| Broche 87 | RE0 — GPIO RE0 |
| Broche 88 | RE1 — GPIO RE1 |
| Broche 89 | VSS — Ground reference |
| Broche 90 | VDD — Digital supply (3.0-3.6 V) |
| Broche 91 | RE2 — GPIO RE2 |
| Broche 92 | RE3 — GPIO RE3 |
| Broche 93 | RE4 — GPIO RE4 |
| Broche 94 | RE5 — GPIO RE5 |
| Broche 95 | RF0 — GPIO RF0 |
| Broche 96 | RF1 — GPIO RF1 |
| Broche 97 | VSS — Ground reference |
| Broche 98 | VDD — Digital supply (3.0-3.6 V) |
| Broche 99 | RF2 — GPIO RF2 |
| Broche 100 | RF3 — GPIO RF3 |
Applications typiques
PIC24HJ256GP610A-H/PF convient pour 6 applications: Automotive Body and Chassis Control, Industrial Motor Control (BLDC / PMSM / ACIM), Uninterruptible Power Supply (UPS) and Power Conversion Control, Advanced Sensing and Instrumentation, Industrial HMI and Embedded Control, Solar Inverter and Renewable Energy Control.
Automotive Body and Chassis Control
The PIC24HJ256GP610A-H/PF is well suited to automotive body and chassis ECUs where AEC-Q100 qualification, a -40C to +150C operating envelope (H grade), and deterministic interrupt response are required. The 40 MIPS core drives real-time tasks such as CAN (ECAN) message handling, sensor fusion, and PWM actuator control simultaneously, while 256 KB Flash hosts the full AUTOSAR-style application and 16 KB SRAM holds communication buffers and diagnostics state. Compared to slower 8-bit MCUs, the PIC24H's hardware DMA offloads CAN-to-memory transfers, freeing the CPU for control loops. The TQFP-100 package provides ample I/O for body controllers managing lighting, mirrors, and door modules. Pair with a CAN transceiver like MCP2551 and an automotive-grade LDO such as the MCP1755 to complete a robust ECU.
Recommandé
Industrial Motor Control (BLDC / PMSM / ACIM)
The PIC24HJ256GP610A-H/PF delivers the 40 MIPS throughput and rich PWM peripheral set required for sensorless and sensored motor control algorithms such as trapezoidal commutation, field-oriented control (FOC), and space-vector PWM. The on-chip 10/12-bit ADC samples phase currents and DC-bus voltage with deterministic latency, while dedicated PWM modules generate complementary outputs with programmable dead time for three-phase inverter bridges. 16 KB SRAM is sufficient for FOC state variables and estimator buffers, while 256 KB Flash hosts the full vector-control library and application layer. The -40C to +150C operating range also supports industrial cabinet installations where ambient can approach 85C. For higher-end motor control with DSP (sinusoidal/space-vector), upgrade to the dsPIC33FJ256GP610A-H/PF which adds hardware MAC and dual 40-bit accumulators.
Recommandé
Uninterruptible Power Supply (UPS) and Power Conversion Control
In UPS, inverter, and DC-DC power-conversion applications, the PIC24HJ256GP610A-H/PF provides the digital control backbone for closed-loop current/voltage regulation, MPPT for solar converters, and grid-synchronization routines for inverter tie-ins. The 40 MIPS core executes digital compensator (PI/PID) calculations and RMS calculations within a single PWM period (typically 50-100 us at 20 kHz switching). Its ADC pairs with high-resolution PWM to drive digital control of PFC and full-bridge topologies, while ECAN allows grid-tied paralleling across modules. The 256 KB Flash is sufficient for full state-machine control firmware, and the 16 KB SRAM supports per-cycle sample buffers and soft-start ramps. AEC-Q100 qualification also lets the same firmware serve ruggedized industrial UPS products.
Recommandé
Advanced Sensing and Instrumentation
The PIC24HJ256GP610A-H/PF's combination of 40 MIPS throughput, 16 KB SRAM, and 10/12-bit ADC makes it a strong fit for sensor aggregation platforms that sample multiple analog sensors, perform digital filtering, and stream results over UART/SPI/CAN. With its hardware multiplier and DMA engine, the device can run moving-average and FIR filters on ADC streams without CPU intervention, freeing cycles for higher-level processing. The ECAN and dual-UART blocks provide redundant communication paths for safety-critical instrumentation, while the wide operating temperature range supports field-deployed instruments. The 100-pin TQFP package exposes enough I/O for multi-sensor daughterboards, and the 256 KB Flash hosts firmware image plus a bootloader for OTA-style firmware refresh.
Recommandé
Industrial HMI and Embedded Control
Human-machine interface (HMI) panels and embedded control modules benefit from the PIC24HJ256GP610A-H/PF's 40 MIPS throughput, which can drive SPI TFT displays, scan keypads, and handle ECAN/Modbus communications simultaneously. The 16 KB SRAM holds display framebuffers and protocol descriptors, while the 256 KB Flash accommodates full graphics libraries and Modbus stacks. The on-chip RTCC provides time-stamping for event logging, and the PWM outputs drive backlight dimming or buzzer tones. The TQFP-100 footprint is widely supported by industrial module vendors, enabling rapid design-in on standard carrier boards. AEC-Q100 qualification also lets the same hardware platform serve harsh-environment industrial HMIs.
Recommandé
Solar Inverter and Renewable Energy Control
Solar micro-inverters, string inverters, and charge controllers benefit from the PIC24HJ256GP610A-H/PF's 40 MIPS performance and rich PWM/ADC peripheral set, which together implement MPPT algorithms (Perturb & Observe, Incremental Conductance) and grid-synchronization loops. The AEC-Q100 qualification and -40C to +150C operating range ensure reliable operation in outdoor enclosure environments where ambient can exceed 70C inside sealed NEMA-rated boxes. 256 KB Flash hosts the grid-tie firmware and protection routines (over-current, anti-islanding per UL 1741), while 16 KB SRAM holds MPPT state variables and grid-synchronization PLL accumulators. ECAN enables parallel-string communication in large photovoltaic arrays.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour PIC24HJ256GP610A-H/PF — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | PIC24HJ256GP610A-I/PF | PIC24HJ256GP610A-E/PF | dsPIC33FJ256GP610A-H/PF | PIC24HJ128GP610A-H/PF | PIC24HJ256GP610A-I/PT | PIC24HJ256GP210A-H/PF |
|---|---|---|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | TQFP-100 (14x14) | TQFP-100 (14x14) - same | TQFP-100 (14x14) - same | TQFP-100 (14x14) - same | TQFP-100 (14x14) - same | TQFP-100 (12x12) - pin-compatible electrically | TQFP-100 (14x14) - same |
| Core Architecture | PIC24H 16-bit, 40 MIPS | PIC24H 16-bit, 40 MIPS | PIC24H 16-bit, 40 MIPS | dsPIC33F 16-bit + DSP, 40 MIPS | PIC24H 16-bit, 40 MIPS | PIC24H 16-bit, 40 MIPS | PIC24H 16-bit, 40 MIPS |
| Flash Memory | 256 KB | 256 KB | 256 KB | 256 KB | 128 KB (-50%) | 256 KB | 256 KB |
| SRAM | 16 KB | 16 KB | 16 KB | 16 KB | 8 KB (-50%) | 16 KB | 16 KB |
| Operating Temperature | -40C to +150C (H grade) | -40C to +85C (I grade) | -40C to +125C (E grade) | -40C to +150C (H grade) | -40C to +150C (H grade) | -40C to +85C (I grade) | -40C to +150C (H grade) |
| AEC-Q100 Qualified | Yes | Yes | Yes | Yes | Yes | Yes | Yes |
| DSP Engine | No | No | No | Yes (hardware MAC, dual 40-bit accumulators) | No | No | No |
Principaux différenciateurs
- Highest operating temperature grade in family (vs PIC24HJ256GP610A-I/PF)
- 256 KB Flash matches sub-family maximum (vs PIC24HJ128GP610A-H/PF)
- Same TQFP-100 pinout as dsPIC33F DSP variant (vs dsPIC33FJ256GP610A-H/PF)
Notes de conception
Estimated: At 40 MIPS core activity and 3.3 V supply, the PIC24HJ256GP610A-H/PF core I_DD is approximately 50-70 mA depending on peripheral use. Provide a low-noise 3.3 V LDO such as the MCP1755 (500 mA) or a switching regulator with adequate input/output capacitance. Decouple every VDD pin with a 0.1 uF ceramic placed within 5 mm of the pin, and place a bulk 4.7-10 uF tantalum or ceramic near the package. Tie all unused VDD pins to the supply, and all unused AVDD pins to the analog supply to ensure proper ADC operation.
The TQFP-100 (14x14 mm) package requires careful PCB layout to maintain signal integrity on the high-speed oscillator and ECAN lines. Route the crystal traces (OSC1/OSC2) as short as possible with guard traces to ground, and keep them away from switching power traces. Use a four-layer PCB with a dedicated ground plane under the MCU; the exposed thermal pad (where present on variants) must be soldered to a copper pour connected to VSS for thermal dissipation. Place the programming/debug header (PGECx/PGEDx) close to the MCU to allow reliable in-circuit debugging with MPLAB ICD 3 or PICkit 4.
Do not apply signals to any pin before VDD has reached its operating range; this can cause latch-up via the ESD protection diodes. The remappable peripheral pins (RPx) require the Peripheral Pin Select (PPS) registers to be configured in firmware before use - failing to do so leaves the pin in GPIO mode. When migrating from -I to -H grade, verify your application's ambient temperature does not exceed 85C, otherwise specify the -H grade from the start. For automotive designs, always use the AEC-Q100 qualified -H/PF variant rather than the industrial -I/PF.
Estimated: At maximum rated junction temperature of 150C and typical 50 mA active current at 3.3 V, the PIC24HJ256GP610A-H/PF dissipates 0.165 W. The TQFP-100 (14x14 mm) junction-to-ambient thermal resistance (theta_JA) is approximately 50 C/W on a standard 4-layer JEDEC test PCB, allowing operation at 150C junction with ambient up to ~138C. In practice, design for junction below 125C to maintain margin; add a thermal copper pour under the package connected to VSS to reduce theta_JA in still-air enclosures. For forced-air or sealed-box installations, derate further based on measured delta-JA.
Informations de conformité
AEC-Q100 qualified per Microchip product documentation. RoHS compliant per Microchip product page. REACH compliant per Microchip product page. Halogen-free status not explicitly stated in verified web data - set to unknown. Conflict minerals reporting compliant per Microchip policy.
