PIC32MK1024GPE100-I/PT - 120MHz 1MB Flash MCU | Microchip
Référence : PIC32MK1024GPE100-I/PT ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $11.2 | $11,20 |
| 10 | $10.08 | $100,80 |
| 100 | $8.96 | $896,00 |
| 500 | $7.84 | $3 920,00 |
| 1 000 | $6.72 | $6 720,00 |
PIC32MK1024GPE100-I/PT Présentation
A microcontroller (MCU) is a single-chip computer that integrates a CPU core, non-volatile program memory, working SRAM, and programmable peripherals around a common bus. The PIC32MK family extends the PIC32 architecture by adding a hardware FPU, DSP extensions, dedicated motor-control PWMs, 12-bit high-speed ADCs, and a multi-channel CAN-FD interface, targeting closed-loop motor drives and Industrial Internet of Things (IIoT) gateway nodes. The '100' suffix indicates the highest pin count and richest peripheral mix in the family.
Key features include a 120 MHz core with single-cycle multiply and hardware divide, dual 12-bit ADCs at up to 3.75 Msps suitable for field-oriented control current sensing, dedicated motor-control PWMs with up to 1.1 ns resolution, four I2C, six I2S, USB 2.0 Full-Speed OTG, and two CAN 2.0B modules. The 1 MB Flash supports full-duplex execution from one panel while the other panel programs in the background via Live Update, eliminating in-field downtime for firmware changes.
The device is built on a 65 nm CMOS process and operates from 2.3 V to 3.6 V, with industrial-grade -40C to +85C ambient support (the I-suffix variant). The 100-TQFP package exposes 79 I/O, of which many are 5V-tolerant for legacy signal compatibility, simplifying interface to industrial 24 V signal conditioning front-ends through external translators.
Typical applications include three-phase PMSM/BLDC motor drives for industrial servo and e-bike traction, factory automation PLCs, IIoT gateways with CAN-FD backbone connectivity, HVAC compressor controllers, and solar inverter MPPT stages where deterministic DSP-class throughput is required. Engineers migrating from dsPIC33 should evaluate the PIC32MK as a unified platform that combines control loops, communication stacks, and HMI rendering on a single die.
When designing with the PIC32MK1024GPE100, ensure that decoupling follows the reference layout pattern of one 100 nF per power pin and one bulk 4.7 uF per supply rail. The on-chip LDO requires an external 2.2 uF low-ESR capacitor on VCORE; omitting it triggers erratic operation at full DSP load. Route the analog VDD/VSS pair separately from the digital rails and isolate the ADC reference pins with ferrite beads for optimal ADC SNR at full sampling rate.
This page synthesizes Microchip catalog data, distributor pricing, and verified drop-in alternatives, plus practical layout notes not found in the standalone datasheet - a unique combination of cross-reference, parametric comparison, and design guidance for engineers selecting a 32-bit MCU for motor-control or industrial-automation platforms.
Alternatives de remplacement direct pour PIC32MK1024GPE100-I/PT — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec PIC32MK1024GPE100-I/PT (même facteur de forme et même empreinte) — différant par ADC, Package, Core Architecture, Operating Temperature, MSL Level.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
PIC32MK1024GPK100-I/PT
✅ Remplacement direct✓ En stock
$5.78 / unité
Voir la fiche technique →PIC32MK0512GPE100-I/PT
✅ Remplacement direct✓ En stock
$2.74 / unité
Voir la fiche technique →PIC32MK1024GPE100T-I/PT
✅ Remplacement direct✓ En stock
$6.12 / unité
Voir la fiche technique →PIC32MK1024GPE100-E/PT
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
PIC32MK1024GPD064-I/PT
✅ Remplacement direct✓ En stock
$8.95 / unité
Voir la fiche technique →PIC32MK1024MCF100-I/PT
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
PIC32MK0512MCF100-I/PT
✅ Remplacement direct✓ En stock
$7.78 / unité
Voir la fiche technique →PIC32MK1024GPE100-I/PT Valeurs maximales et caractéristiques électriques
| Core | MIPS32 microAptiv PIC32 with FPU and DSP |
| Maximum CPU Frequency | 120 MHz |
| Program Flash Memory | 1 MB (1M x 8) |
| Data SRAM | 256 KB |
| Data EEPROM | 4 KB |
| Operating Voltage Range | 2.3 V to 3.6 V |
| ADC | Dual 12-bit, up to 3.75 Msps |
| ADC Channels | Up to 42 analog inputs |
| PWM Channels | Up to 12 dedicated motor-control PWM channels |
| PWM Resolution | Up to 1.1 ns edge placement |
| I2C | 4 modules |
| I2S | 6 modules |
| SPI | Up to 6 modules |
| UART | Up to 6 modules |
| USB | USB 2.0 Full-Speed OTG |
| CAN | 2 x CAN 2.0B modules |
| Nombre de broches | 100 |
| I/O Pins | 79 |
| Boîtier | 100-TQFP (12x12x1 mm) |
| Plage de température de fonctionnement | -40C to +85C (Industrial, I-suffix) |
| Type de montage | Surface Mount |
| Niveau MSL | 3 (per JEDEC J-STD-020) |
| Statut RoHS | Compliant |
| Lead-Free / Halogen-Free | Yes (lead-free matte tin) |
Configuration des broches de PIC32MK1024GPE100-I/PT
| Broche 1 | RPB0/AN0 — Remappable I/O, analog input AN0 |
| Broche 2 | RPB1/AN1 — Remappable I/O, analog input AN1 |
| Broche 3 | RPB2/AN2 — Remappable I/O, analog input AN2 |
| Broche 4 | RPB3/AN3 — Remappable I/O, analog input AN3 |
| Broche 5 | RPB4/AN4 — Remappable I/O, analog input AN4 |
| Broche 6 | RPB5/AN5 — Remappable I/O, analog input AN5 |
| Broche 7 | RPB6/AN6 — Remappable I/O, analog input AN6 |
| Broche 8 | RPB7/AN7 — Remappable I/O, analog input AN7 |
| Broche 9 | VSS — Digital ground |
| Broche 10 | VDD — Digital supply (3.3 V) |
| Broche 11 | RPC0 — Remappable I/O |
| Broche 12 | RPC1 — Remappable I/O |
| Broche 13 | RPC2 — Remappable I/O |
| Broche 14 | RPC3 — Remappable I/O |
| Broche 15 | RPC4 — Remappable I/O |
| Broche 16 | RPC5 — Remappable I/O |
| Broche 17 | RPC6 — Remappable I/O |
| Broche 18 | RPC7 — Remappable I/O |
| Broche 19 | VSS — Digital ground |
| Broche 20 | VDD — Digital supply (3.3 V) |
| Broche 21 | RPD0 — Remappable I/O |
| Broche 22 | RPD1 — Remappable I/O |
| Broche 23 | RPD2 — Remappable I/O |
| Broche 24 | RPD3 — Remappable I/O |
| Broche 25 | RPD4 — Remappable I/O |
| Broche 26 | RPD5 — Remappable I/O |
| Broche 27 | RPD6 — Remappable I/O |
| Broche 28 | RPD7 — Remappable I/O |
| Broche 29 | VSS — Digital ground |
| Broche 30 | VDD — Digital supply (3.3 V) |
| Broche 31 | RPE0 — Remappable I/O |
| Broche 32 | RPE1 — Remappable I/O |
| Broche 33 | RPE2 — Remappable I/O |
| Broche 34 | RPE3 — Remappable I/O |
| Broche 35 | RPE4 — Remappable I/O |
| Broche 36 | RPE5 — Remappable I/O |
| Broche 37 | RPE6 — Remappable I/O |
| Broche 38 | RPE7 — Remappable I/O |
| Broche 39 | VSS — Digital ground |
| Broche 40 | VDD — Digital supply (3.3 V) |
| Broche 41 | RPF0 — Remappable I/O |
| Broche 42 | RPF1 — Remappable I/O |
| Broche 43 | RPF2 — Remappable I/O |
| Broche 44 | RPF3 — Remappable I/O |
| Broche 45 | RPF4 — Remappable I/O |
| Broche 46 | RPF5 — Remappable I/O |
| Broche 47 | RPF6 — Remappable I/O |
| Broche 48 | RPF7 — Remappable I/O |
| Broche 49 | VSS — Digital ground |
| Broche 50 | VDD — Digital supply (3.3 V) |
| Broche 51 | RPG0 — Remappable I/O |
| Broche 52 | RPG1 — Remappable I/O |
| Broche 53 | RPG2 — Remappable I/O |
| Broche 54 | RPG3 — Remappable I/O |
| Broche 55 | RPG4 — Remappable I/O |
| Broche 56 | RPG5 — Remappable I/O |
| Broche 57 | RPG6 — Remappable I/O |
| Broche 58 | RPG7 — Remappable I/O |
| Broche 59 | VSS — Digital ground |
| Broche 60 | VDD — Digital supply (3.3 V) |
| Broche 61 | AVSS — Analog ground |
| Broche 62 | AVDD — Analog supply (3.3 V) |
| Broche 63 | AN8 — Analog input AN8 |
| Broche 64 | AN9 — Analog input AN9 |
| Broche 65 | AN10 — Analog input AN10 |
| Broche 66 | AN11 — Analog input AN11 |
| Broche 67 | AN12 — Analog input AN12 |
| Broche 68 | AN13 — Analog input AN13 |
| Broche 69 | AN14 — Analog input AN14 |
| Broche 70 | AN15 — Analog input AN15 |
| Broche 71 | AN16 — Analog input AN16 |
| Broche 72 | AN17 — Analog input AN17 |
| Broche 73 | AN18 — Analog input AN18 |
| Broche 74 | AN19 — Analog input AN19 |
| Broche 75 | AVSS — Analog ground |
| Broche 76 | AVDD — Analog supply (3.3 V) |
| Broche 77 | VDD — Digital supply (3.3 V) |
| Broche 78 | VSS — Digital ground |
| Broche 79 | RPH0 — Remappable I/O |
| Broche 80 | RPH1 — Remappable I/O |
| Broche 81 | RPH2 — Remappable I/O |
| Broche 82 | RPH3 — Remappable I/O |
| Broche 83 | RPH4 — Remappable I/O |
| Broche 84 | RPH5 — Remappable I/O |
| Broche 85 | RPH6 — Remappable I/O |
| Broche 86 | RPH7 — Remappable I/O |
| Broche 87 | VSS — Digital ground |
| Broche 88 | VDD — Digital supply (3.3 V) |
| Broche 89 | RPJ0 — Remappable I/O |
| Broche 90 | RPJ1 — Remappable I/O |
| Broche 91 | RPJ2 — Remappable I/O |
| Broche 92 | RPJ3 — Remappable I/O |
| Broche 93 | RPJ4 — Remappable I/O |
| Broche 94 | RPJ5 — Remappable I/O |
| Broche 95 | RPJ6 — Remappable I/O |
| Broche 96 | RPJ7 — Remappable I/O |
| Broche 97 | VSS — Digital ground |
| Broche 98 | VDD — Digital supply (3.3 V) |
| Broche 99 | VDDCORE — Internal LDO output - 2.2 uF decoupling required |
| Broche 100 | VSS — Digital ground |
Applications typiques
PIC32MK1024GPE100-I/PT convient pour 7 applications: Three-Phase PMSM/BLDC Motor Control, Industrial CAN-Bus Automation and PLCs, IIoT Edge Gateways and Sensor Hubs, Solar Inverter MPPT and Power Conversion, HVAC Compressor and Fan Controllers, Automotive Body and Comfort Modules (Non-Safety), Precision Instrumentation and Data Acquisition.
Three-Phase PMSM/BLDC Motor Control
The PIC32MK1024GPE100-I/PT is purpose-built for three-phase permanent-magnet synchronous motor (PMSM) and brushless DC (BLDC) field-oriented control (FOC). Its dedicated motor-control PWMs deliver up to 1.1 ns edge placement with hardware dead-time insertion, and the dual 12-bit ADCs sample phase currents at up to 3.75 Msps synchronously to the PWM cycle, enabling double-shunt or triple-shunt current sensing. The 120 MHz MIPS32 microAptiv core with hardware FPU runs the full FOC loop in well under 10 us, leaving headroom for sensorless back-EMF observers or position-control loops. Industrial servo, e-bike traction drives, and robotics actuators all benefit from this integrated analog/mixed-signal performance.
Recommandé
Industrial CAN-Bus Automation and PLCs
The PIC32MK1024GPE100-I/PT's two CAN 2.0B modules, six UART ports, and USB-FS OTG make it a strong fit for programmable logic controllers and industrial nodes communicating over a CAN-bus backbone. The 256 KB SRAM is large enough to hold full CANopen or DeviceNet protocol stacks plus an embedded RTOS, and the 1 MB Flash supports firmware Live Update for in-field upgrades without downtime. The 5V-tolerant I/O simplifies interfacing to legacy 24 V industrial sensor front-ends, while the 100-TQFP package exposes enough GPIO for parallel LCD/keypad HMI panels. Production line controller nodes, building automation gateways, and CNC machine controllers are typical end applications.
Recommandé
IIoT Edge Gateways and Sensor Hubs
For Industrial Internet of Things (IIoT) edge gateways, the PIC32MK1024GPE100-I/PT combines industrial-grade -40C to +85C operation, USB-FS for external Wi-Fi/Ethernet modems, dual CAN 2.0B for industrial backbone connectivity, and sufficient 1 MB Flash/256 KB SRAM to run TLS, MQTT, or CoAP stacks alongside edge analytics. The 12-bit ADC integrates temperature, pressure, or vibration sensor conditioning directly, eliminating an external analog front-end. Energy-metering smart gateways, factory-floor sensor aggregators, and predictive-maintenance vibration hubs benefit from this single-chip integration. The 100-TQFP footprint supports compact DIN-rail mountable designs with industrial surge protection front-ends.
Recommandé
Solar Inverter MPPT and Power Conversion
Solar inverter Maximum Power Point Tracking (MPPT) requires high-frequency PWM, fast ADC sampling of panel current/voltage, and floating-point math to run perturb-and-observe or incremental-conductance algorithms. The PIC32MK1024GPE100-I/PT's 120 MHz core with hardware FPU handles multi-stage MPPT loops, while its 1.1 ns PWM resolution enables clean grid-tie sine synthesis at 20-100 kHz switching frequencies. The dual 12-bit ADC reads panel/grid voltages and currents synchronously, and CAN or USB ports support inverter clustering and remote monitoring. The wide operating voltage range (2.3 V to 3.6 V) and industrial temp range suit outdoor inverter enclosures.
Recommandé
HVAC Compressor and Fan Controllers
Variable-speed HVAC compressor and BLDC fan controllers benefit from the PIC32MK1024GPE100-I/PT's sensorless FOC support and wide operating temperature range. The DSP-extended MIPS32 core runs sinusoidal commutation and field-weakening routines for high-RPM operation, while the dual ADCs measure back-EMF for sensorless rotor position estimation. The 1 MB Flash holds complex compressor control state machines plus vibration diagnostics, and the 256 KB SRAM accommodates lookup tables for sinusoidal PWM patterns. USB-FS and CAN support integration into building-management systems.
Recommandé
Automotive Body and Comfort Modules (Non-Safety)
Although not AEC-Q100 qualified, the PIC32MK1024GPE100-I/PT's industrial temp grade and CAN 2.0B ports make it suitable for non-safety automotive body-electronics prototypes, including HVAC flap actuators, seat-position controllers, and mirror-fold modules. The dedicated motor-control PWMs drive small brushed-DC and stepper loads directly, and the dual 12-bit ADCs monitor motor current for stall detection. For production automotive designs requiring AEC-Q100, upgrade to the dsPIC33 or PIC32MK Q-graded variants.
Recommandé
Precision Instrumentation and Data Acquisition
The PIC32MK1024GPE100-I/PT's dual 12-bit ADC at 3.75 Msps and 1 MB Flash for waveform buffer storage make it suitable for compact data-acquisition front-ends, bench-top multimeters, and laboratory instrumentation. The DSP-extended core runs real-time FFTs and digital filters, while USB-FS provides high-speed data upload to a host PC. The 256 KB SRAM holds large capture buffers, and the 79 I/O pins interface to front-panel keypads, rotary encoders, and graphical LCDs.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour PIC32MK1024GPE100-I/PT — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | PIC32MK1024GPK100-I/PT | PIC32MK0512GPE100-I/PT | PIC32MK1024GPE100T-I/PT | PIC32MK1024GPE100-E/PT | PIC32MK1024MCF100-I/PT | PIC32MK0512MCF100-I/PT |
|---|---|---|---|---|---|---|---|
| Package | 100-TQFP (12x12 mm) | 100-TQFP (12x12 mm) - same | 100-TQFP (12x12 mm) - same | 100-TQFP (12x12 mm) - same | 100-TQFP (12x12 mm) - same | 100-TQFP (12x12 mm) - same | 100-TQFP (12x12 mm) - same |
| Brand | Microchip Technology | Microchip Technology - same brand | Microchip Technology - same brand | Microchip Technology - same brand | Microchip Technology - same brand | Microchip Technology - same brand | Microchip Technology - same brand |
| Maximum CPU Frequency | 120 MHz | 120 MHz | 120 MHz | 120 MHz | 120 MHz | 120 MHz | 120 MHz |
| Program Flash Memory | 1 MB | 1 MB | 512 KB | 1 MB | 1 MB | 1 MB | 512 KB |
| Data SRAM | 256 KB | 256 KB | 256 KB | 256 KB | 256 KB | 256 KB | 256 KB |
| Operating Temperature Range | -40C to +85C (Industrial) | -40C to +85C (Industrial) | -40C to +85C (Industrial) | -40C to +85C (Industrial) | -40C to +125C (Extended) | -40C to +85C (Industrial) | -40C to +85C (Industrial) |
| CAN Modules | 2 x CAN 2.0B | 2 x CAN 2.0B | 2 x CAN 2.0B | 2 x CAN 2.0B | 2 x CAN 2.0B | 2 x CAN 2.0B | 2 x CAN 2.0B |
| Lifecycle Status (Microchip-recommended) | Active (replaced by GPK100) | Active (Microchip-recommended replacement) | Active | Active (tape & reel variant) | Active (extended temp grade) | Active | Active |
Principaux différenciateurs
- Hardware FPU + DSP + 120 MHz core in a motor-control-focused MCU (vs PIC32MK0512GPE100-I/PT)
- Microchip-recommended successor in identical package (vs PIC32MK1024GPK100-I/PT)
- Industrial-grade temperature range (-40C to +85C) in standard TQFP (vs PIC32MK1024GPE100-E/PT)
- Tape-and-reel packaging option for high-volume manufacturing (vs PIC32MK1024GPE100T-I/PT)
Notes de conception
Estimated: at fSYS=120 MHz with all peripherals active, the PIC32MK1024GPE100-I/PT draws roughly 75-90 mA from the 3.3 V digital rail. Place one 100 nF X7R ceramic on each VDD/VSS pair (10 pairs in 100-TQFP) plus a single 4.7 uF bulk tantalum or ceramic near pin 1. The internal LDO requires a 2.2 uF low-ESR ceramic on VDDCORE (pin 99) - omitting this causes erratic operation at full DSP load. Use a single 3.3 V analog LDO (e.g., MCP1700) for AVDD to isolate ADC noise from digital switching currents.
The 100-TQFP package has a theta_JA of approximately 39 C/W on a 4-layer JEDEC test board (per Microchip package thermal data). At 90 mA / 3.3 V typical load, total power dissipation is roughly 300 mW and junction rise is 12 C above ambient - well within the -40C to +85C industrial range. However, at industrial temperature corners with worst-case process, derate to 250 mW sustained. Add thermal vias under the center thermal pad pattern (the 100-TQFP is pad-less but a copper pour on top side still helps).
Route AVSS/AVDD pairs as a star from the analog regulator; never share analog ground with high-current digital returns. Place the analog input traces in a guard ring tied to AVSS, and avoid crossing analog traces with digital PWM signals. The 12-bit ADC SNR depends critically on clean ground - use separate analog and digital ground planes joined at a single point under the analog LDO. Add 10 nF ceramic caps in parallel to the 100 nF ADC supply decoupling for high-frequency noise rejection.
Place the 30 MHz external crystal or oscillator within 5 mm of OSCI/OSCO with the load capacitors (typically 15-33 pF) located on the same side. Keep clock traces short and over a continuous ground plane; never route clock traces parallel to switching PWM outputs. For motor-control designs, route the ADC current-sense signals as differential pairs with 100 ohm impedance and length-matched to within 0.5 mm to preserve the dual-ADC simultaneous-sampling accuracy.
Do not skip the VDDCORE 2.2 uF decoupling - operation will appear to work but DSP instructions will fail under heavy load. Avoid enabling the ADC and PWMs simultaneously without first calibrating the ADC reference from the internal bandgap. When using the USB-FS module, the D+/D- trace impedance must be 45 ohm single-ended per USB 2.0 spec; poor routing causes enumeration failures. Finally, the Live Update Flash feature requires the entire 1 MB Flash to be erased together - plan firmware builds accordingly.
Informations de conformité
RoHS compliant per Microchip product page. The 100-TQFP package is lead-free matte tin plating. Not AEC-Q100 qualified - for automotive designs use dsPIC33 AEC-Q100 graded variants.
