PIC32MX110F016D-V/ML - 40MHz 32-bit MCU, 16KB Flash | Microchip
Référence : PIC32MX110F016D-V/ML ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $3.42 | $3,42 |
| 10 | $3.08 | $30,80 |
| 100 | $2.74 | $274,00 |
| 500 | $2.45 | $1 225,00 |
| 1 000 | $2.18 | $2 180,00 |
PIC32MX110F016D-V/ML Présentation
A microcontroller (MCU) is a single-chip computer that integrates a CPU core, program memory (Flash/ROM), working memory (SRAM), and a rich set of peripherals onto one silicon die. Within the broader taxonomy, the PIC32MX110F016D belongs to the PIC32MX1xx family of general-purpose 32-bit microcontrollers, which sits under Microchip's PIC32 family and ultimately under the MIPS-based MCU product line for embedded control. The 'D' suffix denotes an integrated Parallel Master Port (PMP) for graphics and external memory interfacing, while the 'V' temperature grade extends the operating range to -40C to +105C for industrial environments.
Key features include up to 21 general-purpose I/O pins with Peripheral Pin Select (PPS) remapping, two I2S/SPI modules for codec and audio interfacing, a Charge Time Measurement Unit (CTMU) for mTouch capacitive touch sensing, an RTCC, 3 analog comparators, and 4-channel DMA. The device consumes less than 0.5 mA/MHz active current and operates from 2.3 V to 3.6 V. Additional peripherals include five 16-bit timers, two UART modules, two I2C modules, and a 10-bit 1 Msps ADC.
Architecturally, the PIC32MX110F016D uses a Harvard-style MIPS32 M4K core with a 5-stage pipeline, single-cycle hardware multiply/divide, and a prefetch cache to maximize throughput from Flash. The result is deterministic interrupt response suitable for hard real-time control, while the integrated DMA engine offloads repetitive peripheral data movement from the CPU.
Typical applications include industrial control panels with capacitive touch, low-cost audio playback with I2S DACs, USB device nodes (via on-chip USB FS), graphical user interfaces using PMP, smart sensors, and home appliances. The integrated CTMU makes the part particularly attractive for cost-sensitive human-machine interfaces.
When designing with this device, ensure the exposed pad (EP) is soldered to a sufficient ground copper pour to meet thermal and electrical performance; verify PPS remapping against the device variant's pin map; and use MPLAB XC32 with the appropriate compiler license to unlock optimizations above -O1.
This page synthesizes current distributor pricing, verified drop-in alternatives from the same PIC32 family, and practical design notes that go beyond what the manufacturer datasheet alone offers.
Alternatives de remplacement direct pour PIC32MX110F016D-V/ML — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec PIC32MX110F016D-V/ML (même facteur de forme et même empreinte) — différant par Package, ADC, DMA Channels, Communication Peripherals, Operating Temperature Range.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
PIC32MX110F016DT-V/ML
✅ Remplacement direct✓ En stock
$1.39 / unité
Voir la fiche technique →PIC32MX210F016D-V/ML
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
PIC32MX110F016D-V/ML Valeurs maximales et caractéristiques électriques
| Core Architecture | MIPS32 M4K 32-bit RISC |
| Maximum CPU Clock | 40 MHz |
| Program Memory (Flash) | 16 KB (16K x 8) |
| Data Memory (SRAM) | 4 KB |
| Operating Voltage Range | 2.3 V to 3.6 V |
| Plage de température de fonctionnement | -40C to +105C (V grade) |
| I/O Pins | 21 |
| Boîtier | 44-pin QFN (ML) 8x8 mm with EP |
| Active Current Consumption | < 0.5 mA/MHz |
| ADC | 10-bit, up to 1 Msps |
| Timers | 5 x 16-bit |
| UART Modules | 2 |
| I2C Modules | 2 |
| SPI / I2S Modules | 2 |
| DMA Channels | 4 |
| Analog Comparators | 3 |
| CTMU (Capacitive Touch) | Yes (mTouch) |
| Parallel Master Port (PMP) | Yes |
| Peripheral Pin Select (PPS) | Yes |
| RTCC | Yes |
| Type de montage | Surface Mount |
| Statut RoHS | Compliant |
Configuration des broches de PIC32MX110F016D-V/ML
| Broche 1 | RP5/RB5/OC2/IC5/PMD5 — Remappable I/O, Output Compare 2, Input Capture 5, PMP data 5 |
| Broche 2 | RP6/RB6/IC4/PMD6 — Remappable I/O, Input Capture 4, PMP data 6 |
| Broche 3 | RP7/RB7/IC3/PMD7 — Remappable I/O, Input Capture 3, PMP data 7 |
| Broche 4 | RA0/TMS — General I/O, JTAG Test Mode Select |
| Broche 5 | RA1/TCK — General I/O, JTAG Test Clock |
| Broche 6 | VDD — Positive supply voltage |
| Broche 7 | VSS — Ground reference |
| Broche 8 | RA2/SCL2 — General I/O, I2C2 clock |
| Broche 9 | RA3/SDA2 — General I/O, I2C2 data |
| Broche 10 | RA4/TDI — General I/O, JTAG Test Data In |
| Broche 11 | RA5/TDO — General I/O, JTAG Test Data Out |
| Broche 12 | RA6 — General I/O |
| Broche 13 | RA7 — General I/O |
| Broche 14 | RB0/PGED1 — General I/O, ICSP programming clock |
| Broche 15 | RB1/PGEC1 — General I/O, ICSP programming data |
| Broche 16 | RB2/SDA1 — General I/O, I2C1 data |
| Broche 17 | RB3/SCL1 — General I/O, I2C1 clock |
| Broche 18 | RB4/SDA2/PMWR — Remappable I/O, I2C2 data, PMP write strobe |
| Broche 19 | RA8 — General I/O |
| Broche 20 | RA9 — General I/O |
| Broche 21 | RA10 — General I/O |
| Broche 22 | VDD — Positive supply voltage |
| Broche 23 | VSS — Ground reference |
| Broche 24 | RB8/IC1 — Remappable I/O, Input Capture 1 |
| Broche 25 | RB9/IC2 — Remappable I/O, Input Capture 2 |
| Broche 26 | RB10/IC3 — Remappable I/O, Input Capture 3 |
| Broche 27 | RB11 — General I/O |
| Broche 28 | RC1 — General I/O |
| Broche 29 | RC2 — General I/O |
| Broche 30 | RC3 — General I/O |
| Broche 31 | RC4 — General I/O |
| Broche 32 | VDD — Positive supply voltage |
| Broche 33 | VSS — Ground reference |
| Broche 34 | RC5/OC1 — General I/O, Output Compare 1 |
| Broche 35 | RC6/OC2 — General I/O, Output Compare 2 |
| Broche 36 | RC7/OC3 — General I/O, Output Compare 3 |
| Broche 37 | RC8/OC4 — General I/O, Output Compare 4 |
| Broche 38 | RC9/OC5 — General I/O, Output Compare 5 |
| Broche 39 | RG2/D+ — USB Full-Speed D+ line |
| Broche 40 | RG3/D- — USB Full-Speed D- line |
| Broche 41 | RB12 — General I/O |
| Broche 42 | RB13 — General I/O |
| Broche 43 | RB14 — General I/O |
| Broche 44 | RB15/PMCS1 — Remappable I/O, PMP Chip Select 1 |
Applications typiques
PIC32MX110F016D-V/ML convient pour 6 applications: Industrial HMI with mTouch Capacitive Buttons, Low-Cost USB Audio Device (Speaker/Headset), Graphical User Interface with PMP-driven LCD, USB Smart Sensor Hub (Industrial IoT Edge Node), Home Appliance Motor Control (Low-Volume BLDC/PWM), Portable Medical Accessory (USB-connected).
Industrial HMI with mTouch Capacitive Buttons
The PIC32MX110F016D-V/ML's integrated Charge Time Measurement Unit (CTMU) and 32-bit MIPS performance make it ideal for industrial human-machine interface panels with capacitive touch buttons and sliders. CTMU hardware measures capacitance changes directly, offloading the CPU and allowing reliable touch detection on 10+ electrodes in noisy industrial environments. The device's -40C to +105C operating range and 21 GPIOs (with Peripheral Pin Select remapping) support multiple LEDs, buzzer PWM, and segmented LCD via PMP. A typical design uses MPLAB Harmony's mTouch library, achieving IEC 61000-4-6 noise-immune touch performance.
Recommandé
Low-Cost USB Audio Device (Speaker/Headset)
The PIC32MX110F016D-V/ML's integrated USB 2.0 Full-Speed device controller plus dual I2S/SSI modules enables single-chip USB audio class (UAC) implementations for low-cost speakers and headsets. The 40 MHz MIPS32 M4K core handles 48 kHz stereo audio with minimal CPU loading (~30% headroom), while DMA channels move I2S samples without CPU intervention. Microchip's USB audio framework under MPLAB Harmony provides ready-made descriptors and driver glue, reducing firmware development time. The V-temperature grade supports thermal envelopes of enclosed audio peripherals, and the 16 KB Flash accommodates a USB stack + audio processing.
Recommandé
Graphical User Interface with PMP-driven LCD
The PIC32MX110F016D-V/ML's integrated Parallel Master Port (PMP) drives small parallel TFT or OLED displays (up to 8-bit data bus) without an external graphics controller, slashing BOM cost for menu-driven appliances and portable instruments. The MIPS32 core can refresh a QVGA (320x240) framebuffer over PMP at >30 Hz while leaving cycles for application logic. The 4 KB SRAM accommodates small framebuffers and double-buffering is achieved via DMA ping-pong. Designers can use Microchip's MPLAB Harmony Graphics Composer or third-party LVGL to draw menus and gauges.
Recommandé
USB Smart Sensor Hub (Industrial IoT Edge Node)
For USB-attached industrial sensor hubs, the PIC32MX110F016D-V/ML serves as the bridge between external sensors (via I2C, SPI, UART, or analog via the 10-bit ADC) and a USB host. The 4-channel DMA engine streams data from SPI sensors directly to the USB endpoint, offloading the CPU. The CTMU can also drive precision temperature measurement by measuring the discharge of an RC network. The -40C to +105C operating range and industrial peripherals (3 comparators for fault detection) make it a robust front-end.
Recommandé
Home Appliance Motor Control (Low-Volume BLDC/PWM)
The PIC32MX110F016D-V/ML's five 16-bit timers with PWM output, three analog comparators for back-EMF sensing, and 40 MHz core are sufficient for low-volume BLDC or single-phase appliance motor control (fan, pump, small drive). Peripheral Pin Select (PPS) routes comparator outputs and PWM outputs to any GPIO, simplifying PCB layout. The -40C to +105C V grade suits appliance thermal environments, and 4 KB SRAM accommodates small state machines plus sensored trapezoidal commutation.
Recommandé
Portable Medical Accessory (USB-connected)
The PIC32MX110F016D-V/ML's USB Full-Speed device, low-power modes (sleep and idle), and 10-bit ADC make it suitable for USB-connected portable medical accessories such as pulse oximeter front-ends, single-channel ECG patches, or spirometer sensors. The MIPS32 core processes 1 Msps ADC data into filtered vital-sign data, and DMA offloads the USB endpoint. Combined with low quiescent current in sleep, the device enables battery-friendly designs when tethered to a host for both data and power.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour PIC32MX110F016D-V/ML — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | PIC32MX110F016DT-V/ML | PIC32MX210F016D-V/ML | PIC32MX110F016CT-V/TL |
|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 44-pin QFN (ML) 8x8 mm | 44-pin QFN (ML) 8x8 mm - same | 44-pin QFN (ML) 8x8 mm - same | 36-pin VTLA (TL) 6x6 mm - different |
| Core | MIPS32 M4K 32-bit | MIPS32 M4K 32-bit | MIPS32 M4K 32-bit | MIPS32 M4K 32-bit |
| Max CPU Clock | 40 MHz | 40 MHz | 50 MHz | 40 MHz |
| Flash | 16 KB | 16 KB | 16 KB | 16 KB |
| SRAM | 4 KB | 4 KB | 4 KB | 4 KB |
| USB | USB FS device (no bootloader) | USB FS device + bootloader pre-installed | USB FS device + CAN | USB FS device (no bootloader) |
| Operating Temperature | -40C to +105C (V grade) | -40C to +105C (V grade) | -40C to +105C (V grade) | -40C to +105C (V grade) |
| Pricing (1 pc, as of 2026-10-01) | $3.42 | $3.55 - $3.80 | $4.10 - $4.45 | $3.30 - $3.60 |
Principaux différenciateurs
- USB Full-Speed device with CTMU capacitive touch in a single chip (vs PIC32MM0064GPL028-I/SS)
- Drop-in upgrade with same QFN-44 footprint and pinout (vs PIC32MX210F016D-V/ML)
- Industrial V-grade (-40C to +105C) versus commercial-only CTMU PIC (vs PIC32MX110F016B-I/SP)
Notes de conception
Solder the exposed thermal pad (EP) of the 44-pin QFN to a continuous ground copper pour with at least 6 thermal vias (0.3 mm drill, 0.6 mm pad) to the inner ground plane. This pad is the primary heat-dissipation path; an unsoldered pad increases junction-to-ambient thermal resistance by ~30% and can degrade high-speed USB signal integrity by creating ground-bounce.
Place 0.1 uF ceramic decoupling capacitors on each VDD pin (pins 6, 25, 32, 44) within 3 mm trace length. Add a single 4.7 uF bulk capacitor near the device. The PIC32MX110F016D's low <0.5 mA/MHz active current means total active draw stays under 25 mA, so a single TPS7A4701-type LDO is sufficient; avoid shared ferrite beads with RF circuitry.
Route the USB D+/D- differential pair (RG2/RG3, pins 39/40) as a 90-ohm differential with matched lengths (<2 mm skew) and an unbroken ground plane beneath. Place the 15 kohm USB pull-down on D- (or pull-up on D+ for device mode) within 5 mm of the pins. Use Microchip's USB checklist to validate eye diagram compliance for Full-Speed signaling.
Do not rely on default Peripheral Pin Select (PPS) mappings when migrating firmware across PIC32MX1xx variants - peripheral-to-pin mappings differ across package options and silicon revisions. Always lock PPS pins via CFGCON before enabling interrupts. Also note that JTAG pins (TMS/TCK/TDO/TDI on RA0-RA5) are repurposed after programming; add 10 kohm pull-ups to prevent floating inputs.
Estimated: at 40 MHz active current of 20 mA total from 3.3 V, the device dissipates ~66 mW. The QFN-44 (ML) 8x8 mm has theta_JA around 28 C/W on a 4-layer JEDEC JESD51-7 test board with soldered EP, giving a junction temperature rise of only ~2C above ambient - well within the +105C rating. No heatsink is required.
Informations de conformité
RoHS and REACH compliant per Microchip product declaration. V temperature grade is -40C to +105C industrial; not AEC-Q100 qualified - choose PIC32MX110F016D-40V/ML for automotive.
