PIC32MX130F256DT-I/ML - 40MHz 256KB Flash MCU | Microchip 32-bit
Référence : PIC32MX130F256DT-I/ML ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $5.96 | $5,96 |
| 10 | $5.42 | $54,20 |
| 100 | $4.87 | $487,00 |
| 500 | $4.35 | $2 175,00 |
| 1 000 | $3.95 | $3 950,00 |
PIC32MX130F256DT-I/ML Présentation
A PIC32MX microcontroller is a 32-bit RISC MCU built on the MIPS M4K core that combines the simplicity of an 8-bit PIC with the throughput of a 32-bit processor. It belongs to the broader hierarchy MCU -> microcontroller -> embedded processor -> semiconductor, and integrates Flash program memory, SRAM, multiple timers, ADC, communication peripherals (UART, SPI/I2S, I2C), and Peripheral Pin Select (PPS) routing onto a single die. The Low-Power variant (LP) is also referred to as the LP MCU, while the standard part is sometimes called the GP MCU.
Key features include 256 KB (256K x 8) Flash, 16 KB SRAM, up to 40 MHz operation with 50 DMIPS throughput, 0.5 mA/MHz typical active current, 10-bit 1 Msps ADC, two I2S/SPI modules for codec interfaces, and PPS for flexible pin function remapping. A 5-bit / 32-bit Parallel Master Port (PMP) supports graphics interfaces, while on-chip temperature measurement and 1 ns high-resolution time measurement simplify sensing and timing applications.
The PIC32MX130F256DT-I/ML uses a 5-stage pipelined MIPS32 M4K architecture with hardware multiply/divide, single-cycle 32-bit ALU operations, and tightly coupled peripherals for deterministic I/O. This gives the part its 1.57 DMIPS/MHz figure while keeping interrupt latency low enough for hard-real-time control loops.
Typical applications include low-cost embedded control, USB device/host bridges using external PHYs, mTouch capacitive touch sensing, 16-bit stereo audio with external CODEC, and low-power wireless sensor nodes. Its PPS feature is particularly valuable when multiple peripherals must be routed to a fixed PCB footprint without redesign.
When designing with this device, verify the 44-QFN (8x8) land pattern and exposed pad are correctly soldered; thermal pad connection to the internal ground plane is critical for power dissipation. Decoupling capacitors must be placed within 3 mm of each supply pin to meet the 1 Msps ADC noise floor.
This page synthesizes distributor pricing, drop-in same-family alternatives, and practical design considerations not consolidated in the manufacturer datasheet, helping engineers select the correct tape-and-reel variant of the PIC32MX130F256D family for production.
Alternatives de remplacement direct pour PIC32MX130F256DT-I/ML — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec PIC32MX130F256DT-I/ML (même facteur de forme et même empreinte) — différant par Package, Operating Temperature, ADC, Core, SRAM.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
PIC32MX130F256D-I/ML
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
PIC32MX130F256DT-50I/ML
✅ Remplacement direct✓ En stock
$2.55 / unité
Voir la fiche technique →PIC32MX130F256B-I/ML
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
$4.12 / unité
Voir la fiche technique →PIC32MX130F256BT-I/ML
✅ Remplacement direct✓ En stock
$3.65 / unité
Voir la fiche technique →PIC32MX130F256DT-I/ML Valeurs maximales et caractéristiques électriques
| Core Architecture | MIPS32 M4K |
| Largeur du bus de données | 32-bit |
| Maximum CPU Frequency | 40 MHz |
| DMIPS Performance | 50 DMIPS |
| Program Memory (Flash) | 256 KB (256K x 8) |
| SRAM | 16 KB |
| Operating Voltage Range | 2.5 V / 3.3 V |
| Active Current (Typical) | 0.5 mA/MHz |
| ADC | 10-bit, 1 Msps |
| I2S/SPI Modules | 2 |
| Peripheral Pin Select (PPS) | Yes |
| Parallel Master Port (PMP) | Yes |
| mTouch Capacitive Touch | Supported |
| High-Resolution Time Measurement | 1 ns |
| On-chip Temperature Sensor | Yes |
| Boîtier | 44-QFN (8x8 mm) with exposed pad |
| Type de montage | Surface Mount |
| Température de fonctionnement | -40C to +85C (Industrial) |
| Lead-Free / RoHS | Yes (per part number suffix) |
Configuration des broches de PIC32MX130F256DT-I/ML
| Broche 1 | RB9 — Port B bit 9 (PPS-capable I/O) |
| Broche 2 | RB10 — Port B bit 10 (PPS-capable I/O) |
| Broche 3 | RB11 — Port B bit 11 (PPS-capable I/O) |
| Broche 4 | RB12 — Port B bit 12 (PPS-capable I/O) |
| Broche 5 | RB13 — Port B bit 13 (PPS-capable I/O) |
| Broche 6 | RB14 — Port B bit 14 (PPS-capable I/O) |
| Broche 7 | RB15 — Port B bit 15 (PPS-capable I/O) |
| Broche 8 | VSS — Ground |
| Broche 9 | VDD — Core supply voltage |
| Broche 10 | RA0 — Port A bit 0 |
| Broche 11 | RA1 — Port A bit 1 |
| Broche 12 | RA2 — Port A bit 2 |
| Broche 13 | RA3 — Port A bit 3 |
| Broche 14 | RA4 — Port A bit 4 |
| Broche 15 | RA5 — Port A bit 5 |
| Broche 16 | RA6 — Port A bit 6 |
| Broche 17 | RA7 — Port A bit 7 |
| Broche 18 | VSS — Ground |
| Broche 19 | VDD — Core supply voltage |
| Broche 20 | RB0 — Port B bit 0 (PPS-capable I/O) |
| Broche 21 | RB1 — Port B bit 1 (PPS-capable I/O) |
| Broche 22 | RB2 — Port B bit 2 (PPS-capable I/O) |
| Broche 23 | RB3 — Port B bit 3 (PPS-capable I/O) |
| Broche 24 | RB4 — Port B bit 4 (PPS-capable I/O) |
| Broche 25 | RB5 — Port B bit 5 (PPS-capable I/O) |
| Broche 26 | RB6 — Port B bit 6 (PPS-capable I/O) |
| Broche 27 | RB7 — Port B bit 7 (PPS-capable I/O) |
| Broche 28 | RB8 — Port B bit 8 (PPS-capable I/O) |
| Broche 29 | VSS — Ground |
| Broche 30 | VDD — Core supply voltage |
| Broche 31 | RC0 — Port C bit 0 |
| Broche 32 | RC1 — Port C bit 1 |
| Broche 33 | RC2 — Port C bit 2 |
| Broche 34 | RC3 — Port C bit 3 |
| Broche 35 | RC4 — Port C bit 4 |
| Broche 36 | RC5 — Port C bit 5 |
| Broche 37 | RC6 — Port C bit 6 |
| Broche 38 | RC7 — Port C bit 7 |
| Broche 39 | RC8 — Port C bit 8 |
| Broche 40 | RC9 — Port C bit 9 |
| Broche 41 | OSC1 — Crystal oscillator input |
| Broche 42 | OSC2 — Crystal oscillator output |
| Broche 43 | MCLR — Master clear (reset) input |
| Broche 44 | VSS — Ground (exposed pad - thermal/electrical) |
Applications typiques
PIC32MX130F256DT-I/ML convient pour 6 applications: Low-Cost 32-bit Embedded Control, mTouch Capacitive Touch Sensing, 16-bit Stereo Audio with External CODEC, Graphics Interface via Parallel Master Port, Low-Power Wireless Sensor Nodes, Industrial Control and HMI.
Low-Cost 32-bit Embedded Control
The PIC32MX130F256DT-I/ML is a strong fit for cost-sensitive 32-bit embedded control because it combines a 40 MHz MIPS32 M4K core delivering 50 DMIPS with only 0.5 mA/MHz active current. Its 256 KB Flash and 16 KB SRAM accommodate moderate firmware sizes typical of motor-control, HVAC, and small appliance controllers. The 44-QFN 8x8 package is footprint-compatible with the PIC32MX1xx/2xx/5xx family, simplifying PCB reuse across product variants.
Recommandé
mTouch Capacitive Touch Sensing
The PIC32MX130F256DT-I/ML supports Microchip's mTouch capacitive touch buttons and sliders through dedicated hardware charge-time measurement, freeing the CPU from intensive scanning. With 1 ns high-resolution time measurement, the part achieves reliable touch discrimination even in noisy industrial environments. Its low 0.5 mA/MHz active current allows touch-enabled appliances to remain in low-power standby while scanning sensors.
Recommandé
16-bit Stereo Audio with External CODEC
The PIC32MX130F256DT-I/ML integrates two I2S/SPI modules that interface directly with external 16/24-bit audio CODECs, making it suitable for stereo audio playback, voice recorders, and intercom systems. The 256 KB Flash can hold compressed audio assets, while DMA-driven I2S transfers minimize CPU overhead. Its 50 DMIPS performance comfortably runs lightweight audio decoders such as ADPCM in real time without audible artifacts.
Recommandé
Graphics Interface via Parallel Master Port
The PIC32MX130F256DT-I/ML's Parallel Master Port (PMP) connects directly to small TFT or OLED displays with 8/16-bit parallel buses, supporting graphical user interfaces on appliances, instruments, and industrial HMIs. The 50 DMIPS throughput handles frame-buffer updates smoothly, while 256 KB Flash stores fonts, icons, and bitmaps. Peripheral Pin Select simplifies routing PMP signals when adding other peripherals like UART debug ports.
Recommandé
Low-Power Wireless Sensor Nodes
The PIC32MX130F256DT-I/ML pairs well with external sub-GHz or 2.4 GHz transceivers for battery-powered wireless sensor nodes. Its 0.5 mA/MHz active current and multiple low-power sleep modes extend battery life, while the 10-bit ADC and on-chip temperature sensor handle a variety of analog sensor inputs. PPS allows flexible routing of SPI to the radio without remapping PCB traces.
Recommandé
Industrial Control and HMI
The PIC32MX130F256DT-I/ML's 50 DMIPS MIPS32 M4K core, 10-bit 1 Msps ADC, and PPS-driven peripherals make it well-suited to industrial control panels and small HMIs. It supports real-time control loops while driving a graphics display via PMP, and its industrial -40C to +85C temperature range qualifies it for factory automation enclosures. The 44-QFN exposed pad provides robust thermal dissipation for continuous operation.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour PIC32MX130F256DT-I/ML — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | PIC32MX130F256D-I/ML | PIC32MX130F256DT-50I/ML | PIC32MX130F256B-I/ML |
|---|---|---|---|---|
| Package | 44-QFN (8x8) with exposed pad | 44-QFN (8x8) - same | 44-QFN (8x8) - same | 44-QFN (8x8) - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Max CPU Frequency | 40 MHz | 40 MHz - same | 50 MHz (+25%) | 40 MHz - same |
| Flash Memory | 256 KB | 256 KB - same | 256 KB - same | 256 KB - same |
| SRAM | 16 KB | 16 KB - same | 16 KB - same | 16 KB - same |
| Packaging Form | Tape & Reel (T suffix) | Tray (no T suffix) | Tape & Reel - same form | Tray |
| Operating Temperature | -40C to +85C (Industrial) | -40C to +85C - same | -40C to +85C - same | -40C to +85C - same |
| USB Controller | No | No - same | No - same | No - same |
| Pinout/Peripheral Mix | D-revision (full PPS, PMP) | D-revision - identical | D-revision - identical | B-revision (reduced peripherals) |
Principaux différenciateurs
- Tape-and-reel form for high-volume assembly (vs PIC32MX130F256D-I/ML)
- 40 MHz CPU with full D-revision peripherals (vs PIC32MX130F256B-I/ML)
- Industrial -40C to +85C qualification (vs PIC32MX130F128HT-I/MR)
Notes de conception
The 44-QFN package's exposed thermal pad (pin 44 / EP) must be soldered to a ground copper pour of at least 1 sq inch to meet thermal and electrical specifications. Missing the EP connection degrades ADC performance and may cause reliability failures. Per Microchip guidelines, place 0.1 uF decoupling capacitors within 3 mm of every VDD/VSS pair (the part has three VDD/VSS pairs).
Do not assume the PIC32MX130F256DT-I/ML includes a USB peripheral - it does not. Engineers migrating from PIC32MX2xx must remove all USB stack code and repurpose the pins via PPS. Also note the -DT variant (40 MHz) versus -D-50T variant (50 MHz); firmware configured for 50 MHz PBCLK dividers will overrun on the -DT part and must be retuned at compile time.
At 40 MHz full operation, the PIC32MX130F256DT-I/ML consumes approximately 20 mA active (0.5 mA/MHz typical). Use a low-dropout regulator with at least 100 mA headroom and a ferrite bead on VDD to suppress digital switching noise from coupling into the 10-bit ADC. Sleep current drops to <2 mA with peripherals off, enabling battery-powered designs when paired with RTCC.
Per Microchip's PIC32MX hardware design checklist, route the 8 MHz primary oscillator traces short (<5 mm) and guard them with a ground ring to reduce EMI. Place the crystal within 5 mm of OSC1/OSC2. PPS re-mapping is software-only - it does not relax PCB layout rules, so high-frequency signals should still be routed as short and direct as possible.
Informations de conformité
RoHS and REACH compliant per Microchip product environmental compliance information. Not AEC-Q100 qualified (industrial -40C to +85C grade only). For automotive variants, refer to PIC32MX1xx automotive grade parts.
