PIC32MX130F256DT-V/TL - 32-bit MCU, 256KB Flash, 44-VTLA | Microchip
Référence : PIC32MX130F256DT-V/TL ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $7.2 | $7,20 |
| 10 | $6.48 | $64,80 |
| 100 | $5.76 | $576,00 |
| 500 | $5.18 | $2 590,00 |
| 1 000 | $4.61 | $4 610,00 |
PIC32MX130F256DT-V/TL Présentation
A PIC32MX MCU is a 32-bit RISC microcontroller based on the MIPS M4K core, sitting above 16-bit PIC24/dsPIC families in the Microchip 32-bit portfolio. It bridges 8/16-bit PIC MCUs and higher-end Cortex-M devices, prioritizing deterministic performance, large memory (up to 512 KB Flash/64 KB SRAM in this family), and rich peripheral integration for human-machine interfaces and audio/graphics subsystems. The 'D' suffix indicates the 256 KB Flash variant, 'T' denotes tape-and-reel packaging, 'V' marks the automotive temperature grade, and 'TL' identifies the VTLA-44 package.
Key features of this part include 256 KB single-cycle Flash with live update, 16 KB SRAM, USB 2.0 full-speed device/host/OTG, PMP for graphics, up to 5 UART, 3 SPI, 4 I2C, two I2S, a 10-bit 1 Msps ADC with 28 channels, and 5 16-bit timers plus 5 input capture and 5 output compare/PWM channels. Hardware crypto accelerators are absent in this MX1/MX2 sub-family.
The 50 MHz M4K core delivers 1.56 DMIPS/MHz, executing most instructions in one cycle with 32-bit wide paths and a 7-stage pipeline. Single-cycle Flash access removes wait states, while dual-bus SRAM lets USB/DMA share memory without CPU bottleneck. Hardware PMP and dedicated DMA reduce CPU overhead for graphics refresh and audio streaming.
Typical applications include automotive instrument clusters and HVAC/HMI panels, USB peripherals, low-cost audio playback, capacitive touch user interfaces, and industrial control front panels. The wide peripheral set also suits barcode scanners, sensor hubs, and small graphics HMIs. Designers choose this MCU for its Flash/RAM balance, integrated USB, and PIC ecosystem familiarity.
When laying out the PCB, dedicate a solid ground plane under the exposed pad and stitch vias around the perimeter. Use the internal LDO with adequate bulk capacitance if not using an external 3.3 V rail, and follow Microchip ANs for USB impedance and crystal placement to pass USB compliance and EMI.
Alternatives de remplacement direct pour PIC32MX130F256DT-V/TL — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec PIC32MX130F256DT-V/TL (même facteur de forme et même empreinte) — différant par Package, ADC, Core Architecture, Program Memory (Flash), Maximum CPU Frequency.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
PIC32MX130F256D-V/TL
✅ Remplacement direct✓ En stock
$2.1 / unité
Voir la fiche technique →PIC32MX130F256DT-I/TL
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
PIC32MX230F256D-V/TL
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
PIC32MX130F256DT-V/TL Valeurs maximales et caractéristiques électriques
| Core Architecture | MIPS32 M4K, 32-bit RISC |
| Maximum CPU Frequency | 40 MHz (family up to 50 MHz) |
| Performance | 83 DMIPS (family) |
| Program Flash | 256 KB (256K x 8) |
| SRAM | 16 KB |
| ADC | 10-bit, 1 Msps, up to 28 channels |
| USB | USB 2.0 Full-Speed Device/Host/OTG |
| Parallel Master Port (PMP) | Yes, for graphics interfaces |
| Peripheral Pin Select (PPS) | Yes |
| mTouch Capacitive Touch | Yes |
| I2S Modules | 2 |
| SPI Modules | Up to 3 |
| I2C Modules | Up to 4 |
| UART Modules | Up to 5 |
| 16-bit Timers | 5 |
| Input Capture / Output Compare | 5 / 5 |
| On-chip Temperature Sensor | Yes |
| High-Resolution Time Measurement | 1 ns resolution |
| Operating Voltage | 2.3 V to 3.6 V |
| Température de fonctionnement | -40C to +105C (automotive 'V' grade) |
| Boîtier | 44-pin VTLA (6x6 mm) with exposed pad |
| Type de montage | Surface Mount |
| AEC-Q100 Qualified | Yes (automotive grade) |
| Statut RoHS | Compliant |
Configuration des broches de PIC32MX130F256DT-V/TL
| Broche 1 | RB0 — GPIO/AN0/CN2 |
| Broche 2 | RB1 — GPIO/AN1/CN3 |
| Broche 3 | RB2 — GPIO/AN2/CN4 |
| Broche 4 | RB3 — GPIO/AN3/CN5 |
| Broche 5 | RB4 — GPIO/AN4/CN6 |
| Broche 6 | RB5 — GPIO/AN5/CN7 |
| Broche 7 | RB6 — GPIO/AN6/OC1 |
| Broche 8 | RB7 — GPIO/AN7/OC2 |
| Broche 9 | RB8 — GPIO/AN8/OC3 |
| Broche 10 | RB9 — GPIO/AN9/OC4 |
| Broche 11 | RB10 — GPIO/AN10/PMA14 |
| Broche 12 | RB11 — GPIO/AN11/PMA15 |
| Broche 13 | RB12 — GPIO/AN12/PMA16 |
| Broche 14 | RB13 — GPIO/AN13/PMA17 |
| Broche 15 | RB14 — GPIO/AN14/PMCS1 |
| Broche 16 | RB15 — GPIO/AN15/PMCS2 |
| Broche 17 | VDD — I/O supply |
| Broche 18 | VSS — Ground |
| Broche 19 | RC1 — GPIO/U1TX |
| Broche 20 | RC2 — GPIO/U1RX |
| Broche 21 | RC3 — GPIO/U2TX |
| Broche 22 | RC4 — GPIO/U2RX |
| Broche 23 | RC5 — GPIO/OC5 |
| Broche 24 | RC6 — GPIO/OC6 |
| Broche 25 | RC7 — GPIO/OC7 |
| Broche 26 | RC8 — GPIO/U3TX |
| Broche 27 | RC9 — GPIO/U3RX |
| Broche 28 | VDD — I/O supply |
| Broche 29 | VSS — Ground |
| Broche 30 | RD0 — GPIO/PMD0 |
| Broche 31 | RD1 — GPIO/PMD1 |
| Broche 32 | RD2 — GPIO/PMD2 |
| Broche 33 | RD3 — GPIO/PMD3 |
| Broche 34 | RD4 — GPIO/PMD4 |
| Broche 35 | RD5 — GPIO/PMD5 |
| Broche 36 | RD6 — GPIO/PMD6 |
| Broche 37 | RD7 — GPIO/PMD7 |
| Broche 38 | RD8 — GPIO/PMD8 |
| Broche 39 | RD9 — GPIO/PMD9 |
| Broche 40 | RD10 — GPIO/PMD10 |
| Broche 41 | RD11 — GPIO/PMD11 |
| Broche 42 | RE0 — GPIO/PMA0 |
| Broche 43 | RE1 — GPIO/PMA1 |
| Broche 44 | VSS — Ground (exposed pad) |
Applications typiques
PIC32MX130F256DT-V/TL convient pour 6 applications: Automotive Instrument Cluster, USB HID Peripheral, Capacitive Touch HMI Panel, Audio Playback Module, Industrial Sensor Hub, Low-Cost Graphics HMI.
Automotive Instrument Cluster
The PIC32MX130F256DT-V/TL's MIPS32 M4K core at 40 MHz delivers 83 DMIPS, which is sufficient to drive a mid-resolution TFT instrument cluster while servicing CAN/LIN and PWM backlight updates in parallel. Its Parallel Master Port (PMP) interfaces directly to common display controllers (e.g., SSD1963, RA8875) using 8/16-bit bus modes, and the 256 KB Flash holds vector graphics tables and CAN DBC lookup data. AEC-Q100 qualification plus the -40C to +105C 'V' grade ensure operation behind the windshield through cold-start and summer heat soak. Designers add the integrated USB for factory programming and service-log retrieval without external PHY cost.
Recommandé
USB HID Peripheral
The integrated USB 2.0 full-speed OTG controller with on-chip transceiver makes the PIC32MX130F256DT-V/TL ideal for HID peripherals such as custom keyboards, barcode scanners, and PC accessories. The 40 MHz core handles HID report packing, debouncing, and LED animations with substantial headroom; 256 KB Flash stores USB descriptors and application logic without external EEPROM. The 16 KB SRAM accommodates HID ring buffers and double-buffered endpoints. The VTLA-44 6x6 mm footprint keeps the PCB under 20x30 mm for compact dongle designs, and the automotive temperature grade permits industrial enclosures.
Recommandé
Capacitive Touch HMI Panel
Hardware mTouch capacitive touch support on the PIC32MX130F256DT-V/TL enables robust button, slider, and wheel implementations with zero external touch ICs. The CTMU peripheral delivers femtofarad resolution, while PPS routing lets the designer place sensor electrodes anywhere on the PCB without pinout constraints. AEC-Q100 qualification plus the wide -40C to +105C range allow deployment in automotive HVAC panels, appliance controls, and outdoor kiosks. The 256 KB Flash and 16 KB SRAM accommodate touch libraries and complex gesture state machines.
Recommandé
Audio Playback Module
Two I2S/SSP modules on the PIC32MX130F256DT-V/TL drive external 16/24-bit DACs for low-cost audio playback products such as doorbells, white-noise generators, and announcement systems. The DMA engine offloads I2S sample streaming from the CPU, leaving MIPS for audio decoders (ADPCM, MP3, or WAV). PMP can simultaneously drive an LCD status panel, while USB enables field firmware updates. The 6x6 mm VTLA package simplifies routing audio differential pairs cleanly to a codec on the same PCB.
Recommandé
Industrial Sensor Hub
The 10-bit 1 Msps ADC with up to 28 channels on the PIC32MX130F256DT-V/TL aggregates multiple analog sensors (temperature, pressure, flow) into a single industrial hub that bridges to a host PLC via UART, SPI, or USB. Five UART ports support RS-232/RS-485 multi-drop networks, while the 16 KB SRAM buffers transient sampling bursts. AEC-Q100 plus extended temperature enable deployment near motor drives and process lines. The mTouch peripheral additionally supports operator panel buttons without extra ICs.
Recommandé
Low-Cost Graphics HMI
The PIC32MX130F256DT-V/TL drives small graphical HMIs through PMP interfacing to TFT controllers at up to 16-bit color depth, handling menus, gauges, and animated icons at moderate refresh rates. The 40 MHz core is sufficient for screen redraws at QVGA without dedicated GPU hardware, and 256 KB Flash stores multi-language bitmap/font assets. USB and CAN connectivity let the HMI talk to a host controller or vehicle bus, while PPS remaps peripherals to fit custom PCB layouts. The -40C to +105C grade suits indoor/outdoor industrial enclosures.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour PIC32MX130F256DT-V/TL — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | PIC32MX130F256D-V/TL | PIC32MX130F256DT-I/TL | PIC32MX230F256D-V/TL | PIC32MX130F256D-I/PT |
|---|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 44-VTLA (6x6 mm) | 44-VTLA (6x6 mm) - same | 44-VTLA (6x6 mm) - same | 44-VTLA (6x6 mm) - same | TQFP-44 - different |
| Maximum CPU Frequency | 40 MHz | 40 MHz | 40 MHz | 50 MHz | 40 MHz |
| Flash Memory | 256 KB | 256 KB | 256 KB | 256 KB | 256 KB |
| SRAM | 16 KB | 16 KB | 16 KB | 16 KB | 16 KB |
| Temperature Grade | Automotive -40C to +105C | Automotive -40C to +105C | Industrial -40C to +85C | Automotive -40C to +105C | Industrial -40C to +85C |
| USB 2.0 FS | Yes | Yes | Yes | Yes | Yes |
| AEC-Q100 Qualified | Yes | Yes | No (industrial) | Yes | No (industrial) |
Principaux différenciateurs
- Automotive AEC-Q100 qualification with -40C to +105C range (vs PIC32MX130F256DT-I/TL)
- Higher 50 MHz core for 25% more MIPS headroom (vs PIC32MX130F256D-V/TL)
- Tape-and-reel factory packaging for SMT assembly (vs PIC32MX130F256D-V/TL)
Notes de conception
Estimated: Solder the VTLA-44 exposed thermal pad to a ground copper pour of at least 100 mm^2 with thermal vias (9 x 0.3 mm vias in a 3x3 grid) for a junction-to-ambient theta_JA of approximately 30 C/W. Keep-out zones around the perimeter help with manufacturability. Decoupling requires 0.1 uF ceramics on every VDD pin plus 1 uF bulk adjacent to the part. Per Microchip AN1xx PIC32 layout guidelines, route USB D+/D- as a 90.9 ohm differential pair with length matching within 150 mil.
Estimated: The internal 1.8 V LDO draws from VDD and powers the core; for noise-sensitive analog applications, an external 1.8 V regulator reduces digital switching noise on AVSS/AVDD rails. Connect VDDCORE through 10 uF + 0.1 uF per datasheet DS60001168L. If the application uses USB, total VDD current can exceed 80 mA under full USB traffic; verify upstream supply handles inrush at hot-plug events.
Do not reuse code from PIC32MX5xx/6xx/7xx parts without checking peripheral register definitions - the MX1XX/2XX family has a different USART, I2C, and PMP register layout. The 'V' temperature grade operates to +105C, not +125C - if the design needs underhood automotive, use PIC32MX150/170 families rated to +125C. Always configure PPS before enabling peripherals, or pin function will default to GPIO.
Informations de conformité
AEC-Q100 qualified per Microchip automotive documentation. RoHS/REACH compliant per product page. The -V automotive temperature grade is qualified for cabin and underhood Class A/B modules.
