PIC32MX170F512HT-50I/MR - 50MHz 32-bit MCU, 512KB Flash | Microchip
Référence : PIC32MX170F512HT-50I/MR ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $5.71 | $5,71 |
| 10 | $5.13 | $51,30 |
| 100 | $4.56 | $456,00 |
| 500 | $3.99 | $1 995,00 |
| 1 000 | $3.42 | $3 420,00 |
PIC32MX170F512HT-50I/MR Présentation
A 32-bit microcontroller (MCU) is a programmable system-on-chip that integrates a processor core, program memory, data memory, and peripherals into a single IC. PIC32MX MCUs sit in Microchip's mid-range 32-bit portfolio, sitting below the Cortex-M class for low-power connected designs and above the 8-bit PIC16/PIC18 families for computationally demanding real-time control. As a member of the PIC32 family, the PIC32MX170F512H falls within the PIC32MX1x0/2x0 superset of low-cost, USB-optional 32-bit parts.
Key features of the PIC32MX170F512HT-50I/MR include 50 MHz CPU clock (83 DMIPS) with single-cycle 32x16 MAC and two-cycle 32x32 hardware multiply, 16-channel 10-bit ADC at up to 1 Msps, four SPI modules, two I2S interfaces for codec audio, two I2C, five UART modules, two comparators, CTMU for touch and capacitive sensing, PMP with dual read/write buffers for graphics, and Peripheral Pin Select (PPS) for flexible signal routing. The 512 KB Flash supports 10,000 minimum erase/write cycles and the device supports MIPS16e code compression for up to 40% smaller code.
Architecturally, the PIC32MX170F512H uses the MIPS M4K Harvard architecture with separate 32-bit instruction and data buses, 5-stage pipeline, hardware multiply/divide, and an integrated prefetch cache that boosts Flash throughput. The Peripheral Pin Select (PPS) remapping block decouples digital peripheral I/O from physical pin assignments, which is rare at this price point and dramatically simplifies PCB layout revisions. The 64-pin QFN (MR) package exposes a large EP thermal pad for low-thermal-resistance dissipation.
Typical applications include industrial control and HMI panels, USB device/embedded host peripherals, low-cost graphics with PMP-driven TFT displays, audio processing with external I2S codecs, capacitive touch user interfaces using the CTMU, sensor aggregation nodes, and home appliance motor control. The wide peripheral set makes it suitable as a main MCU for connected consumer devices and IoT edge nodes.
When designing with this device, reserve at least one PGECx/PGEDx pair for in-circuit serial programming (ICSP) and connect all VSS/VDD pairs to a low-impedance ground/power plane. The PPS remapping block must be unlocked via CFGCON before remapping - leaving defaults active is the most common debug pitfall on first hardware bring-up.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes for the PIC32MX170F512HT-50I/MR that are not found in the manufacturer datasheet alone.
Alternatives de remplacement direct pour PIC32MX170F512HT-50I/MR — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec PIC32MX170F512HT-50I/MR (même facteur de forme et même empreinte) — différant par ADC, Package, Parallel Master Port (PMP), Core Architecture, UART Modules.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
PIC32MX170F512H-50I/MR
✅ Remplacement direct✓ En stock
$4.1 / unité
Voir la fiche technique →PIC32MX170F512HT-I/MR
✅ Remplacement direct✓ En stock
$4.46 / unité
Voir la fiche technique →PIC32MX270F512B-I/MR
✅ Remplacement direct ⚠️ Spécifications non vérifiées📋 Alternative de référence (hors catalogue)
PIC32MX150F256H-50I/MR
✅ Remplacement direct✓ En stock
$3.05 / unité
Voir la fiche technique →PIC32MX170F256H-50I/MR
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
PIC32MX154F128D-I/ML
✅ Remplacement direct✓ En stock
$3.92 / unité
Voir la fiche technique →PIC32MX130F256H-50I/MR
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
PIC32MX170F512HT-50I/MR Valeurs maximales et caractéristiques électriques
| Core | MIPS32 M4K |
| CPU Architecture | 32-bit RISC |
| Maximum CPU Frequency | 50 MHz |
| DMIPS | 83 DMIPS |
| Program Memory (Flash) | 512 KB |
| Data Memory (SRAM) | 64 KB |
| Operating Voltage | 2.3 V to 3.6 V |
| I/O Pins | 53 (maximum) |
| ADC | 10-bit, 16-channel, 1 Msps |
| SPI Modules | 4 |
| I2C Modules | 2 |
| UART Modules | 5 |
| I2S Modules | 2 |
| Comparators | 2 |
| Boîtier | 64-QFN (MR) 9x9 mm with exposed pad |
| Température de fonctionnement | -40C to +85C (industrial) |
| Type de montage | Surface Mount |
| Statut RoHS | Compliant |
| Code Compression | MIPS16e (up to 40% smaller code) |
Guide de configuration des broches du PIC32MX170F512HT-50I/MR 64-qfn (mr) 9x9 mm with exposed pad
Configuration des broches du PIC32MX170F512HT-50I/MR (boîtier 64-qfn (mr) 9x9 mm with exposed pad). Ce circuit intégré numérique comprend des GPIO, des interfaces de communication (UART, SPI, I2C) et des broches d'alimentation. Consultez la fiche technique du fabricant pour les fonctions alternatives des broches et les options de configuration. Indispensable pour la conception de systèmes embarqués et la conception de circuits imprimés.
Aucune donnée de brochage détaillée disponible pour PIC32MX170F512HT-50I/MR.
Consultez la fiche technique pour la configuration complète des broches.
Applications typiques
PIC32MX170F512HT-50I/MR convient pour 6 applications: Industrial HMI with TFT Display, USB Device Embedded Host Peripherals, Audio Processing with I2S Codec, Capacitive Touch User Interface, Sensor Aggregation IoT Edge Node, Home Appliance Motor Control.
Industrial HMI with TFT Display
The PIC32MX170F512HT-50I/MR is well-matched to industrial HMI panels because its Parallel Master Port (PMP) with dual read/write buffers directly drives 8-bit/16-bit TFT-LCD interfaces. The 512 KB Flash stores graphical assets, fonts, and localized strings while the 83 DMIPS MIPS M4K core renders UI updates without flicker. Five UART modules allow simultaneous connection to motor drives, sensors, and a host PLC, and Peripheral Pin Select (PPS) decouples PCB routing from peripheral assignment. The 64-QFN 9x9 mm package with exposed thermal pad handles industrial -40C to +85C operation with sustained CPU activity, and 64 KB RAM supports mid-resolution framebuffers without external memory.
Recommandé
USB Device Embedded Host Peripherals
The PIC32MX170F512HT-50I/MR's 50 MHz MIPS M4K core and 64 KB RAM handle full-speed USB device class stacks (CDC, HID, MSD) when paired with an external USB transceiver and the PIC32MX USB framework. The 512 KB Flash accommodates composite USB stacks plus application firmware. Five UART modules serve as auxiliary debug or sensor channels, and PPS remapping keeps D+/D- lines on optimal board locations. Designers using this in non-USB applications can step down to PIC32MX170F256B for cost savings; for native USB integration, evaluate PIC32MX270F512B which integrates the USB peripheral directly.
Recommandé
Audio Processing with I2S Codec
The PIC32MX170F512HT-50I/MR integrates two I2S interfaces that connect directly to audio codecs like AK4642, WM8731, or SGTL5000 without external glue logic. The 83 DMIPS performance and 64 KB RAM support basic DSP operations such as biquad filters, mixing, and simple echo/reverb in real-time at 48 kHz sample rates. The 10-bit ADC at 1 Msps enables low-cost analog audio input for entry-level effects units and karaoke systems. Four SPI modules connect to Flash memory for sample storage, and CTMU enables touch-button input on the enclosure. The 64-QFN exposed pad provides adequate thermal dissipation for sustained audio processing workloads.
Recommandé
Capacitive Touch User Interface
The PIC32MX170F512HT-50I/MR's integrated CTMU (Charge Time Measurement Unit) combined with PPS enables up to 16-channel capacitive touch sensing for sliders, buttons, and proximity detection. The 50 MHz MIPS M4K core handles mTouch capacitive touch library algorithms including water rejection and noise filtering. With 512 KB Flash, designers can implement rich touch gestures, haptic feedback control via PWM, and BLE pairing logic. The industrial -40C to +85C temperature range supports appliances, automotive cabin controls, and outdoor kiosks. PPS remapping lets engineers position touch electrodes optimally without silicon constraints.
Recommandé
Sensor Aggregation IoT Edge Node
The PIC32MX170F512HT-50I/MR aggregates sensor data from multiple I2C and SPI devices through its four SPI and two I2C peripherals, processing readings at the edge before forwarding over UART or SPI to a gateway MCU. The 64 KB RAM buffers sensor histories while the 512 KB Flash stores configuration and protocol stacks like MQTT-SN or LoRaWAN. At 83 DMIPS the M4K core runs sensor fusion algorithms (Kalman filtering, complementary filters) in real time. The 10-bit ADC at 1 Msps handles analog sensor inputs simultaneously with digital sensors, and the 64-QFN package fits space-constrained IoT edge enclosures.
Recommandé
Home Appliance Motor Control
The PIC32MX170F512HT-50I/MR drives BLDC, PMSM, and stepper motors via its PWM/OC/Timer peripherals with 83 DMIPS computational headroom for field-oriented control (FOC) algorithms. Five UART modules enable simultaneous communication with user interfaces, safety sensors, and main controllers. The 16-channel 10-bit ADC samples motor phase currents and back-EMF at the 1 Msps rate required for high-RPM control loops. The 512 KB Flash stores FOC lookup tables and protection firmware, and the -40C to +85C industrial temperature range handles appliance environments. The 64-QFN package with exposed pad provides thermal headroom for sustained motor control workloads.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour PIC32MX170F512HT-50I/MR — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | PIC32MX170F512H-50I/MR | PIC32MX170F512HT-I/MR | PIC32MX270F512B-I/MR | PIC32MX150F256H-50I/MR | PIC32MX170F256H-50I/MR |
|---|---|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 64-QFN (MR) 9x9 mm | 64-QFN (MR) 9x9 mm - same | 64-QFN (MR) 9x9 mm - same | 64-QFN (MR) 9x9 mm - same | 64-QFN (MR) 9x9 mm - same | 64-QFN (MR) 9x9 mm - same |
| Core | MIPS32 M4K | MIPS32 M4K - same | MIPS32 M4K - same | MIPS32 M4K - same | MIPS32 M4K - same | MIPS32 M4K - same |
| Maximum CPU Frequency | 50 MHz | 50 MHz | 50 MHz | 50 MHz | 50 MHz | 50 MHz |
| Flash Memory | 512 KB | 512 KB | 512 KB | 512 KB | 256 KB (-50%) | 256 KB (-50%) |
| SRAM | 64 KB | 64 KB | 64 KB | 64 KB | 32 KB (-50%) | 64 KB |
| USB Peripheral | No | No | No | Yes (USB 2.0 FS device) | No | No |
| Operating Temperature | -40C to +85C (industrial) | -40C to +85C | -40C to +85C | -40C to +85C | -40C to +85C | -40C to +85C |
Principaux différenciateurs
- Highest-density Flash in the PIC32MX1xx QFN family (vs PIC32MX170F256H-50I/MR)
- PPS remapping flexibility (vs PIC32MX130F256H-50I/MR)
- Industrial -40C to +85C with sustained MIPS performance (vs PIC32MX150F256H-50I/MR)
Notes de conception
The 64-QFN (MR) package has an exposed thermal pad (EP) that MUST be soldered to the PCB ground plane for both thermal dissipation and electrical reference. Per Microchip land pattern recommendations, use a 5x5 array of thermal vias (0.3 mm drill, 0.5 mm pitch) under the EP to conduct heat into inner ground planes. Inadequate EP soldering causes the junction temperature to rise by 15-25C above spec, triggering thermal shutdown under sustained load.
The Peripheral Pin Select (PPS) registers on the PIC32MX170F512HT-50I/MR are LOCKED by default after reset. Engineers must unlock them via the CFGCON unlock sequence (SYSKEY = 0xAA996655, then SYSKEY = 0x556699AA, then CFGCONbits.IOLOCK = 0) before remapping peripheral signals. Forgetting this unlock sequence is the #1 cause of 'GPIO doesn't toggle' debug confusion on first hardware bring-up - leaving the PPS at default mappings even though code 'configures' them.
The PIC32MX170F512HT-50I/MR operates from 2.3V to 3.6V. Decouple each VDD/VSS pair with a 100 nF ceramic capacitor placed within 3 mm of the pin pair. Add a bulk 4.7 uF to 10 uF tantalum or ceramic capacitor near the package EP. The ADC accuracy degrades if digital switching noise couples into AVDD; isolate analog and digital supply traces and consider a ferrite bead between AVDD and DVDD for precision measurements.
Reserved one PGECx/PGEDx pair (e.g., PGEC1/PGED1) for ICSP programming/debug access - any pair works but both pins must be used together as documented in the family datasheet. Connect TRST_N (if present) through a 10 kOhm pull-up to VDD. The ICSP pins should be brought out to a 2x3 or 1x6 header footprint to support PICkit 4 or MPLAB ICD 4 in-circuit programming during development.
Informations de conformité
RoHS and REACH compliant per Microchip product environmental compliance documentation. Not AEC-Q100 qualified - not intended for automotive safety-critical applications. Lead-free and halogen-free per Microchip PIC32MX family material declarations.