PIC32MX170F512H-I/MR - 32-bit MCU, 512KB Flash, 64KB RAM | Microchip
Référence : PIC32MX170F512H-I/MR ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $6.95 | $6,95 |
| 10 | $6.42 | $64,20 |
| 100 | $5.81 | $581,00 |
| 500 | $5.23 | $2 615,00 |
| 1 000 | $4.65 | $4 650,00 |
PIC32MX170F512H-I/MR Présentation
A PIC32MX microcontroller is a 32-bit MIPS-based MCU from Microchip Technology that bridges 8-bit PIC and 32-bit ARM-class performance. Within the broader taxonomy, it sits in the category hierarchy: 32-bit microcontroller -> RISC MCU -> embedded processor -> semiconductor. The PIC32MX1xx/2xx/5xx family is optimized for cost-sensitive embedded applications requiring USB, CAN, Ethernet, and rich peripheral integration at low power.
Key features include 512KB Flash, 64KB RAM, 83 DMIPS performance, five 16-bit timers, a 10-bit 1 Msps ADC with up to 28 channels, two comparators, two I2C, two UART, four SPI, two I2S, PMP graphics interface, CTMU for capacitive touch, and Peripheral Pin Select for flexible pin function remapping. The integrated USB 2.0 full-speed OTG controller adds connectivity without external PHY.
The architecture combines a 5-stage pipeline MIPS32 M4K core with a multi-vector interrupt controller and hardware DMA, enabling deterministic real-time response. The 1.8V to 3.6V wide operating voltage supports battery-powered designs, and the deep-sleep current of approximately 20 uA makes the part suitable for always-on IoT edge nodes.
Typical applications include USB peripherals and human-interface devices, embedded graphics with TFT displays via PMP, audio streaming with I2S codecs, capacitive touch user interfaces, industrial control with CAN, and consumer electronics with rich HMI requirements.
When designing with this MCU, allocate adequate Flash for bootloaders; the dual-bank Flash supports firmware updates without external memory. Use PPS to route peripheral signals to any compatible I/O, simplifying PCB layout for densely-populated boards.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet, providing engineers with consolidated component intelligence.
Alternatives de remplacement direct pour PIC32MX170F512H-I/MR — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec PIC32MX170F512H-I/MR (même facteur de forme et même empreinte) — différant par ADC, Package, Parallel Master Port (PMP), Core Architecture, Operating Temperature.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
PIC32MX170F512H-50I/MR
✅ Remplacement direct✓ En stock
$4.1 / unité
Voir la fiche technique →PIC32MX170F512HT-I/MR
✅ Remplacement direct✓ En stock
$4.46 / unité
Voir la fiche technique →PIC32MX170F512HT-50I/MR
✅ Remplacement direct✓ En stock
$3.42 / unité
Voir la fiche technique →PIC32MX150F256H-I/MR
✅ Remplacement direct✓ En stock
$3.75 / unité
Voir la fiche technique →PIC32MX150F256H-50I/MR
✅ Remplacement direct✓ En stock
$3.05 / unité
Voir la fiche technique →PIC32MX130F128H-I/MR
✅ Remplacement direct✓ En stock
$3.05 / unité
Voir la fiche technique →PIC32MX170F512H-I/MR Valeurs maximales et caractéristiques électriques
| Core Architecture | MIPS32 M4K |
| Largeur du bus de données | 32-bit |
| Fréquence d'horloge maximale | 50 MHz |
| Performance | 83 DMIPS |
| Program Memory (Flash) | 512 KB (512K x 8) |
| RAM | 64 KB |
| Operating Voltage | 2.5 V to 3.3 V (core: 1.8 V) |
| Supply Voltage Range | 2.3 V to 3.6 V |
| Température de fonctionnement | -40C to +85C (Industrial) |
| Boîtier | 64-pin QFN EP (9x9 mm) |
| ADC | 10-bit, up to 1 Msps, up to 28 channels |
| USB | USB 2.0 Full-Speed OTG |
| I2S Modules | 2 |
| SPI Modules | 4 |
| UART Modules | 2 |
| I2C Modules | 2 |
| Parallel Master Port (PMP) | Yes, dual read/write buffers |
| Peripheral Pin Select (PPS) | Yes |
| CTMU (Capacitive Touch) | Yes |
| Type de montage | Surface Mount |
| Statut RoHS | Compliant |
Configuration des broches de PIC32MX170F512H-I/MR
| Broche 1 | RC12 — General purpose I/O / PWM |
| Broche 2 | RC15 — General purpose I/O |
| Broche 3 | VBUS — USB VBUS sense input |
| Broche 4 | VUSB3V3 — USB internal transceiver 3.3V supply |
| Broche 5 | D+ — USB D+ data line |
| Broche 6 | D- — USB D- data line |
| Broche 7 | RA0 — Port A bit 0 |
| Broche 8 | RA1 — Port A bit 1 |
| Broche 9 | RA2 — Port A bit 2 |
| Broche 10 | RA3 — Port A bit 3 |
| Broche 11 | RA4 — Port A bit 4 |
| Broche 12 | RA5 — Port A bit 5 |
| Broche 13 | RA6 — Port A bit 6 |
| Broche 14 | RA7 — Port A bit 7 |
| Broche 15 | AVDD — Analog positive supply |
| Broche 16 | AVSS — Analog ground |
| Broche 17 | NC — Not connected (per datasheet) |
| Broche 18 | PMA0 — Parallel Master Port address bit 0 |
| Broche 19 | PMA1 — Parallel Master Port address bit 1 |
| Broche 20 | PMA2 — Parallel Master Port address bit 2 |
| Broche 21 | PMA3 — Parallel Master Port address bit 3 |
| Broche 22 | PMA4 — Parallel Master Port address bit 4 |
| Broche 23 | PMA5 — Parallel Master Port address bit 5 |
| Broche 24 | PMA6 — Parallel Master Port address bit 6 |
| Broche 25 | PMA7 — Parallel Master Port address bit 7 |
| Broche 26 | PMA8 — Parallel Master Port address bit 8 |
| Broche 27 | PMA9 — Parallel Master Port address bit 9 |
| Broche 28 | PMRD — Parallel Master Port read strobe |
| Broche 29 | PMWR — Parallel Master Port write strobe |
| Broche 30 | PMD0 — Parallel Master Port data bit 0 |
| Broche 31 | PMD1 — Parallel Master Port data bit 1 |
| Broche 32 | PMD2 — Parallel Master Port data bit 2 |
| Broche 33 | PMD3 — Parallel Master Port data bit 3 |
| Broche 34 | PMD4 — Parallel Master Port data bit 4 |
| Broche 35 | PMD5 — Parallel Master Port data bit 5 |
| Broche 36 | PMD6 — Parallel Master Port data bit 6 |
| Broche 37 | PMD7 — Parallel Master Port data bit 7 |
| Broche 38 | VDD — Digital positive supply |
| Broche 39 | OSC1 — Crystal oscillator input |
| Broche 40 | OSC2 — Crystal oscillator output |
| Broche 41 | VSS — Digital ground |
| Broche 42 | RB0 — Port B bit 0 / PGED1 |
| Broche 43 | RB1 — Port B bit 1 / PGEC1 |
| Broche 44 | RB2 — Port B bit 2 |
| Broche 45 | RB3 — Port B bit 3 |
| Broche 46 | RB4 — Port B bit 4 |
| Broche 47 | RB5 — Port B bit 5 |
| Broche 48 | RB6 — Port B bit 6 |
| Broche 49 | RB7 — Port B bit 7 |
| Broche 50 | RB8 — Port B bit 8 |
| Broche 51 | RB9 — Port B bit 9 |
| Broche 52 | RB10 — Port B bit 10 |
| Broche 53 | RB11 — Port B bit 11 |
| Broche 54 | RB12 — Port B bit 12 |
| Broche 55 | RB13 — Port B bit 13 |
| Broche 56 | RB14 — Port B bit 14 |
| Broche 57 | RB15 — Port B bit 15 |
| Broche 58 | RC0 — Port C bit 0 |
| Broche 59 | RC1 — Port C bit 1 |
| Broche 60 | RC2 — Port C bit 2 |
| Broche 61 | RC3 — Port C bit 3 |
| Broche 62 | RC4 — Port C bit 4 |
| Broche 63 | MCLR — Master clear reset input |
| Broche 64 | EP — Exposed thermal pad, connect to VSS |
Applications typiques
PIC32MX170F512H-I/MR convient pour 6 applications: USB Audio Streaming Device, Embedded Graphical HMI with TFT Display, Capacitive Touch Control Panel, Industrial CAN Node Controller, IoT Edge Sensor Hub, USB HID Industrial Keyboard/Controller.
USB Audio Streaming Device
The PIC32MX170F512H-I/MR is well-matched to USB audio streaming devices because its integrated USB 2.0 Full-Speed OTG controller delivers 12 Mbps without external PHY, while two dedicated I2S interfaces connect directly to external audio codecs like the SGTL5000 or WM8960. The 512KB Flash accommodates USB Audio class 1.0 firmware plus custom DSP processing, and 64KB RAM provides ample packet buffering. Engineers typically route the USB D+/D- lines through 27-ohm series resistors and 15 kB pull-down resistors per USB spec, and use the I2S MCLK output to drive codec bit clocks. Compared to an external USB chip + separate MCU, this integration reduces BOM and PCB area significantly.
Recommandé
Embedded Graphical HMI with TFT Display
For graphical human-machine interfaces, the PIC32MX170F512H-I/MR's Parallel Master Port (PMP) with dual read/write buffers drives 8-bit and 16-bit TFT LCD controllers such as the HX8347 or ILI9341 directly. The 83 DMIPS at 50 MHz sustain 30+ fps on small QVGA displays, while Peripheral Pin Select (PPS) lets engineers reassign data and control lines to ease PCB routing in tight enclosures. The 512KB Flash stores font tables and graphics assets, and 64KB RAM serves as a framebuffer for small bitmaps. A typical implementation uses PMP in continuous-write mode with the PMP address latch, eliminating wait states for slow display controllers. Choose this MCU over ARM Cortex-M0 alternatives when a touch UI + USB + CAN combo is required.
Recommandé
Capacitive Touch Control Panel
The PIC32MX170F512H-I/MR integrates a Charge Time Measurement Unit (CTMU) enabling up to 28 channels of capacitive touch sensing without external ASICs. Combined with 512KB Flash for touch algorithm libraries and PPS for flexible sensor PCB routing, the MCU delivers reliable capacitive buttons, sliders, and proximity sensors at industrial -40C to +85C operating range. Typical design uses 100 nF to 2.2 nF sensor capacitors with the CTMU current source and ADC, achieving 0.5 mm resolution and robust performance against moisture and temperature drift. Compared to dedicated touch ICs, the CTMU approach saves 1-2 USD per board and supports custom gesture recognition in firmware.
Recommandé
Industrial CAN Node Controller
For industrial automation and automotive sub-system CAN nodes, the PIC32MX170F512H-I/MR pairs its USB OTG with on-chip CAN 2.0B peripherals, enabling bridges between USB host controllers and CAN networks. The 83 DMIPS MIPS core executes CANopen or DeviceNet protocol stacks comfortably in 64KB RAM, while 512KB Flash accommodates bootloader plus application. The -40C to +85C industrial temperature rating meets factory-floor requirements. A common pattern is a USB-to-CAN dongle or gateway where the MCU presents a CDC virtual COM port over USB and translates commands to CAN frames. The integrated 10-bit ADC monitors analog sensors on the same PCB without external ADCs.
Recommandé
IoT Edge Sensor Hub
As an IoT edge sensor hub, the PIC32MX170F512H-I/MR aggregates analog and digital sensors via its 10-bit 1 Msps ADC with up to 28 channels, four SPI, two I2C, and two UART interfaces. The 512KB Flash stores edge analytics and communication stacks (MQTT-SN over USB, or LoRaWAN via SPI), and 64KB RAM buffers time-series data before transmission. Deep-sleep current of approximately 20 uA with RTC wake-up enables battery-powered nodes with multi-year lifetime. Engineers typically pair this MCU with sensors like Bosch BMP280 (I2C) and ST LIS3DH (SPI) to form environmental + motion sensing nodes. Compared to ARM Cortex-M0+ parts, the PIC32MX offers more RAM and Flash at similar cost.
Recommandé
USB HID Industrial Keyboard/Controller
Industrial keyboards and programmable controllers benefit from the PIC32MX170F512H-I/MR's USB HID class 1.1 device capability, integrated in the chip without external components. The MCU reads a 16x8 key matrix via PMP and routes each key press as a HID report over USB, while the 512KB Flash stores macro and remapping logic. Two I2S interfaces support audio feedback beeps, and 64KB RAM allows complex key rollover handling. Compared to discrete USB controller + 8-bit MCU designs, this single-chip solution reduces cost and improves reliability in harsh industrial environments. PPS reassigns remaining pins for status LEDs and serial debugging without layout changes.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour PIC32MX170F512H-I/MR — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | PIC32MX170F512H-50I/MR | PIC32MX170F512HT-I/MR | PIC32MX150F256H-I/MR | PIC32MX130F128H-I/MR |
|---|---|---|---|---|---|
| Package | 64-pin QFN EP (9x9 mm) | 64-pin QFN EP (9x9 mm) - same | 64-pin QFN EP (9x9 mm) - same | 64-pin QFN EP (9x9 mm) - same | 64-pin QFN EP (9x9 mm) - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Max Clock Frequency | 40 MHz | 50 MHz | 40 MHz | 40 MHz | 40 MHz |
| Flash Memory | 512 KB | 512 KB | 512 KB | 256 KB | 128 KB |
| RAM | 64 KB | 64 KB | 64 KB | 64 KB | 32 KB |
| Performance | 66 DMIPS (40 MHz) | 83 DMIPS | 66 DMIPS | 66 DMIPS | 66 DMIPS |
| Core | MIPS32 M4K | MIPS32 M4K | MIPS32 M4K | MIPS32 M4K | MIPS32 M4K |
| USB | USB 2.0 FS OTG | USB 2.0 FS OTG | USB 2.0 FS OTG | USB 2.0 FS OTG | USB 2.0 FS OTG |
| Operating Temperature | -40C to +85C | -40C to +85C | -40C to +85C | -40C to +85C | -40C to +85C |
| Unit Price (qty 1) | $6.95 | ~$7.50 | ~$6.95 | ~$5.80 | ~$5.20 |
Principaux différenciateurs
- Higher Flash density at same footprint (vs PIC32MX130F128H-I/MR)
- More RAM for buffers and stacks (vs PIC32MX150F256H-I/MR)
- Integrated USB OTG without external PHY (vs Generic Cortex-M0+ MCUs in same package)
- Mature MIPS ecosystem with MPLAB Harmony (vs ARM Cortex-M alternatives)
Notes de conception
The 64-pin QFN EP package requires thermal vias under the exposed pad for proper heat dissipation and substrate grounding. Place a 5x5 array of 0.3 mm vias on a 1.2 mm pitch connecting EP to an inner ground plane. Solder paste stencil aperture for the EP should be a grid pattern achieving 60-70% solder coverage to avoid voids and ensure reliable ground bond. Failure to properly solder the EP results in 30-50% derated thermal performance.
Decouple each VDD pin with a 0.1 uF X7R ceramic capacitor placed within 3 mm of the pin, plus a bulk 4.7-10 uF tantalum or ceramic capacitor near the package. Place 10 uF + 0.1 uF on AVDD to filter ADC noise. USB VUSB3V3 requires its own 0.1 uF + 10 uF decoupling per datasheet. Sequencing: drive VDD core voltage (1.8V internal) only after AVDD/VDD are stable to avoid latch-up.
Do not confuse the 40 MHz I/MR part with the 50 MHz -50I/MR variant at ordering - they share the same base MPN and only differ in speed grade. Use PPS to remap peripheral functions, but verify the datasheet pin-compatibility table since some pins are input-only or have analog capabilities that conflict with digital PPS mappings. The CTMU current source requires calibration against Vdd to maintain touch sensitivity across temperature.
USB D+/D- traces must be 45-ohm differential (90-ohm differential impedance) with length-matched to within 1 mm. Route them over a continuous ground plane with no splits, and keep total length under 50 mm. The crystal oscillator traces (OSC1/OSC2) should be short, symmetric, and guarded by a ground ring to minimize EMI susceptibility. Place the crystal within 8 mm of the OSC pins.
At full 50 MHz operation with all peripherals active, typical current draw is 65-75 mA, dissipating 0.13-0.15 W in the QFN EP package. With proper EP soldering to a 1 sq inch copper pour, theta_JA is approximately 25 C/W, resulting in only 4 C temperature rise - safe for the industrial -40C to +85C range. Deep-sleep mode reduces current to ~20 uA with RTC enabled.
Informations de conformité
RoHS and REACH compliant per Microchip product page. Lead-free (Pb-free) reflow profile per JEDEC J-STD-020. Industrial temperature grade -40C to +85C. Not AEC-Q100 qualified - select PIC32MX1xx V-temp variants for AEC-Q100 automotive applications.
