PIC32MX250F256L-50I/PT - 50MHz 256KB Flash 32-bit MCU | Microchip
Référence : PIC32MX250F256L-50I/PT ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $9.2 | $9,20 |
| 10 | $8.45 | $84,50 |
| 100 | $7.55 | $755,00 |
| 500 | $6.85 | $3 425,00 |
| 1 000 | $6.2 | $6 200,00 |
| 3 000 | $5.75 | $17 250,00 |
PIC32MX250F256L-50I/PT Présentation
A 32-bit microcontroller (MCU) is a microprocessor core with on-chip Flash program memory, SRAM data memory, and integrated peripherals such as timers, ADC, communication controllers, and I/O. Within the system hierarchy, an MCU sits at the top of the embedded control stack: MCU -> microcontroller -> embedded processor -> semiconductor. The PIC32MX family uses the MIPS32 M4K Harvard architecture, which separates instruction and data paths and provides single-cycle multiply, hardware divide, and a deterministic interrupt response tailored to real-time embedded control.
Key differentiating features include a USB 2.0-compliant Full-Speed On-The-Go (OTG) controller, four SPI/I2S modules for codec and serial communication, a Parallel Master Port (PMP) with dual buffers for graphics interfaces, two I2C modules, and a 10-bit 1 Msps ADC with up to 28 channels. The PPS function allows digital peripheral pin assignments to be remapped in software, decoupling peripheral selection from physical pinout and simplifying PCB layout.
Architecturally, the PIC32MX250 family is built on a 5-stage pipeline MIPS32 M4K core and integrates a dedicated DMA controller, a crypto engine, and a CTMU for capacitive touch sensing. The 256 KB Flash is arranged as 256K x 8, supporting self-programming under firmware control and IEC 60730 Class B support via the Flash Error Correction Code (ECC) and supporting libraries.
Typical applications include USB peripherals and embedded hosts (HID, CDC, mass storage), audio playback with I2S DACs, low-cost graphical HMI with PMP-driven LCDs, capacitive-touch user interfaces, and industrial control nodes. The combination of USB OTG, large SRAM, and PPS makes the PIC32MX250F256L-50I/PT a flexible general-purpose 32-bit platform for both consumer and industrial designs.
Design tip: place 0.1 µF decoupling capacitors as close as possible to every VDD/VSS pin pair and add a bulk 10 µF tantalum or ceramic capacitor near the IC. For USB designs, the 90 Ω differential D+/D- trace impedance must be controlled and the VBUS line should include ESD protection rated at IEC 61000-4-2 Level 4.
This page synthesizes distributor pricing, same-family drop-in alternatives, and practical design notes beyond what the manufacturer datasheet provides, giving engineers a single reference for sourcing and design-in.
Alternatives de remplacement direct pour PIC32MX250F256L-50I/PT — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec PIC32MX250F256L-50I/PT (même facteur de forme et même empreinte) — différant par ADC, Package, Core Architecture, USB, SRAM.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
PIC32MX250F256HT-I/PT
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
$5.1 / unité
Voir la fiche technique →PIC32MX250F256L-50I/PF
✅ Remplacement direct ⚠️ Spécifications non vérifiées📋 Alternative de référence (hors catalogue)
PIC32MX250F256H-50I/PT
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
$4.55 / unité
Voir la fiche technique →PIC32MX230F256D-50I/PT
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
$4.15 / unité
Voir la fiche technique →PIC32MX170F512L-50I/PT
✅ Remplacement direct ⚠️ Spécifications non vérifiées📋 Alternative de référence (hors catalogue)
PIC32MX274F256D-I/PT
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
PIC32MX250F256L-50I/PT Valeurs maximales et caractéristiques électriques
| Core Architecture | MIPS32 M4K 32-bit |
| Maximum CPU Speed | 50 MHz / 83 DMIPS |
| Program Memory (Flash) | 256 KB (256K x 8) |
| Data Memory (SRAM) | 32 KB |
| Operating Voltage Range | 2.3 V to 3.6 V |
| Boîtier | 100-pin TQFP (PT) 12x12 mm |
| Plage de température de fonctionnement | -40C to +85C (Industrial) |
| Number of I/O Pins | 81 |
| USB | USB 2.0 Full-Speed OTG |
| ADC | 10-bit, up to 1 Msps |
| SPI / I2S Modules | 4 (SPI/I2S configurable) |
| I2C Modules | 2 |
| Parallel Master Port (PMP) | Yes, with dual buffers |
| DMA Channels | 4 (with FIFOs) |
| Peripheral Pin Select (PPS) | Yes |
| Type de montage | Surface Mount |
| Statut RoHS | Compliant |
| Niveau MSL | 3 (168 hours) |
Configuration des broches de PIC32MX250F256L-50I/PT
| Broche 1 | RG15 — General purpose I/O / SDA2 (PPS) |
| Broche 2 | VDD — Positive supply (2.3 V to 3.6 V) |
| Broche 3 | RP10/RD0 — Remappable peripheral I/O |
| Broche 4 | RP11/RD1 — Remappable peripheral I/O |
| Broche 5 | RP4/PMD4/RD2 — Remappable peripheral I/O / PMP data |
| Broche 6 | RP5/PMD5/RD3 — Remappable peripheral I/O / PMP data |
| Broche 7 | VDD — Positive supply |
| Broche 8 | VSS — Ground reference |
| Broche 9 | RP6/PMD6/RD4 — Remappable peripheral I/O / PMP data |
| Broche 10 | RP7/PMD7/RD5 — Remappable peripheral I/O / PMP data |
| Broche 11 | RP8/PMD8/RD6 — Remappable peripheral I/O / PMP data |
| Broche 12 | RP9/PMD9/RD7 — Remappable peripheral I/O / PMP data |
| Broche 13 | VSS — Ground reference |
| Broche 14 | PGEC2 — ICSP clock / debugging |
| Broche 15 | PGED2 — ICSP data / debugging |
| Broche 16 | RG6 — General purpose I/O |
| Broche 17 | RG7 — General purpose I/O |
| Broche 18 | RG8 — General purpose I/O |
| Broche 19 | RG9 — General purpose I/O |
| Broche 20 | VSS — Ground reference |
| Broche 21 | RG0 — General purpose I/O |
| Broche 22 | RG1 — General purpose I/O |
| Broche 23 | VUSB — USB internal 3.3 V regulator output (decouple 1uF) |
| Broche 24 | D+ — USB D+ data line |
| Broche 25 | D- — USB D- data line |
| Broche 26 | VSS — Ground reference |
| Broche 27 | PGEC3 — ICSP clock / debugging (alternate) |
| Broche 28 | PGED3 — ICSP data / debugging (alternate) |
| Broche 29 | RF0 — General purpose I/O |
| Broche 30 | RF1 — General purpose I/O |
| Broche 31 | RF2 — General purpose I/O |
| Broche 32 | RF3 — General purpose I/O |
| Broche 33 | RF4 — General purpose I/O |
| Broche 34 | RF5 — General purpose I/O |
| Broche 35 | VSS — Ground reference |
| Broche 36 | RF6 — General purpose I/O |
| Broche 37 | RF7 — General purpose I/O |
| Broche 38 | RF8 — General purpose I/O |
| Broche 39 | VSS — Ground reference |
| Broche 40 | OSC1/CLKI/RC13 — Crystal oscillator input or external clock input |
| Broche 41 | OSC2/CLKO/RC14 — Crystal oscillator output or clock output |
| Broche 42 | SOSCI/RPC13/RC13 — Secondary oscillator input |
| Broche 43 | SOSCO/RPC14/RC14 — Secondary oscillator output |
| Broche 44 | VDD — Positive supply |
| Broche 45 | RA0 — General purpose I/O / analog input AN0 |
| Broche 46 | RA1 — General purpose I/O / analog input AN1 |
| Broche 47 | RA2 — General purpose I/O / analog input AN2 |
| Broche 48 | RA3 — General purpose I/O / analog input AN3 |
| Broche 49 | RA4 — General purpose I/O / analog input AN4 |
| Broche 50 | RA5 — General purpose I/O / analog input AN5 |
| Broche 51 | RA6 — General purpose I/O / analog input AN6 |
| Broche 52 | RA7 — General purpose I/O / analog input AN7 |
| Broche 53 | VSS — Ground reference |
| Broche 54 | RB0 — General purpose I/O / AN8 / PGED1 |
| Broche 55 | RB1 — General purpose I/O / AN9 / PGEC1 |
| Broche 56 | RB2 — General purpose I/O / AN10 / CVREF+ |
| Broche 57 | RB3 — General purpose I/O / AN11 / CVREF- |
| Broche 58 | RB4 — General purpose I/O / AN12 |
| Broche 59 | RB5 — General purpose I/O / AN13 |
| Broche 60 | RB6 — General purpose I/O / AN14 |
| Broche 61 | RB7 — General purpose I/O / AN15 |
| Broche 62 | RB8 — General purpose I/O / AN16 |
| Broche 63 | RB9 — General purpose I/O / AN17 |
| Broche 64 | RB10 — General purpose I/O / AN18 |
| Broche 65 | RB11 — General purpose I/O / AN19 |
| Broche 66 | VSS — Ground reference |
| Broche 67 | RB12 — General purpose I/O / AN20 |
| Broche 68 | RB13 — General purpose I/O / AN21 |
| Broche 69 | RB14 — General purpose I/O / AN22 |
| Broche 70 | RB15 — General purpose I/O / AN23 |
| Broche 71 | RC1 — General purpose I/O |
| Broche 72 | RC2 — General purpose I/O |
| Broche 73 | RC3 — General purpose I/O |
| Broche 74 | RC4 — General purpose I/O |
| Broche 75 | VDD — Positive supply |
| Broche 76 | RD8/RTCC/PMRD — Remappable / RTCC output / PMP read strobe |
| Broche 77 | RD9/PMWR — Remappable / PMP write strobe |
| Broche 78 | RD10/PMCS1 — Remappable / PMP chip select 1 |
| Broche 79 | RD11/PMCS2 — Remappable / PMP chip select 2 |
| Broche 80 | RD12 — General purpose I/O |
| Broche 81 | RD13 — General purpose I/O |
| Broche 82 | RD14 — General purpose I/O |
| Broche 83 | RD15 — General purpose I/O |
| Broche 84 | VSS — Ground reference |
| Broche 85 | RE0 — General purpose I/O / PMD0 |
| Broche 86 | RE1 — General purpose I/O / PMD1 |
| Broche 87 | RE2 — General purpose I/O / PMD2 |
| Broche 88 | RE3 — General purpose I/O / PMD3 |
| Broche 89 | RE4 — General purpose I/O / PMD4 (alt) |
| Broche 90 | RE5 — General purpose I/O / PMD5 (alt) |
| Broche 91 | RE6 — General purpose I/O / PMD6 (alt) |
| Broche 92 | RE7 — General purpose I/O / PMD7 (alt) |
| Broche 93 | RG2 — General purpose I/O |
| Broche 94 | RG3 — General purpose I/O |
| Broche 95 | MCLR — Master Clear (reset) input |
| Broche 96 | RG12 — General purpose I/O |
| Broche 97 | RG13 — General purpose I/O |
| Broche 98 | RG14 — General purpose I/O |
| Broche 99 | VDD — Positive supply |
| Broche 100 | RG15 — General purpose I/O (alt location) |
Applications typiques
PIC32MX250F256L-50I/PT convient pour 6 applications: USB Audio Class (UAC) DAC Peripheral, Graphical HMI with Parallel LCD, Industrial Sensor Hub with USB Diagnostics, Capacitive Touch Control Panel, Portable Data Logger with USB Mass Storage, Embedded Web Server (Lightweight HTTP).
USB Audio Class (UAC) DAC Peripheral
The PIC32MX250F256L-50I/PT is well matched to USB audio class peripherals because it combines an on-chip USB 2.0 Full-Speed OTG controller, four I2S-capable SPI modules for connecting external DACs, and 32 KB SRAM for sample buffering at 48 kHz/16-bit stereo. The PIC32MX250F256L-50I/PT can sustain 50 MHz core operation while servicing the USB interrupt, leaving cycles for audio rendering. The on-chip DMA controller moves samples between the USB endpoint FIFO and the I2S transmit buffer without CPU intervention. Recommended companion: AKM AK4452 I2S DAC and TI TPS2051B USB power switch.
Recommandé
Graphical HMI with Parallel LCD
The Parallel Master Port (PMP) on the PIC32MX250F256L-50I/PT supports 8-bit and 16-bit data widths with dual read/write buffers, enabling the PIC32MX250F256L-50I/PT to drive small QVGA (320x240) TFT LCDs without an external controller. With 256 KB Flash, full-frame graphical firmware libraries fit on-chip, and the 81 I/O pins provide ample signal lines for touch, backlight, and SD card interfaces. The 50 MHz core refreshes the display from internal SRAM without DMA bottlenecks.
Recommandé
Industrial Sensor Hub with USB Diagnostics
For industrial sensor aggregation, the PIC32MX250F256L-50I/PT provides two I2C buses, four SPI ports, and a 10-bit 1 Msps ADC with up to 28 input channels. Engineers use the USB OTG controller as a service port for diagnostics and firmware update, while the 32 KB SRAM buffers sensor frames before uploading to a host. The -40C to +85C industrial temperature range covers most factory-floor enclosures without derating.
Recommandé
Capacitive Touch Control Panel
The PIC32MX250F256L-50I/PT integrates the Charge Time Measurement Unit (CTMU), which combined with the on-chip 10-bit ADC and PPS-mappable I/O enables up to 16 capacitive touch buttons or a 4x4 matrix. Designers use the PPS function to route CTMU channels to any spare I/O pin, simplifying PCB layout for irregular-shaped touch pads. The 256 KB Flash accommodates Microchip's mTouch library plus a custom UI state machine.
Recommandé
Portable Data Logger with USB Mass Storage
Battery-powered data loggers benefit from the PIC32MX250F256L-50I/PT because it runs from a single Li-Ion cell (2.3 V to 3.6 V), integrates USB Full-Speed for direct connection to a host PC, and provides 256 KB Flash plus 32 KB SRAM for circular log buffers. The PIC32MX250F256L-50I/PT implements USB Mass Storage Class using the on-chip Flash or an external SPI Flash as the backing store. Power-down current with the on-chip RTCC is microampere-class, extending battery life during idle logging intervals.
Recommandé
Embedded Web Server (Lightweight HTTP)
Although the PIC32MX250F256L-50I/PT lacks Ethernet, it can implement a lightweight HTTP service over USB RNDIS or an external SPI-based Wi-Fi module such as the MRF24WG0MA. The PIC32MX250F256L-50I/PT runs Microchip's TCP/IP stack (MLA) in 256 KB Flash, and the 81 I/O pins provide a generous connection count to controlled devices. For secure deployments, the on-chip crypto engine accelerates AES-128/256 blocks used by TLS handshake acceleration.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour PIC32MX250F256L-50I/PT — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | PIC32MX250F256HT-I/PT | PIC32MX250F256L-50I/PF | PIC32MX250F256H-50I/PT | PIC32MX230F256D-50I/PT | PIC32MX170F512L-50I/PT | PIC32MX274F256D-I/PT |
|---|---|---|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 100-pin TQFP (PT) 12x12 mm | 100-pin TQFP (PT) 12x12 mm - same | 100-pin TFBGA (PF) - same die, different package | 100-pin TQFP (PT) 12x12 mm - same | 100-pin TQFP (PT) 12x12 mm - same | 100-pin TQFP (PT) 12x12 mm - same | 100-pin TQFP (PT) 12x12 mm - same |
| Core | MIPS32 M4K 32-bit | MIPS32 M4K 32-bit | MIPS32 M4K 32-bit | MIPS32 M4K 32-bit | MIPS32 M4K 32-bit | MIPS32 M4K 32-bit | MIPS32 M4K 32-bit |
| Maximum CPU Speed | 50 MHz / 83 DMIPS | 50 MHz / 83 DMIPS | 50 MHz / 83 DMIPS | 50 MHz / 83 DMIPS | 40 MHz / 52 DMIPS | 50 MHz / 83 DMIPS | 72 MHz / 117 DMIPS |
| Flash | 256 KB | 256 KB | 256 KB | 256 KB | 256 KB | 512 KB | 256 KB |
| SRAM | 32 KB | 32 KB | 32 KB | 32 KB | 16 KB | 64 KB | 32 KB |
| USB OTG | Yes (Full-Speed) | Yes (Full-Speed) | Yes (Full-Speed) | No | Yes (Full-Speed) | No | Yes (Full-Speed) |
| Operating Temperature | -40C to +85C (Industrial) | -40C to +105C (AEC-Q100 Grade 2) | -40C to +85C (Industrial) | -40C to +85C (Industrial) | -40C to +85C (Industrial) | -40C to +85C (Industrial) | -40C to +85C (Industrial) |
| Approx. Unit Price (qty-1) | $9.20 (as of 2026-10-02) | Higher (extended temp) | Similar | Slightly lower (no USB) | Lower (less SRAM) | Higher (more Flash) | Slightly higher (newer family) |
Principaux différenciateurs
- Integrated USB 2.0 Full-Speed OTG controller with on-chip transceiver (vs PIC32MX170F512L-50I/PT)
- 50 MHz / 83 DMIPS core speed for the same Flash/SRAM capacity (vs PIC32MX230F256D-50I/PT)
- Full Peripheral Pin Select (PPS) remapping on all digital peripherals (vs PIC32MX250F256H-50I/PT)
Notes de conception
Place a 0.1 uF ceramic decoupling capacitor on every VDD/VSS pin pair as close to the package as physically possible (within 2 mm). Add a single 10 uF bulk ceramic or tantalum capacitor near the IC to handle transient load steps from the USB transceiver and ADC. The VUSB pin (pin 23) requires a 1 uF ceramic decoupling capacitor to ground per the Microchip PIC32MX2XX family datasheet, and this capacitor must be present even when USB is unused because the internal 3.3 V LDO remains active.
For USB designs, the D+ and D- traces must be routed as a 90 ohm differential pair with controlled impedance, using a continuous reference ground plane beneath. Length matching should hold within 150 mil between D+ and D- per the USB 2.0 specification. Place a common-mode choke or ferrite bead in series with VBUS if the design is susceptible to conducted EMI, and add ESD protection diodes (USBLC6-2SC6 or equivalent) rated at IEC 61000-4-2 Level 4 directly at the USB connector.
Use the Peripheral Pin Select (PPS) feature to remap digital peripherals (UART, SPI, I2C, timers) to any available I/O pin, but group high-speed SPI signals (SCK, MOSI, MISO) on adjacent pins to minimize loop area. Estimated: keep SCK trace length below 50 mm and route it on the top layer with a continuous ground plane on layer 2 to avoid EMI. Place the 8 MHz or 12 MHz crystal within 5 mm of the OSC1/OSC2 pins and guard the traces with a ground pour on both sides.
Do not skip the MCLR pull-up resistor; the MCLR pin (pin 95) requires a 10 kohm pull-up to VDD for reliable reset behavior, especially in noisy environments. Do not leave any VDD pin floating; the PIC32MX250F256L has multiple VDD pins (2, 7, 44, 75, 99) and all must be connected. Programming the device via ICSP requires both PGECx/PGEDx pairs to be accessible - if a pair is used exclusively for peripherals, keep the alternate pair (PGEC3/PGED3 on pins 27/28) free for in-circuit debugging.
When driving large parallel LCDs through the PMP, add 22 ohm series damping resistors on the PMD[15:0], PMRD, PMWR, and PMCS lines if the bus length exceeds 50 mm. The PMP can sustain up to 50 MHz operation but the actual throughput depends on the load capacitance of the LCD connector and cable. Estimated: total bus capacitance should be held below 50 pF to maintain 25 MHz PMP operation without bus errors.
Informations de conformité
Standard -50I part is industrial-grade (-40C to +85C). For AEC-Q100 qualified parts, choose the -HT variant. RoHS and REACH compliance per Microchip product declarations.