PIC32MX274F256DT-I/ML - 72MHz 32-bit MCU 256KB Flash | Microchip
Référence : PIC32MX274F256DT-I/ML ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $4.12 | $4,12 |
| 10 | $3.78 | $37,80 |
| 100 | $3.42 | $342,00 |
| 500 | $3.05 | $1 525,00 |
| 1 000 | $2.71 | $2 710,00 |
PIC32MX274F256DT-I/ML Présentation
A 32-bit microcontroller (MCU) is a single-chip computer that integrates a CPU core, program memory (Flash), data memory (SRAM), and peripherals on one die. PIC32MX MCUs use the MIPS32 M4K architecture, placing them in the broader hierarchy: microcontroller -> embedded MCU -> 32-bit RISC processor -> semiconductor. The eXtreme Low Power (XLP) variant adds sleep/deep-sleep modes that reduce quiescent current to the microampere range for battery-powered designs.
Key specifications include a 72MHz maximum CPU clock with 83 DMIPS performance, 256KB (256K x 8) Flash program memory, 64KB SRAM, USB 2.0 Full-Speed with device/host/OTG support, and 5-channel 10-bit ADC at 1 Msps. The 44-QFN (8x8) package has an exposed thermal pad and offers up to 34 general-purpose I/O pins. Peripherals include three analog comparators, two I2C, two UART, two SPI, and a CTMU for capacitive touch sensing.
Typical applications include USB-connected consumer devices, capacitive-touch human-machine interfaces, low-power IoT sensor nodes, and battery-powered instrumentation. The RTCC with calendar mode supports time-stamped data logging without CPU intervention, while the CTMU enables 10-bit resolution touch buttons and sliders with no external IC.
When designing with this part, choose the 44-QFN (8x8) variant when board area is constrained and exposed-pad thermal performance is required. The PIC32MX274F256DT-I/ML (industrial -40C to +85C) differs from the automotive PIC32MX274F256DT-V/ML only in temperature range and qualification testing.
This page synthesizes current distributor pricing, drop-in compatible variants within the PIC32MX1XX/2XX family, and practical PCB layout considerations specific to the 44-QFN exposed-pad package not found on the manufacturer product page.
Alternatives de remplacement direct pour PIC32MX274F256DT-I/ML — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec PIC32MX274F256DT-I/ML (même facteur de forme et même empreinte) — différant par ADC, Package, Core Architecture, I/O Pins, Operating Temperature.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
PIC32MX274F256DT-V/ML
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
PIC32MX274F256DT-50I/ML
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
PIC32MX270F256DT-I/ML
✅ Remplacement direct✓ En stock
$3.78 / unité
Voir la fiche technique →PIC32MX274F256BT-I/ML
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
PIC32MX174F256DT-I/ML
✅ Remplacement direct✓ En stock
$2.55 / unité
Voir la fiche technique →PIC32MX274F256DT-I/ML Valeurs maximales et caractéristiques électriques
| Core Architecture | MIPS32 M4K |
| Largeur du bus de données | 32-bit |
| Maximum CPU Frequency | 72 MHz |
| Program Memory (Flash) | 256 KB (256K x 8) |
| SRAM | 64 KB |
| Operating Voltage Range | 2.3 V to 3.6 V |
| Supply Voltage (Typical) | 3.3 V |
| ADC | 10-bit, up to 1 Msps, 9 channels |
| USB | USB 2.0 Full-Speed, device/host/OTG |
| Analog Comparators | 3 |
| CTMU (Capacitive Touch) | Yes |
| RTCC (Real-Time Clock/Calendar) | Yes |
| UART | 2 |
| I2C | 2 |
| SPI | 2 |
| I/O Pins | 34 (max) |
| Boîtier | 44-pin QFN (8x8 mm) with exposed pad |
| Température de fonctionnement | -40C to +85C (Industrial) |
| Type de montage | Surface Mount |
| Statut RoHS | Compliant |
Guide de configuration des broches du PIC32MX274F256DT-I/ML 44-pin qfn (8x8 mm) with exposed pad
Configuration des broches du PIC32MX274F256DT-I/ML (boîtier 44-pin qfn (8x8 mm) with exposed pad). Ce circuit intégré numérique comprend des GPIO, des interfaces de communication (UART, SPI, I2C) et des broches d'alimentation. Consultez la fiche technique du fabricant pour les fonctions alternatives des broches et les options de configuration. Indispensable pour la conception de systèmes embarqués et la conception de circuits imprimés.
Aucune donnée de brochage détaillée disponible pour PIC32MX274F256DT-I/ML.
Consultez la fiche technique pour la configuration complète des broches.
Applications typiques
PIC32MX274F256DT-I/ML convient pour 6 applications: USB HID Human Interface Devices, Capacitive Touch Control Panels, Low-Power IoT Sensor Nodes, Industrial Data Loggers, Medical Point-of-Care Devices, Consumer Appliance Control Boards.
USB HID Human Interface Devices
The PIC32MX274F256DT-I/ML integrates a Full-Speed USB 2.0 controller with on-chip Serial Interface Engine, making it well-suited for USB HID peripherals such as keyboards, mice, game controllers, and custom input devices. With 256KB Flash and 64KB SRAM, it has ample space for USB stacks, HID report descriptors, and debouncing logic without external memory. The 72 MHz MIPS32 M4K core handles USB polling and report generation at full 1 kHz HID rate. Engineers typically pair this MCU with the Microchip MLA USB stack, achieving HID enumeration in under 100 ms from power-on.
Recommandé
Capacitive Touch Control Panels
The integrated CTMU (Capacitive Touch Utility Module) enables up to 10-bit resolution touch sensing on the PIC32MX274F256DT-I/ML without external touch ICs. The CTMU produces a constant current source whose discharge time through a touch electrode varies with capacitance, allowing the MCU to detect touch and proximity through the on-chip ADC and timer. With 34 GPIO and the 44-QFN footprint, designers can implement up to 16 touch buttons plus an I2C-driven LCD. The XLP sleep modes drop quiescent current below 1 uA between touch events, suiting battery-powered remote controls and appliances.
Recommandé
Low-Power IoT Sensor Nodes
The PIC32MX274F256DT-I/ML belongs to the eXtreme Low Power (XLP) PIC32MX27x family, which adds deep-sleep modes drawing under 1 uA. This makes it ideal for battery-powered IoT sensor nodes that wake periodically to measure, log, and transmit. The integrated RTCC (Real-Time Clock/Calendar) enables precise wake intervals without CPU intervention, and the 10-bit ADC at 1 Msps captures analog sensor data. The 44-QFN exposed pad helps dissipate heat in continuous-conversion scenarios. Typical battery life exceeds 5 years on a single CR2032 for sensors reporting once per minute.
Recommandé
Industrial Data Loggers
With 256KB Flash and 64KB SRAM, the PIC32MX274F256DT-I/ML can buffer tens of thousands of timestamped data records in battery-backed SRAM before flushing to Flash. The RTCC provides second-resolution timestamps without software overhead, and the 10-bit ADC at 1 Msps digitizes up to 9 analog sensor channels. The industrial -40C to +85C temperature range supports factory-floor and outdoor installations. UART and SPI peripherals connect to external modems or SD cards for data offload, with USB available for configuration ports.
Recommandé
Medical Point-of-Care Devices
The PIC32MX274F256DT-I/ML's low-power XLP operation and integrated USB are well-matched to portable medical devices such as glucose meters, pulse oximeters, and handheld diagnostics. The CTMU enables reliable capacitive buttons for gloved-hand operation, while the 10-bit ADC captures analog signals from photodetectors or impedance sensors. USB CDC allows direct connection to a host PC for result export and battery charging. With 256KB Flash, full application code, USB stack, and data tables fit on-chip without external memory.
Recommandé
Consumer Appliance Control Boards
The PIC32MX274F256DT-I/ML provides three analog comparators, two UART, two I2C, two SPI, and PWM-capable timers in a single 44-QFN package - eliminating the discrete logic and multiple ICs that older appliance designs required. The capacitive touch capability replaces mechanical buttons with sealed touch panels for high-humidity environments such as washing machines and dishwashers. The 72 MHz MIPS core runs appliance control loops with sub-millisecond response, and the industrial temperature range suits unconditioned garages and basements.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour PIC32MX274F256DT-I/ML — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | PIC32MX274F256DT-V/ML | PIC32MX274F256DT-50I/ML | PIC32MX270F256DT-I/ML | PIC32MX274F256BT-I/ML | PIC32MX174F256DT-I/ML |
|---|---|---|---|---|---|---|
| Package | 44-QFN (8x8 mm) | 44-QFN (8x8 mm) - same | 44-QFN (8x8 mm) - same | 44-QFN (8x8 mm) - same | 44-QFN (8x8 mm) - same | 44-QFN (8x8 mm) - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Flash | 256 KB | 256 KB | 256 KB | 256 KB | 256 KB | 256 KB |
| SRAM | 64 KB | 64 KB | 64 KB | 64 KB | 64 KB | 64 KB |
| Max CPU Frequency | 72 MHz | 72 MHz | 72 MHz | 50 MHz | 72 MHz | 72 MHz |
| USB | USB 2.0 FS device/host/OTG | USB 2.0 FS device/host/OTG | USB 2.0 FS device/host/OTG | USB 2.0 FS device/host/OTG | USB 2.0 FS device/host/OTG | No USB |
| Temperature Range | -40C to +85C (Industrial) | -40C to +105C (Automotive) | -40C to +85C (Extended) | -40C to +85C (Industrial) | -40C to +85C (Industrial) | -40C to +85C (Industrial) |
| Unit Price @ 1k (USD, as of 2026-10-02) | $2.71 | $3.20 (auto grade) | $2.95 | $2.55 | $2.71 | $2.45 |
Principaux différenciateurs
- Full XLP low-power feature set with deep-sleep under 1 uA (vs PIC32MX270F256DT-I/ML)
- Automotive-grade option available in identical footprint (vs PIC32MX274F256DT-V/ML)
- Integrated CTMU eliminates external touch controller cost (vs PIC32MX274F256DT-50I/ML)
Notes de conception
The 44-QFN (8x8 mm) package has an exposed thermal pad (EP) that MUST be soldered to a copper pad on the PCB for proper thermal and electrical performance. Use at least 1 oz copper with thermal vias (9 vias in a 3x3 grid minimum) connecting the top thermal pad to internal ground planes. Without proper thermal pad soldering, the MCU's thermal resistance rises significantly, potentially causing thermal shutdown during full-speed USB and ADC operation at 72 MHz. Estimate: theta_JA of properly soldered QFN-44 is approximately 28 C/W; without EP soldering it exceeds 60 C/W.
Place decoupling capacitors as close as possible to each VDD/VSS pin pair. Use 100 nF X7R ceramic capacitors for each supply pin, plus a single 4.7 uF bulk capacitor near the MCU. The USB D+/D- traces require 90-ohm differential impedance and should be routed over a continuous ground plane. Keep the 48 MHz USB reference clock trace short and away from switching signals. The 8 MHz primary oscillator traces should be surrounded by ground pour to minimize radiated emissions.
Do not confuse the 'DT' suffix (44-QFN package) with 'PT' (44-TQFP) - they have different footprints and pin pitch. The I/ML suffix specifically means the 44-QFN (8x8 mm) industrial-grade variant. When migrating from the 64-pin PIC32MX variants, verify that the alternate peripheral pin assignments do not affect your design - the 44-pin package multiplexes fewer functions per peripheral. Always configure unused I/O pins as outputs low or inputs with internal pull-up enabled, never as floating inputs, to minimize current draw in XLP sleep modes.
Informations de conformité
Industrial-grade variant -40C to +85C. AEC-Q100 qualification available on -V/ML automotive variant. RoHS and REACH compliance confirmed by Microchip product page.
