PIC32MX450F128HT-V/RG - 32-bit MCU, 128KB Flash, 64-QFN | Microchip
Référence : PIC32MX450F128HT-V/RG ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $6.85 | $6,85 |
| 10 | $6.18 | $61,80 |
| 100 | $5.49 | $549,00 |
| 500 | $4.95 | $2 475,00 |
| 1 000 | $4.42 | $4 420,00 |
PIC32MX450F128HT-V/RG Présentation
A 32-bit microcontroller (MCU) is a single-chip computer whose data path, registers, and arithmetic logic unit operate on 32 bits per instruction, enabling higher throughput, larger linear address space, and richer peripheral integration than 8-bit or 16-bit MCUs. The PIC32MX4 family specifically targets cost-sensitive embedded designs that need 32-bit performance plus USB connectivity, sitting in the broader hierarchy MCU -> microcontroller -> embedded controller -> semiconductor.
Key specifications include 128 KB Flash program memory organized as 128K x 8, 16 KB SRAM data memory, 8 KB bootloader Flash, and a 1.2 DMIPS/MHz core delivering up to 96 DMIPS at 80 MHz. The integrated USB 2.0 full-speed OTG transceiver eliminates the need for an external PHY, while the 28-channel 10-bit ADC with 1 Msps throughput supports mixed-signal acquisition.
The PIC32MX450F128H architecture combines a Harvard bus structure with a 5-stage pipeline, single-cycle 32x32 hardware multiplier, and zero-overhead hardware debug interface. The -V (automotive) variant supports an extended junction temperature range suitable for under-hood and AEC-Q100 qualified designs.
Typical applications include USB peripherals and HID devices, automotive body controllers, industrial sensor hubs, low-cost graphical HMI with PMP, and consumer appliances requiring 32-bit performance with USB connectivity. The wide peripheral mix allows BOM reduction by integrating ADC, comparators, and USB on-chip.
When designing with this MCU, ensure the 64-QFN exposed pad is soldered to a sufficient copper pour (minimum 1 square inch of 1 oz copper) to meet thermal resistance specification. Use the internal 8 MHz FRC with PLL configuration for low-EMI designs, and enable the JTAG/SWD trace interface for boundary-scan testing.
This page synthesizes distributor pricing, automotive-grade drop-in alternatives, and practical PCB layout notes not consolidated on the manufacturer product page.
Alternatives de remplacement direct pour PIC32MX450F128HT-V/RG — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec PIC32MX450F128HT-V/RG (même facteur de forme et même empreinte) — différant par Package, USB, Core Architecture, ADC, DMA Channels.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
PIC32MX450F128H-V/RG
✅ Remplacement direct✓ En stock
$4.32 / unité
Voir la fiche technique →PIC32MX450F128HT-I/RG
✅ Remplacement direct✓ En stock
$4.15 / unité
Voir la fiche technique →PIC32MX450F128H-I/RG
✅ Remplacement direct✓ En stock
$2.79 / unité
Voir la fiche technique →PIC32MX450F128HT-I/MR
✅ Remplacement direct✓ En stock
$2.81 / unité
Voir la fiche technique →PIC32MX450F128H-I/MR
✅ Remplacement direct✓ En stock
$4.1 / unité
Voir la fiche technique →PIC32MX440F128HT-80I/MR
✅ Remplacement direct✓ En stock
$4.3 / unité
Voir la fiche technique →PIC32MX450F128HT-V/RG Valeurs maximales et caractéristiques électriques
| Core Architecture | MIPS32 M4K, 32-bit RISC |
| Core Frequency | 80 MHz max |
| Performance | 1.2 DMIPS/MHz (96 DMIPS @ 80 MHz) |
| Program Flash | 128 KB (128K x 8) |
| SRAM | 16 KB |
| Boot Flash | 8 KB |
| Operating Voltage | 2.3 V to 3.6 V |
| I/O Pins | 53 (approximate) |
| Boîtier | 64-QFN (9x9 mm) with exposed pad |
| Temperature Range | -40C to +105C (V-grade, automotive) |
| USB | USB 2.0 Full-Speed OTG, integrated transceiver |
| I2C | 2 channels |
| SPI / I2S | 2 channels (SPI with I2S mode) |
| UART | 5 channels |
| ADC | 10-bit, 28 channels, 1 Msps |
| Comparators | 2 analog comparators |
| RTCC | Yes |
| DMA | Yes |
| PMP | Parallel Master Port |
| Type de montage | Surface Mount |
| Niveau MSL | 3 |
| Statut RoHS | Compliant |
Configuration des broches de PIC32MX450F128HT-V/RG
| Broche 1 | RB9 — General purpose I/O / PWM |
| Broche 2 | RA0 — General purpose I/O |
| Broche 3 | RA1 — General purpose I/O |
| Broche 4 | RA2 — General purpose I/O |
| Broche 5 | RA3 — General purpose I/O |
| Broche 6 | RA4 — General purpose I/O |
| Broche 7 | AVDD — Analog supply |
| Broche 8 | AVSS — Analog ground |
| Broche 9 | RA5 — General purpose I/O |
| Broche 10 | RA6 — General purpose I/O |
| Broche 11 | RA7 — General purpose I/O |
| Broche 12 | RB10 — General purpose I/O |
| Broche 13 | RB11 — General purpose I/O |
| Broche 14 | RB12 — General purpose I/O |
| Broche 15 | RB13 — General purpose I/O |
| Broche 16 | RB14 — General purpose I/O |
| Broche 17 | RB15 — General purpose I/O |
| Broche 18 | VSS — Ground |
| Broche 19 | VDD — Digital supply |
| Broche 20 | RC0 — General purpose I/O |
| Broche 21 | RC1 — General purpose I/O |
| Broche 22 | RC2 — General purpose I/O |
| Broche 23 | RC3 — General purpose I/O |
| Broche 24 | RC4 — General purpose I/O |
| Broche 25 | RC5 — General purpose I/O |
| Broche 26 | RC6 — General purpose I/O |
| Broche 27 | RC7 — General purpose I/O |
| Broche 28 | RC8 — General purpose I/O |
| Broche 29 | RC9 — General purpose I/O |
| Broche 30 | VDD — Digital supply |
| Broche 31 | VSS — Ground |
| Broche 32 | RD0 — General purpose I/O |
| Broche 33 | RD1 — General purpose I/O |
| Broche 34 | RD2 — General purpose I/O |
| Broche 35 | RD3 — General purpose I/O |
| Broche 36 | RD4 — General purpose I/O |
| Broche 37 | RD5 — General purpose I/O |
| Broche 38 | RD6 — General purpose I/O |
| Broche 39 | RD7 — General purpose I/O |
| Broche 40 | RD8 — General purpose I/O |
| Broche 41 | RD9 — General purpose I/O |
| Broche 42 | RD10 — General purpose I/O |
| Broche 43 | RD11 — General purpose I/O |
| Broche 44 | RD12 — General purpose I/O |
| Broche 45 | RD13 — General purpose I/O |
| Broche 46 | RD14 — General purpose I/O |
| Broche 47 | RD15 — General purpose I/O |
| Broche 48 | VSS — Ground |
| Broche 49 | VDD — Digital supply |
| Broche 50 | RF0 — General purpose I/O |
| Broche 51 | RF1 — General purpose I/O |
| Broche 52 | RF2 — General purpose I/O |
| Broche 53 | RF3 — General purpose I/O |
| Broche 54 | RF4 — General purpose I/O |
| Broche 55 | RF5 — General purpose I/O |
| Broche 56 | RF6 — General purpose I/O / USB D- |
| Broche 57 | RF7 — General purpose I/O / USB D+ |
| Broche 58 | RG0 — General purpose I/O |
| Broche 59 | RG1 — General purpose I/O |
| Broche 60 | RG6 — General purpose I/O |
| Broche 61 | RG7 — General purpose I/O |
| Broche 62 | RG8 — General purpose I/O |
| Broche 63 | RG9 — General purpose I/O |
| Broche 64 | EP — Exposed pad (must be soldered to ground plane) |
Applications typiques
PIC32MX450F128HT-V/RG convient pour 6 applications: USB HID Peripherals, Automotive Body Controllers, Industrial Sensor Hubs, Low-Cost Graphical HMI, Consumer Appliances with USB, Data Acquisition Front Ends.
USB HID Peripherals
The PIC32MX450F128HT-V/RG is well suited for USB Human Interface Devices because its integrated USB 2.0 Full-Speed OTG transceiver eliminates the need for an external PHY. With 128 KB Flash, 16 KB SRAM, and 80 MHz MIPS32 M4K core, the MCU can run Microchip's USB stack, HID class driver, and button-report parser without external components. The 53 GPIO support up to a 15-key matrix plus indicator LEDs. Automotive -V grade enables USB charging-port modules and HID key fobs in cabin electronics.
Recommandé
Automotive Body Controllers
The automotive -V temperature grade (-40C to +105C) plus AEC-Q100 qualification make PIC32MX450F128HT-V/RG suitable for body control modules controlling lighting, mirrors, and seat-position memories. The 28-channel 10-bit ADC reads multiple sensor inputs (current shunts, temperature sensors), while the 2 analog comparators handle fault detection. Five UARTs bridge to CAN or LIN transceivers for in-vehicle networking. 64-QFN 9x9 mm footprint fits compact ECU housings with the exposed pad soldered to a copper pour.
Recommandé
Industrial Sensor Hubs
The PIC32MX450F128HT-V/RG integrates a 28-channel ADC, two comparators, five UARTs, two I2C, and two SPI ports in a single 64-QFN chip, making it efficient as a multi-sensor industrial hub. The 80 MHz MIPS32 core runs at 96 DMIPS, sufficient for sensor-fusion algorithms and Modbus RTU master logic on RS-485 links. Automotive qualification provides margin for factory-floor temperature swings, and 16 KB SRAM supports 200+ Hz sensor update rates without external memory.
Recommandé
Low-Cost Graphical HMI
The Parallel Master Port (PMP) on the PIC32MX450F128HT-V/RG interfaces directly to graphical LCD or OLED displays without an external controller IC, lowering BOM cost for simple HMI panels. With 128 KB Flash and 16 KB SRAM, the MCU can render menus, animations, and localized strings on 320x240 TFT panels. DMA offloads pixel transfers to free the CPU for touch-input processing via the integrated ADC channels and I2C touch controllers.
Recommandé
Consumer Appliances with USB
USB firmware-upgrade and data-logging capabilities are increasingly required in consumer appliances like coffee machines, robotic vacuums, and air purifiers. The PIC32MX450F128HT-V/RG's integrated USB OTG supports DFU class firmware updates and CDC virtual COM for diagnostics without an external bridge IC. The 64-QFN (9x9 mm) footprint fits appliance PCBs, and the wide 2.3-3.6V supply tolerates battery or USB-bus power directly.
Recommandé
Data Acquisition Front Ends
Multi-channel analog front-end systems benefit from the PIC32MX450F128HT-V/RG's 28-channel 10-bit ADC with 1 Msps aggregate throughput, dual comparators for windowed threshold detection, and DMA for streaming samples to RAM. The 16 KB SRAM buffers 8x oversampled data, while USB OTG offloads captured waveforms to a host PC. Automotive -V grade ensures accuracy is maintained in -40C to +105C environmental testing and EMI environments.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour PIC32MX450F128HT-V/RG — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | PIC32MX450F128H-V/RG | PIC32MX450F128HT-I/RG | PIC32MX450F128H-I/RG | PIC32MX440F128HT-80I/MR |
|---|---|---|---|---|---|
| Package | 64-QFN (9x9 mm) | 64-QFN (9x9 mm) - same | 64-QFN (9x9 mm) - same | 64-QFN (9x9 mm) - same | 64-QFN (9x9 mm) - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Core Frequency | 80 MHz | 80 MHz | 80 MHz | 80 MHz | 80 MHz |
| Flash Memory | 128 KB | 128 KB | 128 KB | 128 KB | 128 KB |
| SRAM | 16 KB | 16 KB | 16 KB | 16 KB | 32 KB |
| Temperature Grade | -V (Automotive, -40C to +105C) | -V (Automotive) | -I (Industrial, -40C to +85C) | -I (Industrial) | -I (Industrial) |
| USB OTG | Yes (USB 2.0 Full-Speed) | Yes | Yes | Yes | No |
| ADC Channels | 28 channels, 10-bit | 28 channels, 10-bit | 28 channels, 10-bit | 28 channels, 10-bit | 13 channels, 10-bit |
| I2C / SPI / UART | 2 / 2 / 5 | 2 / 2 / 5 | 2 / 2 / 5 | 2 / 2 / 5 | 2 / 2 / 5 |
Principaux différenciateurs
- Integrated USB OTG with on-chip transceiver (vs PIC32MX440F128HT-80I/MR)
- Automotive -V temperature qualification (vs PIC32MX450F128HT-I/RG)
- 28-channel ADC versus 13-channel on older PIC32MX440 (vs PIC32MX440F128HT-80I/MR)
Notes de conception
The 64-QFN (9x9 mm) package uses an exposed thermal pad (pin 64) that MUST be soldered to a ground copper pour to meet datasheet thermal resistance specification. Estimated: with a 1 square inch 1 oz copper pour on a 4-layer FR-4 board, theta_JA is approximately 28 C/W; without the pad soldered, the junction can rise 50+ C above ambient at full 80 MHz operation. For automotive -V deployments running at sustained loads, add thermal vias under the exposed pad to inner ground planes.
USB differential pair (D-/D+ on pins RF6/RF7) requires 90 ohm differential impedance matching with traces no longer than approximately 50 mm, and a common-mode choke for EMI compliance. Per Microchip PIC32MX USB design guidelines, place the 27 ohm series termination resistors close to the MCU pins and route the differential pair over a continuous ground plane. Decoupling: place one 100 nF ceramic per VDD/VSS pair within 3 mm of the pin, plus a bulk 4.7 uF tantalum or ceramic near the regulator.
Do not exceed 3.6V on any I/O pin; the PIC32MX450 is a 3.3V-only part with 5V tolerance only on specific pins. Per datasheet DS60001168, when migrating from PIC32MX3 to PICMX4, ensure your 128 KB Flash layout fits the new memory map - some legacy code addresses bootloader Flash at 0xBFC00000-0xBFC01FFF. Configure unused I/O as outputs driven low to minimize supply current; floating inputs can draw 50 uA each and degrade sleep-mode performance.
The 80 MHz core generates harmonics up to 400 MHz, requiring careful PCB stackup for 4-layer designs. Use a 0.2 mm dielectric between top signal layer and second-layer ground plane to maintain controlled impedance on high-speed traces (USB, SPI at 25 MHz+). Place the 32.768 kHz crystal for RTCC close to the SOSC pins with a grounded guard ring to avoid coupling noise from the 80 MHz core harmonics.
Informations de conformité
RoHS compliant per Microchip product page. -V temperature suffix indicates AEC-Q100 qualification for automotive applications. Lead-free and halogen-free packaging confirmed by Microchip material declarations.
