PIC32MZ0512EFF064-E/MR - 200MHz 32-bit MCU 512KB Flash | Microchip
Référence : PIC32MZ0512EFF064-E/MR ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $8.96 | $8,96 |
| 10 | $8.06 | $80,60 |
| 100 | $7.17 | $717,00 |
| 500 | $6.45 | $3 225,00 |
| 1 000 | $5.74 | $5 740,00 |
PIC32MZ0512EFF064-E/MR Présentation
An MCU (Microcontroller Unit) is a single-chip computer that integrates a CPU core, memory (Flash + SRAM), and peripherals into one package. PIC32 microcontrollers are 32-bit MIPS-based MCUs with deterministic real-time performance. The PIC32MZ EF family adds a Floating Point Unit (FPU) and a MIPS Warrior M-class DSP-enhanced core to accelerate single-cycle MAC, saturating and fractional math operations in compliance with IEEE 754. In the broader taxonomy: MCU -> Microcontroller -> Embedded Processor -> Semiconductor -> Integrated Circuit.
Key differentiating features include 200 MHz / 330 DMIPS core performance, IEEE 754-compliant FPU for fast single/double-precision math, four 64-bit accumulators, single-cycle MAC, and dual-panel Flash for live-update support. The device integrates Hi-Speed USB, 10/100 Ethernet MAC, CAN, SQI (Serial Quad Interface), and 12-bit ADC, providing extensive connectivity for industrial IoT gateways, automotive dashboards, and audio/graphics HMI applications.
The PIC32MZ0512EFF064-E/MR is built on a low-power CMOS process and supports an extended temperature range suitable for harsh environments. The variant name decodes as follows: -E/ suffix denotes the -40C to +125C extended industrial temperature grade, /MR denotes the 64-pin QFN package. The device is also available without crypto acceleration for designs that don't require it.
Typical applications include industrial control panels, IoT edge gateways with Ethernet connectivity, automotive instrument clusters, motor control inverters, and graphic HMI displays with touch. The 64-pin QFN package is suitable for compact designs where the 252 MHz-capable PIC32MZ EF family variants are also available.
When designing with this MCU, allocate adequate decoupling (0.1 uF + bulk) near each VDD pin and follow the High-Speed USB and Ethernet PCB layout guidelines in the family reference manual. The QFN package has an exposed thermal pad that must be soldered to the ground plane for thermal dissipation and electrical performance.
This page synthesizes distributor pricing, parametric drop-in alternatives, and practical design notes - information not consolidated in the manufacturer datasheet alone.
Alternatives de remplacement direct pour PIC32MZ0512EFF064-E/MR — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec PIC32MZ0512EFF064-E/MR (même facteur de forme et même empreinte) — différant par ADC, Core Architecture, Package, FPU, USB.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
PIC32MZ0512EFE064-E/MR
✅ Remplacement direct✓ En stock
$6.86 / unité
Voir la fiche technique →PIC32MZ0512EFF064T-E/MR
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
PIC32MZ0512EFE064-E/MR
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
$6.86 / unité
Voir la fiche technique →PIC32MZ0512EFF064-E/MR Valeurs maximales et caractéristiques électriques
| Core Architecture | MIPS32 M-Class (MIPS Warrior) |
| Core Frequency | 200 MHz (330 DMIPS) |
| FPU | IEEE 754-compliant (single/double precision) |
| DSP Extensions | Four 64-bit accumulators, single-cycle MAC |
| Program Flash | 512 KB (dual panel, live update support) |
| SRAM | 128 KB |
| Boîtier | QFN-64 (MR) 9x9 mm with exposed pad |
| Operating Voltage | 2.3 V to 3.6 V |
| Temperature Grade | Extended -40C to +125C (suffix -E) |
| Communication Interfaces | Hi-Speed USB, 10/100 Ethernet MAC, CAN, SQI, UART, SPI, I2C |
| ADC | 12-bit |
| Crypto Accelerator | No (No Crypto variant) |
| Type de montage | Surface Mount |
| Statut RoHS | Compliant |
Configuration des broches de PIC32MZ0512EFF064-E/MR
| Broche 1 | RB15 — General purpose I/O / analog |
| Broche 2 | VSS — Ground |
| Broche 3 | VDD — Core voltage supply |
| Broche 4 | OSC1 — Crystal oscillator input |
| Broche 5 | OSC2 — Crystal oscillator output |
| Broche 6 | RB14 — General purpose I/O |
| Broche 7 | RB13 — General purpose I/O |
| Broche 8 | RB12 — General purpose I/O |
| Broche 9 | RB11 — General purpose I/O |
| Broche 10 | RB10 — General purpose I/O |
| Broche 11 | VSS — Ground |
| Broche 12 | VDD — Core voltage supply |
| Broche 13 | RB9 — General purpose I/O |
| Broche 14 | RB8 — General purpose I/O |
| Broche 15 | RB7 — General purpose I/O |
| Broche 16 | RB6 — General purpose I/O / Programming |
| Broche 17 | RB5 — General purpose I/O |
| Broche 18 | RB4 — General purpose I/O |
| Broche 19 | RB3 — General purpose I/O |
| Broche 20 | RB2 — General purpose I/O |
| Broche 21 | RB1 — General purpose I/O |
| Broche 22 | RB0 — General purpose I/O |
| Broche 23 | VSS — Ground |
| Broche 24 | VDD — Core voltage supply |
| Broche 25 | RA15 — General purpose I/O |
| Broche 26 | RA14 — General purpose I/O |
| Broche 27 | RA13 — General purpose I/O |
| Broche 28 | RA12 — General purpose I/O |
| Broche 29 | RA11 — General purpose I/O |
| Broche 30 | RA10 — General purpose I/O |
| Broche 31 | RA9 — General purpose I/O |
| Broche 32 | VSS — Ground |
| Broche 33 | VDD — Core voltage supply |
| Broche 34 | RA8 — General purpose I/O |
| Broche 35 | RA7 — General purpose I/O |
| Broche 36 | RA6 — General purpose I/O |
| Broche 37 | RA5 — General purpose I/O |
| Broche 38 | RA4 — General purpose I/O |
| Broche 39 | RA3 — General purpose I/O |
| Broche 40 | RA2 — General purpose I/O |
| Broche 41 | RA1 — General purpose I/O |
| Broche 42 | RA0 — General purpose I/O |
| Broche 43 | VSS — Ground |
| Broche 44 | VDD — Core voltage supply |
| Broche 45 | RF13 — General purpose I/O |
| Broche 46 | RF12 — General purpose I/O |
| Broche 47 | RF5 — General purpose I/O |
| Broche 48 | RF4 — General purpose I/O |
| Broche 49 | RF3 — General purpose I/O |
| Broche 50 | RF2 — General purpose I/O |
| Broche 51 | RF1 — General purpose I/O |
| Broche 52 | RF0 — General purpose I/O |
| Broche 53 | VSS — Ground |
| Broche 54 | VDD — Core voltage supply |
| Broche 55 | RD15 — General purpose I/O |
| Broche 56 | RD14 — General purpose I/O |
| Broche 57 | RD13 — General purpose I/O |
| Broche 58 | RD12 — General purpose I/O |
| Broche 59 | RD11 — General purpose I/O |
| Broche 60 | RD10 — General purpose I/O |
| Broche 61 | RD9 — General purpose I/O |
| Broche 62 | RD8 — General purpose I/O |
| Broche 63 | RC15 — General purpose I/O |
| Broche 64 | RC14 — General purpose I/O |
| Broche 65 | EP — Exposed thermal pad - connect to ground |
Applications typiques
PIC32MZ0512EFF064-E/MR convient pour 6 applications: Industrial IoT Gateways, Motor Control Inverters, Automotive Instrument Clusters, Graphic HMI Touch Displays, Audio Processing Devices, IoT Sensor Hubs.
Industrial IoT Gateways
The PIC32MZ0512EFF064-E/MR is well suited for industrial IoT gateways because its integrated 10/100 Ethernet MAC and Hi-Speed USB enable simultaneous wired networking and device-side USB host/device connectivity. The 200 MHz MIPS core with FPU and DSP extensions handles TCP/IP stack processing (lwIP or Harmony Net) and edge-protocol parsing without offloading. With 512 KB of Flash and 128 KB of SRAM, the device can run an RTOS plus TLS, MQTT, and Modbus stacks concurrently. Place a 25 MHz crystal near the MCU, follow the Ethernet MII/RMII PCB layout guidelines from the family reference manual, and add TVS diodes on the Ethernet lines for surge protection in factory environments.
Recommandé
Motor Control Inverters
For motor control applications, the PIC32MZ0512EFF064-E/MR combines DSP extensions (four 64-bit accumulators and single-cycle MAC) with a 200 MHz core to implement field-oriented control (FOC) loops for PMSM and BLDC motors. The 12-bit ADC with DMA support samples phase currents at high rates, while PWM outputs drive the inverter stage. The QFN-64 package is compact for integrated motor-driver boards, and the extended -40C to +125C temperature grade handles under-hood automotive and industrial environments. Designers typically pair this MCU with three-phase gate drivers such as the Microchip MCP8026 or external FET bridges for sub-1 kW drives.
Recommandé
Automotive Instrument Clusters
The PIC32MZ0512EFF064-E/MR's 200 MHz performance, integrated CAN 2.0B, and 12-bit ADC make it a capable MCU for automotive instrument cluster designs where it drives segmented or small TFT displays over SPI/parallel. The extended -40C to +125C temperature grade supports cabin and under-hood thermal profiles. The DSP extensions accelerate graphic rendering and gauge needle smoothing algorithms. For AEC-Q100 qualified variants, Microchip offers /VAO automotive parts; engineers can also pair this MCU with the PIC32MX secondary controller for backlight/keypad handling. The QFN-64 footprint keeps the PCB compact behind the cluster dial.
Recommandé
Graphic HMI Touch Displays
The PIC32MZ0512EFF064-E/MR drives small-to-medium HMI displays with touch using its parallel display interface and integrated SQI for fast external QSPI Flash lookup of graphics assets. The 512 KB of Flash stores UI assets and font tables, while 128 KB of SRAM holds the framebuffer for sub-3-inch displays. The MIPS DSP extensions help with image scaling and rotation effects. The MCU's Hi-Speed USB enables firmware updates and configuration upload over USB, and the Ethernet MAC supports remote diagnostics. Combine with Microchip's MPLAB Harmony Graphics suite for drop-in widgets.
Recommandé
Audio Processing Devices
Audio applications benefit from the PIC32MZ0512EFF064-E/MR's 200 MHz MIPS core with DSP extensions for real-time effects processing. The 12-bit ADC and PWM outputs support simple DAC and Class-D amplification paths, while I2S interfaces connect to external audio codecs. Microchip's audio frameworks (Microchip audio library, USB Audio Class) accelerate development of USB speakers and audio mixers. The 128 KB SRAM is sufficient for 16-bit 48 kHz audio buffers. For higher fidelity, route I2S to external 24-bit codecs rather than using the internal 12-bit ADC.
Recommandé
IoT Sensor Hubs
The PIC32MZ0512EFF064-E/MR acts as a sensor hub aggregating I2C, SPI, and analog sensor data and forwarding it over Ethernet, USB, or CAN. The SQI interface supports fast external Flash for data logging, and the 12-bit ADC reads analog sensors directly. With MPLAB Harmony and FreeRTOS, the MCU can manage sensor sampling, local filtering, and edge-protocol publishing concurrently. The compact QFN-64 footprint enables integration into small enclosure designs for industrial monitoring or smart-building sensor boxes.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour PIC32MZ0512EFF064-E/MR — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | PIC32MZ0512EFE064-E/MR | PIC32MZ0512EFF064T-E/MR |
|---|---|---|---|
| Package | QFN-64 (MR) 9x9 mm | QFN-64 (MR) 9x9 mm - same | QFN-64 (MR) 9x9 mm - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology |
| Core Frequency | 200 MHz | 200 MHz | 200 MHz |
| Flash | 512 KB | 512 KB | 512 KB |
| SRAM | 128 KB | 128 KB | 128 KB |
| Crypto Accelerator | No | Yes (AES/SHA/RNG) | No |
| Temperature Grade | -40C to +125C (E) | -40C to +125C (E) | -40C to +125C (E) |
| Ethernet + USB | 10/100 MAC + Hi-Speed USB | 10/100 MAC + Hi-Speed USB | 10/100 MAC + Hi-Speed USB |
Principaux différenciateurs
- Dual-panel Flash for live firmware updates (vs PIC32MZ0512EFE064-E/MR)
- Same-package drop-in tape-and-reel variant (vs PIC32MZ0512EFF064T-E/MR)
- Integrated Hi-Speed USB + Ethernet reduces BOM (vs External PHY + external MCU design)
Notes de conception
Place a 0.1 uF ceramic decoupling capacitor within 2 mm of every VDD pin and a single 10 uF bulk capacitor near the MCU. The QFN-64 package has multiple VDD/VSS pairs that each require local decoupling. The exposed thermal pad (EP) MUST be soldered to a ground plane with thermal vias for both electrical grounding and heat dissipation; a discontinuous ground plane under the EP will degrade ADC performance and EMC behavior.
Route the Ethernet MII/RMII traces as 50-ohm impedance-controlled differential pairs with matching lengths within 2 mm. Place the 25 MHz or 24 MHz crystal within 5 mm of the OSC1/OSC2 pins and guard it with a ground ring. For Hi-Speed USB, follow the 90-ohm differential impedance rule and avoid vias on the D+/D- lines. The SQI Flash signals should be length-matched within 1 mm for reliable high-speed operation.
Do not exceed 3.6 V on any VDD pin; the PIC32MZ EF family is NOT 5V tolerant on I/O. When using the Ethernet MAC, the external PHY must be configured for the same reference clock source (25 MHz vs 24 MHz) as the MCU; mismatch causes the MAC to lose link. Programming pins (PGECx/PGEDx) require a 4.7 kohm pull-up on MCLR for reliable ICSP. Estimated: device active current at 200 MHz is approximately 70 mA - budget the LDO accordingly.
Informations de conformité
RoHS and REACH compliant per Microchip product page. The -E/ temperature grade is extended industrial, not AEC-Q100 automotive grade; for AEC-Q100 qualified parts, choose the -VAO suffix variants.
