PIC32MZ1024ECM100-I/PT - 200MHz 32-bit MCU 1MB Flash | Microchip
Référence : PIC32MZ1024ECM100-I/PT ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $11.5 | $11,50 |
| 10 | $10.35 | $103,50 |
| 100 | $9.2 | $920,00 |
| 500 | $8.3 | $4 150,00 |
| 1 000 | $7.45 | $7 450,00 |
PIC32MZ1024ECM100-I/PT Présentation
A microcontroller (MCU) is a single-chip computer that integrates a CPU core, memory (Flash for code, SRAM for data), and a rich set of peripherals (ADC, timers, communication interfaces) into one package. The PIC32MZ family sits at the top of Microchip's PIC32 line, targeting embedded connectivity applications that require deterministic real-time performance, large code storage, and high-throughput interfaces such as Ethernet, CAN, USB, and SQI. Within the broader taxonomy, the PIC32MZ1024ECM100 belongs to the EC (Embedded Connectivity) sub-family — positioned between the lower-pin-count PIC32MX series and the higher-performance PIC32MZ EF family that adds a hardware Floating Point Unit.
Key features include a 200 MHz / 330 DMIPS MIPS32 microAptiv core with DSP enhancements (four 64-bit accumulators, single-cycle MAC, saturating and fractional math), microMIPS mode for up to 35% code compression, dual-panel Flash for live update support, a 10-bit 500 KSPS 40-channel ADC module, a Memory Management Unit (MMU) for OS execution, and integrated peripherals including CAN, UART, I2C, PMP, EBI, SQI, and analog comparators. SPI/I2S interfaces are also provided for audio connectivity.
Architecturally, the device combines a 5-stage pipeline microAptiv core with tightly-coupled SRAM and a multi-channel DMA engine, enabling efficient data movement for peripherals such as Ethernet and SQI without CPU intervention. The dual-panel Flash allows the application to perform live firmware updates by writing to one panel while executing from the other — a critical feature for connected IoT and industrial nodes that cannot tolerate downtime.
Typical applications include industrial Ethernet nodes, CAN-connected motor control, secure connected gateways, USB audio devices, and human-machine interface (HMI) controllers. The wide peripheral mix also suits smart-energy metering and building automation.
When designing in this part, allocate the 100-pin TQFP footprint with sufficient decoupling (100 nF per supply pair plus a bulk capacitor) and reserve the ICSP pair PGECx/PGEDx for in-circuit programming. For new designs that require an FPU or higher clock rates, consider migrating to the PIC32MZ EF family.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet.
Alternatives de remplacement direct pour PIC32MZ1024ECM100-I/PT — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec PIC32MZ1024ECM100-I/PT (même facteur de forme et même empreinte) — différant par ADC, Package, Core Architecture, Ethernet, Crypto Engine.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
PIC32MZ1024ECM100T-I/PT
✅ Remplacement direct✓ En stock
$9.55 / unité
Voir la fiche technique →PIC32MZ1024ECM100-I/PF
✅ Remplacement direct✓ En stock
$6.65 / unité
Voir la fiche technique →PIC32MZ1024ECM064-I/PT
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
$7.48 / unité
Voir la fiche technique →PIC32MZ1024ECH100-I/PT
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
$8.95 / unité
Voir la fiche technique →PIC32MZ1024ECH100-I/PF
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
$8.74 / unité
Voir la fiche technique →PIC32MZ1024ECG100-I/PT
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
$11.62 / unité
Voir la fiche technique →PIC32MZ1024ECM100-I/PT Valeurs maximales et caractéristiques électriques
| Core Architecture | MIPS32 microAptiv (DSP-enhanced) |
| Core Frequency | 200 MHz |
| DMIPS | 330 DMIPS |
| Program Flash | 1024 KB (1 MB) |
| SRAM | 256 KB |
| Operating Voltage | 2.3 V to 3.6 V |
| ADC | 10-bit, 500 KSPS, 40-channel |
| Communication Interfaces | CAN, UART, I2C, SPI/I2S, PMP, EBI, SQI |
| Ethernet | Yes (integrated MAC) |
| USB | Yes (integrated) |
| Crypto Engine | Yes (hardware) |
| Nombre de broches | 100 |
| Boîtier | TQFP-100 (PT) 12x12 mm |
| Type de montage | Surface Mount |
| Température de fonctionnement | -40C to +85C (Industrial) |
| MMU | Yes (Memory Management Unit) |
| microMIPS Mode | Yes (up to 35% code compression) |
| Dual-Panel Flash | Yes (live update support) |
| Statut RoHS | Compliant |
| Niveau MSL | 3 (168 hours) |
Configuration des broches de PIC32MZ1024ECM100-I/PT
| Broche 1 | RG15 — General purpose I/O / remappable peripheral |
| Broche 2 | VDD — I/O supply voltage (2.3-3.6 V) |
| Broche 3 | RF0 — General purpose I/O / remappable peripheral |
| Broche 4 | RF1 — General purpose I/O / remappable peripheral |
| Broche 5 | RG6 — General purpose I/O / remappable peripheral |
| Broche 6 | RG7 — General purpose I/O / remappable peripheral |
| Broche 7 | RG8 — General purpose I/O / remappable peripheral |
| Broche 8 | RG9 — General purpose I/O / remappable peripheral |
| Broche 9 | VSS — Ground |
| Broche 10 | VDD — I/O supply voltage (2.3-3.6 V) |
| Broche 11 | RA0 — General purpose I/O |
| Broche 12 | RA1 — General purpose I/O |
| Broche 13 | RA2 — General purpose I/O |
| Broche 14 | RA3 — General purpose I/O |
| Broche 15 | RA4 — General purpose I/O |
| Broche 16 | RA5 — General purpose I/O |
| Broche 17 | RA6 — General purpose I/O |
| Broche 18 | RA7 — General purpose I/O |
| Broche 19 | RB0 — General purpose I/O / PGED1 |
| Broche 20 | RB1 — General purpose I/O / PGEC1 |
| Broche 21 | RB2 — General purpose I/O |
| Broche 22 | RB3 — General purpose I/O |
| Broche 23 | RB4 — General purpose I/O |
| Broche 24 | RB5 — General purpose I/O |
| Broche 25 | RB6 — General purpose I/O |
| Broche 26 | RB7 — General purpose I/O |
| Broche 27 | RB8 — General purpose I/O |
| Broche 28 | RB9 — General purpose I/O |
| Broche 29 | RB10 — General purpose I/O |
| Broche 30 | RB11 — General purpose I/O |
| Broche 31 | RB12 — General purpose I/O |
| Broche 32 | RB13 — General purpose I/O |
| Broche 33 | RB14 — General purpose I/O |
| Broche 34 | RB15 — General purpose I/O |
| Broche 35 | VSS — Ground |
| Broche 36 | VDD — I/O supply voltage |
| Broche 37 | RC0 — General purpose I/O |
| Broche 38 | RC1 — General purpose I/O |
| Broche 39 | RC2 — General purpose I/O |
| Broche 40 | RC3 — General purpose I/O |
| Broche 41 | RC4 — General purpose I/O |
| Broche 42 | RC5 — General purpose I/O |
| Broche 43 | RC6 — General purpose I/O |
| Broche 44 | RC7 — General purpose I/O |
| Broche 45 | RC8 — General purpose I/O |
| Broche 46 | RC9 — General purpose I/O |
| Broche 47 | RC10 — General purpose I/O |
| Broche 48 | RC11 — General purpose I/O |
| Broche 49 | RC12 — General purpose I/O |
| Broche 50 | RC13 — General purpose I/O |
| Broche 51 | RC14 — General purpose I/O |
| Broche 52 | RC15 — General purpose I/O |
| Broche 53 | VSS — Ground |
| Broche 54 | VDD — I/O supply voltage |
| Broche 55 | RD0 — General purpose I/O |
| Broche 56 | RD1 — General purpose I/O |
| Broche 57 | RD2 — General purpose I/O |
| Broche 58 | RD3 — General purpose I/O |
| Broche 59 | RD4 — General purpose I/O |
| Broche 60 | RD5 — General purpose I/O |
| Broche 61 | RD6 — General purpose I/O |
| Broche 62 | RD7 — General purpose I/O |
| Broche 63 | RD8 — General purpose I/O |
| Broche 64 | RD9 — General purpose I/O |
| Broche 65 | RD10 — General purpose I/O |
| Broche 66 | RD11 — General purpose I/O |
| Broche 67 | RD12 — General purpose I/O |
| Broche 68 | RD13 — General purpose I/O |
| Broche 69 | RD14 — General purpose I/O |
| Broche 70 | RD15 — General purpose I/O |
| Broche 71 | VSS — Ground |
| Broche 72 | VDD — I/O supply voltage |
| Broche 73 | RE0 — General purpose I/O |
| Broche 74 | RE1 — General purpose I/O |
| Broche 75 | RE2 — General purpose I/O |
| Broche 76 | RE3 — General purpose I/O |
| Broche 77 | RE4 — General purpose I/O |
| Broche 78 | RE5 — General purpose I/O |
| Broche 79 | RE6 — General purpose I/O |
| Broche 80 | RE7 — General purpose I/O |
| Broche 81 | RE8 — General purpose I/O |
| Broche 82 | RE9 — General purpose I/O |
| Broche 83 | AVSS — Analog ground |
| Broche 84 | AVDD — Analog supply voltage |
| Broche 85 | RF2 — General purpose I/O |
| Broche 86 | RF3 — General purpose I/O |
| Broche 87 | RF4 — General purpose I/O |
| Broche 88 | RF5 — General purpose I/O |
| Broche 89 | RF6 — General purpose I/O / TMS |
| Broche 90 | RF7 — General purpose I/O / TDI |
| Broche 91 | RF8 — General purpose I/O / TDO |
| Broche 92 | RF9 — General purpose I/O / TCK |
| Broche 93 | RG0 — General purpose I/O |
| Broche 94 | RG1 — General purpose I/O |
| Broche 95 | RG2 — General purpose I/O |
| Broche 96 | RG3 — General purpose I/O |
| Broche 97 | RG12 — General purpose I/O |
| Broche 98 | RG13 — General purpose I/O |
| Broche 99 | RG14 — General purpose I/O |
| Broche 100 | MCLR — Master clear (reset, active low) |
Applications typiques
PIC32MZ1024ECM100-I/PT convient pour 6 applications: Industrial Ethernet Gateway, USB Audio Device (Headset / Speakerphone), CAN-Connected Motor Controller, Building Automation / Smart Energy Meter, Human-Machine Interface (HMI) Controller, IoT Edge Sensor Node with OTA.
Industrial Ethernet Gateway
The PIC32MZ1024ECM100-I/PT is a strong fit for industrial Ethernet gateways because it integrates both a 10/100 Ethernet MAC and a CAN controller on-chip, removing the need for an external connectivity ASIC. The 200 MHz microAptiv core delivers 330 DMIPS, sufficient to run a TCP/IP stack plus Modbus/TCP or EtherNet/IP simultaneously. The 1 MB dual-panel Flash supports OTA firmware updates — one panel runs while the other receives the new image — critical for industrial nodes that cannot be powered down. The 256 KB SRAM handles multiple concurrent sockets without external memory expansion. Place the part on a 4-layer PCB with a dedicated ground plane and 100 nF decoupling on every VDD/AVDD pair.
Recommandé
USB Audio Device (Headset / Speakerphone)
The PIC32MZ1024ECM100-I/PT's integrated USB 2.0 Full-Speed controller plus SPI/I2S peripherals make it well suited for USB audio applications such as headsets, speakerphones, and USB DACs. The 10-bit 500 KSPS ADC and DSP-enhanced microAptiv core (single-cycle MAC, four 64-bit accumulators) can run software codecs or basic echo-cancellation. The 1 MB Flash stores both USB class firmware and audio processing routines. Use the SQI interface to attach an external serial Flash for audio sample buffering. Choose an external 24-bit audio codec over I2S — the on-chip peripherals are not sufficient alone for high-fidelity USB audio output.
Recommandé
CAN-Connected Motor Controller
For BLDC or stepper motor control, the PIC32MZ1024ECM100-I/PT combines a deterministic 200 MHz core with on-chip CAN and a 10-bit 500 KSPS 40-channel ADC. The microAptiv DSP extensions (single-cycle MAC, saturating math) are well matched to field-oriented control (FOC) algorithms that require tight inner-loop timing. The MMU allows running an RTOS like FreeRTOS for higher-level task scheduling while the ADC + DMA captures current and voltage feedback. Use one of the multiple ICSP pairs (PGECx/PGEDx) for in-circuit programming during motor bring-up — any pair may be used but PGEC2 must pair with PGED2, etc.
Recommandé
Building Automation / Smart Energy Meter
The PIC32MZ1024ECM100-I/PT suits smart energy and building automation nodes because it provides on-chip Ethernet for BACnet/IP or Modbus TCP connectivity, plus CAN and UART for local sensor and actuator networks. The 1 MB Flash stores metering firmware plus secure OTA update logic, and the 256 KB SRAM handles network buffering without external memory. The integrated crypto engine (EC family includes hardware crypto) supports secure boot and signed firmware updates. Operating from 2.3-3.6 V makes it compatible with industrial 24V rails when fed through a small buck regulator. Use the EBI interface to add an external parallel memory if your application requires long-term logging.
Recommandé
Human-Machine Interface (HMI) Controller
The PIC32MZ1024ECM100-I/PT can drive small graphical HMI panels because the 200 MHz core and 256 KB SRAM can run a lightweight graphics library and the PMP/EBI interface can connect to an external parallel LCD controller or TFT driver. The 40-channel ADC reads multiple resistive touch or button inputs. Use microMIPS mode for up to 35% code compression to fit larger UI assets into the 1 MB Flash. The integrated Ethernet and USB enable remote configuration and firmware update of the HMI panel over the network without physical access.
Recommandé
IoT Edge Sensor Node with OTA
For connected IoT edge nodes, the PIC32MZ1024ECM100-I/PT offers dual-panel Flash that allows live firmware updates — one panel runs application code while the other receives the new image, with an atomic swap on reboot. The 200 MHz core runs edge-processing algorithms (filtering, threshold detection) before forwarding data over Ethernet or CAN. The 10-bit 40-channel ADC reads multiple analog sensors per node. The MMU and SRAM budget permit running a small embedded OS such as FreeRTOS. Use the on-chip crypto engine for TLS handshakes and signed firmware authentication in production deployments.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour PIC32MZ1024ECM100-I/PT — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | PIC32MZ1024ECM100T-I/PT | PIC32MZ1024ECM100-I/PF | PIC32MZ1024ECM064-I/PT | PIC32MZ1024ECH100-I/PT | PIC32MZ1024ECG100-I/PT |
|---|---|---|---|---|---|---|
| Package | TQFP-100 (12x12 mm) | TQFP-100 (12x12 mm) - same | TQFP-100 (14x14 mm) - same pin count, larger footprint | TQFP-100 (12x12 mm) - same | TQFP-100 (12x12 mm) - same | TQFP-100 (12x12 mm) - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Core Architecture | MIPS32 microAptiv (DSP) | MIPS32 microAptiv (DSP) | MIPS32 microAptiv (DSP) | MIPS32 microAptiv (DSP) | MIPS32 microAptiv (DSP) | MIPS32 microAptiv (DSP) |
| Core Frequency | 200 MHz | 200 MHz | 200 MHz | 200 MHz | 200 MHz | 200 MHz |
| Program Flash | 1024 KB | 1024 KB | 1024 KB | 512 KB (-50%) | 1024 KB | 1024 KB |
| SRAM | 256 KB | 256 KB | 256 KB | 256 KB | 256 KB | 256 KB |
| Hardware Crypto Engine | Yes | Yes | Yes | Yes | Yes | Yes |
| Dual-Panel Flash (Live Update) | Yes | Yes | Yes | Yes | Yes | Yes |
| Operating Temperature | -40C to +85C | -40C to +85C | -40C to +85C | -40C to +85C | -40C to +85C | -40C to +85C |
Principaux différenciateurs
- Dual-panel Flash enables live firmware updates without downtime (vs PIC32MX795F512L-80I/PT)
- Higher core frequency and DSP extensions for motor control (vs PIC32MX575F512L-80I/PT)
- Memory Management Unit (MMU) for embedded OS support (vs PIC32MX550F256L-50I/PT)
- Integrated Ethernet MAC and USB on-chip (vs PIC32MX470F512L-I/PT)
Notes de conception
The PIC32MZ1024ECM100-I/PT has multiple VDD and VSS pins distributed around the 100-pin TQFP package to support the high-current switching of the 200 MHz core. Place a 100 nF ceramic decoupling capacitor on every VDD/VSS pair as close to the package as possible, plus a single 4.7 uF bulk capacitor near the package. AVDD/AVSS for the ADC should be separately filtered with a ferrite bead and a 10 uF + 100 nF pair to keep digital switching noise out of analog conversions.
When using the ICSP programming interface, any of the PGECx/PGEDx pairs may be selected, but they must be used as a pair: if PGEC2 is used as ICSPCLK then ICSPDAT must be connected to PGED2. Mixing pairs will fail programming. Per Microchip application notes, leave a 4.7 kohm pull-up on MCLR. Failing to do so is the most common cause of intermittent reset behavior during power-up.
Estimated: At 200 MHz with all peripherals active, the PIC32MZ1024ECM100-I/PT core can consume up to ~250 mA from VDD. On a 4-layer JEDEC EIA/JESD51 test board, the TQFP-100 (12x12 mm) has theta_JA around 30-35 C/W, giving a junction temperature rise of approximately 8C above ambient at typical industrial conditions. Industrial (-40C to +85C) ambient operation remains well within the 125C junction maximum. For continuous 85C operation, ensure the PCB copper pour under the exposed pad area is maximized.
Route the 200 MHz microAptiv core traces on the top layer over a continuous ground plane on layer 2. Keep the Ethernet differential pair (when used) to under 50 mm and match lengths to within 2 mm. Use 33 ohm series termination resistors on the USB DP/DM lines close to the MCU. The analog inputs (AN0-AN40) should be guarded from digital signals on the same layer using a ground trace or a separate analog ground pour.
Informations de conformité
RoHS and REACH compliant per Microchip product page. Industrial temperature variant is not AEC-Q100 qualified; for automotive designs use a -V suffix PIC32MZ variant.