R5F10FLCDNA#U0 - 32MHz 32KB 16-Bit MCU | Renesas
Référence : R5F10FLCDNA#U0 ✓ ActifR5F10FLCDNA#U0 Présentation
An MCU is a programmable semiconductor that combines a CPU, memory, and peripherals on one integrated circuit. Within the product hierarchy, this device is an RL78/G1E microcontroller, a 16-bit MCU, an embedded controller, and a semiconductor. The term flash memory describes the nonvolatile program storage that retains firmware when power is removed, while the 32 MHz operating rate establishes the device's principal digital-processing performance class.
The R5F10FLCDNA#U0 combines a 16-bit architecture, 32 MHz maximum operating frequency, and 32 KB flash program memory. Its 64-HWQFN package provides 64 electrical contacts in a compact 9 x 9 mm surface-mount outline. This combination makes the part relevant to embedded controls where processing capability, program density, and PCB area must be balanced in one device.
The RL78/G1E architecture targets embedded applications that benefit from efficient instruction execution and low-power system operation. Program storage is specified as 32 KB, arranged as 32K x 8 for eight-bit-wide data representation. The 32 MHz clock specification provides a useful basis for evaluating timing margins in control loops, communications interfaces, and periodic peripheral service tasks.
Typical design roles include compact industrial controllers, building and appliance automation modules, sensor-hub controllers, programmable logic devices, and low-power embedded instruments. A design can place the MCU beside power-management circuitry, signal-conditioning components, communication transceivers, and discrete sensors to form a complete embedded control node.
The 64-HWQFN footprint requires careful PCB layout and exposed-pad thermal management. Follow the package drawing and land-pattern guidance in the manufacturer documentation when assigning traces, connecting ground and supply pins, and defining copper around the thermal pad. Validate the assembled board across its intended temperature, voltage, and operating-frequency ranges before production release.
This product page organizes the core R5F10FLCDNA#U0 attributes with package guidance, application context, design considerations, and structured component data. It also distinguishes confirmed device characteristics from parameters that require confirmation before schematic or PCB release, helping engineers identify the next verification step efficiently.
Alternatives de remplacement direct pour R5F10FLCDNA#U0 — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec R5F10FLCDNA#U0 (même facteur de forme et même empreinte).
Aucune alternative de remplacement direct disponible pour ce produit.
Demander des alternativesR5F10FLCDNA#U0 Valeurs maximales et caractéristiques électriques
| Product Type | 16-bit microcontroller |
| Microcontroller Family | RL78/G1E |
| Maximum Operating Frequency | 32 MHz |
| Flash Memory Size | 32 KB |
| Flash Memory Organization | 32K x 8 |
| Package Type | 64-HWQFN |
| Package Dimensions | 9 x 9 mm |
| Type de montage | Surface mount |
| Number of Package Contacts | 64 |
| CPU Word Length | 16 bit |
| Program Memory Type | Flash |
| Statut RoHS | unknown |
| REACH Status | unknown |
| AEC-Q100 Qualification | unknown |
Guide de configuration des broches du R5F10FLCDNA#U0 64
Configuration des broches du R5F10FLCDNA#U0 (boîtier 64). Ce circuit intégré numérique comprend des GPIO, des interfaces de communication (UART, SPI, I2C) et des broches d'alimentation. Consultez la fiche technique du fabricant pour les fonctions alternatives des broches et les options de configuration. Indispensable pour la conception de systèmes embarqués et la conception de circuits imprimés.
Aucune donnée de brochage détaillée disponible pour R5F10FLCDNA#U0.
Consultez la fiche technique pour la configuration complète des broches.
Applications typiques
R5F10FLCDNA#U0 convient pour 6 applications: Compact Industrial Control Module, Building Automation Controller, Sensor Hub and Condition Monitoring, Appliance Embedded Control, Programmable Logic and Sequencer, Low-Power Embedded Instrument.
Compact Industrial Control Module
The R5F10FLCDNA#U0 fits compact control modules that coordinate sensors, digital inputs, actuators, and communications within a small industrial enclosure. Its 16-bit RL78/G1E architecture operates up to 32 MHz, providing a practical performance level for control logic, state machines, diagnostics, and periodic peripheral servicing. The 32 KB flash capacity supports a compact application firmware image without an external program-memory device. In the circuit, the MCU can operate from a regulated local rail, supervise sensor inputs, update outputs, and manage a communications interface. The 64-HWQFN 9 x 9 mm package conserves board area but requires a fine-pitch land pattern and careful exposed-pad thermal design.
Building Automation Controller
The R5F10FLCDNA#U0 is suitable for distributed building-automation nodes that monitor switches or sensors and coordinate lighting, HVAC, access, or occupancy functions. Its 32 MHz maximum clock rate supports responsive event handling and multiperipheral coordination, while 16 KB-by-8 flash organization provides 32 KB for embedded control firmware. Place the MCU in the center of the controller board to keep I/O routing short and reduce switching-node coupling. Use the package ground structure and exposed pad as part of the thermal and return-current plan. Before deployment, verify the controller's supply range, environmental limits, communication interfaces, and any regional safety or EMC requirements.
Sensor Hub and Condition Monitoring
The R5F10FLCDNA#U0 can act as the processing hub in a compact sensor node that acquires measurements, applies filtering or compensation, records operating states, and forwards results. Its 32 KB flash accommodates firmware for acquisition routines, calibration tables, diagnostics, and communication protocols, while the 32 MHz maximum frequency supports timely scheduling of multiple acquisition channels. The small 9 x 9 mm 64-HWQFN outline permits placement near sensors and signal-conditioning circuits. Keep analog and digital return paths separated, stabilize reference and supply nodes, and confirm whether the selected RL78/G1E configuration provides the required ADC resolution, sampling rate, and serial interfaces.
Appliance Embedded Control
The R5F10FLCDNA#U0 supports appliance controllers that combine user inputs, motor or heater control, display functions, safety monitoring, and communication in one embedded platform. The 16-bit CPU architecture and 32 MHz operating rate suit real-time control loops, while 32 KB of flash provides room for application code and configuration data. It can be placed beside power-control and interface circuitry to reduce trace length, although switching devices should be positioned away from sensitive MCU inputs. The 64-HWQFN footprint supports compact board designs but requires manufacturing controls for fine-pitch assembly. Validate startup sequencing, brownout behavior, watchdog operation, and all required peripheral functions before production.
Programmable Logic and Sequencer
The R5F10FLCDNA#U0 can implement programmable sequencing logic for equipment where timing, interlocks, and configurable I/O behavior are more important than intensive data processing. A maximum frequency of 32 MHz supports deterministic task execution, and 32 KB flash can hold sequence tables, state-machine logic, and diagnostic routines. The microcontroller should receive clean sensor or command signals through appropriate conditioning circuitry and drive outputs through buffers where voltage, current, or isolation requirements exceed its direct capabilities. Because the package exposes many contacts in a compact area, reserve adequate copper for supply distribution and verify the exact pin multiplexing in the package documentation.
Low-Power Embedded Instrument
The R5F10FLCDNA#U0 is relevant to portable or low-power embedded instruments that need local control, measurement management, and nonvolatile firmware storage in a compact assembly. Its 32 KB flash retains operating firmware and configuration without continuous power, while the 32 MHz maximum rate permits responsive control and data preparation. The 9 x 9 mm 64-HWQFN package can reduce board area in a handheld or desktop instrument. Design the power system to prevent unintended resets, use the correct decoupling arrangement at supply pins, and include a programming/debug interface for field maintenance. Confirm sleep-mode behavior and all peripheral availability for the exact ordering code before finalizing a battery-powered design.
Données de référence d'ingénierie pour R5F10FLCDNA#U0 — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit |
|---|---|
| Brand | Renesas Electronics |
| Package | 64-HWQFN (9 x 9 mm) |
| Microcontroller Family | RL78/G1E |
| CPU Word Length | 16 bit |
| Maximum Operating Frequency | 32 MHz |
| Flash Memory Size | 32 KB |
| Flash Memory Organization | 32K x 8 |
| Program Memory Type | Flash |
| RoHS Status | unknown |
Principaux différenciateurs
- Compact 16-bit control with 32 MHz performance (vs No qualified drop-in alternative MPN identified)
- Nonvolatile program memory in the MCU package (vs No qualified drop-in alternative MPN identified)
- High integration in a compact surface-mount outline (vs No qualified drop-in alternative MPN identified)
Notes de conception
Use the exact 64-HWQFN package drawing and manufacturer land pattern rather than a generic QFN footprint. Confirm exposed-pad dimensions, pin numbering, solder-mask limits, and copper allowances before releasing Gerber data. The 9 x 9 mm outline places many fine-pitch contacts close to one another, so a small routing error can affect multiple pins and make board rework difficult.
Plan the exposed pad and surrounding copper as part of the electrical and thermal design. Follow the manufacturer guidance for exposed-pad connection, via pattern, and paste stencil. Validate junction temperature at the highest expected operating frequency, ambient temperature, and supply voltage because MCU power dissipation changes with clock activity and active peripherals.
Place supply decoupling capacitors close to the device's supply and ground pins and provide a low-impedance return path beneath the package where the layout rules permit it. Separate sensitive analog or measurement inputs from switching-node traces. Confirm the supported voltage range, startup behavior, and brownout requirements from the manufacturer documentation before selecting regulators and capacitor ratings.
Do not assume that another 64-pin MCU is interchangeable merely because the package pin count matches. Firmware depends on the exact peripheral map, pin multiplexing, interrupt vectors, clock tree, memory organization, and programming interface. For any proposed substitute, compare the complete pin list and electrical limits and perform firmware and board-level validation before substitution.
Informations de conformité
Compliance declarations for the exact R5F10FLCDNA#U0 ordering code were not included in the available technical records. Confirm RoHS, REACH, halogen-free, conflict-minerals, and automotive qualification status with the manufacturer before release.
