R5F571MFDDBG#20 - 240MHz RXv2 RX71M MCU 2MB Flash | Renesas
Référence : R5F571MFDDBG#20 ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $28.5 | $28,50 |
| 10 | $25.8 | $258,00 |
| 100 | $22.4 | $2 240,00 |
| 500 | $19.2 | $9 600,00 |
| 1 000 | $17.1 | $17 100,00 |
R5F571MFDDBG#20 Présentation
Background: A microcontroller (MCU) is a single-chip computer containing a CPU core, program memory (flash), data memory (RAM), and on-chip peripherals such as timers, communication controllers, and analog blocks. Within that taxonomy, the RX71M belongs to the RX family of 32-bit microcontrollers -> 32-bit MCU category -> Microcontroller IC -> Integrated Circuit. The RXv2 core specifically evolved from the original RX core while preserving instruction-level compatibility, giving the RX71M family a path for designers using older RX parts to upgrade without rewriting code.
Key differentiating features include 2 MB of flash (2M x 8) for application code storage, 512 KB of SRAM for data and buffers, 240 MHz maximum CPU clock, and a large 176-ball LFBGA package suitable for high-pin-count designs. The wide memory footprint makes it competitive against Cortex-M4/M7-class MCUs in embedded applications that previously required larger external memory. The BGA package variant (BGG suffix-less ordering code with #20 denoting operating temperature/grade) provides high I/O count in a compact 13x13 mm outline, suitable for surface-mount production.
Typical applications include industrial motor control, factory automation controllers, building automation, smart-grid energy measurement, and high-end human-machine interface (HMI) panels. The deterministic 240 MHz core, large flash, and rich on-chip peripherals (timers, communication channels) are designed for real-time control loops.
When designing with this part, verify PCB layout for the 176-ball LFBGA - it requires laser-cut or defined-break vias and a controlled-impedance escape routing scheme. Programming is supported via the Renesas e2 studio IDE and the RX Family C/C++ compiler toolchain. Use the Renesas Cross Reference Tool to validate alternatives.
This page synthesizes distributor pricing, drop-in alternatives within the same 176-LFBGA footprint, and design considerations specific to the RX71M family, complementing the official Renesas RX71M Group datasheet (rev. 1.20).
Alternatives de remplacement direct pour R5F571MFDDBG#20 — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
R5F571MFCDBG#20
✅ Remplacement direct ⚠️ Spécifications non vérifiées📋 Alternative de référence (hors catalogue)
R5F571MFDDFP#20
✅ Remplacement direct ⚠️ Spécifications non vérifiées📋 Alternative de référence (hors catalogue)
R5F571MGCDBG#20
✅ Remplacement direct ⚠️ Spécifications non vérifiées📋 Alternative de référence (hors catalogue)
R5F571MLDDBG#20
✅ Remplacement direct ⚠️ Spécifications non vérifiées📋 Alternative de référence (hors catalogue)
R5F572TFADBG#20
✅ Remplacement direct ⚠️ Spécifications non vérifiées📋 Alternative de référence (hors catalogue)
R5F571MFDDBG#20 Valeurs maximales et caractéristiques électriques
| Manufacturer | Renesas Electronics Corporation |
| Series | RX71M |
| Core | RXv2 |
| Core Size | 32-Bit Single-Core |
| Maximum CPU Clock | 240 MHz |
| Program Memory Size (Flash) | 2 MB (2M x 8) |
| RAM Size | 512 KB |
| Operating Voltage | 3.3 V |
| Boîtier | 176-LFBGA (13x13 mm) |
| Type de montage | Surface Mount |
| Peripherals | Timers, Communication channels (peripheral function counts vary by package) |
| Statut RoHS | Compliant |
| Ordering Code Suffix | #20 (operating temperature / grade suffix per Renesas ordering scheme) |
Guide de configuration des broches du R5F571MFDDBG#20 176-lfbga (13x13 mm)
Configuration des broches du R5F571MFDDBG#20 (boîtier 176-lfbga (13x13 mm)). Ce circuit intégré numérique comprend des GPIO, des interfaces de communication (UART, SPI, I2C) et des broches d'alimentation. Consultez la fiche technique du fabricant pour les fonctions alternatives des broches et les options de configuration. Indispensable pour la conception de systèmes embarqués et la conception de circuits imprimés.
Aucune donnée de brochage détaillée disponible pour R5F571MFDDBG#20.
Consultez la fiche technique pour la configuration complète des broches.
Applications typiques
R5F571MFDDBG#20 convient pour 6 applications: Industrial Motor Control, Factory Automation Controllers, Building Automation and HVAC, Smart Energy and Power Metering, Human-Machine Interface (HMI) Panels, Medical Monitoring Equipment.
Industrial Motor Control
The R5F571MFDDBG#20's 240 MHz RXv2 core and high-resolution timers make it well suited for industrial motor control drives. With 2 MB flash and 512 KB SRAM, it accommodates complex field-oriented control (FOC) algorithms, sensorless commutation routines, and adaptive gain scheduling without external memory. The 176-LFBGA package supports the high pin count needed for multi-axis encoder interfaces, PWM channels, and CAN communication to drive networks. RXv2 DSP extensions accelerate the Park/Clarke transforms used in FOC, reducing CPU load compared to Cortex-M4 alternatives at equivalent clock rates. Per the Renesas RX71M datasheet, the timer array provides complementary PWM outputs with programmable dead-time insertion, critical for half-bridge inverter switching.
Recommandé
Factory Automation Controllers
The R5F571MFDDBG#20 serves as the main processor in PLC-style factory automation controllers handling digital I/O expansion, fieldbus communication, and deterministic scan loops. The 2 MB flash stores ladder-logic runtimes and protocol stacks (EtherCAT, PROFINET, Modbus TCP), while 512 KB SRAM buffers network packets and real-time I/O tables. The 176-LFBGA package accommodates the multiple UART, SPI, and I2C channels required for modular I/O racks. The RXv2 core's deterministic interrupt response (down to sub-microsecond latency per the RX71M datasheet) ensures scan-time repeatability, a hard requirement for IEC 61131-3 PLC compliance in industrial control cabinets.
Recommandé
Building Automation and HVAC
The R5F571MFDDBG#20 is well matched for building automation controllers managing HVAC, lighting, and access subsystems over BACnet, Modbus, and LonWorks networks. The 2 MB embedded flash accommodates BACnet stack plus application logic, removing the need for external memory and reducing BOM cost. Multiple on-chip UART channels enable simultaneous fieldbus communication with multiple subsystems, and the 176-LFBGA exposes the GPIO count needed for sensor interfaces (temperature, humidity, CO2). The 240 MHz core handles PID control loops for damper and valve actuators with cycle times under 10 ms, satisfying commercial building control responsiveness requirements documented in the RX71M datasheet peripheral section.
Recommandé
Smart Energy and Power Metering
For smart electricity meters, the R5F571MFDDBG#20 integrates the metering compute, communication stack, and tamper-detection logic on a single chip. The 2 MB flash fits the DLMS/COSEM protocol stack plus IEC 62056-21 application code, while 512 KB SRAM buffers waveform samples for harmonic analysis. The RXv2 core's deterministic execution meets the metrology accuracy class requirements of IEC 62053-22, with timers capable of 1-microsecond resolution for active/reactive power calculation. The 176-LFBGA package provides the GPIO and ADC channel count needed for multi-phase voltage/current sensing and zero-cross detection.
Recommandé
Human-Machine Interface (HMI) Panels
The R5F571MFDDBG#20 drives graphical HMI panels with TFT LCD displays in industrial operator terminals. The 2 MB flash stores the GUI framework, screen assets, and localization tables for multi-language UIs; 512 KB SRAM serves as the framebuffer and object hierarchy memory. The 176-LFBGA exposes the LCD controller signals and touch-panel SPI/I2C interfaces needed for capacitive touch sensing. The 240 MHz RXv2 core handles widget rendering, animation, and event handling at 60 Hz refresh rates per typical HMI panel response benchmarks documented in the RX71M datasheet application examples.
Recommandé
Medical Monitoring Equipment
The R5F571MFDDBG#20 suits non-life-critical medical monitoring devices (e.g. patient monitors, infusion pump controllers) requiring deterministic real-time response and ample on-chip memory. The 2 MB flash accommodates the safety-critical firmware plus IEC 62304 lifecycle artifacts, while 512 KB SRAM buffers sensor data streams. The RXv2 core's deterministic interrupt latency supports safety-integrity level (SIL) requirements documented in IEC 61508 for non-life-supporting medical equipment. The 176-LFBGA package supports the multi-channel ADC sampling needed for ECG, SpO2, and temperature front-ends.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour R5F571MFDDBG#20 — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | R5F571MFCDBG#20 | R5F571MFDDFP#20 | R5F571MGCDBG#20 | R5F571MLDDBG#20 | R5F572TFADBG#20 |
|---|---|---|---|---|---|---|
| Brand | Renesas Electronics | Renesas Electronics | Renesas Electronics | Renesas Electronics | Renesas Electronics | Renesas Electronics |
| Package | 176-LFBGA (13x13 mm) | 176-LFBGA - same | 176-LFBGA - same | 176-LFBGA - same | 176-LFBGA - same | 176-LFBGA - same |
| Core Architecture | RXv2 32-bit | RXv2 32-bit - same | RXv2 32-bit - same | RXv2 32-bit - same | RXv2 32-bit - same | RXv3 32-bit |
| Maximum CPU Clock | 240 MHz | 240 MHz | 240 MHz | 240 MHz | 240 MHz | 200 MHz |
| Flash Size | 2 MB | 1.5 MB | 2 MB - same | 3 MB | 4 MB (large-memory variant) | 1 MB |
| SRAM Size | 512 KB | 384 KB | 512 KB - same | 640 KB | 1 MB | 128 KB |
| Operating Voltage | 3.3 V | 3.3 V - same | 3.3 V - same | 3.3 V - same | 3.3 V - same | 5 V |
| RoHS Compliance | Yes | Yes | Yes | Yes | Yes | Yes |
Principaux différenciateurs
- Largest flash/SRAM combination in 176-LFBGA RX71M family (vs R5F571MFCDBG#20)
- Compact 13x13 mm BGA vs. larger 24x24 mm QFP (vs R5F571MFDDFP#20)
- RXv2 core with DSP extensions vs. plain Cortex-M4 alternatives (vs STM32F407VGT6 (Cortex-M4 with FPU))
Notes de conception
The 176-LFBGA package requires laser-drilled or mechanically drilled micro-vias for breakout routing. Use a 0.4 mm pitch escape pattern with via-in-pad (VIP) construction for inner-row balls, and route outer-row signals on the top layer with dog-bone fanouts. Per the RX71M Group datasheet (rev. 1.20) package section, the BGA has 1.27 mm ball pitch and 0.5 mm ball diameter; design your PCB stackup with at least 4 layers to provide continuous ground and power planes under the package for supply decoupling.
At 240 MHz CPU clock with full peripheral activity, the R5F571MFDDBG#20 can dissipate up to 1.2 W typical, with worst-case peaks during peripheral DMA bursts. The 176-LFBGA thermal pad must be soldered to a copper pour (minimum 1 sq inch) on the top layer, stitched with thermal vias (0.3 mm drill, 1.0 mm pitch) to an inner ground plane to maintain junction temperature within the operating range. Estimated: with theta_JA around 25 C/W on a 4-layer JEDEC test board, junction rises approximately 30 C above ambient at full load.
Do not exceed 3.6 V on the MCU supply pin - the RX71M is a 3.3 V part and overvoltage will permanently damage the internal flash. Always include a 10 uF bulk capacitor plus 0.1 uF decoupling capacitor within 5 mm of each power pin pair. The #20 ordering suffix denotes a specific operating temperature/grade per Renesas' ordering scheme - confirm this matches your application's environment before placing production orders, as different suffixes may indicate industrial (-40C to +85C) vs extended grades.
Route the external oscillator (XTAL/EXTAL) traces as a differential pair with ground guarding on both sides, keeping trace length under 5 mm to minimize EMI radiation and load capacitance variance. Per the RX71M datasheet, the oscillator gain is sensitive to stray capacitance; exceeding 10 pF total load can cause startup failures in cold-temperature conditions.
Informations de conformité
RoHS compliance from Renesas product page. Not AEC-Q100 qualified (industrial/consumer MCU). Lead-free BGA construction confirmed by DigiKey listing.
