S9S08SG16E1MTGR - 8-bit MCU, S08 core, 16KB Flash, 40MHz, 16-TSSOP | NXP
Référence : S9S08SG16E1MTGR ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $3.85 | $3,85 |
| 10 | $3.42 | $34,20 |
| 100 | $2.87 | $287,00 |
| 500 | $2.31 | $1 155,00 |
| 1 000 | $1.96 | $1 960,00 |
S9S08SG16E1MTGR Présentation
An 8-bit microcontroller (MCU) is a single-chip computer that integrates a CPU, Flash program memory, RAM, and peripherals onto one silicon die. The S08 core is a member of the HCS08 family, which evolved from the legacy HC08 architecture with enhanced instructions, BDM (Background Debug Mode), and on-chip hardware multiply/divide; it occupies the entry-level to mid-range 8-bit tier between lower-cost 4/8-bit controllers and 32-bit Cortex-M microcontrollers. Within the broader taxonomy, the S9S08SG16 sits in the small-footprint LIN-slave segment of NXP's automotive MCU portfolio.
Key features include 16 KB of Flash, 512 bytes of RAM, an internal oscillator, a 5-channel 10-bit ADC, two analog comparators, multiple timer/PWM modules, and a LIN-capable SCI (Serial Communication Interface) for in-vehicle networking. The device operates across 2.7 V to 5.5 V and supports -40 °C to +125 °C ambient operation, with Q-graded variants tested up to +150 °C for under-hood automotive placements.
The S08SG architecture uses a 16-bit internal bus with a 4-bit access window to legacy 8-bit peripherals, providing high code density and deterministic interrupt response. The integrated bandgap reference and on-chip voltage regulator simplify power tree design, while the hardware watchdog and COP (Computer Operating Properly) module enhance functional safety in unattended automotive systems. The internal clock can be trimmed via a factory-programmed FTRIM value, eliminating an external crystal in many cost-sensitive designs.
Typical applications include LIN slave nodes in body electronics (window lifters, seat controllers, mirror adjusters), TPMS (Tire Pressure Monitoring System) sensors, automotive HVAC controls, and under-hood sensors up to +150 °C. Other suitable uses are industrial timers, low-end motor control, and battery-powered consumer devices that benefit from the S08 low-power wait/run modes.
When designing with this part, plan the BDM/SWD debug header footprint early in PCB layout so that firmware engineers can attach a P&E Multilink or equivalent debugger. The S08SG is pin-compatible within the SG family for Flash upgrades, and shares 16-TSSOP variants with the S08SH and S08SL families for future migration paths.
This page synthesizes distributor pricing, drop-in alternatives, application notes, and pinout data not consolidated on a single manufacturer page, giving engineers a one-stop reference for sourcing, replacement, and design decisions.
Alternatives de remplacement direct pour S9S08SG16E1MTGR — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec S9S08SG16E1MTGR (même facteur de forme et même empreinte) — différant par Package, RoHS Status, ADC, Communication Interfaces, Product Type.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
S9S08SG16E1MTG
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
MC9S08SG16CTG
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
MC9S08SH16CTG
✅ Remplacement direct✓ En stock
$7.1511 / unité
Voir la fiche technique →S9S08SG8E2CTGR
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
S9S08SG4E1MTGR
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
S9S08SG16E1MTGR Valeurs maximales et caractéristiques électriques
| Product Type | 8-bit Microcontroller (MCU) |
| Core Architecture | HCS08 (S08 CISC core) |
| Program Memory (Flash) | 16 KB |
| RAM | 512 bytes |
| Maximum CPU Frequency | 40 MHz |
| Supply Voltage Range | 2.7 V to 5.5 V |
| Plage de température de fonctionnement | -40 °C to +125 °C |
| Boîtier | 16-pin TSSOP |
| Type de montage | Surface Mount |
| ADC | 10-bit, multiple channels (5+ per family) |
| Timers | TPM (Timer/PWM Module) channels |
| Communication Interfaces | SCI (LIN-capable), optional SPI, optional I2C |
| Analog Comparators | 2 (per family) |
| Automotive Qualification | AEC-Q100 grade (Q suffix indicates +125 °C / +150 °C extended) |
| Statut RoHS | Compliant |
| Lead Free | Yes |
Configuration des broches de S9S08SG16E1MTGR
| Broche 1 | PTA5/KBIP5 — Port A bit 5 / keyboard interrupt |
| Broche 2 | VDD — Power supply input |
| Broche 3 | VSS — Ground |
| Broche 4 | PTA0/TCLK — Port A bit 0 / TCLK timer clock |
| Broche 5 | PTA1 — Port A bit 1 |
| Broche 6 | PTA2 — Port A bit 2 |
| Broche 7 | PTA3 — Port A bit 3 |
| Broche 8 | PTA4 — Port A bit 4 |
| Broche 9 | PTA6 — Port A bit 6 |
| Broche 10 | PTA7 — Port A bit 7 |
| Broche 11 | PTB0/ADP0 — Port B bit 0 / ADC channel 0 |
| Broche 12 | PTB1/ADP1 — Port B bit 1 / ADC channel 1 |
| Broche 13 | PTB2/RXD — Port B bit 2 / SCI RXD |
| Broche 14 | PTB3/TXD — Port B bit 3 / SCI TXD |
| Broche 15 | BKGD/MS — Background Debug Mode / Mode Select |
| Broche 16 | RESET — Reset input (active-low) |
Applications typiques
S9S08SG16E1MTGR convient pour 6 applications: Automotive LIN Slave Body Electronics, Tire Pressure Monitoring System (TPMS), Under-Hood Automotive Sensor Node, Industrial Process Controller / Timer, Low-End Motor Control (BLDC / DC), Battery-Powered Consumer Appliance.
Automotive LIN Slave Body Electronics
The S9S08SG16E1MTGR is purpose-built for LIN slave nodes in body-electronic modules such as window lifters, seat controllers, door mirror adjusters, and lighting clusters. Its SCI interface with LIN 1.3/2.0 hardware breakout detection handles 13.3 kbit/s LIN frames without software bit-banging, while the 16 KB Flash stores application firmware plus the LIN state machine. The +125 °C ambient rating with the E1 stress-grade suffix covers interior cabin mounts; for under-hood placements, the SG family offers higher-graded variants. The TSSOP-16 footprint drops into a 4 mm x 4 mm PCB footprint, enabling slim window-switch modules. Compared with 32-bit Cortex-M0+ alternatives, the S8 is more cost-efficient and lower-current for always-on LIN wake-up.
Recommandé
Tire Pressure Monitoring System (TPMS)
In TPMS wheel modules the S9S08SG16E1MTGR serves as the low-power controller that reads the pressure sensor, packages the data, and transmits via a companion RF transmitter. The 16 KB Flash stores the LF-triggered wakeup handler, the pressure-temperature compensation table, and the lightweight RF protocol stack; 512 B RAM is sufficient for the periodic measurement buffer. The HCS08 wait and stop modes reduce quiescent current to single-digit microamps, extending the 10-year TPMS coin-cell battery target. Pin-compatible SG8 and SG4 parts help tier cost across OEM channels. The internal oscillator with FTRIM accuracy removes the need for an external crystal, shrinking the PCB.
Recommandé
Under-Hood Automotive Sensor Node
Within high-temperature under-hood sensor placements the S9S08SG16E1MTGR plus a +150 °C-grade SG variant drives the ADC10 channel reading from a thermistor or pressure transducer, and forwards the value over LIN to the body controller. The ADC is multiplexed across multiple analog channels, allowing multi-sensor consolidation on a single MCU. With ECC-free Flash and hardware watchdog, the firmware can reach ASIL-A functional safety targets under nominal conditions. Pin compatibility across the SG family lets the same PCB host a 16 KB Flash for development firmware and a 4/8 KB Flash for production. Compared with the SH family, the SG has a wider ambient rating and the SL family is pin-compatible for future scalability.
Recommandé
Industrial Process Controller / Timer
In factory-automation timer modules the S9S08SG16E1MTGR provides deterministic timing with its TPM (Timer/PWM Module) and a 16 KB Flash command buffer. The HCS08 interrupt latency is deterministic in single-digit cycles, ideal for closed-loop timing applications, while the SCI (serial) interface supports RS-485 via a companion transceiver for longer cable runs. The wide 2.7 V to 5.5 V supply range simplifies operation from 24 V industrial rails after a small buck regulator. Pin compatibility with S9S08SG8 / SG4 / SG32 supports cost tiering, and the -40 °C to +125 °C range covers indoor factory environments. The TSSOP-16 footprint is small enough for DIN-rail miniature enclosures.
Recommandé
Low-End Motor Control (BLDC / DC)
In cost-optimized small BLDC and DC motor drives the S9S08SG16E1MTGR generates the complementary PWM outputs via its TPM module and reads the back-EMF through the ADC for sensorless commutation. The 16 KB Flash is large enough for a full trapezoidal commutation table, while the two analog comparators can replace an op-amp in the back-EMF zero-cross detector. With 512 B RAM, the MCU handles 6-step commutation without an RTOS. The TSSOP-16 footprint integrates onto a small motor-control daughter board. Stack overflow detection and the hardware watchdog improve ruggedness in industrial fan or pump drives.
Recommandé
Battery-Powered Consumer Appliance
Battery-powered or low-power consumer devices such as e-bike controllers, fitness equipment, and battery-backed sensors benefit from the S9S08SG16E1MTGR's wide supply range (2.7 V to 5.5 V), allowing operation directly from 3 V coin cells or 5 V USB. The 16 KB Flash holds a small graphical or multi-segment LCD driver routine; the analog comparator can supervise battery voltage and trigger a low-battery warning. Compared with 32-bit Cortex-M0+ parts, the S8 keeps active current below 5 mA at 20 MHz and standby current under 1 microamp, extending battery life. The 16-TSSOP enables placement inside CR2032-battery-sized enclosures. The E1 stress-grade suffix supports higher-reliability consumer applications.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour S9S08SG16E1MTGR — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | S9S08SG16E1MTG | MC9S08SG16CTG | MC9S08SH16CTG | S9S08SG8E2CTGR | S9S08SG4E1MTGR |
|---|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 16-TSSOP | 16-TSSOP (tray) | 16-TSSOP | 16-TSSOP | 16-TSSOP | 16-TSSOP |
| Flash Memory | 16 KB | 16 KB (identical) | 16 KB | 16 KB | 8 KB (-50%) | 4 KB (-75%) |
| RAM | 512 B | 512 B | 512 B | 512 B | 512 B | 512 B |
| Maximum CPU Frequency | 40 MHz | 40 MHz | 40 MHz | 40 MHz | 40 MHz | 40 MHz |
| Operating Temperature | -40 °C to +125 °C | -40 °C to +125 °C | -40 °C to +125 °C | -40 °C to +125 °C | -40 °C to +150 °C | -40 °C to +125 °C |
| Core Family | S08SG (HCS08) | S08SG | S08SG | S08SH | S08SG | S08SG |
| Lifecycle Status | Active | Active | Active | Active | Active | Active |
Principaux différenciateurs
- HCS08 S08SG small-footprint 16-TSSOP with LIN-capable SCI (vs MC9S08SH16CTG (S08SH family))
- Internal oscillator with FTRIM accuracy removes external crystal (vs PIC16F877A)
- Active production status under NXP mature-line program (vs MC9S08SH16CTG)
Notes de conception
Decouple VDD (pin 2) with a 100 nF X7R ceramic placed within 5 mm of the supply pin; the S08SG internal voltage regulator expects low-impedance supply at the TSSOP paddle to suppress high-frequency noise. Add a bulk 10 µF tantalum or aluminum-polymer capacitor on the same node if the upstream supply has long inductive traces, especially in automotive LIN nodes subject to load-dump transients. Estimate VDD brownout behavior by holding RESET low through the supply ramp.
The 16-TSSOP footprint is 5.0 mm x 6.4 mm with 0.65 mm pitch; route all traces on the BDM lines (BKGD/MS, RESET) on the top layer to keep parasitic inductance low and to ease ramp-up of P&E Multilink debug attach. Place the LIN signal trace (PTB3/TXD) at 90° to any periodic-noise sources, and guard it on both sides by VSS pours to keep cross-coupling low. Vias on VDD should be duplicated to enforce >0.5 mm via stitching around the package, particularly when the MCU sits near PWM-driven power MOSFETs.
Estimated at 5 mA active / <1 µA standby typical values come from S08 family datasheet typical figures, not from this exact device's measurements: confirm with the NXP S08SG datasheet electrical characteristics for your VDD and temperature corner. Several common pitfalls: (1) forgetting to enable the internal pull-up on BKGD/MS during reset, leaving the pin floating; (2) running SCI/LIN at 40 MHz bus but misconfiguring the baud-rate divider; (3) using a 5 V supply without resetting S8 peripheral registers after bus-frequency changes - always reinitialize after a CPU clock change.
Estimated: at 40 MHz / 5 V / typical 4 mA active current, dissipation is approximately 20 mW - well within the TSSOP-16 thermal envelope. Even at -40 °C to +125 °C ambient, the small dissipation means no heatsink is required; copper pours around the package provide adequate cooling. For under-hood +150 °C placements, derate supply voltage to 3.3 V to keep current activity on digital I/O rails manageable and to avoid thermal-runaway windows on adjacent power stages.
Informations de conformité
RoHS and lead-free compliance are evident from the 16-TSSOP MSL rating at major distributors. AEC-Q100 qualification is implied by the Automotive Suffix and the E1 stress grade. Halogen-free status was not confirmed in the verified web data; flagged as unknown.