SAF-XE167F-96F66L - 16-Bit 66MHz 768KB Flash MCU | Infineon
Référence : SAF-XE167F-96F66L ✓ Actif| Qté | Prix unitaire | Total |
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| 1 | $0 | $0,00 |
| 10 | $0 | $0,00 |
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| 1 000 | $0 | $0,00 |
SAF-XE167F-96F66L Présentation
A 16-bit microcontroller is an integrated circuit that combines a CPU, program memory, data memory, and peripherals such as timers, serial interfaces, and analog-to-digital converters on a single die. Within the semiconductor taxonomy, the SAF-XE167F-96F66L sits at microcontroller unit (MCU) -> embedded controller -> 16-bit real-time signal controller -> C166/XE166 family, a lineage originally developed by Infineon (and its predecessor Siemens/Cypress heritage) for motor control, power conversion, and automotive body electronics.
Key features include a 66 MHz maximum CPU clock, 768 KB on-chip Flash, a 3.3 V core supply with 5 V tolerant I/O, a 144-pin LQFP exposed-pad package for improved thermal performance, and the C166SV2 instruction set with DSP extensions (MAC unit) that accelerates control-loop math. The XE166 family also provides a flexible peripheral event controller, multi-channel PWM, and multiple CAN nodes for distributed control architectures.
The exposed-pad LQFP-144 package (PG-LQFP-144) lowers thermal resistance compared with standard LQFP, which matters when the device drives gate-driver and communication peripherals continuously at 66 MHz. The 768 KB Flash allows single-chip implementation of complex field-oriented-control and protocol stacks without external memory, reducing BOM cost and board area.
Typical applications include industrial motor drives and servo controllers, automotive body and powertrain control modules, solar and power-conversion inverters, and industrial automation I/O modules. The combination of 66 MHz compute, DSP MAC, and CAN connectivity fits distributed real-time nodes that must close control loops in microseconds.
When designing with this device, verify the core and I/O supply sequencing and decouple each supply pin with a low-ESR ceramic capacitor placed close to the package. The exposed pad must be soldered to a grounded thermal land with adequate via stitching to carry heat away from the die.
This page synthesizes distributor availability, drop-in alternative analysis, and practical design notes that go beyond the manufacturer datasheet, giving engineers a single reference for sourcing and layout decisions.
Alternatives de remplacement direct pour SAF-XE167F-96F66L — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
SAF-XE167F-96F80L AC
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
XE167F96F66LACFXQMA1
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
SAF-XE167F-48F66L AC
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
SAF-XE167F-96F66L Valeurs maximales et caractéristiques électriques
| Core Architecture | C166SV2 (CISC/DSP/RISC) |
| Largeur du bus de données | 16-bit |
| Maximum CPU Frequency | 66 MHz |
| Program Memory Size | 768 KB Flash |
| Program Memory Type | Flash |
| Core Supply Voltage | 3.3 V |
| I/O Supply Voltage | 3.3 V / 5 V |
| Boîtier / Format | PG-LQFP-144 (144-pin LQFP exposed pad) |
| Type de montage | Surface Mount |
| Statut RoHS | RoHS compliant (per distributor listing) |
| Packaging | Tray |
| Product Series | XE166 classic series (alpha line) |
| Manufacturer Part Status | Active |
Guide de configuration des broches du SAF-XE167F-96F66L pg-lqfp-144 (144-pin lqfp exposed pad)
Configuration des broches du SAF-XE167F-96F66L (boîtier pg-lqfp-144 (144-pin lqfp exposed pad)). Ce circuit intégré numérique comprend des GPIO, des interfaces de communication (UART, SPI, I2C) et des broches d'alimentation. Consultez la fiche technique du fabricant pour les fonctions alternatives des broches et les options de configuration. Indispensable pour la conception de systèmes embarqués et la conception de circuits imprimés.
Aucune donnée de brochage détaillée disponible pour SAF-XE167F-96F66L.
Consultez la fiche technique pour la configuration complète des broches.
Applications typiques
SAF-XE167F-96F66L convient pour 6 applications: Industrial Motor Drive and Servo Control, Automotive Body and Powertrain Control Module, Solar and Power Conversion Inverter, Industrial Automation I/O Module, Real-Time Signal Processing and Control Node, Legacy XE166 System Maintenance and Redesign.
Industrial Motor Drive and Servo Control
The SAF-XE167F-96F66L fits industrial motor drives because its C166SV2 core includes DSP/MAC extensions that accelerate field-oriented-control (FOC) math, and its 66 MHz clock closes current loops fast enough for PWM switching in the 10-20 kHz range. The 768 KB on-chip Flash stores the FOC algorithm, position-estimation tables, and communication stacks without external memory, shrinking board area. In a typical three-phase inverter, the MCU generates complementary PWM for the gate driver, samples phase currents through its ADC, and runs the Clarke/Park transforms in the MAC unit. The 144-pin exposed-pad LQFP improves heat spreading when the device runs continuously at 66 MHz. Designers should decouple each supply pin and tie the exposed pad to a grounded thermal land with via stitching.
Recommandé
Automotive Body and Powertrain Control Module
The SAF-XE167F-96F66L suits automotive body and powertrain control modules because the XE166 family provides multiple CAN nodes for in-vehicle networking and 5 V tolerant I/O that interfaces directly with legacy sensors and actuators. Its 66 MHz core and 768 KB Flash handle body-control state machines, diagnostics, and CAN message scheduling in a single chip. In a body control module, the MCU multiplexes door, lighting, and window outputs while servicing CAN frames, using its peripheral event controller to offload timing tasks from the CPU. The exposed-pad LQFP-144 package supports the thermal load of continuous operation in an engine-bay or cabin environment. Verify the exact temperature grade and AEC-Q100 status for the chosen ordering code before production release.
Recommandé
Solar and Power Conversion Inverter
The SAF-XE167F-96F66L is used in solar and power-conversion inverters because its DSP-capable C166SV2 core executes the control loop for maximum-power-point tracking and grid-tied PWM generation at 66 MHz, while 768 KB Flash holds the control firmware and protection logic. In a single-phase inverter, the MCU computes the MPPT duty cycle, generates sinusoidal PWM, and monitors DC-link and output currents through its ADC, all within one control period. The multi-channel PWM peripheral produces the complementary outputs needed for a full-bridge stage, and CAN or serial ports report status to a system controller. The exposed-pad LQFP-144 package helps dissipate heat from continuous switching. Designers must verify isolation between the control and power stages and keep gate-driver return paths short.
Recommandé
Industrial Automation I/O Module
The SAF-XE167F-96F66L fits industrial automation I/O modules because its 144-pin package provides a high I/O count for digital and analog channels, and its 66 MHz core with 768 KB Flash runs protocol handling and signal conditioning in one device. In a remote I/O module, the MCU scans digital inputs, drives outputs, reads analog channels through its ADC, and communicates over CAN or serial fieldbus, using the peripheral event controller to keep timing deterministic. The 5 V tolerant I/O simplifies interfacing with legacy 24 V field wiring through level shifters and drivers. The exposed-pad LQFP-144 package supports the thermal budget of a densely packed module. Verify the I/O count and ADC channel mapping against the datasheet for the specific ordering code.
Recommandé
Real-Time Signal Processing and Control Node
The SAF-XE167F-96F66L serves real-time signal-processing and control nodes because the C166SV2 core combines CISC control flow with DSP/MAC instructions, letting one 66 MHz device run filtering, control, and communication tasks without a separate DSP. Its 768 KB Flash stores filter coefficients, lookup tables, and protocol stacks, while the peripheral event controller triggers ADC conversions and PWM updates with minimal CPU intervention. In a closed-loop control node, the MCU samples a sensor, applies a digital filter in the MAC unit, computes a control output, and updates PWM in a single deterministic cycle. The 144-pin exposed-pad LQFP provides the I/O and thermal headroom for a dense control board. Confirm the MAC throughput and interrupt latency against the datasheet for timing-critical loops.
Recommandé
Legacy XE166 System Maintenance and Redesign
The SAF-XE167F-96F66L is a practical choice for maintaining and redesigning legacy XE166 systems because it preserves the C166SV2 instruction set, peripheral set, and 144-pin LQFP exposed-pad footprint that existing boards already use. Engineers can port existing firmware with minimal changes, keeping the same toolchain and debug interface, while gaining 768 KB Flash and 66 MHz operation for added features. In a redesign, the MCU can replace an older XE166 derivative on the same land pattern, avoiding PCB rework. The exposed-pad package maintains thermal compatibility with the original layout. Before committing, verify that the specific ordering code's memory map and peripheral instances match the legacy device, since derivative differences can affect register-level code.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour SAF-XE167F-96F66L — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | SAF-XE167F-96F80L AC | XE167F96F66LACFXQMA1 | SAF-XE167F-48F66L AC |
|---|---|---|---|---|
| Package | PG-LQFP-144 (144-pin LQFP EP) | PG-LQFP-144 (same) | PG-LQFP-144-4 (same family) | PG-LQFP-144 (same) |
| Brand | Infineon | Infineon | Infineon | Infineon |
| Core Architecture | C166SV2 (CISC/DSP/RISC) | C166SV2 (same family) | C166SV2 (same) | C166SV2 (same family) |
| Maximum CPU Frequency | 66 MHz | 66 MHz (same family) | 66 MHz | 66 MHz |
| Core Supply Voltage | 3.3 V | 3.3 V (same family) | 3.3 V | 3.3 V |
| I/O Voltage Tolerance | 3.3 V / 5 V | 3.3 V / 5 V (same family) | 3.3 V / 5 V | 3.3 V / 5 V |
| Product Series | XE166 classic series (alpha line) | XE166 classic series (alpha line) | C166SV2 XE16x family | XE166 family |
Principaux différenciateurs
- Same-silicon orderable code available (vs XE167F96F66LACFXQMA1)
- Higher Flash density than the 48F66L derivative (vs SAF-XE167F-48F66L AC)
- Family-compatible upgrade path (vs SAF-XE167F-96F80L AC)
Notes de conception
Decouple every VDD and VDDP supply pin with a low-ESR ceramic capacitor placed as close to the package as possible, and use a separate bulk capacitor on the board rail. The XE166 core runs at 3.3 V while I/O can tolerate 5 V, so verify that any 5 V signals are within the I/O absolute maximum ratings before connecting them directly. Estimated: at 66 MHz with typical peripheral activity, core current is in the tens of milliamps, so a 100 nF per-pin plus 10 uF bulk combination is a reasonable starting point; confirm against the datasheet supply-current table.
The PG-LQFP-144 exposed pad must be soldered to a grounded thermal land with multiple vias to the internal ground plane. The exposed pad lowers thermal resistance versus a standard LQFP, which matters when the MCU runs continuously at 66 MHz while driving PWM and communication peripherals. Estimated: if the device dissipates roughly 0.5 W, a land with several thermal vias keeps the junction rise modest, but the exact theta-JA depends on copper area and airflow; use the datasheet thermal data and measure the case temperature in the final enclosure.
When substituting between XE166 derivatives, do not assume the memory map, peripheral instances, or clock configuration are identical. The SAF-XE167F-96F80L AC and SAF-XE167F-48F66L AC share the family and 144-pin footprint but differ in Flash density and derivative configuration, so linker scripts, startup code, and register-level initialization must be re-validated. Also confirm the exact ordering code's temperature grade and qualification status before production, because the verified web data did not include a confirmed operating-temperature range for this part.
Informations de conformité
Distributor listings (JAK Electronics) indicate RoHS compliance for the SAF-XE167F-96F66L under PG-LQFP-144. REACH, AEC-Q100 qualification, lead-free, and halogen-free status were not confirmed in the verified web data and must be checked against the specific ordering code's declaration.
