SI5330F-B00215-GMR - 1:8 LVCMOS Clock Buffer 200 MHz | Skyworks
Référence : SI5330F-B00215-GMR ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $4.1 | $4,10 |
| 10 | $3.72 | $37,20 |
| 100 | $3.2 | $320,00 |
| 500 | $2.85 | $1 425,00 |
| 1 000 | $2.55 | $2 550,00 |
SI5330F-B00215-GMR Présentation
A clock buffer (or fanout buffer) is a specialized timing IC that takes one reference clock input and replicates it across multiple output channels with minimal additive jitter and tightly controlled skew. Within the broader timing hierarchy, it sits between clock generators/PLLs and downstream loads such as ADCs, DACs, FPGAs, ASICs, and memory interfaces. By regenerating the input waveform at each output, a fanout buffer prevents the reference from being loaded down by many receivers and shields each output from board-level coupling.
Key features include programmable output enable per channel, input formats that accept LVCMOS, LVPECL, LVDS, HCSL, or SSTL style signals, and built-in level translation that allows the Si5330 to act as a clock-level translator between mixed-voltage domains. The Skyworks CMOS architecture targets low additive jitter while maintaining output-to-output skew within a few tens of picoseconds, supporting multi-lane serial interfaces, telecom line cards, and ATE instrumentation.
Typical applications are high-line-count telecom and networking backplanes, multi-FPGA/multi-ASIC clock trees, server and storage controllers, and reference-clock distribution in test and measurement equipment. The exposed thermal pad (EP) improves power dissipation for the eight switching outputs.
When designing in this part, place bypass capacitors of 0.1 µF plus 10 µF as close as possible to each VDD pin, keep trace lengths matched on all eight outputs to preserve low skew, and provide a solid ground pour connected to the EP to ensure thermal and return-path integrity.
Alternatives de remplacement direct pour SI5330F-B00215-GMR — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec SI5330F-B00215-GMR (même facteur de forme et même empreinte) — différant par Function, Number of Outputs, Package, Supply Voltage, Operating Temperature.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
SI5330F-B00214-GMR
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
SI5330F-B00213-GMR
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
SI5330F-B00215-GM
✅ Remplacement direct✓ En stock
$2.62 / unité
Voir la fiche technique →SI5330F-B00216-GMR
✅ Remplacement direct✓ En stock
$2.6 / unité
Voir la fiche technique →SI5330F-B00211-GMR
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
SI5330F-B00215-GMR Spécifications
| Fonction | Clock Buffer / Fanout Buffer / Level Translator |
| Nombre de sorties | 8 (1:8 fanout) |
| Maximum Output Frequency | 200 MHz |
| Type de sortie | LVCMOS |
| Input Type | LVCMOS, LVPECL, LVDS, HCSL, SSTL (single-ended or differential) |
| Tension d'alimentation | 1.8 V (-5%/+10%), 2.5 V (±10%), 3.3 V (±10%) |
| Température de fonctionnement | -40 °C to +85 °C |
| Input-Output Enable | Yes (per-channel output enable) |
| Boîtier | 24-pin VFQFN Exposed Pad |
| Type de montage | Surface Mount |
| Statut RoHS | Compliant |
Configuration des broches de SI5330F-B00215-GMR
| Broche 1 | CLK_IN — Single-ended or positive differential clock input |
| Broche 2 | CLK_IN# — Complementary differential clock input (or n/c for single-ended) |
| Broche 3 | GND — Ground reference |
| Broche 4 | VDD — Core supply (1.8 V / 2.5 V / 3.3 V) |
| Broche 5 | OE0 — Output enable for OUT0 |
| Broche 6 | OE1 — Output enable for OUT1 |
| Broche 7 | OE2 — Output enable for OUT2 |
| Broche 8 | OE3 — Output enable for OUT3 |
| Broche 9 | OE4 — Output enable for OUT4 |
| Broche 10 | OE5 — Output enable for OUT5 |
| Broche 11 | OE6 — Output enable for OUT6 |
| Broche 12 | OE7 — Output enable for OUT7 |
| Broche 13 | OUT0 — LVCMOS clock output 0 |
| Broche 14 | OUT1 — LVCMOS clock output 1 |
| Broche 15 | OUT2 — LVCMOS clock output 2 |
| Broche 16 | OUT3 — LVCMOS clock output 3 |
| Broche 17 | OUT4 — LVCMOS clock output 4 |
| Broche 18 | OUT5 — LVCMOS clock output 5 |
| Broche 19 | OUT6 — LVCMOS clock output 6 |
| Broche 20 | OUT7 — LVCMOS clock output 7 |
| Broche 21 | VDD — Output supply (1.8 V / 2.5 V / 3.3 V) |
| Broche 22 | GND — Ground reference |
| Broche 23 | NC — Not connected (per datasheet) |
| Broche 24 | NC — Not connected (per datasheet) |
Applications typiques
SI5330F-B00215-GMR convient pour 6 applications: Telecom Line-Card Reference Clock Distribution, Multi-FPGA / Multi-ASIC Clock Tree on a Single Board, Server and Storage Controller Reference Clocks, Test & Measurement Instrumentation Clock Fanout, Industrial Control and Factory Automation Backplanes, Mixed-Voltage Multi-Processor Compute Cards.
Telecom Line-Card Reference Clock Distribution
The SI5330F-B00215-GMR's 200 MHz LVCMOS output range covers common telecom reference frequencies such as 156.25 MHz OTN, 161.13 MHz SONET, and 100 MHz Ethernet, while its level-translating inputs accept LVPECL/LVDS backplane references. Placing one SI5330F-B00215-GMR per line card replaces per-ASIC oscillators with a single fanout buffer, cuts BOM cost, and keeps output-to-output skew low so multi-lane SERDES links remain phase-aligned across the card.
Recommandé
Multi-FPGA / Multi-ASIC Clock Tree on a Single Board
On large compute boards the SI5330F-B00215-GMR can fan out one reference clock to eight FPGAs/ASICs without loading the upstream oscillator. Its 24-VFQFN-EP footprint and 1.8/2.5/3.3 V supply flexibility let the same part drive 1.8 V FPGAs and 3.3 V legacy ASICs on a mixed-voltage board, while the per-channel output enable supports sequenced startup of heterogeneous compute tiles for safe bring-up.
Recommandé
Server and Storage Controller Reference Clocks
In SATA/SAS/NVMe storage controllers and server motherboards the SI5330F-B00215-GMR produces eight matched 100-125 MHz LVCMOS reference clocks from one crystal or oscillator. The low jitter of the Si5330 CMOS architecture preserves the eye diagram of high-speed serial links, and the exposed pad provides the thermal headroom needed when all eight outputs switch simultaneously under heavy I/O load.
Recommandé
Test & Measurement Instrumentation Clock Fanout
ATE platforms and bench instruments need many phase-coherent sample clocks distributed to ADCs, DACs, and FPGA DSP engines. The SI5330F-B00215-GMR, with its eight matched outputs and matched output-to-output skew, lets one master reference drive every converter channel without per-channel calibration, and the level translation lets a 3.3 V LVPECL oven oscillator feed 1.8 V converter banks on the same board.
Recommandé
Industrial Control and Factory Automation Backplanes
Industrial PLC and motion-control backplanes often distribute one reference clock to many motor-control ASICs and safety modules. The SI5330F-B00215-GMR's -40 °C to +85 °C industrial temperature range, 24-VFQFN-EP package with EP for thermal stability, and 3.3 V tolerance on the inputs make it suitable for harsh-factory environments while keeping jitter low enough for high-resolution encoder feedback loops.
Recommandé
Mixed-Voltage Multi-Processor Compute Cards
High-performance compute cards combine 1.8 V processors and 3.3 V legacy peripherals on one PCB; the SI5330F-B00215-GMR accepts either single-ended or differential inputs on any of its 1.8/2.5/3.3 V rails and fans them out to the eight endpoints. This lets a single SOIC-sized buffer replace eight individual drivers while preserving signal integrity and offering the per-channel output enable needed during power-sequenced boot.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour SI5330F-B00215-GMR — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | SI5330F-B00214-GMR | SI5330F-B00213-GMR | SI5330F-B00215-GM | SI5330F-B00216-GMR | SI5330F-B00211-GMR |
|---|---|---|---|---|---|---|
| Brand | Skyworks Solutions | Skyworks Solutions | Skyworks Solutions | Skyworks Solutions | Skyworks Solutions | Skyworks Solutions |
| Package | 24-VFQFN Exposed Pad | 24-VFQFN Exposed Pad (same) | 24-VFQFN Exposed Pad (same) | 24-VFQFN Exposed Pad (same) | 24-VFQFN Exposed Pad (same) | 24-VFQFN Exposed Pad (same) |
| Function | 1:8 LVCMOS Clock Buffer | 1:8 LVCMOS Clock Buffer | 1:8 LVCMOS Clock Buffer | 1:8 LVCMOS Clock Buffer | 1:8 LVCMOS Clock Buffer | 1:8 LVCMOS Clock Buffer |
| Maximum Output Frequency | 200 MHz | 200 MHz | 200 MHz | 200 MHz | 200 MHz | 200 MHz |
| Supply Voltage | 1.8/2.5/3.3 V | 1.8/2.5/3.3 V | 1.8/2.5/3.3 V | 1.8/2.5/3.3 V | 1.8/2.5/3.3 V | 1.8/2.5/3.3 V |
| Operating Temperature | -40 °C to +85 °C | -40 °C to +85 °C | -40 °C to +85 °C | -40 °C to +85 °C | -40 °C to +85 °C | -40 °C to +85 °C |
Principaux différenciateurs
- Three-slot supply flexibility supports mixed-voltage boards without a separate level translator (vs Single-supply 1:8 LVCMOS fanout buffers (e.g., 3.3 V only))
- Eight per-channel output-enable pins allow individual clock gating (vs Single-OE 1:8 fanout buffer options)
- Industrial -40 °C to +85 °C temperature range for outdoor / harsh environments (vs Commercial-grade (0 °C to +70 °C) clock buffers)
Notes de conception
Place a 0.1 µF decoupling capacitor as close as possible to every VDD pin and add a 10 µF bulk capacitor on the same plane, per the Si5330 datasheet application circuit. Place the capacitors on the same layer as the IC where possible and use short, wide traces to the VDD and GND pins to keep the high-frequency return path small.
Match the eight output traces for length and impedance to preserve the datasheet's output-to-output skew spec. Route each LVCMOS output over a continuous ground plane and avoid routing them parallel to noisy power rails for more than a few millimetres to limit crosstalk on adjacent clock outputs.
The 24-VFQFN-EP exposed thermal pad must be soldered to a ground pad, and the PCB thermal pad area should be enlarged (preferably 4-6 thermal vias to an internal ground plane) to spread heat when all eight outputs switch at 200 MHz. With all outputs loaded and switching simultaneously, expect up to ~600 mW of dynamic dissipation; adequate copper is required for reliability.
When feeding the SI5330F-B00215-GMR from a differential clock, terminate the differential pair near the input pins with the recommended 100 Ω differential / 50 Ω single-ended termination to avoid reflections. For single-ended LVCMOS inputs, AC-couple or DC-couple and bias the unused complementary input per the datasheet to avoid common-mode noise that couples into the LVCMOS outputs.
Do not leave any OE pin floating - the datasheet instructs that each output enable must be tied high or low. Floating OE pins can float into linear regions and lead to unwanted clock switching on the corresponding output. Drive unused OE pins to a known state with a 10 kΩ pull-up or direct connection.
Informations de conformité
RoHS and REACH compliance is per the Skyworks product page and distributor listings; AEC-Q100 automotive qualification is not stated - consult Skyworks for automotive-grade variants.
