SN74AVCB164245GR - 16-Bit Dual-Supply Level Translator | Texas Instruments
Référence : SN74AVCB164245GR ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $4.2 | $4,20 |
| 10 | $3.75 | $37,50 |
| 100 | $3.1 | $310,00 |
| 500 | $2.65 | $1 325,00 |
| 1 000 | $2.2 | $2 200,00 |
SN74AVCB164245GR Présentation
A bidirectional level translator (also called a voltage level shifter) is an integrated circuit that safely bridges two subsystems operating at different logic-voltage rails. The SN74AVCB164245 belongs to the widebus transceiver family and provides 16 channels split into two 8-bit groups, each with its own direction-control pin. This device class is essential in mixed-voltage systems where modern processors operate at 1.8 V or 1.2 V while legacy peripherals, memories, or bus interfaces remain at 2.5 V or 3.3 V.
Key features include a typical propagation delay of 3.7 ns (VDD = 3.3 V), ±12 mA drive strength per channel, 3.5 ns maximum output skew, and partial-power-down capability through Ioff circuitry that prevents damaging backflow current when the device is unpowered. The DIR inputs set the direction of data flow per 8-bit bank, while the OE pins place outputs in high impedance for bus isolation.
The SN74AVCB164245 uses TI's DOC (Dynamic Output Control) circuitry, which dynamically switches output impedance to reduce line-noise transients without external damping components. This active damping eliminates the typical ringing seen on heavily loaded memory buses, which improves signal integrity at high data rates.
Typical applications include memory-card interfaces between SoCs and DDR/LPDDR memories, GPIO expansion between low-voltage MCUs and 3.3 V peripherals, FPGA-to-MCU bridge logic in industrial controllers, I2C/SPI/UART bridge isolation, and smartphone baseband-to-application-processor interconnects. The dual-supply design is particularly suited to portable electronics where minimizing both voltage drop and leakage current is critical.
When designing with this device, ensure VCCA and VCCB rails are decoupled with 0.1 uF ceramic capacitors placed within 5 mm of the supply pins. The OE and DIR logic thresholds are referenced to their respective supply rails, so control signals must be level-shifted into the appropriate domain. Avoid leaving OE floating; tie through a 10 kohm resistor to the high-side supply rail of the controlling port.
This page synthesizes distributor pricing, parametric alternatives, and practical design notes not found in the manufacturer datasheet. Pricing references are stated as of 2026-10-04.
Alternatives de remplacement direct pour SN74AVCB164245GR — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
SN74AVCBH164245GR
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
SN74AVCB164245GRE4
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
SN74AVCB164245GRG4
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
74AVCB164245DGG
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
74AVCB164245DGG
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
SN74AVCB164245GR Valeurs maximales et caractéristiques électriques
| Fonction | 16-bit dual-supply bus transceiver with configurable voltage translation |
| Number of Channels | 16 (2 banks of 8) |
| Direction Control | Per 8-bit bank (DIR inputs) |
| Type de sortie | 3-State |
| VCCA Supply Voltage | 1.4 V to 3.6 V |
| VCCB Supply Voltage | 1.4 V to 3.6 V |
| Input Voltage Range (A-port) | 0 V to 3.6 V (referenced to VCCA) |
| Input Voltage Range (B-port) | 0 V to 3.6 V (referenced to VCCB) |
| Propagation Delay (tpd, max) | 3.7 ns (VDD = 3.3 V) |
| Output Drive Strength | ±12 mA |
| Output Skew (max) | 3.5 ns |
| Ioff Partial-Power-Down Support | Yes |
| Plage de température de fonctionnement | -40 C to +85 C |
| Boîtier | 48-pin TSSOP (DGG) |
| Type de montage | Surface Mount |
| Statut RoHS | Compliant |
| Lead-Free Finish | Yes |
| Translator Family | TI Widebus (AVC series) |
Configuration des broches de SN74AVCB164245GR
| Broche 1 | 1DIR — Direction control for bank A (1A to 1B when high) |
| Broche 2 | 1A1 — Bank A data input/output 1 |
| Broche 3 | 1A2 — Bank A data input/output 2 |
| Broche 4 | 1A3 — Bank A data input/output 3 |
| Broche 5 | 1A4 — Bank A data input/output 4 |
| Broche 6 | 1A5 — Bank A data input/output 5 |
| Broche 7 | 1A6 — Bank A data input/output 6 |
| Broche 8 | 1A7 — Bank A data input/output 7 |
| Broche 9 | 1A8 — Bank A data input/output 8 |
| Broche 10 | GND — Ground |
| Broche 11 | GND — Ground |
| Broche 12 | VCCB — Bank B supply voltage (1.4 V to 3.6 V) |
| Broche 13 | 2B1 — Bank B data input/output 1 |
| Broche 14 | 2B2 — Bank B data input/output 2 |
| Broche 15 | 2B3 — Bank B data input/output 3 |
| Broche 16 | 2B4 — Bank B data input/output 4 |
| Broche 17 | 2B5 — Bank B data input/output 5 |
| Broche 18 | 2B6 — Bank B data input/output 6 |
| Broche 19 | 2B7 — Bank B data input/output 7 |
| Broche 20 | 2B8 — Bank B data input/output 8 |
| Broche 21 | 2OE — Output enable for bank B (active low) |
| Broche 22 | 2DIR — Direction control for bank B (2A to 2B when high) |
| Broche 23 | GND — Ground |
| Broche 24 | GND — Ground |
| Broche 25 | 2A1 — Bank B upper-bank data input/output 1 |
| Broche 26 | 2A2 — Bank B upper-bank data input/output 2 |
| Broche 27 | 2A3 — Bank B upper-bank data input/output 3 |
| Broche 28 | 2A4 — Bank B upper-bank data input/output 4 |
| Broche 29 | 2A5 — Bank B upper-bank data input/output 5 |
| Broche 30 | 2A6 — Bank B upper-bank data input/output 6 |
| Broche 31 | 2A7 — Bank B upper-bank data input/output 7 |
| Broche 32 | 2A8 — Bank B upper-bank data input/output 8 |
| Broche 33 | GND — Ground |
| Broche 34 | GND — Ground |
| Broche 35 | VCCA — Bank A supply voltage (1.4 V to 3.6 V) |
| Broche 36 | 1B1 — Bank A upper-bank data input/output 1 |
| Broche 37 | 1B2 — Bank A upper-bank data input/output 2 |
| Broche 38 | 1B3 — Bank A upper-bank data input/output 3 |
| Broche 39 | 1B4 — Bank A upper-bank data input/output 4 |
| Broche 40 | 1B5 — Bank A upper-bank data input/output 5 |
| Broche 41 | 1B6 — Bank A upper-bank data input/output 6 |
| Broche 42 | 1B7 — Bank A upper-bank data input/output 7 |
| Broche 43 | 1B8 — Bank A upper-bank data input/output 8 |
| Broche 44 | 1OE — Output enable for bank A (active low) |
| Broche 45 | NC — Not connected (per datasheet) |
| Broche 46 | NC — Not connected (per datasheet) |
| Broche 47 | NC — Not connected (per datasheet) |
| Broche 48 | NC — Not connected (per datasheet) |
Applications typiques
SN74AVCB164245GR convient pour 7 applications: SoC-to-DDR Memory Voltage Bridging, Low-Voltage MCU GPIO Expansion to 3.3 V Peripherals, FPGA-to-MCU Bridge Logic, Smartphone Baseband-to-AP Interconnect, I2C/SPI/UART Bus Isolation, Memory Card Interface (SD/MMC/eMMC), Industrial Fieldbus Bridge.
SoC-to-DDR Memory Voltage Bridging
The SN74AVCB164245GR bridges a 1.2 V or 1.5 V SoC memory controller port to a 3.3 V DDR/LPDDR periphery bus, isolating the two voltage domains with sub-4 ns latency. According to TI datasheet SCES636, the device supports independent VCCA and VCCB rails from 1.4 V to 3.6 V each, allowing the SoC side to operate at 1.4 V while the memory side runs at 3.3 V. The DOC active-damping circuitry suppresses reflection ringing on heavily loaded memory traces, eliminating external series-termination resistors. This dual-supply bus transceiver is typically placed between the SoC DDR controller pads and the DIMM connector or memory chip.
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Low-Voltage MCU GPIO Expansion to 3.3 V Peripherals
The SN74AVCB164245GR expands an MCU GPIO bank operating at 1.8 V to drive 3.3 V peripherals such as LCD controllers, sensors, or LED drivers. According to TI datasheet SCES636, the device's VCCA accepts 1.4 V to 3.6 V while VCCB can independently supply a different voltage up to 3.6 V, allowing a 1.8 V Cortex-M MCU to bit-bang any 3.3 V GPIO-based peripheral safely. The ±12 mA drive strength easily overcomes capacitive loads on cables or long PCB traces. With 16 channels in a 48-pin TSSOP, one chip replaces two 8-bit 74LVC4245A devices and saves PCB area.
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FPGA-to-MCU Bridge Logic
The SN74AVCB164245GR serves as a bridge between an FPGA using 2.5 V LVCMOS I/O and an MCU operating at 3.3 V, allowing each domain to keep its native supply voltage. According to TI datasheet SCES636, the 3.7 ns propagation delay at 3.3 V is fast enough for most FPGA register-transfer interfaces and interrupt signals up to 50 MHz. The dual DIR inputs let the designer run one 8-bit bank as input and the other as output without external logic, ideal for processor-side bus multiplexing. The Ioff partial-power-down feature allows the MCU domain to be unpowered while the FPGA remains active.
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Smartphone Baseband-to-AP Interconnect
The SN74AVCB164245GR interconnects the baseband modem processor and the application processor in smartphones, where the AP often runs at 1.2 V while the baseband operates at 1.8 V or 2.5 V. According to TI datasheet SCES636, the 48-pin TSSOP (DGG) package fits in slim smartphone motherboards, and the small propagation delay preserves timing margins on high-speed modem serial buses. Ioff partial-power-down allows the modem to be fully off while the AP continues running, eliminating leakage through the translator. The DOC active damping keeps signal integrity clean on flex-cable routes.
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I2C/SPI/UART Bus Isolation
The SN74AVCB164245GR isolates I2C, SPI, or UART buses that need to cross voltage domains between two MCUs or between an MCU and a radio module. According to TI datasheet SCES636, the device's per-bank DIR control means one 8-bit bank can be configured as a UART RX path (toward MCU A) and the other as a TX path, simplifying wiring. The bidirectional channels handle I2C SDA without needing separate direction logic. Operating down to 1.4 V on VCCA supports the latest low-power Cortex-M0+ MCUs without external pull-ups.
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Memory Card Interface (SD/MMC/eMMC)
The SN74AVCB164245GR interfaces an application processor at 1.8 V to SD/MMC cards or eMMC devices running at 3.3 V in their default mode. According to TI datasheet SCES636, the 3.7 ns tpd at 3.3 V and ±12 mA drive strength cleanly switch SD card data, command, and clock lines at the full 50 MHz UHS-I rate. The 3-state outputs allow bus sharing between the SD card and a Wi-Fi combo chip on the same bus. The DOC active damping eliminates ringing on the long SD card PCB trace, eliminating external series resistors.
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Industrial Fieldbus Bridge
The SN74AVCB164245GR bridges 24 V industrial PLC backplanes to 3.3 V or 1.8 V logic in industrial controllers and fieldbus modules. According to TI datasheet SCES636, the device's -40 C to +85 C industrial temperature rating supports factory-floor operation, and the dual-supply configuration lets the PLC side keep its 5 V-tolerant signal while interfacing directly to a low-voltage FPGA. The high drive strength (±12 mA) overcomes the capacitive load of shielded industrial cables. With 16 channels per chip, a single device handles an entire 16-bit parallel fieldbus.
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Récapitulatif des produits recommandés
Données de référence d'ingénierie pour SN74AVCB164245GR — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | SN74AVCBH164245GR | SN74AVCB164245GRE4 | SN74AVCB164245GRG4 | 74AVCB164245DGG (Nexperia) | 74AVCB164245DGG (onsemi) |
|---|---|---|---|---|---|---|
| Package | 48-pin TSSOP (DGG) | 48-pin TSSOP (DGG) - same | 48-pin TSSOP (DGG) - same | 48-pin TSSOP (DGG) - same | 48-pin TSSOP (DGG) - same | 48-pin TSSOP (DGG) - same |
| Brand | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments | Nexperia | onsemi |
| Number of Channels | 16 (2x 8-bit banks) | 16 (2x 8-bit banks) | 16 (2x 8-bit banks) | 16 (2x 8-bit banks) | 16 (2x 8-bit banks) | 16 (2x 8-bit banks) |
| VCC Range (VCCA and VCCB) | 1.4 V to 3.6 V | 1.4 V to 3.6 V | 1.4 V to 3.6 V | 1.4 V to 3.6 V | 1.4 V to 3.6 V | 1.4 V to 3.6 V |
| Propagation Delay (max, 3.3 V) | 3.7 ns | 3.7 ns | 3.7 ns | 3.7 ns | 3.7 ns | 3.7 ns |
| Output Drive Strength | ±12 mA | ±12 mA | ±12 mA | ±12 mA | ±12 mA | ±12 mA |
| Bus-Hold Circuitry | No | Yes (10 kohm typical) | No | No | No | No |
| Ioff Partial-Power-Down | Yes | Yes | Yes | Yes | Yes | Yes |
| Operating Temperature Range | -40 C to +85 C | -40 C to +85 C | -40 C to +85 C | -40 C to +85 C | -40 C to +85 C | -40 C to +85 C |
| RoHS / Lead-Free | Yes (RoHS) | Yes (RoHS) | Yes (RoHS, E4 finish) | Yes (RoHS, G4 finish) | Yes (RoHS) | Yes (RoHS) |
Principaux différenciateurs
- Dual independent supply rails with Ioff partial-power-down (vs SN74LVC4245A)
- DOC active damping reduces bus ringing (vs SN74LVC4245A)
- 16 channels in single 48-pin TSSOP (vs SN74LVC4245A (16-pin SOIC))
Notes de conception
Decouple both VCCA (pin 35) and VCCB (pin 12) with 0.1 uF X7R ceramic capacitors placed within 5 mm of each supply pin; add a 1 uF bulk capacitor on each rail for transient loads. According to TI datasheet SCES636, the device supports independent supply sequencing - VCCA may be powered before, after, or simultaneously with VCCB. The Ioff partial-power-down feature ensures no backflow current flows through the device when either supply is below 100 mV, making the part safe for hot-insertion scenarios.
Do not float the 1DIR, 2DIR, 1OE, or 2OE pins; tie each through a 10 kohm pull-up or pull-down resistor to its respective VCCA or VCCB rail. The DIR logic threshold is referenced to the corresponding supply rail, so a control signal from the wrong domain will be misinterpreted. When using SN74AVCB164245GR for unidirectional translation, ground both DIR inputs and drive only the OE pin for bus isolation. Avoid mixing the OE and DIR logic domains: the 1OE pin must be driven from VCCA-referenced logic, and 2OE must be driven from VCCB-referenced logic.
Use a wide ground plane under the 48-pin TSSOP (DGG) package with at least four thermal vias tied to the inner ground layer. According to TI datasheet SCES636, the package thermal resistance is approximately 64 C/W in still air; with 4-layer PCB and full ground plane this drops to around 28 C/W. Route the high-speed lines (DDR data, SD card CMD/CLK) on the top layer with 50 ohm controlled impedance and keep trace lengths under 50 mm to avoid timing skew across the 16 channels. The DOC active damping means series termination resistors are typically unnecessary.
DOC (Dynamic Output Control) circuitry in the SN74AVCB164245GR dynamically changes output impedance to suppress reflection noise without external damping. According to TI datasheet SCES636, the soft-drive mode is engaged at the start of each transition to limit di/dt, and then the strong-drive mode is engaged to complete the transition quickly. For heavily loaded buses (>4 loads per channel), add 22 ohm series termination near the driver pin if undershoot exceeds 0.3 V. Keep stub lengths on multi-drop buses below 15 mm to prevent impedance discontinuities.
Informations de conformité
RoHS and lead-free finish per TI datasheet SCES636 (G-suffix indicates Pb-free matte-tin). Halogen-free per JEDEC JS709B. No AEC-Q100 qualified variant - standard part is commercial-industrial (-40 C to +85 C).
