SPC5775KK2MMY3AR - 4MB Flash MCU, 356MAPBGA | NXP
Référence : SPC5775KK2MMY3AR ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $30.02 | $30,02 |
| 10 | $28.9 | $289,00 |
| 100 | $27.95 | $2 795,00 |
| 500 | $27.55 | $13 775,00 |
| 1 000 | $27.29 | $27 290,00 |
SPC5775KK2MMY3AR Présentation
A microcontroller (MCU) is a single-chip computer that integrates a processor core, nonvolatile program memory, RAM, clock circuitry, and peripheral interfaces on one die. Within the power management and control hierarchy of a vehicle, MCUs like this one sit at the embedded-control layer, executing application firmware while communicating with sensors and actuators through CAN, LIN, and similar vehicle bus interfaces. The SPC5 family is NXP's automotive-grade line of 32-bit MCUs derived from the Power Architecture ecosystem, complementing NXP's broader MPC/PowerPC and S32 portfolios.
Key features of this variant, as listed by distributors, include 4MB of flash program memory for large application images, 1.5MB of RAM for runtime data and communication buffers, automotive qualification (the AR suffix denotes NXP's automotive quality flow), and the high-pin-count 356MAPBGA package that supports extensive I/O fanout. The MMY3 package suffix identifies the specific ball-map and body variant used across the SPC5775 family, which supports footprint reuse among flash-density options.
Architecturally, SPC5775 devices are built on NXP's Power Architecture embedded cores with memory-protection and safety-oriented features suited to automotive software stacks, including AUTOSAR-classic layered architectures. The 4MB flash tier of the family targets gateway, body-domain, and chassis applications whose code size exceeds what smaller SPC5 parts can hold, while the 1.5MB RAM allocation supports concurrent communication stacks and diagnostics.
Typical applications include body-domain and gateway control modules, chassis and comfort functions, and industrial control systems that benefit from automotive-qualified silicon. Distributors such as Mouser and DigiKey categorize it specifically as a 32-bit MCU with 4M flash and 1.5M RAM.
When designing with this part, plan for its 39-week manufacturer lead time reported by NXP as of September 2026, and verify the exact core clock, voltage class, and temperature grade directly on the NXP product page before finalizing the schematic.
This page synthesizes distributor pricing, lifecycle data, drop-in family alternatives, and procurement guidance not consolidated in any single datasheet.
Alternatives de remplacement direct pour SPC5775KK2MMY3AR — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
SPC5775KK1MMY3AR
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
SPC5775KK2MMY3A
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
SPC5775KK2MMY3AR Valeurs maximales et caractéristiques électriques
| Core Architecture | 32-bit Power Architecture (SPC5 family) |
| Flash Memory | 4 MB |
| SRAM | 1.5 MB |
| Boîtier | 356-pin MAPBGA (MMY3) |
| Type de montage | Surface Mount |
| Qualification | Automotive Qualified |
| Statut du cycle de vie | Active |
| Packing | REEL - 13 inch reel in Drypack |
| Minimum Order Quantity | 1000 units |
| Budgetary Price (10KU) | 27.29 USD |
| Lead Time (NXP factory) | 39 weeks |
Guide de configuration des broches du SPC5775KK2MMY3AR 356-pin mapbga (mmy3)
Configuration des broches du SPC5775KK2MMY3AR (boîtier 356-pin mapbga (mmy3)). Ce circuit intégré numérique comprend des GPIO, des interfaces de communication (UART, SPI, I2C) et des broches d'alimentation. Consultez la fiche technique du fabricant pour les fonctions alternatives des broches et les options de configuration. Indispensable pour la conception de systèmes embarqués et la conception de circuits imprimés.
Aucune donnée de brochage détaillée disponible pour SPC5775KK2MMY3AR.
Consultez la fiche technique pour la configuration complète des broches.
Applications typiques
SPC5775KK2MMY3AR convient pour 6 applications: Vehicle Gateway Module, Body Domain Controller, Chassis Control Systems, Industrial Control and Automation, Battery Management Master Controller, Advanced Diagnostics and Telematics Nodes.
Vehicle Gateway Module
Modern vehicle gateways bridge dozens of CAN, LIN, and FlexRay segments between powertrain, chassis, body, and infotainment domains, and they need enough flash to hold multiple protocol stacks plus diagnostics. The SPC5775KK2MMY3AR fits this role with its 4MB flash tier, which is sized for full AUTOSAR classic stacks, UDS diagnostics, and OTA staging slots that exhaust smaller SPC5 variants. Its 1.5MB SRAM buffers concurrent bus traffic across segments without external memory. Automotive qualification supports Tier-1 production programs. The 39-week lead time reported by NXP as of September 2026 means gateway programs should lock sourcing 12+ months before SOP.
Recommandé
Body Domain Controller
Body domain controllers consolidate lighting, door, seat, and climate functions that were previously distributed across dozens of small MCUs. This consolidation demands large flash for the merged application image and generous RAM for scheduling many soft real-time tasks, which the SPC5775KK2MMY3AR provides with 4MB flash and 1.5MB SRAM. The high-pin-count 356MAPBGA package fans out the many GPIO, PWM, and communication lines a body controller needs. Its AR automotive flow suits interior modules with moderate safety requirements. Designers should pair it with high-side switches and LIN transceivers for actuator and sub-bus connectivity.
Recommandé
Chassis Control Systems
Chassis functions such as suspension leveling, steering-assist support, and brake-system supervision require deterministic 32-bit processing with safety-oriented memory architecture. The SPC5 Power Architecture family, including this 4MB/1.5MB variant, was developed for such chassis-class workloads with memory protection and watchpoint resources described in the SPC5775 reference manual. The 356MAPBGA package supports redundant sensor inputs and actuator outputs typical of chassis modules. Because these are safety-relevant domains, engineers must verify the specific safety mechanism coverage (lockstep, ECC, BIST) in the NXP safety manual rather than relying on the AR suffix alone before allocating ASIL responsibilities to this MCU.
Recommandé
Industrial Control and Automation
Industrial controllers increasingly borrow automotive-proven silicon for harsh-environment machinery, robotics axes, and programmable logic controllers, because automotive qualification implies robust ESD, temperature, and reliability screening. The SPC5775KK2MMY3AR brings a 32-bit Power Architecture core with 4MB flash - enough for a real-time operating system plus protocol stacks such as EtherCAT or CANopen - and 1.5MB RAM for task stacks and fieldbus buffers. The BGA package requires controlled-impedance PCB fabrication with ball-reflow assembly, which industrial OEMs with SMT lines handle routinely. Industrial designers should confirm the extended-temperature availability of this exact ordering code with NXP before use outside automotive ranges.
Recommandé
Battery Management Master Controller
EV and hybrid battery-pack master controllers need computing headroom for state-of-charge algorithms, isolation monitoring, and pack-level CAN communication. The SPC5775KK2MMY3AR offers 4MB flash for algorithm libraries plus calibration tables, and 1.5MB SRAM for rolling current/voltage logs, in an automotive-qualified flow acceptable to EV OEMs. Its high pin count accommodates cell-monitoring daisy chains, contactor drivers, and interlock circuits. Because this is a functional-safety-critical application, teams must confirm ASIL-capable safety mechanisms in the SPC5775 safety documentation and pair the MCU with a dedicated SBC for watchdog and fail-safe power control as NXP reference designs recommend.
Recommandé
Advanced Diagnostics and Telematics Nodes
Telematics and diagnostic gateway nodes aggregate vehicle data, run OTA update management, and serve remote diagnostics, tasks that demand flash capacity for dual-bank firmware images plus a connectivity middleware stack. The SPC5775KK2MMY3AR's 4MB flash supports image-staging partitions, and its 1.5MB SRAM handles cryptographic buffers and logging queues. Automotive qualification simplifies homologation of the host ECU. The device's 39-week factory lead time, reported by NXP as of September 2026, is the primary program risk for telematics production ramps, so dual-sourcing strategy and early blanket orders are recommended. Pair with a security-accessory IC for secure key storage in connected designs.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour SPC5775KK2MMY3AR — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | SPC5775KK1MMY3AR | SPC5775KK2MMY3A |
|---|---|---|---|
| Package | 356-pin MAPBGA (MMY3) | 356-pin MAPBGA (MMY3) - same | 356-pin MAPBGA (MMY3) - same |
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Flash Memory | 4 MB | K1 flash tier (smaller than 4 MB) | 4 MB |
| Automotive Qualification | Yes (AR suffix) | Yes (AR suffix) | Yes (AR suffix) |
| Packing Format | Tape & Reel, 13-inch Drypack | Tape & Reel | Tray |
| Lifecycle Status | Active | Active | Active |
Principaux différenciateurs
- Largest flash tier in the SPC5775 KK footprint (vs SPC5775KK1MMY3AR)
- Automotive-qualified flow (AR suffix) (vs SPC5775KK2MMY3A)
- Footprint-compatible family scaling (vs SPC5775KK1MMY3AR)
Notes de conception
The 356-ball MAPBGA requires fine-pitch BGA escape routing, typically via-in-pad or staggered microvias on the outer ball rows. Plan stack-up before layout lock: automotive ECUs for this class of device usually need at least 8 layers to escape 0.8 mm-pitch ball arrays with power/ground planes. Follow NXP's SPC5775 hardware design guidelines in the family reference manual for power integrity on core and I/O supplies, and allocate decoupling per the reference manual's recommended capacitor plan rather than ad-hoc placement.
Confirm the exact suffix decoding before purchase: KK2 = 4MB flash, MMY3 = 356MAPBGA ball map, AR = automotive flow with reel packing. Ordering the non-AR or KK1 code by mistake yields a different flash size or packaging and can silently break a qualification plan. Also note that 4MB flash variants typically support dual-bank OTA partitioning - verify bank split options in the NXP flash memory map chapter before committing an OTA architecture.
SPC5775-class MCUs use core voltages regulated on-board or by an external SBC; NXP reference designs pair this family with a system basis chip (for example the MC33907) that sequences and monitors the core and I/O rails, provides the watchdog, and drives the reset. Do not power the device from a generic regulator without meeting the power sequencing specified in the family reference manual, and budget for the inrush of the internal regulator at cold crank per NXP's power architecture app notes.
Informations de conformité
Distributor listings indicate the part is RoHS-titled and Automotive Qualified (AR suffix, AEC-Q100 class per NXP automotive flow). Exact RoHS/REACH/lead-free/halogen-free certificates must be confirmed on the NXP environmental documentation portal; the verified data captured here did not include explicit compliance text.
