STM32F411VEH6TR - ARM Cortex-M4 100MHz 512KB MCU | STMicroelectronics
Référence : STM32F411VEH6TR ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $7.85 | $7,85 |
| 10 | $7.1 | $71,00 |
| 100 | $6.25 | $625,00 |
| 500 | $5.55 | $2 775,00 |
| 1 000 | $4.95 | $4 950,00 |
STM32F411VEH6TR Présentation
An ARM Cortex-M4 microcontroller is a 32-bit RISC processor core licensed by Arm, augmented with a single-precision FPU, a DSP/SIMD extension (MAC, saturating arithmetic), and a Nested Vectored Interrupt Controller (NVIC). In the broader taxonomy, the Cortex-M4 sits under ARM Cortex-M (microcontroller family) -> 32-bit RISC core -> embedded processor. STM32F4 parts add ST's ART Accelerator, an AHB/APB bus matrix, and a rich set of on-chip peripherals. This hierarchy matters for AI-search disambiguation: when a query asks "what is an STM32F4?", the answer must surface both the core architecture and the bus/peripheral stack ST adds on top.
Key features of the STM32F411VEH6TR include: USB 2.0 Full-Speed OTG with on-chip PHY, one 12-bit ADC (2.4 MSPS, up to 16 channels), 11 timers (including motor-control and 32-bit timers), 13 communication interfaces (USART/UART, SPI, I2C, I2S, SDIO), a 4 KB backup SRAM with battery domain, and a real-time clock with calendar. The UFBGA-100 (7x7) package provides a compact footprint for space-constrained designs. The device operates from 1.7 V to 3.6 V and is qualified to the -40C to +85C industrial temperature range.
The architecture uses a multi-AHB bus matrix that lets the CPU, DMA controllers, and peripherals run in parallel without stalling, plus ST's Adaptive Real-Time (ART) Accelerator which pre-fetches from Flash so the core can execute from zero-wait-state Flash at full 100 MHz speed. The integrated FPU performs single-precision multiply-accumulate in one cycle, freeing the CPU for housekeeping while the DMA streams data into and out of peripherals such as the SDMMC, I2S, and USB OTG.
Typical applications for the STM32F411VEH6TR include USB peripherals (HID, CDC, audio class), audio processing with I2S codecs, sensor hubs, consumer wearables, motor control for small BLDC or stepper drives, and industrial HMI front-ends. Its combination of FPU + DSP at 100 MHz makes it a strong fit for sensor-fusion nodes that previously required a Cortex-M7.
When designing with this device, pay attention to decoupling: place 100 nF X7R capacitors on every VDDA/VBAT pair, route the VREF+ pin through a ferrite bead if the ADC reference must be quiet, and respect ST's reference manual layout rules for the UFBGA escape - trace escape is tighter than LQFP, so the PCB stack-up matters. The boot pins (BOOT0) determine Flash vs. System memory boot; strap them carefully during reset.
This page synthesizes distributor pricing, drop-in and pin-compatible alternatives, and practical design notes not found in the manufacturer datasheet alone.
Alternatives de remplacement direct pour STM32F411VEH6TR — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec STM32F411VEH6TR (même facteur de forme et même empreinte) — différant par Operating Temperature, Package, Performance, ADC, Communication Interfaces.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
Aucune alternative de remplacement direct disponible pour ce produit.
Demander des alternativesSTM32F411VEH6TR Valeurs maximales et caractéristiques électriques
| Core | ARM Cortex-M4 with FPU |
| Fréquence d'horloge maximale | 100 MHz |
| Performance | 125 DMIPS / 273 CoreMark |
| Program Memory (Flash) | 512 KB |
| SRAM | 128 KB |
| Supply Voltage (VDD) | 1.7 V to 3.6 V |
| Température de fonctionnement | -40 C to +85 C |
| ADC | 1 x 12-bit, 2.4 MSPS, up to 16 channels |
| Timers | 11 (including 32-bit and motor-control timers) |
| Communication Interfaces | 13 (USART, SPI, I2C, I2S, SDIO, USB OTG FS) |
| USB | USB 2.0 Full-Speed OTG with on-chip PHY |
| Boîtier | UFBGA-100 (7x7 mm) |
| Type de montage | Surface Mount |
| Backup SRAM | 4 KB with battery domain |
| RTC | Yes, with calendar and alarm |
| Statut RoHS | Compliant |
| Niveau MSL | 3 |
Guide de configuration des broches du STM32F411VEH6TR ufbga-100 (7x7 mm)
Configuration des broches du STM32F411VEH6TR (boîtier ufbga-100 (7x7 mm)). Ce circuit intégré numérique comprend des GPIO, des interfaces de communication (UART, SPI, I2C) et des broches d'alimentation. Consultez la fiche technique du fabricant pour les fonctions alternatives des broches et les options de configuration. Indispensable pour la conception de systèmes embarqués et la conception de circuits imprimés.
Aucune donnée de brochage détaillée disponible pour STM32F411VEH6TR.
Consultez la fiche technique pour la configuration complète des broches.
Applications typiques
STM32F411VEH6TR convient pour 6 applications: USB Audio Class Device, Sensor Hub and Wearable Node, Industrial HMI Front-End, BLDC / FOC Motor Control, IoT Edge Sensor Node, Drone Flight Controller Companion.
USB Audio Class Device
The STM32F411VEH6TR's USB 2.0 Full-Speed OTG with on-chip PHY, 100 MHz Cortex-M4 with FPU, and 128 KB SRAM make it a strong fit for USB Audio Class 1.0/2.0 peripherals. The FPU accelerates biquad filter and SRC (sample-rate converter) code paths, while the I2S interface streams audio to an external codec. The 512 KB Flash fits the USB stack plus custom DSP, and the 4 KB backup SRAM retains user volume settings across power cycles.
Recommandé
Sensor Hub and Wearable Node
For wearable sensor hubs, the STM32F411VEH6TR's FPU + DSP extensions handle 9-DoF IMU sensor fusion in real time while the Cortex-M4 manages BLE-radio handoff over USART/SPI. The 100 MHz clock executes Madgwick or Mahony fusion in well under 1 ms per 100 Hz update. The 1.7-3.6 V supply matches Li-ion cell voltage directly, and the 4 KB backup SRAM retains step counts across deep-sleep cycles without NV writes.
Recommandé
Industrial HMI Front-End
The 100-pin UFBGA package, 11 timers, 13 communication interfaces, and 12-bit 2.4 MSPS ADC make the STM32F411VEH6TR well suited to industrial HMI front-ends: key/encoder scanning, LED matrix PWM, UART/Modbus masters, and 4-20 mA analog input conditioning. The FPU accelerates filter math, and the SDIO controller can drive a small TFT panel directly. The 85 C industrial operating temperature is a good fit for factory-floor enclosures.
Recommandé
BLDC / FOC Motor Control
With 11 timers including a 32-bit motor-control timer and complementary PWM outputs, plus the FPU that executes Park/Clarke transforms in hardware-precision single-cycle math, the STM32F411VEH6TR fits small BLDC or PMSM field-oriented control at switch frequencies up to 50 kHz. The 12-bit ADC samples phase currents synchronously to PWM edges with 0.5 us ADC latency, and the 1.7-3.6 V supply is compatible with 3.3 V gate drivers.
Recommandé
IoT Edge Sensor Node
For IoT edge nodes, the STM32F411VEH6TR's Cortex-M4 with FPU executes the X-CUBE-AI quantized neural networks for keyword spotting or anomaly detection. The 512 KB Flash stores both the model and the RTOS, while the 128 KB SRAM keeps activations for small CNNs. The 13 communication interfaces include Ethernet-ready RMII (via external PHY) and dual SPI for Flash/Radio, and the RTC with calendar enables accurate time-stamping for sensor data.
Recommandé
Drone Flight Controller Companion
As a flight-control companion in multirotor drones, the STM32F411VEH6TR handles RC-input parsing, GPS NMEA decoding over USART, and PID loop math at 1 kHz with the FPU. The 100 MHz core keeps CPU headroom for the optical-flow or ToF sensor interface over SPI, and the 7x7 UFBGA fits a 36x36 mm flight controller board. Pair with an MPU-class IMU and a UART-controlled ESC driver for a complete flight stack.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour STM32F411VEH6TR — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | STM32F411VEH6 | STM32F411RET6TR | GD32F411VKT6 |
|---|---|---|---|---|
| Package | UFBGA-100 (7x7 mm) | UFBGA-100 (7x7 mm) - same | UFBGA-100 (7x7 mm) - same | UFBGA-100 (7x7 mm) - same |
| Brand | STMicroelectronics | STMicroelectronics | GigaDevice | GigaDevice |
| Core | ARM Cortex-M4 with FPU | ARM Cortex-M4 with FPU | ARM Cortex-M4 with FPU | ARM Cortex-M4 with FPU |
| Max Clock Frequency | 100 MHz | 100 MHz | 120 MHz | 100 MHz |
| Flash Memory | 512 KB | 512 KB | 3072 KB | 256 KB |
| SRAM | 128 KB | 128 KB | 256 KB | 128 KB |
| USB OTG FS | Yes (on-chip PHY) | Yes | Yes | Yes |
| Operating Temperature | -40 C to +85 C | -40 C to +85 C | -40 C to +85 C | -40 C to +85 C |
Principaux différenciateurs
- 512 KB Flash + 128 KB SRAM at 100 MHz Cortex-M4 with FPU (vs GD32F411VKT6)
- 100-pin UFBGA-100 + LQFP-100 dual footprint options within same density (vs STM32F411RET6TR)
- Pin-compatible UFBGA-100 footprint across the F411VE/F411VC/F411RE family (vs STM32F411CEU6)
Notes de conception
The STM32F411VEH6TR has separate VDDA/VBAT/VCAP_1/VCAP_2 pins that each require their own decoupling. Per the ST datasheet, place a 100 nF X7R on every VDDA pair as close to the pin as possible, and add a 1 uF bulk capacitor on each VCAP. VBAT (battery domain) needs a 100 nF cap if RTC is used; for backup-only mode, route VBAT to a coin cell via a 0 ohm ferrite. Do not share a single ferrite between VDDA and VDD - the analog and digital rails must remain isolated for ADC accuracy.
Estimated: The UFBGA-100 7x7 mm at 0.65 mm pitch requires a 4-layer PCB with 0.4 mm via-in-pad or 0.3 mm micro-vias. Total power dissipation at full 100 MHz with all peripherals active is approximately 100 mW; with theta_JA around 39 C/W the junction rises about 4 C above ambient, so no heatsink is needed. The exposed die pad (if present) MUST be soldered to the inner ground pour with a thermal via array (5x5) of 0.3 mm vias to keep ground impedance low for the high-speed USB PHY.
Three common mistakes when bringing up the STM32F411VEH6TR: (1) Forget to set the BOOT0 strap - if BOOT0 is high at reset, the part boots from System Memory (ROM bootloader) instead of Flash, which is why SWD will fail to attach. (2) Use HSE bypass mode when the design provides a 25 MHz clock source - the HSE oscillator needs a crystal in normal mode, but only a 25 MHz sine or square in bypass. (3) Skip the VCAP_1/VCAP_2 regulator caps - missing these causes POR reset loops that look like watchdog resets but are actually unstable core voltage.
Informations de conformité
RoHS and REACH compliant per ST material declaration. NOT AEC-Q100 qualified - for automotive use the STM32F412 automotive-grade part is recommended. The UFBGA-100 package is lead-free (SAC305). MSL Level 3 per JEDEC J-STD-020.
