STM32WB55RGV6 - Dual-Core BLE 5.3 MCU 1MB Flash | STMicroelectronics
Référence : STM32WB55RGV6 ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $6.9 | $6,90 |
| 10 | $6.2 | $62,00 |
| 100 | $5.6 | $560,00 |
| 500 | $5.1 | $2 550,00 |
| 1 000 | $4.7 | $4 700,00 |
STM32WB55RGV6 Présentation
A wireless MCU is a microcontroller that integrates both a processing core and a radio transceiver on a single die, sitting at the intersection of the microcontroller and RF transceiver product categories within the broader wireless-connectivity semiconductor hierarchy. By partitioning the real-time radio stack onto the Cortex-M0+ and the user application onto the Cortex-M4, the STM32WB55 family guarantees RF protocol timing independence from application load - a key architectural advantage over single-core BLE MCUs.
Key features include 1 MB of Flash and 256 KB of SRAM for application and stack storage, support for Bluetooth 5.3, Thread, and Zigbee protocols on the same silicon, a rich peripheral set (USB 2.0 full-speed device, USART, SPI, I2C, I2S, Quad-SPI, 12-bit ADC, comparators, touch sensing), and ultra-low-power modes with down to a few microamps in Stop 2 with RAM retention. The integrated balun and output power up to +6 dBm (as per family datasheet range) simplify RF front-end design.
The dual-core radio architecture offloads BLE/802.15.4 stacks from the application core, so deterministic real-time behavior, security via the Cortex-M0+ trust boundary, and OTA firmware update capability are maintained even under heavy application processing. The 68-pin VFQFPN-EP (7x7 mm class) package provides a good GPIO count for sensor hubs and HMI.
Typical applications include smart-home sensors and lighting (Thread/Zigbee), Bluetooth LE beacons and wearables, industrial wireless nodes, and medical monitoring devices.
Design consideration: RF layout requires a 50-ohm match to the antenna and solid ground planes on the exposed pad; verify the exact radio output-power and sensitivity figures against the official STM32WB55xx datasheet.
This page synthesizes distributor pricing, drop-in alternatives, comparison tables, and design notes not found in the manufacturer datasheet.
Alternatives de remplacement direct pour STM32WB55RGV6 — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec STM32WB55RGV6 (même facteur de forme et même empreinte) — différant par Flash Memory, Package, Radio Protocols.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
STM32WB55RGV7
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
STM32WB55VGV6
✅ Remplacement direct ⚠️ Spécifications non vérifiées📋 Alternative de référence (hors catalogue)
STM32WB55VEV6
✅ Remplacement direct ⚠️ Spécifications non vérifiées📋 Alternative de référence (hors catalogue)
STM32WB35CCV6
✅ Remplacement direct ⚠️ Spécifications non vérifiées📋 Alternative de référence (hors catalogue)
STM32WB55RGV6 Valeurs maximales et caractéristiques électriques
| Core (Application) | Arm Cortex-M4 with FPU, 64 MHz |
| Core (Radio) | Arm Cortex-M0+, 32 MHz |
| Flash Memory | 1 Mbyte |
| Radio Protocols | Bluetooth 5.3 (SIG 5.4-compliant radio), IEEE 802.15.4-2011, Thread, Zigbee |
| Frequency Range | 2.405 GHz to 2.48 GHz |
| Boîtier | 68-VFQFPN Exposed Pad |
| Type de montage | Surface Mount |
| USB | USB 2.0 full-speed device |
| Statut RoHS | Compliant |
| Product Family | STM32WB55xx ultra-low-power dual-core wireless MCU |
Guide de configuration des broches du STM32WB55RGV6 68-vfqfpn exposed pad
Configuration des broches du STM32WB55RGV6 (boîtier 68-vfqfpn exposed pad). Ce circuit intégré numérique comprend des GPIO, des interfaces de communication (UART, SPI, I2C) et des broches d'alimentation. Consultez la fiche technique du fabricant pour les fonctions alternatives des broches et les options de configuration. Indispensable pour la conception de systèmes embarqués et la conception de circuits imprimés.
Aucune donnée de brochage détaillée disponible pour STM32WB55RGV6.
Consultez la fiche technique pour la configuration complète des broches.
Applications typiques
STM32WB55RGV6 convient pour 6 applications: Smart-Home Sensors and Lighting, Bluetooth LE Beacons and Wearables, Industrial Wireless Sensor Nodes, Medical Monitoring Devices, Thread/Zigbee Gateways and Border Routers, OTA-Updateable Connected Devices.
Smart-Home Sensors and Lighting
The STM32WB55RGV6 fits smart-home sensor and lighting nodes because its radio is compliant with both Bluetooth LE 5.3/5.4 and IEEE 802.15.4-2011, the PHY layer of Thread and Zigbee - letting one BOM serve multiple ecosystems. The dual-core split keeps the mesh stack timing-deterministic on the Cortex-M0+ while the 64 MHz Cortex-M4 with FPU handles sensor fusion and local logic on 1 MB Flash. In a typical node, the MCU sleeps in a low-power stop mode between events, waking on sensor interrupts or radio packets; ultra-low-power stop modes with RAM retention extend coin-cell life in occupancy and door sensors. Use STM32CubeWB's Thread or Zigbee stacks for the network layer and the ADC/comparator peripherals for direct sensor interface.
Recommandé
Bluetooth LE Beacons and Wearables
For BLE beacons, tags, and wearables, the STM32WB55RGV6 offers BLE 5.3-compliant long-range coded PHY options, an integrated balun that reduces external RF component count, and USB 2.0 full-speed device for charging/configuration links. The 64 MHz Cortex-M4 with FPU runs UI, sensor-fusion, and encryption workloads, while the dedicated Cortex-M0+ radio core maintains connection-event timing independent of application load - critical for reliable connections in dense RF environments. Ultra-low-power stop modes with RAM retention support months of coin-cell operation in asset tags. Design consideration: keep the antenna matching network to 50 ohms and reserve ground clearance per the ST reference design to pass regulatory testing on the first attempt.
Recommandé
Industrial Wireless Sensor Nodes
Industrial condition-monitoring and process nodes benefit from the STM32WB55RGV6's combination of a 12-bit-class ADC, comparators, timers, and a multiprotocol radio in one device, reducing BOM complexity in 802.15.4-based networks such as Thread or Zigbee-based industrial monitoring. The wide peripheral set (Quad-SPI for external memory, multiple USART/SPI/I2C ports) supports dataloggers and gateway front-ends, while the dual-core security partition helps isolate key material in OTA-update scenarios. Its extended temperature class and industrial-grade qualification per the STM32WB55 family datasheet suit factory-floor deployments. The 68-pin VFQFPN-EP provides enough GPIO to drive local HMI and relay outputs without an external I/O expander.
Recommandé
Medical Monitoring Devices
Battery-powered medical monitors (pulse oximeters, glucose meters, activity trackers) use the STM32WB55RGV6's BLE 5.3 link for phone/gateway connectivity and its ultra-low-power modes for multi-week battery life. The Cortex-M4 with hardware FPU executes filtering algorithms (e.g., digital filtering of photoplethysmography signals) at 64 MHz, while the isolated M0+ radio core simplifies safety argumentation for the wireless stack. The hardware crypto resources of the WB55 family support data confidentiality required in health data handling - verify the exact crypto feature set in the datasheet. The exposed-pad VFQFPN package with good thermal spreading supports compact, sealed enclosures typical of medical devices.
Recommandé
Thread/Zigbee Gateways and Border Routers
In gateways, the STM32WB55RGV6 bridges 802.15.4 mesh networks to BLE-enabled phones or to a host processor over USB 2.0 full-speed or UART. Acting as a network co-processor, the M0+ runs the OpenThread/Zigbee stack while the M4 manages application protocol translation on 1 MB Flash - room for multi-protocol coexistence firmware. The 2.405-2.48 GHz radio with family-datasheet output power up to the +6 dBm class, plus coexistence mechanisms between BLE and 802.15.4, sustains reliable mesh performance in congested 2.4 GHz environments. Use the 68-pin package's spare GPIOs for status LEDs and network-reset buttons in field-installed hardware.
Recommandé
OTA-Updateable Connected Devices
Connected products requiring secure over-the-air firmware updates exploit the STM32WB55RGV6's dual-bank-class Flash architecture (1 MB) and the Cortex-M0+ trust boundary: radio and security services run on the M0+ core, isolating key operations from the application. ST's STM32CubeWB provides OTA reference implementations for BLE, and the Quad-SPI interface can hold update images in external Flash. The 64 MHz Cortex-M4 decompresses and verifies images fast enough to keep update windows short, limiting downtime. This makes the part suitable for smart locks, thermostats, and industrial endpoints that must receive security patches over their service life.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour STM32WB55RGV6 — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | STM32WB55RGV7 | STM32WB55VGV6 | STM32WB55VEV6 | STM32WB35CCV6 |
|---|---|---|---|---|---|
| Package | 68-VFQFPN EP | 68-VFQFPN EP - same | 68-VFQFPN EP - same | 68-VFQFPN EP - same | 68-VFQFPN EP - same |
| Brand | STMicroelectronics | STMicroelectronics | STMicroelectronics | STMicroelectronics | STMicroelectronics |
| Application Core | Arm Cortex-M4 64 MHz | Arm Cortex-M4 64 MHz | Arm Cortex-M4 64 MHz | Arm Cortex-M4 64 MHz | Arm Cortex-M4 64 MHz |
| Radio Protocols | BLE 5.3 + 802.15.4 | BLE 5.3 + 802.15.4 | BLE 5.3 + 802.15.4 | BLE 5.3 + 802.15.4 | BLE 5.3 + 802.15.4 |
| Chip Revision | V6 | V7 (newer) | V6 | V6 | V6 |
| Drop-in Compatibility | Reference | Pin-to-pin, best substitution | Pin-to-pin, verify feature set | Pin-to-pin, less Flash | Pin-compatible, reduced peripherals |
Principaux différenciateurs
- True dual-core radio architecture (vs STM32WB35CCV6)
- Revision-identical substitution path (vs STM32WB55RGV7)
- More GPIOs than 48-pin family members (vs STM32WB55CGU6)
- Honest trade-off - Flash vs package (vs STM32WB55VEV6)
Notes de conception
The 68-pin VFQFPN exposed pad is the primary RF and thermal ground return. Connect the exposed pad to a solid, unbroken ground plane with a 3x3 (or more) via array directly under the package. Follow the STMicroelectronics STM32WB55 hardware reference design / NUCLEO-WB55 layout for the antenna matching network (50-ohm), keeping RF traces short, on a keep-out area free of other signals, and with ground stitching vias along both sides. Poor exposed-pad soldering is the most common cause of degraded RF range in production units.
Decouple each VDD/VDDRF pin with 100 nF ceramic capacitors placed within 2 mm of the pin, plus bulk capacitance (4.7-10 uF) near the supply entry. Follow ST AN5156 / family hardware getting-started guidance for regulator (LDO vs SMPS mode, where applicable) configuration. Verify the exact supply-voltage range in the datasheet before finalizing the power tree. RF performance is sensitive to supply ripple, so keep switching-regulator nodes away from VDDRF and the antenna feed.
Silicon revision matters: the RGV7 is a newer revision than RGV6, so always check the current STM32WB55 errata sheet before production, and budget firmware requalification when substituting revisions. Second, remember the dual-core programming model: after erasing Flash with external tools, both cores must be programmed (M0+ stack image plus M4 application); STM32CubeProgrammer handles multi-image flashing, but custom production tools often miss the M0+ image, producing boards that never advertise over BLE.
High-speed GPIO activity on ports adjacent to the RF section can couple into the 2.4 GHz front-end. Route clocks (e.g., 32 MHz HSE or LSE crystal traces) short, guarded by ground, and away from antenna feed lines. Use STM32CubeMX to verify alternate-function assignments and avoid placing fast-toggle pins on package pins nearest RF nets during layout.
Informations de conformité
RoHS compliance per STMicroelectronics product data as listed on distributor pages. REACH, halogen-free, and conflict-minerals declarations should be confirmed via official ST compliance documentation.
