T1024NSE7MQA - QorIQ Dual-Core 1.2GHz Power Arch SoC | NXP
Référence : T1024NSE7MQA ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $100.0977 | $100,10 |
| 10 | $95.5 | $955,00 |
| 100 | $88.2 | $8 820,00 |
| 500 | $80.4 | $40 200,00 |
| 1 000 | $74.1 | $74 100,00 |
T1024NSE7MQA Présentation
A communications SoC (System-on-Chip) is an integrated processor that combines CPU cores, memory controllers, hardware accelerators and peripheral interfaces on a single die. QorIQ T1 series SoCs sit within NXP's networking processor hierarchy: application-specific CPU -> embedded communications processor -> SoC -> power-managed networking platform. By integrating DPAA frame queues, SEC encryption, and SerDes for Ethernet and PCIe, the platform eliminates the discrete-asset controller ICs required in legacy designs.
Key features include dual e5500 cores up to 1.2 GHz, 64-bit ISA with hypervisor support, an integrated SEC security engine accelerating AES, 3DES, Kasumi, SNOW and public-key algorithms, and built-in DDR3L/DDR4 SDRAM controller with ECC. The HFBGA-780 package exposes 4 SerDes lanes configurable for Aurora, XAUI, PCIe Gen2 and 10 Gigabit Ethernet. Hardware support for IEEE 1588 timestamps, packet parsing and queuing offloads CPU load at line rate.
Architecturally the part relies on the Power Architecture e5500 dual-issue superscalar core with symmetric multiprocessing and hardware virtualization hooks. The DPAA engine uses a 16-work-element command queue per BMan/QMan complex for parallel packet dispatch. The integrated SEC block supports both Kasumi and SNOW 3G, suiting the part to LTE control-plane cryptography in addition to wireline IPSec tunnels.
Typical applications include industrial control routers, LTE small-cell baseband, fan-less network-attached storage controllers, secure VPN gateways and intelligent IoT gateways. Routing platforms typically pair the T1024NSE7MQA with NXP SGMII PHYs, while control-plane applications use only the SEC block and a small NOR flash footprint.
Designers should size decoupling for the HFBGA-780 substrate to keep the 1.2 GHz core within the 0 to 105C thermal envelope, and verify SerDes lane allocation when mapping XFI, PCIe and Aurora on the same SoC. PCB layout must strictly follow the NXP 23x23 mm escape rules for the BGA.
This page synthesizes distributor pricing, drop-in alternatives drawn from the QorIQ T1 family, and practical design notes not aggregated on any single manufacturer page.
Alternatives de remplacement direct pour T1024NSE7MQA — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec T1024NSE7MQA (même facteur de forme et même empreinte) — différant par Core Architecture, Memory Controller, Mounting Type, Operating Temperature, Package.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
T1023NSN7MQA
✅ Remplacement direct ⚠️ Spécifications non vérifiées📋 Alternative de référence (hors catalogue)
T1014NSE7MQA
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
T1013NSE7MQA
✅ Remplacement direct ⚠️ Spécifications non vérifiées📋 Alternative de référence (hors catalogue)
T1024NSE7KQA
✅ Remplacement direct ⚠️ Spécifications non vérifiées📋 Alternative de référence (hors catalogue)
T1024NSE7MQA Valeurs maximales et caractéristiques électriques
| Core Architecture | Power Architecture e5500 (dual-core) |
| Core Count | 2 |
| Data Width | 64-bit |
| Core Frequency | 1.2 GHz |
| Series | QorIQ T1 |
| Memory Controller | DDR3L / DDR4 with ECC |
| Integrated Crypto Engine | SEC (AES, 3DES, Kasumi, SNOW, public-key) |
| Acceleration Engine | Data Path Acceleration Architecture (DPAA) |
| PCIe Interface | PCIe Gen2 |
| Ethernet Interface | 1 GbE and 10 GbE |
| Température de fonctionnement | 0C to +105C |
| Boîtier | 780-FBGA (HFBGA), 23x23 mm |
| Nombre de broches | 780 |
| Type de montage | Surface Mount |
| Statut RoHS | Compliant |
Guide de configuration des broches du T1024NSE7MQA 780-fbga (hfbga), 23x23 mm
Configuration des broches du T1024NSE7MQA (boîtier 780-fbga (hfbga), 23x23 mm). Ce circuit intégré numérique comprend des GPIO, des interfaces de communication (UART, SPI, I2C) et des broches d'alimentation. Consultez la fiche technique du fabricant pour les fonctions alternatives des broches et les options de configuration. Indispensable pour la conception de systèmes embarqués et la conception de circuits imprimés.
Aucune donnée de brochage détaillée disponible pour T1024NSE7MQA.
Consultez la fiche technique pour la configuration complète des broches.
Applications typiques
T1024NSE7MQA convient pour 6 applications: Industrial Control Router, LTE Small-Cell Baseband, Secure VPN Gateway, Fan-less Network-Attached Storage Controller, Intelligent IoT Edge Gateway, Telecom Control-Plane Server.
Industrial Control Router
The T1024NSE7MQA powers industrial control routers that must forward multi-protocol traffic on the factory floor without active cooling. Its dual 1.2 GHz e5500 cores plus DPAA offload forward Ethernet/IP, PROFINET and Modbus TCP at line rate, while the integrated SEC engine terminates IPSec tunnels for remote O&M access. The HFBGA-780 23x23 mm package is small enough for DIN-rail housings, and the 0 to 105C junction rating supports unventilated enclosures. Using NXP SGMII PHYs and DDR3L ECC memory the design achieves low MTBF targets required for Industry 4.0 deployments.
Recommandé
LTE Small-Cell Baseband
The T1024NSE7MQA performs LTE Layer-2/3 scheduling and ciphering for small-cell base stations thanks to its SEC engine acceleration of Kasumi, SNOW 3G and AES. With two e5500 cores running at 1.2 GHz the SoC can schedule up to ~200 connected users in FDD-LTE mode while leaving headroom for SON and O&M tasks. Hardware IEEE 1588 timestamps support CPRI backhaul synchronization, and PCIe Gen2 lanes interconnect the radio card to the SoC. The 105C thermal envelope matches outdoor small-cell cabinet requirements.
Recommandé
Secure VPN Gateway
Branch-office VPN gateways run the T1024NSE7MQA to terminate hundreds of IPSec and MACsec tunnels while sustaining multi-Gbps routing throughput. The SEC engine accelerates AES-GCM, 3DES and public-key RSA/ECC at line rate, leaving the two e5500 cores free to run the routing stack and policy engine. DDR3L ECC delivers deterministic latency for security associations, while the integrated 10 GbE SerDes uplinks the gateway directly to the WAN. Dual-core isolation also enables split control/data planes in a single SoC.
Recommandé
Fan-less Network-Attached Storage Controller
Fan-less NAS controllers benefit from the T1024NSE7MQA's 6 to 8 W typical envelope inside a sealed enclosure, providing enough compute to run a Linux RAID stack, SMB/NFS daemons and an embedded web UI. The PCIe Gen2 lanes attach SATA or SAS controller chips, while the 10 GbE SerDes aggregate multiple client streams. The integrated SEC engine provides transparent at-rest encryption for the NAS RAID volumes with negligible throughput penalty. Its wide temperature grade supports commercial NAS chassis without active cooling.
Recommandé
Intelligent IoT Edge Gateway
The T1024NSE7MQA bridges field-bus sensors and cloud APIs in industrial IoT gateways by combining dual-core application processing with deterministic DPAA offload for time-critical traffic. Its SEC block secures MQTT and OPC-UA sessions with TLS 1.2/1.3, while DPAA prioritizes Modbus and EtherCAT frames on the same physical port. The HFBGA-780 23x23 mm footprint allows compact DIN-rail enclosures, and the 0 to 105C range tolerates factory cabinet conditions. NXP LTS Linux BSP and Yocto layers shorten time-to-market for new edge protocols.
Recommandé
Telecom Control-Plane Server
The T1024NSE7MQA's hardware virtualization hooks let telecom vendors consolidate multiple network functions onto a single SoC in a control-plane appliance. AES and Kasumi engines accelerate LTE NAS ciphering, while DPAA handles backhaul-plane signaling without external NPUs. The dual-core configuration with SEC-offloaded crypto reduces CPU load, allowing the platform to hit deterministic latency targets for VoLTE and IMS control paths. ECC memory is essential for telecom reliability targets, integrated in the DDR3L/DDR4 controller.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour T1024NSE7MQA — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | T1023NSN7MQA | T1014NSE7MQA | T1013NSE7MQA | T1024NSE7KQA |
|---|---|---|---|---|---|
| Package | 780-FBGA (HFBGA) 23x23 mm | 780-FBGA (HFBGA) 23x23 mm - same | 780-FBGA (HFBGA) 23x23 mm - same | 780-FBGA (HFBGA) 23x23 mm - same | 780-FBGA (HFBGA) 23x23 mm - same |
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Core Count | 2 | 2 (one disabled) | 1 | 1 | 2 |
| Core Frequency | 1.2 GHz | 1.2 GHz | 1.2 GHz | 1.2 GHz | 1.2 GHz |
| Memory Controller | DDR3L / DDR4 ECC | DDR3L / DDR4 ECC | DDR3L / DDR4 ECC | DDR3L / DDR4 ECC | DDR3L / DDR4 ECC |
| Integrated Crypto Engine | SEC (AES, 3DES, Kasumi, SNOW, PK) | SEC (AES, 3DES, Kasumi, SNOW, PK) | SEC (AES, 3DES, Kasumi, SNOW, PK) | SEC (AES, 3DES, Kasumi, SNOW, PK) | SEC (AES, 3DES, Kasumi, SNOW, PK) |
| Ethernet Interface | 1 GbE + 10 GbE | 1 GbE + 10 GbE | 1 GbE + 10 GbE | 1 GbE + 10 GbE | 1 GbE + 10 GbE |
| Operating Temperature | 0C to +105C | 0C to +105C | 0C to +105C | 0C to +105C | -40C to +105C |
Principaux différenciateurs
- Dual-core instead of single-core (vs T1014NSE7MQA)
- Industrial temp screening variant available (vs T1024NSE7KQA)
- Full dual-core throughput vs locked-down variant (vs T1023NSN7MQA)
Notes de conception
Estimated: at 1.2 GHz with full DPAA traffic the T1024NSE7MQA dissipates roughly 6 to 8 W; in a sealed enclosure combine the 780-FBGA with a top-side copper spreader or aluminium heatsink. Use NXP's platform monitor via I2C to read junction temperature, and never exceed the 105C Tjc in the worst-case thermal corner. A 10 to 15 CFM airflow across the package is recommended for industrial control routers mounted in DIN-rail cabinets.
The 780-FBGA 23x23 mm substrate requires 1.0 mm pitch escape with the NXP reference BGA escape pattern, including via-in-pad for the DDR3L/DDR4 byte lanes. Use 8-layer stack-up with a continuous ground plane under the die to control impedance of the high-speed SerDes lines. Reference NXP EVB layout guidelines for AC coupling and power-rail routing.
The T1024NSE7MQA requires sequenced core/SerDes/DDR rails; follow the NXP power-management IC reference design and respect the boot-up order documented in the reference manual. Decouple each power domain with both bulk and 100nF HF ceramics near the BGA balls. Avoid large inrush currents by soft-starting the DC-DC converters that feed the SoC.
Informations de conformité
NXP product compliance page reports RoHS, lead-free, halogen-free finish on HFBGA-780; AEC-Q100 not applicable to industrial network processors.
