TC265D40F200WBCKXUMA1 - AURIX 32-bit MCU, 2.5MB Flash, 200MHz, LQFP-176 | Infineon
Référence : TC265D40F200WBCKXUMA1 ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $24.23 | $24,23 |
| 10 | $22.1 | $221,00 |
| 100 | $19.85 | $1 985,00 |
| 500 | $18.4 | $9 200,00 |
| 1 000 | $16.95 | $16 950,00 |
TC265D40F200WBCKXUMA1 Présentation
A microcontroller (MCU) is a single-chip computer that integrates a CPU core, memory (Flash + SRAM), peripherals, and I/O on one silicon die. The AURIX TC2xx family is engineered for safety-critical embedded systems, combining lockstep TriCore cores, hardware security modules, and ASIL-D capable peripherals. Within the broader taxonomy, the TC265D40F200WBCKXUMA1 belongs to: MCU -> 32-bit MCU -> TriCore architecture -> AURIX family -> TC26xD sub-family -> automotive-grade MCU.
Key features include 2.5 MB of program Flash, on-chip SRAM, a 200 MHz dual-core TriCore CPU with DSP instructions, and a rich peripheral mix including multiple CAN-FD nodes, SPI, LIN, QSPI, ASCLIN, and timers. The part also embeds a Programmable HSM (Hardware Security Module) for secure boot, key storage, and EVITA-Full cryptography, along with a GTM (Generic Timer Module) for complex PWM and motor-control tasks.
The TC26xD implements Infineon's TriCore instruction set, which fuses RISC, DSP, and microcontroller paradigms in a single load/store architecture with deterministic interrupt latency. Built on a 40 nm embedded Flash process, it operates from a 3.3 V / 5 V supply with internal core logic on a separate voltage domain. Memory protection, ECC on Flash/SRAM, and lockstep compare logic support ASIL-D safety integrity when configured in dual-core lockstep mode.
Typical applications include automotive body domain controllers, electric power steering, airbag ECUs, battery management systems, and industrial servo drives. The wide temperature range and integrated peripherals make it suitable for chassis, powertrain, and ADAS sensor fusion subsystems where deterministic performance and hardware security are mandatory.
When designing with this part, provide at least four decoupling capacitors (100 nF + bulk) near each supply pin, follow Infineon PCB layout guidelines for the LQFP-176 EP package, and configure the HSM for secure boot before deploying production firmware. Use Infineon's AURIX Development Studio and the iLLD (Infineon Low-Level Driver) libraries to shorten firmware bring-up.
Alternatives de remplacement direct pour TC265D40F200WBCKXUMA1 — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
TC265D-40F200W BC
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
TC265D40F200NBCKXUMA1
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
TC264D40F200WBCKXUMA1
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
TC275D40F200WBCKXUMA1
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
TC233D40F200NBCKXUMA1
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
TC265D40F200WBCKXUMA1 Valeurs maximales et caractéristiques électriques
| Manufacturer | Infineon Technologies |
| Series | AURIX TC26xD |
| Core | TriCore v1.6 (32-bit dual-core) |
| CPU Frequency | 200 MHz |
| Program Memory | 2.5 MB Flash (2.5M x 8) |
| Tension d'alimentation | 3.3 V / 5 V |
| Température de fonctionnement | -40C to +125C (automotive Grade) |
| Boîtier | PG-LQFP-176-22 (LQFP-176 with EP) |
| Type de montage | Surface Mount |
| AEC-Q100 | Qualified |
| HSM (Hardware Security Module) | Yes (EVITA-Full capable) |
| Generic Timer Module (GTM) | Yes |
| Niveau de sensibilité à l'humidité (MSL) | 3 (168 hours) |
| Statut RoHS | Compliant |
Guide de configuration des broches du TC265D40F200WBCKXUMA1 pg-lqfp-176-22 (lqfp-176 with ep)
Configuration des broches du TC265D40F200WBCKXUMA1 (boîtier pg-lqfp-176-22 (lqfp-176 with ep)). Ce circuit intégré numérique comprend des GPIO, des interfaces de communication (UART, SPI, I2C) et des broches d'alimentation. Consultez la fiche technique du fabricant pour les fonctions alternatives des broches et les options de configuration. Indispensable pour la conception de systèmes embarqués et la conception de circuits imprimés.
Aucune donnée de brochage détaillée disponible pour TC265D40F200WBCKXUMA1.
Consultez la fiche technique pour la configuration complète des broches.
Applications typiques
TC265D40F200WBCKXUMA1 convient pour 6 applications: Automotive Body Domain Controller, Electric Power Steering (EPS) ECU, Battery Management System (BMS) Master, Airbag and Restraint ECU, Industrial Servo Drive, ADAS Sensor Fusion ECU.
Automotive Body Domain Controller
The TC265D40F200WBCKXUMA1's 200 MHz dual-core TriCore CPU and 2.5 MB Flash make it ideal for body domain controllers that consolidate lighting, door, seat, and climate functions. The integrated HSM supports secure boot and OEM key management, while CAN-FD and LIN peripherals connect directly to body-network transceivers without external bridges. AEC-Q100 qualification ensures reliable operation in -40C to +125C automotive environments, and the GTM module can drive PWM-controlled actuators directly.
Recommandé
Electric Power Steering (EPS) ECU
EPS ECUs require deterministic torque-loop control and ASIL-D capability, which the TC265D40F200WBCKXUMA1 delivers through its dual-core lockstep TriCore with SMU safety unit. The GTM module generates complementary PWM for the three-phase motor inverter, while the SAR ADC samples phase currents with sub-microsecond latency. Combined with 2.5 MB Flash, the device has ample headroom for sensor-fusion algorithms and OEM diagnostic libraries in a single LQFP-176 footprint.
Recommandé
Battery Management System (BMS) Master
The TC265D40F200WBCKXUMA1 suits BMS master controllers that supervise lithium-ion packs up to 800 V. Its CAN-FD interface streams cell telemetry to the vehicle CAN bus, while SPI connects to AFE chips (such as the TLE9012) that monitor individual cells. The on-chip HSM authenticates BMS firmware and protects OEM calibration parameters. Deterministic TriCore interrupt latency ensures cell balancing and SOC/SOH calculations stay within their cycle budgets.
Recommandé
Airbag and Restraint ECU
Active-safety airbag systems require ASIL-D capable MCUs, and the TC265D40F200WBCKXUMA1's lockstep TriCore cores with SMU satisfy that integrity level. The dual-core architecture runs the deployment algorithm and watchdog diagnostics in parallel with deterministic loop time. The 2.5 MB Flash stores deployment tables and event-recorder data, while the HSM protects OEM-issued squib keys and prevents unauthorized deployment.
Recommandé
Industrial Servo Drive
Outside of automotive, the TC265D40F200WBCKXUMA1 powers industrial servo drives that require deterministic multi-axis PWM and EtherCAT connectivity. The GTM module generates up to 200 MHz resolution PWM for FOC loops on three-phase PMSM motors. TriCore DSP instructions accelerate Clarke/Park transforms and proportional-integral controllers in firmware. The LQFP-176 package supports both control-board and integrated-drive layouts in factory automation.
Recommandé
ADAS Sensor Fusion ECU
Sensor-fusion ECUs in advanced driver-assistance systems aggregate radar, lidar, and camera data on a high-throughput platform. The TC265D40F200WBCKXUMA1's dual-core TriCore at 200 MHz runs object-tracking firmware while the second core handles safety monitoring. Multiple CAN-FD nodes and SPI interfaces connect to sensor front-ends, and the HSM authenticates incoming sensor data. The AEC-Q100 qualification and LQFP-176 EP thermal performance suit ADAS ECU enclosures.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour TC265D40F200WBCKXUMA1 — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | TC265D-40F200W BC | TC265D40F200NBCKXUMA1 | TC264D40F200WBCKXUMA1 | TC275D40F200WBCKXUMA1 | TC233D40F200NBCKXUMA1 |
|---|---|---|---|---|---|---|
| Brand | Infineon Technologies | Infineon Technologies | Infineon Technologies | Infineon Technologies | Infineon Technologies | Infineon Technologies |
| Package | PG-LQFP-176-22 | PG-LQFP-176-22 (same) | PG-LQFP-176-22 (same) | PG-LQFP-176-22 (same) | PG-LQFP-176-22 (same) | PG-LQFP-176-22 (same) |
| CPU Core | TriCore v1.6 dual-core | TriCore v1.6 dual-core (same) | TriCore v1.6 dual-core (same) | TriCore v1.6 dual-core (same) | TriCore v1.6 triple-core | TriCore v1.6 single-core |
| CPU Frequency | 200 MHz | 200 MHz (same) | 200 MHz (same) | 200 MHz (same) | 200 MHz (same) | 200 MHz (same) |
| Program Flash | 2.5 MB | 2.5 MB (same) | 2.5 MB (same) | 2.5 MB (same) | 4.0 MB (upgrade path) | 2.0 MB |
| HSM (Hardware Security Module) | Yes (EVITA-Full) | Yes (same) | Yes (same) | Yes (EVITA-Full) | Yes (EVITA-Full) | Reduced HSM |
| AEC-Q100 Grade | Qualified | Qualified | Qualified | Qualified | Qualified | Qualified |
| Operating Temperature | -40C to +125C | -40C to +125C (same) | -40C to +125C (same) | -40C to +125C (same) | -40C to +125C (same) | -40C to +125C (same) |
Principaux différenciateurs
- Triple-core upgrade path in same LQFP-176-22 footprint (vs TC275D40F200WBCKXUMA1)
- Lower-cost TC264D step-down path shares footprint (vs TC264D40F200WBCKXUMA1)
- Integrated EVITA-Full HSM eliminates external secure element (vs TC233D40F200NBCKXUMA1)
Notes de conception
The TC265D40F200WBCKXUMA1 requires a stable 3.3 V or 5 V supply on VEXT and a separate core voltage generated by the internal EVR. Place a 100 nF decoupling cap on each VDD pin and a 4.7 uF bulk capacitor on the EVR input. Use Infineon's TLF35584 PMIC to provide safety-compliant watchdog, supply monitoring, and ASIL-D voltage supervision for chassis and powertrain ECUs.
Estimated: at 200 MHz dual-core full load, the device dissipates approximately 1.5 W to 2 W. The PG-LQFP-176-22 EP package has a thermal resistance of about 25 C/W on a 4-layer JEDEC test board, allowing junction temperature to stay below 125 C at +85 C ambient. The exposed pad must be soldered to a continuous copper pour (recommended at least 4 cm x 4 cm) to meet this thermal performance. Without a proper thermal pad, the junction may exceed AEC-Q100 thermal limits.
Route high-speed signals (CAN-FD, SPI, QSPI, and debug ASC) with 50 ohm controlled impedance and keep trace lengths under 50 mm to avoid signal-integrity issues. Place the 16 MHz crystal within 5 mm of the XTAL pins and guard the crystal traces with a ground ring. Reference Infineon's AURIX PCB Design App Note for the recommended LQFP-176 EP footprint, via stitching, and exposed-pad via pattern.
Do not skip configuration of the SWD/JTAG debug port lock bits in production firmware - leaving the debug interface open allows firmware extraction. Also, ensure the HSM is provisioned with secure boot keys before deploying OTA updateable firmware, otherwise OTA could bypass authentication. Finally, always configure the PMS and SMU to map safety-relevant faults to the error pin so that the external PMIC can shut down the system deterministically.
Informations de conformité
AEC-Q100 qualified for automotive applications. RoHS and REACH compliant per Infineon product page. Conflict-minerals reporting available via Infineon corporate compliance portal.
