THS1230CDWR - 12-Bit 30 MSPS Low-Power ADC | Texas Instruments
Référence : THS1230CDWR ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $8.4 | $8,40 |
| 10 | $7.55 | $75,50 |
| 100 | $6.72 | $672,00 |
| 500 | $5.95 | $2 975,00 |
| 1 000 | $5.2 | $5 200,00 |
THS1230CDWR Présentation
An ADC (analog-to-digital converter) is a mixed-signal integrated circuit that samples continuous analog input voltages and produces discrete digital codes at a defined sample rate. The THS1230 belongs to the successive-approximation-register (SAR) ADC product family, which trades the very high sample rates of flash or pipeline converters for low power consumption, low latency, and excellent DC accuracy. Within the broader semiconductor taxonomy, the THS1230 is a data-conversion IC, itself a sub-category of mixed-signal integrated circuits that sit between analog signal-conditioning blocks and a host microcontroller, FPGA, or DSP.
Key features of the THS1230CDWR include 12-bit resolution, 30 MSPS maximum sampling rate, configurable analog inputs that can be set to single-ended, single-ended with offset, or true differential modes, internal reference voltage, and a hardware power-down pin that drops quiescent current to microamp levels when conversions are not required. The part operates from a single 3.3 V supply and is specified over the commercial 0 °C to +70 °C temperature range (C-grade). The wide input range and flexible input topology allow the converter to interface directly with many op-amp output stages without external level translation.
Internally, the THS1230 uses a pipelined multi-stage architecture combined with an internal reference and digital error correction to deliver 12-bit linearity at high throughput while keeping total power consumption below 250 mW at full sample rate. The digital outputs are CMOS-compatible and can be directly connected to a wide range of DSPs, microcontrollers, and FPGAs. Built-in sample-and-hold, internal clock duty-cycle stabilizer, and an out-of-range indicator further simplify system design.
Typical applications include CCD and CIS imaging digitizers, baseband processing for low-IF radio receivers, portable instrumentation and data loggers, ultrasound front-end preprocessing, and general-purpose high-speed data acquisition systems. Its low power dissipation also makes it well suited to battery-powered equipment.
When designing with this device, pay close attention to the analog input common-mode voltage, the decoupling of AVDD and DRVDD supplies, and the placement of the input RC anti-aliasing network. Use a low-jitter external oscillator to drive the CLK input because aperture-jitter limitations directly cap achievable signal-to-noise ratio at high input frequencies.
This page synthesizes distributor pricing, drop-in SOIC-28 alternatives, and practical design notes that are not aggregated in any single manufacturer datasheet.
Alternatives de remplacement direct pour THS1230CDWR — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec THS1230CDWR (même facteur de forme et même empreinte) — différant par Architecture, Operating Temperature, Resolution, Data Interface, Input Type.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
THS1230CDW
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
THS1230CDWG4
✅ Remplacement direct✓ En stock
$4.85 / unité
Voir la fiche technique →THS1230IDWR
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
THS1230CDWR Valeurs maximales et caractéristiques électriques
| Résolution | 12 bits |
| Sample Rate | 30 MSPS |
| Number of Channels | 1 |
| Supply Voltage (AVDD) | 3.3 V (single supply) |
| Architecture | Pipelined / multi-stage with digital error correction |
| Input Type | Configurable: single-ended, single-ended with offset, or differential |
| Power Dissipation | <250 mW at 30 MSPS (typical) |
| Power-Down Mode | Yes (hardware PD pin) |
| Digital Output | CMOS, parallel 12-bit |
| Température de fonctionnement | 0 °C to +70 °C (C-grade commercial) |
| Boîtier | 28-pin SOIC (DW), 7.50 mm body width, tape and reel |
| Type de montage | Surface Mount |
| Statut RoHS | Compliant |
| Reference | Internal (external reference option) |
Configuration des broches de THS1230CDWR
| Broche 1 | AVDD — Analog supply voltage (3.3 V) |
| Broche 2 | AGND — Analog ground |
| Broche 3 | IN+ — Differential analog input, positive |
| Broche 4 | IN- — Differential analog input, negative |
| Broche 5 | VCM — Common-mode voltage bypass |
| Broche 6 | REFT — Top reference decoupling |
| Broche 7 | REFB — Bottom reference decoupling |
| Broche 8 | REFOUT — Internal reference output |
| Broche 9 | REFIN — Reference input |
| Broche 10 | PD — Power-down control (active high) |
| Broche 11 | MODE0 — Input mode select bit 0 |
| Broche 12 | MODE1 — Input mode select bit 1 |
| Broche 13 | DRVDD — Digital output supply |
| Broche 14 | DRGND — Digital ground |
| Broche 15 | D11 — Data output bit 11 (MSB) |
| Broche 16 | D10 — Data output bit 10 |
| Broche 17 | D9 — Data output bit 9 |
| Broche 18 | D8 — Data output bit 8 |
| Broche 19 | D7 — Data output bit 7 |
| Broche 20 | D6 — Data output bit 6 |
| Broche 21 | D5 — Data output bit 5 |
| Broche 22 | D4 — Data output bit 4 |
| Broche 23 | D3 — Data output bit 3 |
| Broche 24 | D2 — Data output bit 2 |
| Broche 25 | D1 — Data output bit 1 |
| Broche 26 | D0 — Data output bit 0 (LSB) |
| Broche 27 | OTR — Out-of-range indicator |
| Broche 28 | CLK — External clock input |
Applications typiques
THS1230CDWR convient pour 6 applications: CCD/CIS Imaging Digitizer, Low-IF Communications Baseband, Portable Data Acquisition System, Ultrasound Front-End Preprocessing, Test & Measurement Instrumentation, Industrial Process Control Digitizer.
CCD/CIS Imaging Digitizer
The THS1230CDWR fits CCD and CIS imaging front-ends because its 30 MSPS throughput captures video-rate pixel streams at up to 30 megapixels-per-second while the configurable single-ended or differential input accepts direct coupling from CCD output stages. With <250 mW typical dissipation it suits multi-channel camera boards, and the hardware power-down pin enables duty-cycled operation between frame captures to extend battery life in portable scanners and digital microscopes.
Recommandé
Low-IF Communications Baseband
The THS1230CDWR is well suited to digitizing low-IF baseband outputs from radio receivers because its 12-bit resolution and 30 MSPS sample rate provide sufficient dynamic range for quadrature baseband at IF frequencies up to several MHz. The differential input mode rejects common-mode noise from mixers and IF filters, and the 3.3 V single-supply operation simplifies integration alongside low-voltage DSPs. Designers should pay attention to aperture jitter, which limits achievable SNR at high input frequencies.
Recommandé
Portable Data Acquisition System
For portable and battery-powered data acquisition, the THS1230CDWR delivers 30 MSPS sampling at <250 mW while the power-down mode drops quiescent current to microampere levels between triggered captures. The 28-pin SOIC package provides enough copper area to dissipate heat without external heatsinking in handheld enclosures. Single 3.3 V supply operation allows direct connection to Li-ion battery rails via a small LDO, simplifying the analog power tree in field instruments and medical telemetry devices.
Recommandé
Ultrasound Front-End Preprocessing
In ultrasound receive-channel preprocessing, the THS1230CDWR's 30 MSPS rate captures pre-beamformed RF or post-detection envelopes at baseband rates that match mid-tier medical imaging designs. The configurable input accommodates the bipolar output of time-gain-compensation (TGC) amplifiers, and the 12-bit resolution gives sufficient dynamic range for B-mode envelope detection. Designers should de-couple AVDD/DRVDD separately and place input RC anti-aliasing filters within a few millimeters of the analog input pins.
Recommandé
Test & Measurement Instrumentation
Bench-top oscilloscopes, spectrum analyzers, and arbitrary waveform digitizers benefit from the THS1230CDWR's combination of 30 MSPS throughput and 12-bit linearity in a small SOIC-28 footprint. The internal reference and digital error correction reduce external component count, while the hardware power-down pin enables triggered single-shot captures. The wide operating temperature range of the C-grade part (0 °C to +70 °C) covers typical laboratory environments.
Recommandé
Industrial Process Control Digitizer
In industrial process-control and condition-monitoring modules, the THS1230CDWR serves as the digitization stage for vibration, acoustic, and current-sensor outputs. The differential input mode rejects common-mode noise from motor inverters and switching power stages, while the configurable input offset accommodates bipolar sensor signals without external level shifters. The hardware power-down pin supports duty-cycled multi-channel scanning that lowers system power in factory-floor monitoring nodes.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour THS1230CDWR — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | THS1230CDW | THS1230CDWG4 | THS1230IDWR | THS1230IPWR | THS1215IPWG4 |
|---|---|---|---|---|---|---|
| Package | SOIC-28 (DW) | SOIC-28 (DW) - same | SOIC-28 (DW) - same | SOIC-28 (DW) - same | TSSOP-28 (PW) - smaller | TSSOP-28 (PW) - smaller |
| Brand | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments |
| Resolution | 12 bits | 12 bits | 12 bits | 12 bits | 12 bits | 12 bits |
| Sample Rate | 30 MSPS | 30 MSPS | 30 MSPS | 30 MSPS | 30 MSPS | 15 MSPS |
| Supply Voltage | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
| Operating Temperature | 0 °C to +70 °C (C-grade) | 0 °C to +70 °C | 0 °C to +70 °C | -40 °C to +85 °C | -40 °C to +85 °C | -40 °C to +85 °C |
| Power-Down Pin | Yes | Yes | Yes | Yes | Yes | Yes |
| Differential Input | Yes (configurable) | Yes | Yes | Yes | Yes | Yes |
| Packaging Media | Tape and Reel | Tube | Tube (Pb-free) | Tape and Reel | Tape and Reel | Tube |
Principaux différenciateurs
- Lower-cost tube-packaging drop-in variant (vs THS1230CDW)
- Extended industrial temperature range drop-in (vs THS1230IDWR)
- Higher sample rate at same resolution (vs THS1215IPWG4)
Notes de conception
Estimated power dissipation at 30 MSPS and 3.3 V supply is approximately 70 mA total supply current (AVDD + DRVDD combined), giving under 250 mW typical. Decouple AVDD with a 10 µF bulk capacitor in parallel with a 0.1 µF ceramic placed within 5 mm of the AVDD pin. Tie DRVDD to the same 3.3 V rail or to a separate 1.8 V logic rail through a ferrite bead; both grounds must connect at a single star point beneath the package.
Drive the CLK input with a low-jitter clock source (aperture jitter < 2 ps RMS) to preserve SNR at high analog input frequencies. Use a series termination resistor (typically 22 Ω to 33 Ω) close to the clock driver to damp overshoot. Keep the CLK trace short and routed over a continuous ground plane; cross-coupling from digital outputs D0-D11 back into IN+ or IN- will degrade harmonic performance.
Place the input anti-aliasing RC network (typically 50 Ω series + 20 pF shunt to AGND) within 5 mm of the IN+ and IN- pins. Route analog inputs as a matched differential pair on the top layer with ground-side shielding. Keep the digital outputs (D0-D11, OTR) routed away from IN+/IN- to minimize digital feedback. Connect the exposed pad (if present in DW package variant) to a clean analog ground pour for thermal relief.
Do not leave the MODE0/MODE1 pins floating; tie them to AGND or DRVDD through a defined logic level to select the intended input configuration. Failure to drive MODE pins selects an undefined state that can produce non-linear codes. Similarly, do not float the PD pin; tie it to AGND if power-down is unused, otherwise the part may enter an unintended low-power mode at power-up.
Informations de conformité
RoHS and REACH compliance status inferred from current TI product page status; AEC-Q100 not applicable for ADC product family. Pb-free G4 variant available for fully Pb-free assembly. Conflict-minerals declaration on file with TI.
