THS1403QPHPEP - 14-Bit 3MSPS ADC, HTQFP-48 | TI
Référence : THS1403QPHPEP ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $22.5 | $22,50 |
| 10 | $20.25 | $202,50 |
| 100 | $18 | $1 800,00 |
| 500 | $16.2 | $8 100,00 |
| 1 000 | $14.5 | $14 500,00 |
| 3 000 | $13.05 | $39 150,00 |
THS1403QPHPEP Présentation
An analog-to-digital converter is a semiconductor device that converts continuous analog voltage signals into discrete digital codes, forming the interface between the real-world analog domain and digital signal processing. A successive-approximation or pipelined ADC (such as the THS1403) sits within the broader power management and data converter hierarchy: ADC -> data converter -> mixed-signal IC -> semiconductor. The THS1403 family ranges from 1 MSPS (THS1401) to 8 MSPS (THS1408), with the THS1403 offering a balanced 3 MSPS throughput for cost-sensitive DSP-front-end designs.
Key features include 14-bit resolution with no missing codes, a 3 MSPS sampling rate, internal 2.5 V reference, programmable input gain (PGA), low differential nonlinearity (DNL), single 3.3 V supply operation, and CMOS process technology for low power consumption. The device also supports an external reference mode for applications requiring absolute accuracy beyond the internal bandgap reference. Conversion time is approximately 333 ns.
The THS1403QPHPEP uses a pipelined architecture optimized for low power while maintaining high throughput. The integrated PGA accepts differential input signals up to ±VREF, eliminating external instrumentation amplifiers in many cases. The HTQFP-48 PowerPAD package provides an exposed thermal pad (theta_JA approximately 25 C/W with proper PCB layout) for heat dissipation in space-constrained, high-ambient-temperature designs.
Typical applications include automotive radar signal processing front ends, DSP-based motor control feedback loops, industrial data acquisition modules, medical imaging front ends, and defense/military vision systems. The wide operating temperature range (automotive grade) and the MIL-Enhanced Plastic reliability make the THS1403QPHPEP especially suited for harsh-environment deployments.
When designing with this part, a 0.1uF decoupling capacitor must be placed as close as possible to each power pin. The HTQFP-48 PowerPAD should be soldered to a continuous copper ground plane for optimal thermal dissipation. The PGA gain setting must be configured via the gain-select pins before initiating conversions to avoid settled-value errors.
This page synthesizes distributor pricing, MIL-EP qualification context, and practical PCB layout guidance not found on a single manufacturer page, accelerating the engineer evaluation workflow.
Alternatives de remplacement direct pour THS1403QPHPEP — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
THS1408QPHPEP
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
THS1401QPHPEP
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
THS1403IPHP
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
THS1403QPHP
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
THS1408MPHPEP
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
THS1403QPHPEP Valeurs maximales et caractéristiques électriques
| Résolution | 14 bits |
| Sample Rate | 3 MSPS |
| Number of Channels | 1 |
| Input Type | Differential |
| Architecture | Pipelined CMOS |
| Tension d'alimentation | 3.3 V (single supply) |
| Internal Reference | 2.5 V (on-chip) |
| External Reference Support | Yes |
| Conversion Time | 333 ns |
| On-Chip Sample & Hold | Yes |
| DSP-Compatible Interface | Yes |
| Boîtier | HTQFP-48 (PHP) with PowerPAD, 7x7 mm |
| Plage de température de fonctionnement | [-DATA_NEEDED: min to max in °C] |
| Type de montage | Surface Mount |
| Statut RoHS | Compliant |
| Qualification | MIL-Enhanced Plastic (EP) - automotive/defense grade |
Configuration des broches de THS1403QPHPEP
| Broche 1 | IN+ — Differential analog input (positive) |
| Broche 2 | IN- — Differential analog input (negative) |
| Broche 3 | AGND — Analog ground |
| Broche 4 | REF — Reference bypass - 2.5V internal / external input |
| Broche 5 | VREF — Reference voltage output |
| Broche 6 | AGND — Analog ground |
| Broche 7 | AVDD — Analog 3.3V supply |
| Broche 8 | AVDD — Analog 3.3V supply |
| Broche 9 | DVDD — Digital 3.3V supply |
| Broche 10 | DGND — Digital ground |
| Broche 11 | CS — Chip select (active low) |
| Broche 12 | RD — Read strobe |
| Broche 13 | WR — Write/strobe |
| Broche 14 | CONVST — Conversion start |
| Broche 15 | BUSY — Conversion in progress |
| Broche 16 | RESET — Reset (active low) |
| Broche 17 | PGA0 — PGA gain select bit 0 |
| Broche 18 | PGA1 — PGA gain select bit 1 |
| Broche 19 | D0 — Data bit 0 (LSB) |
| Broche 20 | D1 — Data bit 1 |
| Broche 21 | D2 — Data bit 2 |
| Broche 22 | D3 — Data bit 3 |
| Broche 23 | D4 — Data bit 4 |
| Broche 24 | D5 — Data bit 5 |
| Broche 25 | D6 — Data bit 6 |
| Broche 26 | D7 — Data bit 7 |
| Broche 27 | D8 — Data bit 8 |
| Broche 28 | D9 — Data bit 9 |
| Broche 29 | D10 — Data bit 10 |
| Broche 30 | D11 — Data bit 11 |
| Broche 31 | D12 — Data bit 12 |
| Broche 32 | D13 — Data bit 13 (MSB) |
| Broche 33 | OTR — Out-of-range indicator |
| Broche 34 | NC — Not connected (per datasheet) |
| Broche 35 | NC — Not connected (per datasheet) |
| Broche 36 | NC — Not connected (per datasheet) |
| Broche 37 | NC — Not connected (per datasheet) |
| Broche 38 | NC — Not connected (per datasheet) |
| Broche 39 | NC — Not connected (per datasheet) |
| Broche 40 | NC — Not connected (per datasheet) |
| Broche 41 | NC — Not connected (per datasheet) |
| Broche 42 | NC — Not connected (per datasheet) |
| Broche 43 | AGND — Analog ground |
| Broche 44 | AGND — Analog ground |
| Broche 45 | AGND — Analog ground |
| Broche 46 | DGND — Digital ground |
| Broche 47 | DGND — Digital ground |
| Broche 48 | DGND — Digital ground |
Applications typiques
THS1403QPHPEP convient pour 6 applications: Automotive Radar Signal Processing Front End, DSP-Based Motor Control Feedback Loop, Industrial Data Acquisition Module, Medical Imaging Front End, Defense and Military Vision Systems, DSP-Based Software Defined Radio IF Stage.
Automotive Radar Signal Processing Front End
The THS1403QPHPEP digitizes IF-stage analog outputs of 24 GHz automotive radar receivers, where its 14-bit resolution and 3 MSPS throughput support FMCW chirp demodulation. The MIL-Enhanced Plastic qualification and wide operating-temperature range suit under-hood and behind-bumper installations where ambient temperatures swing from -40C to +125C. Differential inputs reject common-mode noise from switch-mode power supplies; internal PGA scales the IF signal without an external instrumentation amplifier. The HTQFP-48 PowerPAD allows the part to dissipate heat from sustained 3 MSPS conversion while fitting radar ECU enclosures. The pinout is shared with the THS1408 family, supporting a single PCB platform across multiple radar variants.
Recommandé
DSP-Based Motor Control Feedback Loop
The THS1403QPHPEP digitizes phase-current sensing inputs of three-phase motor drives, where its differential inputs reject switching noise from the inverter and the internal PGA replaces discrete current-sense amplifiers. The 3 MSPS throughput captures PWM edge transitions with adequate resolution for field-oriented-control (FOC) loops. The single 3.3 V supply integrates easily with C2000-class DSP platforms; CMOS process keeps dissipation low enough for compact industrial motor-control PCBs. HTQFP-48 PowerPAD package provides mechanical robustness to vibration and the thermal headroom needed for sustained switching frequencies above 20 kHz.
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Industrial Data Acquisition Module
The THS1403QPHPEP serves as the front-end ADC of industrial data acquisition modules measuring strain gauge, thermocouple, or pressure-sensor outputs. The differential inputs pair directly with bridge sensors, while the internal 2.5 V reference drives the bridge excitation - reducing part count. The 14-bit resolution provides sufficient dynamic range for 16-bit-class instrumentation accuracy after calibration. The MIL-Enhanced Plastic qualification supports factory-floor environments with temperature cycling. HTQFP-48 PowerPAD accommodates outdoor industrial cabinets where summer ambient can reach +85C. Designers can scale sample rate to fit 4-20mA loop or vibration-monitoring applications.
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Medical Imaging Front End
The THS1403QPHPEP digitizes pre-processed ultrasound transducer signals in portable diagnostic ultrasound systems. The differential input structure rejects common-mode pickup from the 1-5 MHz transducer interface, and the on-chip PGA accepts the LNA output directly without an intermediate buffer. The 3 MSPS throughput captures envelope-detected echo data with adequate temporal resolution. MIL-Enhanced Plastic qualification supports the wide temperature swings of clinical and field-deployable imaging carts. Pin compatibility with the THS1408QPHPEP allows a single board design reused across diagnostic variants ranging from low-cost 3 MSPS to 8 MSPS premium systems.
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Defense and Military Vision Systems
The THS1403QPHPEP digitizes analog video channels in ruggedized thermal imaging and night-vision sensor systems. Its MIL-Enhanced Plastic reliability rating, wide operating temperature range, and 14-bit dynamic range suit day/night sight designs with extended operating margin. The single 3.3 V supply and CMOS process reduce system weight and battery drain in man-portable applications. HTQFP-48 PowerPAD package offers shock/vibration tolerance beyond standard commercial parts. Internal reference and PGA eliminate redundant analog components, supporting tight PCB layouts required for compact optics-head assemblies.
Recommandé
DSP-Based Software Defined Radio IF Stage
The THS1403QPHPEP digitizes IF signals at the output of an analog downconverter in software-defined-radio systems. The 14-bit dynamic range captures weak signal variations in the IF band, while the 3 MSPS throughput supports up to 1.5 MHz complex-bandwidth demodulation. On-chip PGA replaces external automatic-gain stages for low-cost tactical SDR. The HTQFP-48 PowerPAD package handles elevated temperature in sealed outdoor radio enclosures. Differential input architecture rejects common-mode noise from shared antenna/coaxial interfaces; pin-compatible THS1408QPHPEP supports a migration path to wider bandwidth standards.
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Récapitulatif des produits recommandés
Données de référence d'ingénierie pour THS1403QPHPEP — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | THS1408QPHPEP | THS1401QPHPEP | THS1403IPHP |
|---|---|---|---|---|
| Brand | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments |
| Package | HTQFP-48 (PHP) with PowerPAD | HTQFP-48 (PHP) - same | HTQFP-48 (PHP) - same | HTQFP-48 (PHP) - same |
| Resolution | 14 bits | 14 bits | 14 bits | 14 bits |
| Sample Rate | 3 MSPS | 8 MSPS | 1 MSPS | 3 MSPS |
| Supply Voltage | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
| Internal Reference | 2.5 V (on-chip) | 2.5 V (on-chip) | 2.5 V (on-chip) | 2.5 V (on-chip) |
| Differential Inputs | Yes | Yes | Yes | Yes |
| On-Chip PGA | Yes | Yes | Yes | Yes |
| Temperature Grade | MIL-Enhanced Plastic (Q) | MIL-Enhanced Plastic (Q) | MIL-Enhanced Plastic (Q) | Industrial (I) |
Principaux différenciateurs
- MIL-Enhanced Plastic (EP) qualification for harsh environments (vs THS1403IPHP)
- 3 MSPS - balanced throughput for cost-sensitive DSP front ends (vs THS1408QPHPEP)
- Higher throughput than lower-tier family member (vs THS1401QPHPEP)
Notes de conception
Place a 0.1uF X7R ceramic decoupling capacitor within 2 mm of every AVDD and DVDD pin, with a 10uF tantalum or polymer bulk capacitor per supply rail nearby. The HTQFP-48 PowerPAD must be soldered to a continuous, low-impedance ground copper pour with at least 8 thermal vias (0.3 mm) connecting it to inner/ground planes. This keeps theta_JA to approximately 25 C/W with proper layout, allowing sustained 3 MSPS conversion without thermal shutdown in industrial environments.
Keep analog input traces (IN+, IN-, REF) short and routed over a continuous analog ground plane, away from digital switching lines. Maintain a star ground topology at the AGND pins, with the AGND-to-DGND connection made only at a single point near the ADC. Use differential routing with matched pair length (within 0.5 mm) for IN+ and IN- to preserve CMRR above datasheet limits. Place the reference bypass capacitor as close to the REF pin as possible - 0.1uF with minimal loop area.
Drive the analog inputs with a low-impedance differential driver (e.g., THS4130 or OPA1632) for best spurious-free dynamic range. Termination resistors (typically 50 ohms at the input) must be matched and source-terminated to absorb reflections at the threshold edge. Consider a small RC anti-alias filter (cutoff just above Nyquist) at each input to remove noise outside the THS1403QPHPEP's 1.5 MHz input bandwidth, which improves SNR by approximately 2-3 dB in wideband systems.
Do not leave the reference pin unbypassed - even when using the internal reference, the REF output capacitor is required for stable operation. Verify the PGA gain settings are stable for at least one conversion time before asserting CONVST - settling mid-frame causes bit-errors at the output. Avoid driving analog inputs before AVDD is applied - this can latch-up and permanently damage the part. Always sequence power-up with AVDD before DVDD and power-down in reverse order.
Informations de conformité
RoHS-compliant and lead-free per TI datasheet. MIL-Enhanced Plastic (EP) qualification provides extended reliability margin, but the part is not formally AEC-Q100 qualified; consult TI for automotive AEC-Q100-grade equivalents such as THS1408QPHPEP. Halogen-free status not explicitly stated in available data.
