TPD1E04U04DPYT - 0.5pF 3.6V ESD TVS Diode | TI | USB 3.0
Référence : TPD1E04U04DPYT ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $0.11 | $0,11 |
| 10 | $0.09 | $0,90 |
| 100 | $0.062 | $6,20 |
| 500 | $0.048 | $24,00 |
| 1 000 | $0.038 | $38,00 |
TPD1E04U04DPYT Présentation
An ESD protection diode, also called a TVS (transient voltage suppressor) diode or ESD suppressor, is a type of clamping device in the broader circuit-protection hierarchy (circuit protection -> surge protectors -> TVS diodes). It sits on high-speed signal lines and shunts electrostatic-discharge transients to ground before they reach sensitive silicon, while remaining invisible to the signal in normal operation.
Key features include ultra-low 0.5 pF insertion capacitance, which preserves signal integrity on interfaces running up to 6 Gbps such as HDMI 2.0 and USB 3.0; low dynamic resistance (RDYN), which produces an ultra-low clamping voltage during a strike; and compliance with IEC 61000-4-2 Level 4, exceeding the ±16 kV contact-discharge maximum of that international standard.
Technically, the unidirectional topology clamps positive transients to a low forward-voltage path and negative transients to the diode breakdown region. The low dynamic resistance between the trigger and clamping regions is the parameter that distinguishes this device from conventional TVS diodes: lower RDYN directly translates to less residual voltage reaching the protected SoC during system-level ESD events.
Typical applications are HDMI 2.0 port protection, USB 3.0 SuperSpeed lane protection, and any high-speed differential pair on smartphones, tablets, docking stations, and set-top boxes where sub-1-pF capacitance is mandatory.
Design consideration: place the diode as close to the connector as possible so the transient is clamped before it propagates along the trace; short stubs matter more than the diode itself at 6 Gbps.
This page synthesizes verified distributor data, drop-in alternatives, and practical design notes not found in the manufacturer datasheet.
Alternatives de remplacement direct pour TPD1E04U04DPYT — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec TPD1E04U04DPYT (même facteur de forme et même empreinte) — différant par Clamping Voltage, Package.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
TPD1E05U06DPYT
✅ Remplacement direct ⚠️ Spécifications non vérifiées📋 Alternative de référence (hors catalogue)
TPD1E10U06DPYT
✅ Remplacement direct ⚠️ Spécifications non vérifiées📋 Alternative de référence (hors catalogue)
TPD1E04U04DPYR
✅ Remplacement direct✓ En stock
$0.11 / unité
Voir la fiche technique →TPD1E04U04DPYT Valeurs maximales et caractéristiques électriques
| Channel Count | 1 |
| Direction | Unidirectional |
| Reverse Standoff Voltage | 3.6 V |
| IO Capacitance | 0.5 pF |
| ESD Rating (IEC 61000-4-2) | ±16 kV contact (exceeds Level 4) |
| Clamping Voltage | 8.9 V at 2.5 A Ipp (8/20 us) |
| Peak Pulse Current (Ipp) | 2.5 A (8/20 us) |
| Application | HDMI 2.0, USB 3.0 (up to 6 Gbps) |
| Boîtier | 2-X1SON (DPY, 1.0 x 0.60 mm, 0402 footprint) |
| Type de montage | Surface Mount |
| Température de fonctionnement | -40C to +125C |
| Supported Data Rate | Up to 6 Gbps |
Configuration des broches de TPD1E04U04DPYT
| Broche 1 | IO — Input/output line to be protected; connects in series on the high-speed signal trace |
| Broche 2 | GND — Ground; connect to ground plane through short, low-inductance via |
Applications typiques
TPD1E04U04DPYT convient pour 6 applications: USB 3.0 Port Protection, HDMI 2.0 TMDS Lane Protection, Smartphone and Tablet I/O Protection, Docking Stations and Set-Top Boxes, Industrial Communication Ports, Automotive Infotainment USB/HDMI.
USB 3.0 Port Protection
The TPD1E04U04DPYT protects USB 3.0 SuperSpeed differential pairs where its 0.5-pF IO capacitance keeps the 5 Gbps eye mask open, adding negligible insertion loss to lanes running up to 6 Gbps. One channel is placed on each TX/RX lane plus D+/D-, with the diode oriented so its IO pin sits directly on the signal trace and GND pin ties to the nearest ground via. Because USB 3.0 signaling stays well below the 3.6 V reverse standoff voltage, the diode is transparent in normal operation. The benefit is system-level IEC 61000-4-2 Level 4 robustness at the connector without degrading the high-speed signal, clamping strikes to 8.9 V at 2.5 A (8/20 us) before they reach the host controller.
Recommandé
HDMI 2.0 TMDS Lane Protection
HDMI 2.0 TMDS lanes operate at 6 Gbps, making capacitance budget the dominant constraint for ESD diode selection; the TPD1E04U04DPYT's 0.5-pF capacitance and low dynamic resistance are specifically engineered for this interface, as stated in the TI datasheet. One unidirectional channel is used per TMDS pair and on the HPD/CEC lines, placed immediately behind the HDMI connector pads so the transient is shunted before propagating down the trace. The low RDYN ensures the residual clamping voltage stays below the absolute maximum of the HDMI transceiver silicon even during ±16 kV contact discharges, delivering reliable port protection with a 0402 footprint that fits the tight spacing typical of HDMI connector keep-out zones.
Recommandé
Smartphone and Tablet I/O Protection
Mobile devices expose multiple external connectors (USB, HDMI/MHL, SIM, audio) that are frequent targets of human-body ESD events. The TPD1E04U04DPYT's 0402 (1.0 x 0.60 mm) X1SON package conserves board area, its -40C to +125C operating range covers both outdoor and internal thermal environments, and the 0.5-pF capacitance keeps high-speed MIPI and USB lanes intact. In a typical smartphone design, one diode per exposed line is arrayed along the connector edge, with each GND pin dropping directly to the main ground plane. The result is consumer-grade port reliability exceeding IEC 61000-4-2 Level 4 at minimal BOM cost, roughly a few cents per protected line as of 2026-10-21 pricing.
Recommandé
Docking Stations and Set-Top Boxes
Docking stations and set-top boxes aggregate multiple high-speed external interfaces (USB 3.0 hubs, HDMI 2.0 outputs) on a single exposed panel, multiplying ESD exposure. The TPD1E04U04DPYT addresses both interface classes with one catalog part: its 6-Gbps bandwidth covers HDMI 2.0 TMDS and USB 3.0 SuperSpeed lanes, while the ±16 kV IEC 61000-4-2 contact rating absorbs strikes arriving through attached cables. Channels are placed one per line at each connector, using the 0402 DPY footprint for straightforward assembly on cost-driven consumer PCBs. The low dynamic resistance clamping keeps residual transient voltage below the surviving thresholds of downstream hub and SoC silicon, reducing field-return rates caused by connector ESD.
Recommandé
Industrial Communication Ports
Industrial field equipment with exposed USB service ports, HDMI diagnostic outputs, or other high-speed connectors faces harsher electrostatic environments than consumer devices, with dry air and workplace handling producing repeated human-body and contact discharges. The TPD1E04U04DPYT provides system-level protection exceeding IEC 61000-4-2 Level 4 (±16 kV contact), and its -40C to +125C operating range suits factory-floor and outdoor cabinets. On each protected line, the diode sits between the connector and the transceiver, with a short, direct ground return. Its 3.6 V standoff accommodates standard signaling levels while the 0.5-pF capacitance preserves high-speed signals, letting one verified protection part cover all fast serial ports in the design.
Recommandé
Automotive Infotainment USB/HDMI
Automotive head units and rear-seat entertainment systems expose USB charging/data ports and HDMI inputs to passengers, making them the highest ESD-risk interfaces in the vehicle cabin. The TPD1E04U04DPYT's -40C to +125C operating temperature range and robust IEC 61000-4-2 Level 4 performance make it applicable to cabin electronics; its 0.5-pF capacitance protects 5-6 Gbps SuperSpeed and TMDS lanes feeding the infotainment SoC. Diodes are arrayed at the connector with low-inductance ground connections on the multilayer board. The 0402 DPY footprint suits automated high-volume assembly. For applications requiring AEC-Q100-qualified alternatives, verify the appropriate TI Q1 ESD portfolio variant before release, as qualification requirements vary by OEM platform.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour TPD1E04U04DPYT — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | TPD1E05U06DPYT | TPD1E10U06DPYT | TPD1E04U04DPYR |
|---|---|---|---|---|
| Package | 2-X1SON (DPY, 0402) | 2-X1SON (DPY, 0402) - same | 2-X1SON (DPY, 0402) - same | 2-X1SON (DPY, 0402) - same |
| Brand | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments |
| Reverse Standoff Voltage | 3.6 V | 5 V | 5 V | 3.6 V |
| ESD Rating (IEC 61000-4-2) | ±16 kV contact (above Level 4) | ±15 kV class (verify datasheet) | ±15 kV class (verify datasheet) | ±16 kV contact (above Level 4) |
| Target Interface | HDMI 2.0 / USB 3.0 up to 6 Gbps | 5 V high-speed lines | Higher-energy/high-voltage lines | HDMI 2.0 / USB 3.0 up to 6 Gbps |
| Operating Temperature | -40C to +125C | -40C to +125C | -40C to +125C | -40C to +125C |
Principaux différenciateurs
- Ultra-low 0.5 pF capacitance for 6 Gbps lines (vs TPD1E05U06DPYT)
- Low dynamic resistance yields ultra-low clamping (vs TPD1E10U06DPYT)
- 0402 X1SON footprint for high-volume assembly (vs TPD1E04U04DPLT)
Notes de conception
Place the TPD1E04U04DPYT as close to the USB 3.0 or HDMI 2.0 connector as physically possible. The protection strategy depends on shunting the ESD transient at the point of entry; if the diode sits downstream of even 10-15 mm of trace, the inductance of that trace re-radiates the transient and the residual voltage at the SoC rises well above the 8.9 V clamping figure. Connect the GND pin (pin 2) directly to the ground plane with at least one via immediately adjacent to the pad, and avoid shared thin ground stubs.
At 5-6 Gbps, every pF of parasitic capacitance narrows the eye diagram. Although this diode contributes only 0.5 pF, remember to include its capacitance in the overall channel budget along with connector and PCB parasitics. Keep stub lengths on the protected line to near zero - the diode should sit on the trace, not on a tee branch. For USB 3.0, re-run signal-integrity simulation after layout because the 0402 pad geometry itself adds a small discontinuity.
Do not substitute a 5 V-standoff part (TPD1E05U06DPYT) on a 3.6 V-class line expecting identical clamping - the higher standoff shifts the clamping onset and may allow higher residual voltage on 3.3 V rails. Conversely, do not use the 3.6 V TPD1E04U04 on 5 V lines where it would conduct in breakdown during normal operation. Verify the pad-1 marker orientation: X1SON packages are small enough that reversed placement shorts the signal line to ground.
Informations de conformité
Compliance details were not present in the provided verified web data; check the TI product page quality/environmental section for RoHS/REACH status of the DPYT ordering suffix.
