TPS628660AYCGR - 6A Sync Buck Converter, 5.5V, I2C | TI
Référence : TPS628660AYCGR ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $2.95 | $2,95 |
| 10 | $2.65 | $26,50 |
| 100 | $2.35 | $235,00 |
| 500 | $2.1 | $1 050,00 |
| 1 000 | $1.85 | $1 850,00 |
TPS628660AYCGR Présentation
A buck (step-down) DC-DC converter is a switching-mode power supply circuit that uses an inductor and two switches (typically MOSFETs) to convert a higher DC input voltage into a lower DC output voltage with high efficiency. As a member of the synchronous buck family of voltage regulators (DC-DC converter -> switching regulator -> power management IC -> semiconductor), the TPS62866 family operates at high switching frequency to minimize external LC component size, enabling a sub-2 mm solution footprint suitable for wearable, smartphone, and battery-powered applications.
Key technical features include 7 mΩ and 6.5 mΩ internal power MOSFETs, I2C-compatible interface up to 3.4 Mbps for output voltage scaling and telemetry, a VID pin for dynamic voltage scaling (DVS), power-good indication, and thermal pre-warning plus thermal shutdown protection. The high switching frequency supports tiny inductors and capacitors, achieving a solution height of less than 1 mm.
The TPS628660AYCGR uses adaptive on-time control architecture with internal compensation, simplifying external design while delivering fast transient response to load steps. The I2C interface allows output voltage margining and monitoring without external resistor changes, while the VID pin enables hardware-based dynamic voltage scaling - critical for processors that lower core voltage in idle states to extend battery life.
Typical applications include powering processors, FPGAs, and SoCs in mobile devices, IoT sensor nodes, wearables, single-cell Li-ion battery powered systems, and portable industrial instruments. Its small footprint and I2C programmability suit designs that require adaptive power management under varying load conditions.
When designing with this device, place input capacitors as close as possible to the PVIN pin to reduce switching noise. Maintain the PGND-to-AGND ground separation recommended in the datasheet to avoid ground bounce, and use the I2C pins with a pull-up resistor on the host side. Verify that the chosen inductor's saturation current exceeds the device's peak current limit for reliable operation.
This page synthesizes distributor pricing, real-world pin-compatible TI alternatives in the same YCG WCSP footprint, and practical design notes that go beyond the manufacturer datasheet.
Alternatives de remplacement direct pour TPS628660AYCGR — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
TPS628640AYCGR
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
TPS628662AYCGR
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
TPS62866AYCGR
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
TPS62864AYCGR
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
TPS628661AYCGR
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
TPS628660AYCGR Valeurs maximales et caractéristiques électriques
| Topologie | Synchronous Step-Down (Buck) Converter |
| Plage de tension d'entrée | 2.4 V to 5.5 V |
| Plage de tension de sortie | 0.4 V to approximately 4 V (adjustable) |
| Output Current | 6 A |
| Type de sortie | Adjustable (via I2C and external resistor) |
| Nombre de sorties | 1 |
| Interface | I2C (up to 3.4 Mbps) |
| HS MOSFET Rds(on) | 7 mΩ |
| LS MOSFET Rds(on) | 6.5 mΩ |
| Boîtier | 15-XFBGA / WCSP (YCG), 1.05 mm x 1.78 mm x 0.5 mm, 0.35 mm pitch |
| Nombre de broches | 15 |
| VID Pin | Yes (Dynamic Voltage Scaling) |
| Power Good | Yes |
| Thermal Protection | Thermal pre-warning + thermal shutdown |
| Température de fonctionnement | -40C to +125C |
| Type de montage | Surface Mount |
| Statut RoHS | Compliant (assumed for TI active parts; see datasheet) |
Configuration des broches de TPS628660AYCGR
| Broche A1 | PGND — Power ground |
| Broche A2 | PVIN — Power input voltage |
| Broche A3 | PVIN — Power input voltage |
| Broche B1 | SW — Switch node - connect to inductor |
| Broche B2 | SW — Switch node - connect to inductor |
| Broche B3 | AGND — Analog ground |
| Broche C1 | VOUT — Regulated output voltage |
| Broche C2 | VOS — Output voltage sense / feedback |
| Broche C3 | EN — Enable (active high) |
| Broche D1 | PG — Power good indicator (open drain) |
| Broche D2 | VID — VID pin for dynamic voltage scaling |
| Broche D3 | SCL — I2C clock |
| Broche E1 | SDA — I2C data |
| Broche E2 | VSEL — Voltage select (default VOUT vs I2C VOUT) |
| Broche E3 | NC — Not connected (per datasheet) |
Applications typiques
TPS628660AYCGR convient pour 6 applications: Smartphone Application Processor Power Rail, Wearable Fitness Tracker Main Rail, IoT Sensor Hub Point-of-Load Conversion, Portable Medical Monitoring Device, FPGA / SoC Core Voltage Rail, Single-Cell Li-ion Battery Powered Industrial Instrument.
Smartphone Application Processor Power Rail
The TPS628660AYCGR is well-suited to powering multi-core smartphone application processors from a single-cell Li-ion battery, where space-constrained PCBs demand a sub-2 mm footprint and high efficiency to preserve battery life. The 6 A continuous output covers peak CPU/GPU load transients, while the I2C interface allows the host PMIC to dynamically adjust Vcore for low-power idle states. With 7 mΩ / 6.5 mΩ internal MOSFETs, conduction loss stays low even at full load, and the high switching frequency shrinks the inductor to a tiny 0402-size component for a total solution height under 1 mm - critical for slim handset designs.
Recommandé
Wearable Fitness Tracker Main Rail
Wearable fitness trackers and smartwatches benefit from the TPS628660AYCGR's 1.05 mm x 1.78 mm WCSP footprint, which fits inside watch-strap-sized PCBs while still delivering up to 6 A for sensor fusion and display refresh peaks. The I2C interface lets the wearable MCU adjust output voltage based on activity state, extending battery life across multi-day wear cycles. Thermal pre-warning is useful in the enclosed, body-adjacent thermal environment where heat dissipation is constrained. The high switching frequency supports a sub-1 mm total solution profile - mandatory for comfortable wrist-worn form factors.
Recommandé
IoT Sensor Hub Point-of-Load Conversion
Industrial and smart-home IoT sensor hubs often need a small, efficient buck regulator to step down a 3.3 V or 5 V rail into the precise voltage required by a wireless SoC or sensor array. The TPS628660AYCGR's 2.4-5.5 V input range covers both common rails, while its I2C programmability lets a host microcontroller re-target the output voltage for different operating modes (TX burst, RX listen, sleep). The 6 A current supports simultaneous radio transmission and sensor sampling peaks. Combined with surface-mount ceramic capacitors and a small inductor, the converter fits on densely populated IoT PCBs alongside radios and antennas.
Recommandé
Portable Medical Monitoring Device
Portable medical devices such as continuous glucose monitors, pulse oximeters, and handheld ECG monitors need converters that combine high efficiency, small footprint, and reliable thermal behavior. The TPS628660AYCGR delivers 6 A in a 1.05 mm x 1.78 mm WCSP package, freeing PCB real estate for analog front-ends and patient-isolation barriers. The I2C telemetry and power-good indicator support redundant fault detection in medical-grade firmware. Thermal shutdown and pre-warning provide a second safety layer in body-worn enclosures where heat dissipation is poor. The 0.4 V minimum output is convenient for very low-voltage digital cores on the latest medical SoCs.
Recommandé
FPGA / SoC Core Voltage Rail
Compact FPGA and SoC development boards (especially those built around Zynq, Spartan, or low-power FPGA families) often need a sub-2 mm buck converter to deliver a 0.85 V-1.2 V core rail at multi-amp currents. The TPS628660AYCGR supports output voltages down to 0.4 V via external resistor or I2C command, satisfies core rails as low as 0.85 V at 6 A, and fits beside BGA packages on tight four-layer boards. The VID/DVS features simplify power-state coordination with the FPGA's internal PowerManage unit. Its power-good output can be tied to the FPGA's reset line for clean boot sequencing.
Recommandé
Single-Cell Li-ion Battery Powered Industrial Instrument
Handheld industrial instruments such as barcode scanners, ruggedized tablets, and digital multimeters are powered by single-cell Li-ion batteries where 2.4-5.5 V input range covers the full discharge curve. The TPS628660AYCGR steps the battery directly down to SoC core and I/O voltages with high efficiency, extending the device's run-time between charges. Its industrial -40C to +125C operating range supports outdoor and factory-floor environments. The I2C interface enables the host to monitor load conditions and adjust output voltage to optimize efficiency across the discharge profile - especially valuable at low battery voltages where efficiency loss would otherwise waste capacity.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour TPS628660AYCGR — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | TPS628640AYCGR | TPS628662AYCGR | TPS62866AYCGR | TPS62864AYCGR |
|---|---|---|---|---|---|
| Brand | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments |
| Package | 15-XFBGA/WCSP (YCG) 1.05x1.78 mm | 15-XFBGA/WCSP (YCG) - same | 15-XFBGA/WCSP (YCG) - same | 15-XFBGA/WCSP (YCG) - same | 15-XFBGA/WCSP (YCG) - same |
| Output Current | 6 A | 4 A | 6 A | 6 A | 4 A |
| Input Voltage Range | 2.4 V to 5.5 V | 2.4 V to 5.5 V | 2.4 V to 5.5 V | 2.4 V to 5.5 V | 2.4 V to 5.5 V |
| Output Voltage Range | 0.4 V to ~4 V (adj) | 0.4 V to ~4 V (adj) | 0.4 V to ~4 V (adj, factory-default variant) | 0.4 V to ~4 V (adj) | 0.4 V to ~4 V (adj) |
| I2C Interface | Yes (up to 3.4 Mbps) | Yes (up to 3.4 Mbps) | Yes (up to 3.4 Mbps) | Yes (up to 3.4 Mbps) | Yes (up to 3.4 Mbps) |
| VID Pin (DVS) | Yes | Yes | Yes | No | No |
| Power Good | Yes | Yes | Yes | Yes | Yes |
| HS MOSFET Rds(on) | 7 mΩ | 7 mΩ | 7 mΩ | 7 mΩ | 7 mΩ |
Principaux différenciateurs
- Highest current in TPS62866 family at 6 A (vs TPS628640AYCGR (4 A))
- VID pin for hardware DVS (vs TPS62866AYCGR (no VID pin))
- Sub-2 mm solution footprint (vs Larger QFN/DFN buck converters in this current range)
Notes de conception
Place the input ceramic capacitor (>=10 uF X7R) as close as possible to the PVIN balls (A2, A3) to minimize switching-loop parasitic inductance, which otherwise increases voltage ripple and EMI. Keep the SW-node copper area compact to reduce radiated emissions, and use the inner PCB ground plane directly under the device to provide a low-impedance thermal path. For the 15-ball YCG WCSP, follow the TI reference layout exactly - hand-routing WCSP requires precise ball-pad geometry the manufacturer documents in the datasheet's land-pattern appendix.
Estimated: At VIN=5 V, VOUT=1.0 V, and full 6 A load, power dissipation is approximately (5-1)*6*(typical efficiency of 85%) ~= 4 W in the package. The 1.05 mm x 1.78 mm WCSP has limited thermal mass - rely on at least 4 thermal vias to the inner ground plane to keep junction temperature below the 125C limit. Use the device's thermal pre-warning pin to throttle the host SoC before thermal shutdown, especially in enclosed wearables where ambient temperatures can reach 50C.
Do not probe the YCG WCSP balls with test clips after PCB assembly - the balls are too small (0.35 mm pitch) and mechanical contact will damage pads. Instead, use the VOS pin (C2) for closed-loop voltage measurements. Note that the VSEL pin (E2) chooses between factory-default VOUT and I2C-programmed VOUT - if you require dynamic scaling, drive VSEL low and use I2C commands; if you want a fixed voltage, leave VSEL high and use external resistor feedback at VOS.
The I2C lines (SCL, SDA) require external pull-up resistors per I2C standard - typically 2.2 kohm to 4.7 kohm depending on bus capacitance. Keep I2C traces short and avoid routing near the SW node to prevent coupled switching noise from confusing the I2C state machine. Add a small RC filter on the SCL/SDA lines if bus errors are observed in noisy environments, such as near a switching power stage or inductive load.
Informations de conformité
RoHS / REACH compliance per TI active product listing; AEC-Q100 qualified variants (if needed for automotive) may not exist in this family - confirm with TI representative. Halogen-free status should be confirmed on the specific lot via TI material declaration documents.
