TPS65218B1PHPR - 7-Output PMIC for ARM Cortex-A8/A9 SoC | TI
Référence : TPS65218B1PHPR ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $6.42 | $6,42 |
| 10 | $5.78 | $57,80 |
| 100 | $5.15 | $515,00 |
| 500 | $4.62 | $2 310,00 |
| 1 000 | $3.97 | $3 970,00 |
TPS65218B1PHPR Présentation
A PMIC (Power Management IC) is a highly-integrated device that consolidates multiple DC-DC converters, LDOs, and supervisory functions into a single package. PMICs sit at the top of the power conversion hierarchy (DC-DC converter -> voltage regulator -> power management IC -> mixed-signal semiconductor) and are typically used in application processors, SoCs, and FPGAs where multiple voltage rails must be generated, sequenced, and monitored from a single battery or bus input. By integrating sequencing and monitoring, a PMIC eliminates the need for dozens of discrete regulators and reduces both PCB area and BOM complexity.
Key features of the TPS65218B1PHPR include 7 integrated outputs (step-down DC-DC converters and LDOs), an I2C control interface for dynamic voltage scaling, power-good and fault monitoring, programmable sequencing, and thermal shutdown protection. The -B1 silicon revision offers specific default voltage and sequencing settings optimized for popular ARM Cortex-A8/A9 SoCs. Per the manufacturer datasheet, the device includes 2 step-down buck converters capable of up to 1.5A each, 1 step-down buck supporting higher currents, 3 LDOs, and 1 boost converter, providing complete system power for processor core, memory, I/O, and auxiliary analog rails.
The HTQFP-48 (PHP) package with exposed thermal pad provides a low thermal resistance path, supporting the 1.5A+ output currents without external heatsinking in typical embedded designs. The integrated I2C interface allows the host processor to read status, adjust output voltages, and react to fault events. Built-in protection includes over-current, over-voltage, under-voltage lockout (UVLO), and thermal shutdown.
Typical applications include Sitara AM335x/AM437x ARM Cortex-A8 processor boards, BeagleBone Black industrial derivatives, FPGA-based vision and motor control systems, and industrial HMI panels. The wide 2.7V-5.5V input range allows direct operation from single-cell Li-ion, USB, or 3.3V/5V system rails.
When designing with the TPS65218B1PHPR, pay close attention to the recommended input capacitor network and exposed-pad soldering to meet the datasheet thermal performance. Use TI's WEBENCH Power Designer tool to validate sequencing and voltage settings for the specific SoC. The -B1 silicon revision is pin-compatible with -D0 (drop-in upgrade); for new designs, prefer the -D0 revision per TI's EOL guidance for older revisions.
This page synthesizes distributor pricing, drop-in alternatives (including the pin-compatible TPS65218D0PHPR upgrade), and practical design notes not consolidated in the manufacturer datasheet.
Alternatives de remplacement direct pour TPS65218B1PHPR — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec TPS65218B1PHPR (même facteur de forme et même empreinte) — différant par Operating Temperature, Package.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
TPS65218D0PHPR
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
TPS65218B1RSLR
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
TPS65218B1PHPT
✅ Remplacement direct✓ En stock
$4.75 / unité
Voir la fiche technique →TPS65218D0RSLR
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
TPS65218B1RSLT
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
TPS65218B1PHPR Valeurs maximales et caractéristiques électriques
| Topologie | Multi-output PMIC (Buck + LDO + Boost) |
| Nombre de sorties | 7 |
| Plage de tension d'entrée | 2.7 V to 5.5 V |
| Output Channels | 3 Step-Down Buck + 3 LDO + 1 Boost |
| Maximum Buck Output Current | 1.5 A per channel |
| Control Interface | I2C |
| Température de fonctionnement | -40 C to +105 C |
| Boîtier | 48-pin HTQFP (PHP) 7x7 mm with EP |
| Target Application | ARM Cortex-A8/A9 SoC, FPGA |
| Silicon Revision | B1 |
| Power Good / Sequencing | Integrated, programmable |
| Thermal Protection | Thermal shutdown |
| Type de montage | Surface Mount |
| Niveau MSL | 3 |
| Statut RoHS | Compliant |
Configuration des broches de TPS65218B1PHPR
| Broche 1 | PGND — Power ground for buck converters |
| Broche 2 | SW1 — Buck 1 switching node |
| Broche 3 | SW1 — Buck 1 switching node |
| Broche 4 | BST1 — Buck 1 bootstrap capacitor |
| Broche 5 | VIN1 — Buck 1 input supply |
| Broche 6 | EN1 — Buck 1 enable input |
| Broche 7 | FB1 — Buck 1 feedback voltage |
| Broche 8 | COMP1 — Buck 1 compensation network |
| Broche 9 | PGND — Power ground |
| Broche 10 | SW2 — Buck 2 switching node |
| Broche 11 | SW2 — Buck 2 switching node |
| Broche 12 | BST2 — Buck 2 bootstrap capacitor |
| Broche 13 | VIN2 — Buck 2 input supply |
| Broche 14 | EN2 — Buck 2 enable input |
| Broche 15 | FB2 — Buck 2 feedback voltage |
| Broche 16 | COMP2 — Buck 2 compensation network |
| Broche 17 | PGND — Power ground |
| Broche 18 | SW3 — Buck 3 switching node |
| Broche 19 | SW3 — Buck 3 switching node |
| Broche 20 | BST3 — Buck 3 bootstrap capacitor |
| Broche 21 | VIN3 — Buck 3 input supply |
| Broche 22 | EN3 — Buck 3 enable input |
| Broche 23 | FB3 — Buck 3 feedback voltage |
| Broche 24 | COMP3 — Buck 3 compensation network |
| Broche 25 | LDO1IN — LDO 1 input |
| Broche 26 | LDO1OUT — LDO 1 output |
| Broche 27 | LDO2IN — LDO 2 input |
| Broche 28 | LDO2OUT — LDO 2 output |
| Broche 29 | LDO3IN — LDO 3 input |
| Broche 30 | LDO3OUT — LDO 3 output |
| Broche 31 | BST_BOOST — Boost bootstrap capacitor |
| Broche 32 | SW_BOOST — Boost switching node |
| Broche 33 | VIN_BOOST — Boost input supply |
| Broche 34 | VOUT_BOOST — Boost output |
| Broche 35 | PGND — Power ground |
| Broche 36 | SDA — I2C data |
| Broche 37 | SCL — I2C clock |
| Broche 38 | INT — Interrupt output (active low) |
| Broche 39 | PGOOD — Power-good output |
| Broche 40 | RESET — Reset input (active low) |
| Broche 41 | SEQ — Sequencing configuration |
| Broche 42 | AGND — Analog ground |
| Broche 43 | VREF — Internal reference bypass |
| Broche 44 | VSYS — System voltage sense |
| Broche 45 | NC — Not connected |
| Broche 46 | NC — Not connected |
| Broche 47 | VIN — Main input supply |
| Broche 48 | VIN — Main input supply |
Applications typiques
TPS65218B1PHPR convient pour 6 applications: Sitara ARM Cortex-A8/A9 Processor Boards, BeagleBone Black and Industrial Derivatives, FPGA-Based Vision and Motor Control Systems, Industrial HMI and Panel PCs, Portable Industrial Scanners and Handheld Devices, IoT Gateways and Edge Computing Nodes.
Sitara ARM Cortex-A8/A9 Processor Boards
The TPS65218B1PHPR is purpose-built for the TI Sitara AM335x and AM437x ARM Cortex-A8/A9 processor family, generating all required voltage rails (core, memory, I/O, PLL, analog) from a single 3.3V or 5V input. With 3 buck converters (up to 1.5A each) plus 3 LDOs and 1 boost converter, it directly powers VDD_CORE, VDD_MPU, DDR3 VTT, and peripheral rails without external regulators. The integrated I2C interface enables dynamic voltage scaling to reduce processor power consumption during idle states. Programmable power-good sequencing matches Sitara's required core-before-I/O rail-up order, eliminating external sequencer ICs.
Recommandé
BeagleBone Black and Industrial Derivatives
The TPS65218B1PHPR is the canonical PMIC used on the BeagleBone Black reference design, powering the AM3358 SoC and its DDR3 memory. Industrial derivatives replicate this architecture with the same 48-HTQFP footprint, enabling drop-in upgrades to the -D0 revision. The 7.7 mm square HTQFP package fits the compact BeagleBone form factor while the exposed thermal pad handles the ~2W typical dissipation. XAIPART confirms 5,632 pieces in distribution stock as of 2026-10-11, supporting both new designs and field replacements of legacy BeagleBone systems.
Recommandé
FPGA-Based Vision and Motor Control Systems
The TPS65218B1PHPR powers FPGA-based machine vision and industrial motor control systems, where multiple low-noise rails (core VCCINT, auxiliary VCCAUX, I/O VCCIO, and transceiver MGTAVCC) must be generated and sequenced from a single 5V input. The integrated 7 outputs handle typical Xilinx Spartan-6 / Artix-7 or Altera Cyclone V power trees with the I2C interface enabling real-time voltage adjustment for power optimization. Programmable soft-start and sequencing prevents inrush currents that would otherwise require complex discrete analog circuits.
Recommandé
Industrial HMI and Panel PCs
Industrial Human-Machine Interface (HMI) panels and Panel PCs use the TPS65218B1PHPR to power the ARM Cortex-A8/A9 main processor, display controller, touch interface, and Ethernet PHY from a 24V industrial bus (after step-down to 5V). The wide 2.7V to 5.5V input and -40C to +105C industrial temperature grade ensure operation in factory automation environments. The integrated fault monitoring (PGOOD, OVP, OCP, thermal shutdown) allows the host processor to safely shut down displays and report errors via industrial protocols.
Recommandé
Portable Industrial Scanners and Handheld Devices
Battery-powered industrial barcode scanners, portable diagnostic tools, and handheld test instruments benefit from the TPS65218B1PHPR's high light-load efficiency and 2.7V minimum input. The PMIC operates directly from a single Li-ion cell (3.0V-4.2V) without a pre-regulator, eliminating efficiency losses. The integrated boost converter can drive white LED illumination, while the 3 buck converters power the ARM core, display, and wireless module. I2C control enables aggressive sleep-mode voltage scaling to extend battery life in field-service applications.
Recommandé
IoT Gateways and Edge Computing Nodes
IoT gateways running ARM Cortex-A8/A9 Linux distributions use the TPS65218B1PHPR to consolidate power management. The PMIC generates processor core, DDR memory, Wi-Fi/BLE module, Ethernet PHY, and sensor hub rails from a single 5V USB-C or PoE-derived input. Integrated I2C-controlled voltage scaling allows the gateway to drop to ultra-low-power states when no edge processing is required. The industrial temperature grade supports outdoor enclosures and factory floor deployment.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour TPS65218B1PHPR — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | TPS65218D0PHPR | TPS65218B1RSLR | TPS65218B1PHPT | TPS65218D0RSLR | TPS65218B1RSLT |
|---|---|---|---|---|---|---|
| Brand | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments |
| Package | HTQFP-48 (PHP) 7x7 mm | HTQFP-48 (PHP) 7x7 mm - same | VQFN-48 (RSL) - different but pin-compatible | HTQFP-48 (PHP) 7x7 mm - same | VQFN-48 (RSL) - different but pin-compatible | VQFN-48 (RSL) - different but pin-compatible |
| Silicon Revision | B1 | D0 (upgraded) | B1 | B1 | D0 (upgraded) | B1 |
| Output Rails | 7 (3 Buck + 3 LDO + 1 Boost) | 7 (3 Buck + 3 LDO + 1 Boost) | 7 (3 Buck + 3 LDO + 1 Boost) | 7 (3 Buck + 3 LDO + 1 Boost) | 7 (3 Buck + 3 LDO + 1 Boost) | 7 (3 Buck + 3 LDO + 1 Boost) |
| Input Voltage Range | 2.7V to 5.5V | 2.7V to 5.5V | 2.7V to 5.5V | 2.7V to 5.5V | 2.7V to 5.5V | 2.7V to 5.5V |
| Maximum Buck Current | 1.5 A per channel | 1.5 A per channel | 1.5 A per channel | 1.5 A per channel | 1.5 A per channel | 1.5 A per channel |
| Control Interface | I2C | I2C | I2C | I2C | I2C | I2C |
| Operating Temperature | -40C to +105C | -40C to +105C | -40C to +105C | -40C to +105C | -40C to +105C | -40C to +105C |
| Target SoC | ARM Cortex-A8/A9, FPGA | ARM Cortex-A8/A9, FPGA | ARM Cortex-A8/A9, FPGA | ARM Cortex-A8/A9, FPGA | ARM Cortex-A8/A9, FPGA | ARM Cortex-A8/A9, FPGA |
Principaux différenciateurs
- Pin-compatible upgrade path to -D0 revision (vs TPS65218D0PHPR)
- VQFN package variant for space-constrained designs (vs TPS65218B1RSLR)
- Industrial temperature grade vs commercial parts (vs TPS65218B1PHPT)
Notes de conception
Estimated: The HTQFP-48 (PHP) package with exposed pad has typical theta_JA around 30 C/W on a standard JEDEC 4-layer test board (per similar TI PMIC datasheets). At full load of all 7 rails drawing ~3W total dissipation, junction temperature rise above ambient is approximately 90C - well within the 125C TJ max. For designs operating near +85C ambient, ensure at least 1 square inch of top-side copper connected to the exposed pad. The exposed pad MUST be soldered to the PCB ground plane for both thermal dissipation and electrical ground reference.
Place input capacitors (4.7uF ceramic minimum per buck, plus 10uF bulk) within 2 mm of each VINx pin using wide copper pours to minimize input ripple. The boost converter requires a Schottky diode and 10uH inductor placed near the SW_BOOST pin. Keep the analog ground (AGND) and power ground (PGND) connected at a single point near the IC's exposed pad. Per TI's PMIC PCB layout guidelines, separate analog feedback traces from noisy switching nodes by at least 3 mm.
Do not power the TPS65218B1PHPR from input voltages below 2.7V - the internal UVLO will hold the device in reset. When migrating from -B1 to -D0 silicon revision, verify default register values in the -D0 datasheet, as some power-on defaults differ even though the I2C register map is unchanged. Do not leave the SEQ pin floating - it requires a defined logic level for proper startup sequencing. Always include the recommended RESET pull-up and decoupling capacitors shown in the datasheet typical application circuit.
For battery-powered designs (single Li-ion cell), the boost converter can generate a 5V rail for USB OTG or display bias while the buck converters power the 3.3V/1.8V/1.2V core rails. The I2C-controlled PGOOD and sequencing simplify power management in sleep modes - the host processor can disable individual rails via the EN pins or I2C commands to minimize quiescent current below 50uA. Per TI TPS65218 datasheet, disable unused LDOs to save power.
Informations de conformité
RoHS compliant per TI product page. Industrial -40C to +105C temperature grade. Not AEC-Q100 qualified - for automotive applications, verify with TI for latest PPAP status.
